200913180 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種基板貼合之裝置，特別是關於一種 使一可撓性基板結合於另一基板之裝置之設計。 【先前技術】 按，目前一般大眾所使用之手機、pDA、影音3C產 品等，其顯示螢幕或觸控螢幕係由至少兩種不同_之基 板貼合製作而成，而習用之基板貼合技術如第^圖所示了 其係在一標的基板i之一貼合面u塗佈有—層光學^， 為:將-可撓性基板2貼合於基板}之貼合面u，乃藉由 向著-方向I滾動之一滾輪3對可撓性基板2施予一壓合 力Π ’以使可撓性基板2隨著滾輪3之滾壓而逐漸經= 學踢12貼合於基板1之貼合面11，其間之空氣則從開放 的一端排出。 此種使用滾輪將基板滾壓貼合之缺點為，滾輪係屬一 種機械機構，其有行程時間（Cycle Time)之限制以及貼 合工件數$之限制’且其會產生邊角壓力集中效應㈤弘 職ct)造成氣體包覆於貼合介面形成氣泡之不良現象。基 方、k些缺點’因而有其它的基板貼合技術被研發出來，例 如美國發明專利第6，⑽，665號專利案中，其揭露出一種製 造眼鏡片之設備’其係把上下兩透明柔性片包裹在具有光 學曲度的合成鏡片周圍，並抽真空使合成鏡片黏合，再以 UV燈照射養護成型。 200913180 / 又例如美國發明專利第5 +山 ’ ’ 9 〇號專利案中，宜指| 路出一種在一真空袋中貼合一 一’、/、揭 O' iMr -V 和—塑膠薄板之二明、、厶 結構之技術，除同樣利用抽直 一月^ 屬制忐夕+ ^王之方式外，並藉助一以金 屬衣成之蓋板之麼力來幫助塑曝薄板和玻璃之貼合。 【發明内容】 本發明所欲解決之技術問題 …、而，上述吴國發明專利第 一円囡斗&丄 号M〇6,665唬專利案係在 圍圏結構中來進行貼人 而上述美國發明專利第 5,501，910號專利荦传僅為 首 值在真空袋中進行貼合，盆均夫描 板偏移定位之情形 供-種穩定的貼合治具，因此在貼人广心“/、勺未& U此在貼合之過程中難免產生其 ^^7 λ^ΐ -> iKi- TL^. 亚且，上述兩專利案除藉助真空壓力外，頂多再輔以 蓋板之廢力來幫助不同之基板進行貼合，並無設計一機構 以再施加—外力予基板以使基板之貼合面更完全緊密地貼 再者，上述美國發明專利第6，106,665號專利案係僅 應用於眼鏡片之生產製作，並不包含顯示螢幕以及觸控式 螢幕之‘作或其它不同基板貼合技術之應用。 丄緣此，本發明之主要目的即是提供一種具有穩定貼合 治具之基板貼合裝置，以使基板穩定地貼合而不偏移定位。 本發明之另一目的是提供一種具有頂推機構之基板貼 合裝置，以使兩基板更完全緊密地貼合一起。 本發明之另一目的是提供一種可應用於各種領域之基 200913180 板貼合裝置 本發明解決問題之技術手段 ^月為解W知技術之問題所剌之技術手段係提 =-種基板貼合裝置’用以將—可撓性基板貼合在一標的 基板之貼合面。包括一貼人、、λ且 和m。〇 一可撓性基板承托結構 ,、s、冶具係由一對相對應之側壁形成-凹部 並在凹邛工間之頂面形成_開放頂面，凹部空間係 2通m通道。可撓性基板承托結構制技在貼合治 空間中，用以承托可撓性基板之兩端緣，並使可 ::二:之底面與標的基板之貼合面之間具有-預定間 貼人板係盍覆在貼合治具之開放頂面，以在軟性板與 貼δ / 口具之凹部空問^# 與貼合治㈣貼讀室。當軟性板 ;;α卩工間之間形成之氣密貼合艙室由一真空 抽氣4置經由抽氣诵酋 作 〃 抽真工牯，軟性板受真空壓力 m，㈣可撓絲板向下壓，使可撓性基板之 底面貼合於標的基板之貼合面。 頂推明之1讀實施例巾，基板貼合裝置更可包括一 頂推機構，設置於貼人，、Λ 氣穷貼人、口/〇底部所開設之一槽孔中，當 空氣被抽空後，頂推機構將標的基板向 預定距離’以使標的基板之貼合面完全貼合於可 心}'生基板之底面。 本發明對照先前技術之功效 200913180 經由本發明所採用之技術手段，可以使得兩不同之基 板在貼合之過程中穩定地貼合，而不致偏移定位。且藉由 頂推機構之設計可使兩基板更完全緊密地貼合—起，並且 本發明之結構設計係可應用於各種需貼合兩種基板之不同 應用領域中。 本發明所採用的具體實施例，將藉由以下之實施例及 附呈圖式作進一步之說明。 【實施方式】 參閱第2圖所示，其係顯示本發明基板貼合裝置第— 實施例之剖視圖。本發明基板貼合裝置1〇〇係用以將—可 撓性基板2貼合在-標的基& i之貼合自1;[，亦即標的基 板1之貼合面II係塗佈有一層光學膠12，可撓性基板二 係可經由光學膠12而貼合於標的基板丨之貼合面u。 本發明基板貼合裝置100包括一貼合治具31、一軟性 板4和一厘合構件41。 貼合治具31係由一對相對應之側壁形成一凹部空間 32，並在凹部空間32之頂面形成一開放頂面33，凹部空 間32中係供承置標的基板}。且凹部空間32中係形成有 -可撓性基板承托結構34，用財托可撓絲板2之兩端 緣’並使可撓性基板2之底面與標的基板i之貼合面u之 間具有-預定間距。於本實施财，可撓性基板承托結構 34係為形成在貼合治具31之凹部空間32中之—對應側壁 之段階結構。凹部空間32連通有—減通道％，且貼人 200913180 治具3 1之選定位置係開設有一排氣孔％。 幸人眭板4係盍覆在貼合治具3 1之開放頂面33，以在 4與貼合治具31之凹部空間32之間形成一氣密貼 a舶至j 7或者，軟性板4亦可以一撓性板來替代。壓合 構件1係位在貼合治具31之開放頂面33，μ將軟性二 4緊密蓋覆在貼合治具m放頂面33，並且軟性板4係 距綠可撓性基板2之頂面—預定距離。軟性板4係可使用 橡膠、石夕膠（Silicon Rubber)、pvc、pET、pE 等軟性 彈性之材料。 參閱第3圖所示，當軟性板4與貼合治具3丨之凹部 空間32之間形成之氣密貼合艙室37由一真空抽氣裝置5 ㈣一抽氣管路51和抽氣通道35予以抽真空時，軟性板 广文-真空壓力ΠΙ作用變形下凹，而將可撓性基板2向下 壓’使可撓性基板2之底面貼合於標的基板1之貼合面U。 當可挽性基板2之底面貼合於標的基板1之貼合面U後， 由於貼α ’α具31之排氣孔36係經由一導管61連接於—開 關閥62知控者係可開啟開關閥62以使氣密貼合艙室Ρ 中之殘留氣體經由排氣孔36和導管61排出。 >閱第4圖所示，其係顯示本發明基板貼合裝置第二 ^施例^剖視圖。本發明基板貼合裝置200之結構設計: 月）述之第貫施例大致相同，故相同之構件乃標示以相同 之元件編號，以資對應。其差異在於基板貼合裝置細係 包括-_機構7 ’頂推機構7係設置於貼合治m 部所開設之一槽孔38中。 、 200913180 參閱第5圖所示，在本發明之第二 貼合搶室37中之空氣被抽空後，頂推:：;施二= W予標的基板卜而將標的基板 頂推力 以使標的基板！之貼合面u完全貼〜/推—預定距離， 面。同樣地，此時操控者係可開啟開關間& = 艙室Ρ中之殘留氣體經由排氣孔36和導f6i排^、a 所二，其係顯示本發明基板貼合裝置第三 lt、L 。柄明基板貼合裝| _之結構設計盘 别述:弟-貫施例大致相同，故相同之構件乃標示以相同、 之π件編號，以貧對應。其差異在於基板貼合裝置遍之 31a之-對應側壁並不形成有可撓性基板承托結 =4 ’因此可撓性基板2係經由—層靜電膠仏占附於軟 性板4之底面，並使用一對CCD影像感測器81和一對設 置於軟性板4之頂面之定位點82來進行標的基板i和可挽 性基板2之相對位置的判定與對準。 參閱第7圖所示，在本發明之第三實施例中，當氣密 貼合艙室37由真空抽氣裝置5經由抽氣管路51和:氣二 道35予以抽真空時’軟性板4以及貼附於軟性板4之可撓 性基板2受―真空壓力111作《形下凹’而使可撓性基板 2之底面貼合於標的基板丨之貼合面u。當可撓性基板2 之底面貼合於標的基板丨之貼合面n後，操控者係可開啟 開關閥62以使氣密貼合艙室37中之殘留氣體經由排氣孔 36和導管61排出。 參閱第8圖所示，其係顯示本發明基板貼合裝置第四 200913180 實施例之剖視圖。本發明基板貼合裝置彻之 前述之第三實施例大致 ，，'。構叹相 仰U 政相冋之構件乃楞千丨7扣η 之元件編號，以資對庫。直兰翌— ^ 、…"差異在於基板貼合裝置4〇〇 # 包括一頂推機構7，ir> 再頂推機構7係設置於貼合治具3 部所開設之一槽孔3 8中。 - 參閱弟9圖所示，在本發明之第四實施例中，杂氣穷 貼合搶室37中之空氣被抽空後，頂推機構7施以-二 W予標喊，㈣標喊板1向距力 以使標的基板1之貼& n〜人以 t貞疋距離 攸之貼口面11完全貼合於可接性基板2之底 面。同樣地，此時操控者傣可開啟開關閥62 人 艙室π中之殘留氣體經由排氣孔36和導管61排=' 口 由以上之實施例可知，本發明所提供之基板貼合裝置 確具產業上之利用價值’故本發明業已符合於專利之要件。 惟=上之敘述僅為本發明之較佳實施例說明，凡精於此項 技藝者當可依據上述之說明而作其它種種之改良，惟這些 改變仍屬於本發明之發明精神及以下所界定之專利範圍 中〇 【圖式簡單說明】 第1圖係習用以滾輪貼合基板之示意圖； 第2圖係本發明基板貼合裝置第一實施例之剖視圖； 第3圖係本發明基板貼合裝置第一實施例之基板貼合動作 示意圖； 第4圖係本發明基板貼合裝置第二實施例之剖視圖； 12 200913180 第5圖係本發明基板貼合裝置第二實施例之基板貼合動作 示意圖； 第6圖係本發明基板貼合裝置第三實施例之剖視圖； 第7圖係本發明基板貼合裝置第三實施例之基板貼合動作 示意圖； 第8圖係本發明基板貼合裝置第四實施例之剖視圖； 第9圖係本發明基板貼合裝置第四實施例之基板貼合動作 示意圖。 主要元件符號說明】 100 、 200 、 300 、 400 基板貼合裝置 1 標的基板 11 貼合面 12 光學膠 2 可撓性基板 3 滾輪 31 、 31a 貼合治具 32 凹部空間 33 開放頂面 34 可撓性基板承托結構 35 抽氣通道 36 排氣孔 37 氣密貼合艙室 38 槽孔 13 200913180 4 軟性板 41 壓合構件 42 靜電膠 5 真空抽氣裝置 51 抽氣管路 61 導管 62 開關閥 7 頂推機構 81 CCD影像感測器 82 定位點 I 方向 II 壓合力 III 真空壓力 IV 頂推力 14BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for bonding substrates, and more particularly to a device for bonding a flexible substrate to another substrate. [Prior Art] According to the current mobile phone, pDA, audio and video 3C products used by the general public, the display screen or touch screen is made of at least two different substrates, and the conventional substrate bonding technology As shown in FIG. 4, the bonding surface u is coated on one of the bonding surfaces u of a target substrate i, and the bonding surface u of the flexible substrate 2 is bonded to the substrate. A flexible pressing force Π ' is applied to the flexible substrate 2 by rolling the roller 3 toward the direction I so that the flexible substrate 2 is gradually attached to the substrate 1 by the rolling of the roller 3 as the roller 3 is rolled. The mating surface 11 with the air in between is discharged from the open end. The disadvantage of using the roller to roll the substrate is that the roller is a mechanical mechanism, which has a limitation of the Cycle Time and a limit of the number of workpieces to be attached, and it has a corner pressure concentration effect (5). Hiroyuki ct) causes a problem that gas is coated on the bonding interface to form bubbles. The base side, k some shortcomings', and thus other substrate bonding techniques have been developed. For example, in the U.S. Patent No. 6, (10), No. 665, it discloses a device for manufacturing an ophthalmic lens. The flexible sheet is wrapped around a synthetic lens having an optical curvature, and vacuum is applied to bond the synthetic lens, and then cured by UV light irradiation. 200913180 / For example, in the patent case of the US invention patent No. 5 + Shan ' ' 9 〇 , , , , , , , , , , , , , , , , , , , , , , , 路 一种 路 路 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种The technology of Erming and Yu's structure, in addition to the same method of straightening in January ^ is a system of 忐 + + ^ 王, and with the help of a metal-clad cover to help plastic exposed sheet and glass stickers Hehe. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is that the above-mentioned Wu Guo invention patent No. 1 bucket & 丄 M〇 6,665 唬 patent case is attached to the cofferdam structure and the above-mentioned American invention Patent No. 5, 501, 910 is rumored that only the first value is attached in a vacuum bag, and the situation of the basin-averaged offset plate is provided for a stable fitting fixture, so that it is affixed to the heart. & U, in the process of fitting, it is inevitable to produce ^^7 λ^ΐ -> iKi- TL^. In addition, the above two patents are supplemented by the waste force of the cover plate in addition to the vacuum pressure. To assist in the bonding of different substrates, there is no design of a mechanism to re-apply an external force to the substrate to make the bonding surface of the substrate more closely attached. The above-mentioned U.S. Patent No. 6,106,665 is only applied. The production of the ophthalmic lens does not include the application of the display screen and the touch screen or other different substrate bonding techniques. The main purpose of the present invention is to provide a stable bonding fixture. Substrate bonding device to stabilize the substrate Another object of the present invention is to provide a substrate bonding apparatus having a pushing mechanism to make the two substrates more closely fit together. Another object of the present invention is to provide a substrate 200913180 plate laminating device applied to various fields, the technical means for solving the problem of the present invention, the technical means for solving the problem of the technology, and the like, the substrate bonding device is used for the flexible substrate Bonding surface of a target substrate, including a sticker, λ and m. A flexible substrate support structure, s, a metallurgy is formed by a pair of corresponding side walls - a concave portion and is concave The top surface of the masonry is formed with an open top surface, and the recessed space is a 2-way m-channel. The flexible substrate supporting structure is used to support the two ends of the flexible substrate in the bonding space. Between: 2: The bottom surface of the substrate and the bonding surface of the target substrate have a predetermined affixed panel attached to the open top surface of the bonding fixture to empty the flexible panel and the δ / mouthpiece Ask ^# and paste together (4) reading room. When the soft board; The close-fitting compartment is pumped by a vacuum pumping 4, and the soft board is subjected to vacuum pressure m, (4) the flexible screen is pressed downward, so that the bottom surface of the flexible substrate is attached to the target. The bonding surface of the substrate. The first embodiment of the substrate, the substrate bonding device may further comprise a pushing mechanism, which is arranged in a slot which is provided in the bottom of the mouth/squat. After the air is evacuated, the pushing mechanism positions the target substrate to a predetermined distance 'to make the bonding surface of the target substrate completely conform to the bottom surface of the green substrate. The present invention compares the efficacy of the prior art 200913180 via the present invention. The technical means can be used to make the two different substrates stably fit during the bonding process without offset positioning. Moreover, the design of the pushing mechanism enables the two substrates to be more completely adhered together, and the structural design of the present invention can be applied to various application fields in which the two substrates are to be bonded. The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings. [Embodiment] Referring to Fig. 2, there is shown a cross-sectional view showing a first embodiment of the substrate bonding apparatus of the present invention. The substrate bonding apparatus 1 of the present invention is used for bonding the flexible substrate 2 to the base of the standard substrate and the bonding of the substrate 1 to the substrate 1; A layer of optical glue 12, the flexible substrate can be bonded to the bonding surface u of the target substrate via the optical adhesive 12. The substrate bonding apparatus 100 of the present invention comprises a bonding jig 31, a flexible board 4 and a thawing member 41. The fitting jig 31 forms a recessed space 32 by a pair of corresponding side walls, and an open top surface 33 is formed on the top surface of the recessed space 32, and the recessed space 32 is for holding the target substrate}. Further, a flexible substrate supporting structure 34 is formed in the recessed space 32, and the both ends of the flexible flexible substrate 2 and the bonding surface of the target substrate i are used. There is a - predetermined spacing. In the present embodiment, the flexible substrate supporting structure 34 is formed in a stepped structure of the corresponding side wall formed in the recessed space 32 of the bonding jig 31. The recessed space 32 is connected to the reduced-channel %, and is attached to a selected position of the 200913180 fixture 3 1 with a venting opening %. Fortunately, the seesaw 4 is overlaid on the open top surface 33 of the fitting jig 31 to form an airtight sticker between the 4 and the recessed space 32 of the bonding fixture 31 to the j 7 or the flexible board 4 Can be replaced by a flexible board. The pressing member 1 is positioned on the open top surface 33 of the bonding jig 31, the μ is tightly covered on the bonding fixture m top surface 33, and the flexible board 4 is spaced from the green flexible substrate 2. Top surface - predetermined distance. For the flexible board 4, soft elastic materials such as rubber, silicone rubber, pvc, pET, and pE can be used. Referring to Fig. 3, the airtight fitting chamber 37 formed between the flexible panel 4 and the recessed space 32 of the bonding fixture 3 is provided by a vacuum pumping device 5 (4), an air suction line 51 and an air suction passage 35. When the vacuum is applied, the flexible plate is deformed by the vacuum pressure, and the flexible substrate 2 is pressed downward to bond the bottom surface of the flexible substrate 2 to the bonding surface U of the target substrate 1. After the bottom surface of the slidable substrate 2 is attached to the bonding surface U of the target substrate 1, the vent hole 36 of the affixing α α α is connected to the switching valve 62 via a conduit 61. The on-off valve 62 is configured to discharge residual gas in the airtightly fitted chamber Ρ through the vent hole 36 and the conduit 61. > Referring to Fig. 4, there is shown a cross-sectional view showing a second embodiment of the substrate bonding apparatus of the present invention. The structural design of the substrate bonding apparatus 200 of the present invention is substantially the same as that of the first embodiment, and the same components are denoted by the same component numbers. The difference is that the substrate bonding apparatus includes a -_mechanism 7' pushing mechanism 7 which is disposed in one of the slots 38 formed in the bonding unit m. Referring to FIG. 5, after the air in the second bonding chamber 37 of the present invention is evacuated, the pushing:: applying the second substrate to the target substrate and pushing the target substrate to the target substrate ! The mating surface u is completely attached ~ / push - predetermined distance, surface. Similarly, at this time, the controller can open the switch room & = the residual gas in the compartment 经由 through the vent hole 36 and the guide f6i, a, which shows the third lt, L of the substrate bonding apparatus of the present invention. . Handle Ming Substrate Mounting | _Structural Design Plate Others: The same applies to the same example, so the same components are marked with the same π-piece number, which corresponds to the lean. The difference is that the substrate bonding apparatus is not covered with the flexible substrate supporting junction = 4 ' across the corresponding sidewalls. Therefore, the flexible substrate 2 is attached to the bottom surface of the flexible board 4 via the layer of electrostatic adhesive. The determination and alignment of the relative positions of the target substrate i and the slidable substrate 2 are performed using a pair of CCD image sensors 81 and a pair of positioning points 82 provided on the top surface of the flexible board 4. Referring to Fig. 7, in the third embodiment of the present invention, when the airtight fitting chamber 37 is evacuated by the vacuum pumping device 5 via the air suction line 51 and the gas line 35, the 'soft board 4 and The flexible substrate 2 attached to the flexible board 4 is subjected to a "vacuum pressure 111" and the bottom surface of the flexible substrate 2 is bonded to the bonding surface u of the target substrate. When the bottom surface of the flexible substrate 2 is attached to the bonding surface n of the target substrate, the controller can open the switching valve 62 to discharge the residual gas in the airtight bonding chamber 37 through the vent hole 36 and the conduit 61. . Referring to Fig. 8, there is shown a cross-sectional view showing a fourth embodiment of the substrate bonding apparatus of the present invention. The substrate bonding apparatus of the present invention is substantially the same as the third embodiment described above. The component of the sighing and sighing of the U government is the component number of the 楞7丨7 buckle η, to the library. Straight Lancome — ^ , ... " The difference is that the substrate bonding apparatus 4〇〇# includes a pushing mechanism 7, ir> The pushing mechanism 7 is disposed in one of the slots 3 of the fitting jig 3 8 in. - Referring to Figure 9, in the fourth embodiment of the present invention, after the air in the miscellaneous gas snug chamber 37 is evacuated, the pushing mechanism 7 applies - two W to mark, (4) the sign board The one-way force is such that the surface of the target substrate 1 is attached to the bottom surface of the susceptor substrate 2 with the affixing surface 11 at a distance of 贞疋. Similarly, at this time, the controller 开启 can open the switching valve 62. The residual gas in the human cabin π is discharged through the vent hole 36 and the conduit 61. From the above embodiments, the substrate bonding device provided by the present invention has The industrial use value 'The invention has been in compliance with the requirements of the patent. The descriptions of the present invention are merely illustrative of the preferred embodiments of the present invention, and those skilled in the art can make various other modifications based on the above description, but these changes still belong to the inventive spirit of the present invention and are defined below. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1 is a schematic view showing a roller-attached substrate; FIG. 2 is a cross-sectional view showing a first embodiment of the substrate bonding apparatus of the present invention; and FIG. 3 is a substrate bonding of the present invention. FIG. 4 is a cross-sectional view showing a second embodiment of the substrate bonding apparatus of the present invention; 12 200913180 FIG. 5 is a substrate bonding operation of the second embodiment of the substrate bonding apparatus of the present invention. Figure 6 is a cross-sectional view showing a third embodiment of the substrate bonding apparatus of the present invention; Figure 7 is a schematic view showing a substrate bonding operation of the third embodiment of the substrate bonding apparatus of the present invention; and Figure 8 is a substrate bonding apparatus of the present invention. Fig. 9 is a schematic view showing the substrate bonding operation of the fourth embodiment of the substrate bonding apparatus of the present invention. Main component symbol description] 100, 200, 300, 400 Substrate bonding device 1 Standard substrate 11 Fitting surface 12 Optical adhesive 2 Flexible substrate 3 Roller 31, 31a Fitting fixture 32 Concave space 33 Open top surface 34 Flexible Substrate support structure 35 Exhaust passage 36 Venting hole 37 Airtight fitting chamber 38 Slot hole 13 200913180 4 Flexible plate 41 Pressing member 42 Electrostatic glue 5 Vacuum suction device 51 Extraction line 61 Pipe 62 Switch valve 7 Top Push mechanism 81 CCD image sensor 82 Positioning point I Direction II Pressing force III Vacuum pressure IV Top thrust 14