TW200939439A - Lead frame and manufacturing method of circuit device using the lead frame - Google Patents
Lead frame and manufacturing method of circuit device using the lead frame Download PDFInfo
- Publication number
- TW200939439A TW200939439A TW097146558A TW97146558A TW200939439A TW 200939439 A TW200939439 A TW 200939439A TW 097146558 A TW097146558 A TW 097146558A TW 97146558 A TW97146558 A TW 97146558A TW 200939439 A TW200939439 A TW 200939439A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- support portion
- hole
- lead
- frame
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 229920005989 resin Polymers 0.000 claims description 67
- 239000011347 resin Substances 0.000 claims description 67
- 238000007789 sealing Methods 0.000 claims description 55
- 238000005520 cutting process Methods 0.000 claims description 45
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 17
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 241000283216 Phocidae Species 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008025930A JP5144294B2 (ja) | 2008-02-06 | 2008-02-06 | リードフレームおよびそれを用いた回路装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200939439A true TW200939439A (en) | 2009-09-16 |
Family
ID=41071116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097146558A TW200939439A (en) | 2008-02-06 | 2008-12-01 | Lead frame and manufacturing method of circuit device using the lead frame |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5144294B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20090086148A (enrdf_load_stackoverflow) |
| TW (1) | TW200939439A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI800266B (zh) * | 2021-05-31 | 2023-04-21 | 日商Ｔｏｗａ股份有限公司 | 成型模、樹脂成型裝置及樹脂成型品的製造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5215980B2 (ja) * | 2009-10-30 | 2013-06-19 | 株式会社三井ハイテック | 半導体装置の製造方法 |
| JP5397195B2 (ja) * | 2009-12-02 | 2014-01-22 | 日立化成株式会社 | 光半導体素子搭載用基板の製造方法、及び、光半導体装置の製造方法 |
| JP5613463B2 (ja) * | 2010-06-03 | 2014-10-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| DE102015100025A1 (de) * | 2015-01-05 | 2016-07-07 | Osram Opto Semiconductors Gmbh | Leiterrahmen |
| JP6924411B2 (ja) * | 2017-08-28 | 2021-08-25 | 大日本印刷株式会社 | リードフレームおよび半導体装置の製造方法 |
| TWM654617U (zh) * | 2024-01-08 | 2024-04-21 | 大陸商蘇州震坤科技有限公司 | 減少切單時刀損耗的導線架結構 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077235A (ja) * | 1999-09-06 | 2001-03-23 | Mitsui High Tec Inc | 半導体素子搭載用基板 |
| JP3634757B2 (ja) * | 2001-02-02 | 2005-03-30 | 株式会社三井ハイテック | リードフレーム |
| JP3628971B2 (ja) * | 2001-02-15 | 2005-03-16 | 松下電器産業株式会社 | リードフレーム及びそれを用いた樹脂封止型半導体装置の製造方法 |
| JP2007294715A (ja) * | 2006-04-26 | 2007-11-08 | Renesas Technology Corp | 半導体装置の製造方法 |
-
2008
- 2008-02-06 JP JP2008025930A patent/JP5144294B2/ja active Active
- 2008-12-01 TW TW097146558A patent/TW200939439A/zh unknown
- 2008-12-15 KR KR1020080127219A patent/KR20090086148A/ko not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI800266B (zh) * | 2021-05-31 | 2023-04-21 | 日商Ｔｏｗａ股份有限公司 | 成型模、樹脂成型裝置及樹脂成型品的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090086148A (ko) | 2009-08-11 |
| JP2009188150A (ja) | 2009-08-20 |
| JP5144294B2 (ja) | 2013-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101587561B1 (ko) | 리드프레임 어레이를 구비하는 집적회로 패키지 시스템 | |
| US9412684B2 (en) | Top exposed semiconductor chip package | |
| TW200939439A (en) | Lead frame and manufacturing method of circuit device using the lead frame | |
| JP2002261228A (ja) | リードフレーム | |
| JP2002076228A (ja) | 樹脂封止型半導体装置 | |
| JP2008211041A (ja) | 半導体装置、リードフレームおよび半導体装置の製造方法 | |
| US8609467B2 (en) | Lead frame and method for manufacturing circuit device using the same | |
| JP4408475B2 (ja) | ボンディングワイヤを採用しない半導体装置 | |
| TW201635478A (zh) | 半導體裝置之製造方法 | |
| JP2003174131A (ja) | 樹脂封止型半導体装置及びその製造方法 | |
| CN106373932A (zh) | 一种封装器件及制备方法 | |
| US8697496B1 (en) | Method of manufacture integrated circuit package | |
| JP2003249604A (ja) | 樹脂封止半導体装置およびその製造方法、樹脂封止半導体装置に使用されるリードフレーム、ならびに半導体モジュール装置 | |
| TWI274409B (en) | Process for manufacturing sawing type leadless semiconductor packages | |
| US8829685B2 (en) | Circuit device having funnel shaped lead and method for manufacturing the same | |
| JP5285289B2 (ja) | 回路装置およびその製造方法 | |
| JP4979661B2 (ja) | 半導体装置の製造方法 | |
| JP2003046053A (ja) | 半導体装置およびその製造方法 | |
| TW201813011A (zh) | 分離式預成形封裝導線架及其製作方法 | |
| US20050098859A1 (en) | Semiconductor device and fabrication method thereof | |
| JP4162303B2 (ja) | 半導体装置の製造方法 | |
| JP4215300B2 (ja) | 半導体装置の製造方法 | |
| JP2002164496A (ja) | 半導体装置およびその製造方法 | |
| JP2022094480A (ja) | 半導体装置 | |
| JP4798199B2 (ja) | 半導体装置の製造方法 |