TW200926381A - Method for producing substrate - Google Patents

Method for producing substrate Download PDF

Info

Publication number
TW200926381A
TW200926381A TW097140818A TW97140818A TW200926381A TW 200926381 A TW200926381 A TW 200926381A TW 097140818 A TW097140818 A TW 097140818A TW 97140818 A TW97140818 A TW 97140818A TW 200926381 A TW200926381 A TW 200926381A
Authority
TW
Taiwan
Prior art keywords
substrate
electrode
semiconductor substrate
pad
forming
Prior art date
Application number
TW097140818A
Other languages
English (en)
Chinese (zh)
Inventor
Hideaki Sakaguchi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200926381A publication Critical patent/TW200926381A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0234—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes that stop on pads or on electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0242—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes from the back sides of the chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0249—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0265—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the sidewall insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07131—Means for applying material, e.g. for deposition or forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW097140818A 2007-10-25 2008-10-24 Method for producing substrate TW200926381A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007277438A JP5237607B2 (ja) 2007-10-25 2007-10-25 基板の製造方法

Publications (1)

Publication Number Publication Date
TW200926381A true TW200926381A (en) 2009-06-16

Family

ID=40262148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140818A TW200926381A (en) 2007-10-25 2008-10-24 Method for producing substrate

Country Status (4)

Country Link
US (1) US7867894B2 (https=)
EP (1) EP2053651B1 (https=)
JP (1) JP5237607B2 (https=)
TW (1) TW200926381A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GR20080100491A (el) * 2008-07-23 2010-02-24 Διονυσιος Χαραλαμπους Χοϊδας Συσκευη κινητης τηλεφωνιας με ενσωματωμενη διαταξη επαληθευσης των ενδειξεων του ταξιμετρου ενος μισθωμενου οχηματος
JP5578808B2 (ja) * 2009-05-15 2014-08-27 新光電気工業株式会社 半導体パッケージ
JP5644242B2 (ja) 2009-09-09 2014-12-24 大日本印刷株式会社 貫通電極基板及びその製造方法
JP2011187771A (ja) * 2010-03-10 2011-09-22 Omron Corp 電極部の構造
EP2482310B1 (en) * 2011-01-27 2020-09-23 Sensirion AG Through vias in a sensor chip
JP5821284B2 (ja) * 2011-05-30 2015-11-24 セイコーエプソン株式会社 配線基板、赤外線センサー及び貫通電極形成方法
JP6031746B2 (ja) * 2011-11-01 2016-11-24 セイコーエプソン株式会社 半導体装置の製造方法、半導体装置及び電子機器
US9653401B2 (en) * 2012-04-11 2017-05-16 Nanya Technology Corporation Method for forming buried conductive line and structure of buried conductive line
EP2871152B1 (en) 2013-11-06 2017-05-24 Sensirion AG Sensor device
EP3001186B1 (en) 2014-09-26 2018-06-06 Sensirion AG Sensor chip
EP3032227B1 (en) 2014-12-08 2020-10-21 Sensirion AG Flow sensor package

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648585B2 (ja) * 1997-05-27 2005-05-18 カシオ計算機株式会社 半導体装置及びその製造方法
US6943056B2 (en) * 2002-04-16 2005-09-13 Renesas Technology Corp. Semiconductor device manufacturing method and electronic equipment using same
JP2004095849A (ja) 2002-08-30 2004-03-25 Fujikura Ltd 貫通電極付き半導体基板の製造方法、貫通電極付き半導体デバイスの製造方法
US6790775B2 (en) * 2002-10-31 2004-09-14 Hewlett-Packard Development Company, L.P. Method of forming a through-substrate interconnect
JP2005026582A (ja) * 2003-07-04 2005-01-27 Olympus Corp 半導体装置及びその半導体装置の製造方法
JP4524156B2 (ja) * 2004-08-30 2010-08-11 新光電気工業株式会社 半導体装置及びその製造方法
JP4528100B2 (ja) * 2004-11-25 2010-08-18 新光電気工業株式会社 半導体装置及びその製造方法
US7307348B2 (en) * 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
KR100753528B1 (ko) * 2006-01-04 2007-08-30 삼성전자주식회사 웨이퍼 레벨 패키지 및 이의 제조 방법
US7659612B2 (en) * 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
US8034702B2 (en) * 2007-08-16 2011-10-11 Micron Technology, Inc. Methods of forming through substrate interconnects

Also Published As

Publication number Publication date
JP2009105311A (ja) 2009-05-14
EP2053651A2 (en) 2009-04-29
EP2053651B1 (en) 2013-03-06
US20090117738A1 (en) 2009-05-07
EP2053651A3 (en) 2011-11-16
JP5237607B2 (ja) 2013-07-17
US7867894B2 (en) 2011-01-11

Similar Documents

Publication Publication Date Title
TW200926381A (en) Method for producing substrate
JP4551321B2 (ja) 電子部品実装構造及びその製造方法
CN100435299C (zh) 布线基板的制备方法
TWI358973B (https=)
CN101315917B (zh) 配线基板及其制造方法
TWI331797B (en) Surface structure of a packaging substrate and a fabricating method thereof
TWI223419B (en) Semiconductor device and method of manufacturing the same
TWI437668B (zh) 佈線板、半導體裝置、佈線板之製造方法及半導體裝置之製造方法
JP5193503B2 (ja) 貫通電極付き基板及びその製造方法
TWI523591B (zh) 佈線基板之製造方法
TWI248141B (en) Semiconductor device and manufacturing method therefor
TW201108905A (en) Wiring substrate and method of manufacturing the same
CN102931154B (zh) 半导体装置
TW201023322A (en) Wiring substrate and the method of manufacturing the same
TW201018347A (en) Wiring board capable of having built-in functional element and method for manufacturing the same
TW200950006A (en) Circuit board process
JP2016152260A (ja) 電子装置
TW201025529A (en) Substrate structure and manufacturing method thereof
TW200917365A (en) Method of manufacturing semiconductor device
TW201138043A (en) Circuit board structure, packaging structure and method for making the same
TWI294760B (https=)
TW200920216A (en) Wiring board
TWI295499B (en) Chip structure and fabricating process thereof
TW200539417A (en) Package substrate without plating bar and a mathod of forming the same
TW201023278A (en) Method for forming metallic bump on semiconductor component and sealing semiconductor component