TW200933306A - Exposure apparatus and semiconductor device fabrication method - Google Patents

Exposure apparatus and semiconductor device fabrication method Download PDF

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Publication number
TW200933306A
TW200933306A TW097140021A TW97140021A TW200933306A TW 200933306 A TW200933306 A TW 200933306A TW 097140021 A TW097140021 A TW 097140021A TW 97140021 A TW97140021 A TW 97140021A TW 200933306 A TW200933306 A TW 200933306A
Authority
TW
Taiwan
Prior art keywords
driving
optical element
optical system
optical
drive
Prior art date
Application number
TW097140021A
Other languages
English (en)
Chinese (zh)
Inventor
Bunsuke Takeshita
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200933306A publication Critical patent/TW200933306A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/54—Lamp housings; Illuminating means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW097140021A 2007-11-05 2008-10-17 Exposure apparatus and semiconductor device fabrication method TW200933306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007287849A JP5006762B2 (ja) 2007-11-05 2007-11-05 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200933306A true TW200933306A (en) 2009-08-01

Family

ID=40587773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140021A TW200933306A (en) 2007-11-05 2008-10-17 Exposure apparatus and semiconductor device fabrication method

Country Status (4)

Country Link
US (2) US8659740B2 (https=)
JP (1) JP5006762B2 (https=)
KR (1) KR20090046727A (https=)
TW (1) TW200933306A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5418768B2 (ja) * 2009-06-26 2014-02-19 キヤノン株式会社 露光装置、調整方法及びデバイスの製造方法
WO2016087177A1 (en) * 2014-12-01 2016-06-09 Asml Netherlands B.V. Projection system
WO2020148038A1 (en) * 2019-01-18 2020-07-23 Asml Netherlands B.V. Projection system and lithographic apparatus comprising said projection system
JP2022114974A (ja) * 2021-01-27 2022-08-08 キヤノン株式会社 光学系、露光装置および物品製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645228A (ja) * 1992-07-23 1994-02-18 Nikon Corp 投影露光装置
JPH0829738A (ja) * 1994-07-18 1996-02-02 Nikon Corp 防振ズームレンズ
US5548195A (en) * 1994-12-22 1996-08-20 International Business Machines Corporation Compensated servo control stage positioning apparatus
JPH1012515A (ja) * 1996-06-20 1998-01-16 Nikon Corp 投影露光装置
JPH11150053A (ja) * 1997-11-18 1999-06-02 Nikon Corp 露光方法及び装置
JP3631045B2 (ja) 1999-06-16 2005-03-23 キヤノン株式会社 駆動装置、光学素子駆動装置、露光装置およびデバイス製造方法
CN1462471A (zh) * 2000-09-21 2003-12-17 株式会社尼康 成像特性的测量方法和曝光方法
JP4298305B2 (ja) * 2003-01-20 2009-07-15 キヤノン株式会社 露光装置及び半導体デバイスの製造方法
JP3805323B2 (ja) 2003-05-21 2006-08-02 キヤノン株式会社 露光装置、収差低減方法及び光学部材調整機構
TWI396225B (zh) * 2004-07-23 2013-05-11 尼康股份有限公司 成像面測量方法、曝光方法、元件製造方法以及曝光裝置
JP2006113414A (ja) 2004-10-18 2006-04-27 Canon Inc 光学素子保持装置、鏡筒、露光装置及びマイクロデバイスの製造方法
US7221434B2 (en) * 2005-03-01 2007-05-22 Canon Kabushiki Kaisha Exposure method and apparatus
JP4994598B2 (ja) * 2005-03-18 2012-08-08 キヤノン株式会社 駆動装置
JP5069232B2 (ja) * 2005-07-25 2012-11-07 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置の投影対物レンズ
JP2007281079A (ja) * 2006-04-04 2007-10-25 Canon Inc 光学要素駆動装置及び基板露光装置
JP2007317713A (ja) * 2006-05-23 2007-12-06 Canon Inc 光学素子駆動装置
JP4366386B2 (ja) * 2006-09-07 2009-11-18 キヤノン株式会社 露光装置およびデバイス製造方法

Also Published As

Publication number Publication date
US20090115988A1 (en) 2009-05-07
JP5006762B2 (ja) 2012-08-22
US9104119B2 (en) 2015-08-11
US8659740B2 (en) 2014-02-25
US20140125960A1 (en) 2014-05-08
KR20090046727A (ko) 2009-05-11
JP2009117556A (ja) 2009-05-28

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