TWI687317B - Substrate bonding device and bonding method, and electronic device manufacturing method - Google Patents

Substrate bonding device and bonding method, and electronic device manufacturing method Download PDF

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TWI687317B
TWI687317B TW104139213A TW104139213A TWI687317B TW I687317 B TWI687317 B TW I687317B TW 104139213 A TW104139213 A TW 104139213A TW 104139213 A TW104139213 A TW 104139213A TW I687317 B TWI687317 B TW I687317B
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substrate
roller
force
laminate
bonding
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TW201632357A (en
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宇津木洋
伊藤泰則
大坪豊
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日商Ａｇｃ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Optics & Photonics (AREA)
  • Quality & Reliability (AREA)
  • Mathematical Physics (AREA)
  • Laminated Bodies (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

第1基板與第2基板係隔著吸附層而貼合。第1滾軸係將第2基板以撓曲變形之狀態按壓於第1基板，且邊滾動邊藉由第1力將第2基板之整面貼附於第1基板。第2滾軸藉由對將第2基板之整面貼附於第1基板之積層體，邊滾動邊賦予較第1力大之第2力，而將第2基板之整面壓接於第1基板。 The first substrate and the second substrate are bonded together via an adsorption layer. The first roller presses the second substrate against the first substrate in a deflection state, and the entire surface of the second substrate is attached to the first substrate by the first force while rolling. The second roller applies pressure to the entire surface of the second substrate to the laminate by attaching the entire surface of the second substrate to the laminate of the first substrate while rolling and applying a second force greater than the first force 1 substrate.

Description

基板之貼合裝置及貼合方法以及電子裝置之製造方法 Substrate bonding device and bonding method, and electronic device manufacturing method

本發明係關於一種基板之貼合裝置及貼合方法以及電子裝置之製造方法。 The invention relates to a substrate bonding device, a bonding method and a manufacturing method of an electronic device.

隨著顯示面板、太陽能電池、薄膜二次電池等之電子裝置之薄型化、輕量化，要求使用於該等電子裝置之玻璃板、樹脂板、金屬板等之基板(第1基板)之薄板化。 With the thinning and lightening of electronic devices such as display panels, solar cells, thin film secondary batteries, etc., the thinning of substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices is required .

然而，由於若基板之厚度變薄，則基板之處理能力惡化，故難以於基板之表面形成電子裝置用之功能層(薄膜電晶體(TFT：Thin Film Transistor)、彩色濾光片(CF：Color Filter))。 However, as the thickness of the substrate becomes thinner, the processing capability of the substrate deteriorates, so it is difficult to form a functional layer (thin film transistor (TFT: Thin Film Transistor), color filter (CF: Color) for electronic devices on the surface of the substrate Filter)).

因此，有人提出製造於基板之背面貼合加強板(第2基板)，藉由加強板加強基板之積層體，以積層體之狀態於基板之表面形成功能層之電子裝置之製造方法(例如，參照專利文獻1)。根據該製造方法，由於基板之處理能力提高，故可於基板之表面良好地形成功能層。然後，加強板係於功能層之形成後自基板剝離。 Therefore, it has been proposed to manufacture a method for manufacturing an electronic device in which a reinforcing plate (second substrate) is attached to the back of the substrate, the laminate is reinforced by the reinforcing plate, and a functional layer is formed on the surface of the substrate in the state of the laminate (for example, Refer to Patent Document 1). According to this manufacturing method, since the processing capability of the substrate is improved, a functional layer can be formed well on the surface of the substrate. Then, the reinforcing plate is peeled from the substrate after the functional layer is formed.

於專利文獻2揭示有貼合基板與加強板之貼合裝置(黏合裝置)。 Patent Document 2 discloses a bonding device (bonding device) for bonding a substrate and a reinforcing plate.

專利文獻2之貼合裝置包含：上平臺，其係於其下表面吸附基板；及下平臺，其係配置於上平臺之下方，且於其上表面載置加強板。又，包含：旋轉滾軸，其接觸於載置於下平臺之加強板之下表面，且使加強板以自重撓曲變形；按壓氣缸，其將藉由旋轉滾軸撓曲變形之加強板按壓於吸附於上平臺之基板；及移動機構，其使旋轉滾 軸及按壓氣缸相對於上平臺之下表面移動。 The laminating device of Patent Document 2 includes: an upper platform, which adsorbs a substrate on its lower surface; and a lower platform, which is disposed below the upper platform and places a reinforcing plate on its upper surface. Also, it includes: a rotating roller that contacts the lower surface of the reinforcing plate placed on the lower platform and deflects the reinforcing plate by its own weight; pressing the cylinder, which presses the reinforcing plate that is flexed and deformed by the rotating roller On the substrate adsorbed on the upper platform; and the moving mechanism, which makes the rotating roller The shaft and the pressing cylinder move relative to the lower surface of the upper platform.

根據專利文獻2之貼合裝置，首先，將基板吸附於上平臺，且將加強板載置於下平臺。接著，藉由按壓氣缸使旋轉滾軸上升，且使旋轉滾軸接觸加強板之下表面後，使旋轉滾軸進而上升而使加強板以自重撓曲變形，以該狀態將加強板按壓於基板。接著，藉由移動機構使旋轉滾軸及按壓氣缸移動，藉此將加強板貼合於基板。 According to the bonding apparatus of Patent Document 2, first, the substrate is attracted to the upper stage, and the reinforcing plate is placed on the lower stage. Next, the rotary roller is raised by pressing the cylinder, and after the rotary roller contacts the lower surface of the reinforcing plate, the rotating roller is further raised to deflect the reinforcing plate by its own weight, and the reinforcing plate is pressed against the substrate in this state . Next, the rotating mechanism and the pressing cylinder are moved by the moving mechanism, thereby bonding the reinforcing plate to the substrate.

根據專利文獻2之貼合裝置，由於將加強板以撓曲變形之狀態與基板貼合，故於基板與加強板之間難以咬入氣泡。又，由於未吸附固定加強板，故能以加強板之應變較少之狀態貼合加強板與基板。因此，可減少於貼合後產生之積層體之彎曲。 According to the bonding apparatus of Patent Document 2, since the reinforcing plate is bonded to the substrate in a deflection state, it is difficult to bite air bubbles between the substrate and the reinforcing plate. In addition, since the reinforcing plate is not fixed by suction, the reinforcing plate and the substrate can be bonded in a state where the strain of the reinforcing plate is small. Therefore, it is possible to reduce the bending of the laminate after bonding.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

專利文獻1：日本專利特開2007-326358號公報 Patent Document 1: Japanese Patent Laid-Open No. 2007-326358

專利文獻2：日本專利特開2013-155053號公報 Patent Document 2: Japanese Patent Laid-Open No. 2013-155053

專利文獻2之貼合裝置可大幅地改善於貼合後產生之積層體之彎曲，但對氣泡之咬入難以大幅地改善，存在於貼合後之積層體殘留有氣泡之情形。 The laminating device of Patent Document 2 can greatly improve the bending of the laminated body generated after lamination, but it is difficult to greatly improve the bite of bubbles, and there are cases where bubbles remain in the laminated body after lamination.

本發明係鑑於此種問題而完成者，目的在於提供一種可減少貼合後之積層體之彎曲，且可減少氣泡之殘存數之基板之貼合裝置及貼合方法以及電子裝置之製造方法。 The present invention has been completed in view of such a problem, and an object of the present invention is to provide a substrate bonding apparatus, a bonding method, and an electronic device manufacturing method that can reduce the bending of a laminated body after bonding and can reduce the number of remaining bubbles.

為了達成上述目的，本發明之基板之貼合裝置之一態樣係將第1基板與第2基板隔著吸附層貼合者；且其特徵在於包含：第1滾軸，其將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動邊藉 由第1力將上述第2基板之整面貼附於上述第1基板；及第2滾軸，其對將上述第2基板之整面貼附於上述第1基板之積層體，藉由邊滾動邊賦予較上述第1力大之第2力，將上述第2基板之整面壓接於上述第1基板。 In order to achieve the above object, one aspect of the substrate bonding apparatus of the present invention is the one in which the first substrate and the second substrate are bonded via an adsorption layer; and it is characterized by comprising: a first roller, which connects the second The substrate is pressed against the above-mentioned first substrate in a state of deflection and deformation, while rolling Attaching the entire surface of the second substrate to the first substrate by the first force; and a second roller, which is a laminate for attaching the entire surface of the second substrate to the first substrate The rolling edge imparts a second force greater than the first force, and press-bonds the entire surface of the second substrate to the first substrate.

為了達成上述目的，本發明之基板之貼合方法之一態樣係將第1基板與第2基板隔著吸附層貼合者，且其特徵在於包含：貼附步驟，其藉由第1滾軸將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動上述第1滾軸，邊藉由自上述第1滾軸賦予之第1力，將上述第2基板之整面貼附於上述第1基板；及壓接步驟，其對在上述第1基板貼附有上述第2基板之整面之積層體，藉由邊滾動第2滾軸，邊自上述第2滾軸賦予較上述第1力大之第2力，將上述第2基板之整面壓接於上述第1基板。 In order to achieve the above object, one aspect of the substrate bonding method of the present invention is the one in which the first substrate and the second substrate are bonded via an adsorption layer, and it is characterized by including: a bonding step, which is performed by the first roll The shaft presses the second substrate against the first substrate in a state of flexure deformation, and while rolling the first roller, the second substrate is integrated by the first force applied from the first roller The surface is attached to the first substrate; and a pressure bonding step is performed by rolling the second roller while rolling the second roller on the entire surface of the laminate on which the second substrate is attached to the first substrate The shaft imparts a second force greater than the first force, and press-contacts the entire surface of the second substrate to the first substrate.

根據本發明之一態樣，於貼附步驟中，藉由自第1滾軸賦予之較第2力小之第1力，將第2基板之整面貼附於第1基板，故可減少貼附後之積層體之彎曲。然後，於壓接步驟中，藉由自第2滾軸賦予之較第1力大之第2力，將第2基板之整面壓接於第1基板。由於在壓接步驟中，介存於第1基板與第2基板之間之氣泡係藉由第2力擴散於吸附層之內部，溶入於吸附層之內部，故可減少氣泡之殘存數。 According to one aspect of the present invention, in the attaching step, the entire surface of the second substrate is attached to the first substrate by the first force applied from the first roller, which is smaller than the second force, so it can be reduced The bending of the laminated body after attachment. Then, in the crimping step, the entire surface of the second substrate is crimped to the first substrate by the second force applied from the second roller that is greater than the first force. In the pressure bonding step, the air bubbles interposed between the first substrate and the second substrate are diffused into the interior of the adsorption layer by the second force and dissolved into the interior of the adsorption layer, so the number of remaining air bubbles can be reduced.

因此，根據本發明之一態樣，藉由較第2力小之第1力，將第2基板之整面貼附於第1基板，防止貼附後之彎曲後，藉由較第1力大之第2力，將第2基板之整面壓接於第1基板，減少氣泡之殘存數。 Therefore, according to one aspect of the present invention, the entire surface of the second substrate is attached to the first substrate with the first force smaller than the second force to prevent bending after attachment. A large second force presses the entire surface of the second substrate to the first substrate to reduce the number of remaining bubbles.

本發明之貼合裝置之一態樣，係上述第2滾軸之直徑較佳為較上述第1滾軸之直徑小。 In one aspect of the bonding apparatus of the present invention, the diameter of the second roller is preferably smaller than the diameter of the first roller.

根據本發明之一態樣，藉由將第2滾軸之直徑設為較第1滾軸之直徑小，可獲得較第1力大之第2力(參照赫茲接觸應力公式)。 According to one aspect of the present invention, by setting the diameter of the second roller smaller than the diameter of the first roller, a second force larger than the first force can be obtained (refer to the Hertz contact stress formula).

本發明之貼合裝置之一態樣，係上述第2滾軸之彈性模數較佳為 大於上述第1滾軸之彈性模數。 In one aspect of the bonding device of the present invention, the elastic modulus of the second roller is preferably It is greater than the elastic modulus of the first roller.

根據本發明之一態樣，藉由將第2滾軸之彈性模數設為大於第1滾軸之彈性模數，可獲得較第1力大之第2力(參照赫茲接觸應力公式)。 According to one aspect of the present invention, by setting the elastic modulus of the second roller to be greater than the elastic modulus of the first roller, a second force larger than the first force can be obtained (refer to Hertz contact stress formula).

本發明之貼合裝置之一態樣，係附加於上述第2滾軸之載荷較佳為大於附加於上述第1滾軸之載荷。 In one aspect of the bonding apparatus of the present invention, the load applied to the second roller is preferably greater than the load applied to the first roller.

根據本發明之一態樣，藉由將附加於第2滾軸之載荷設為大於附加於第1滾軸之載荷，可獲得較第1力大之第2力。 According to one aspect of the present invention, by setting the load applied to the second roller to be greater than the load applied to the first roller, a second force larger than the first force can be obtained.

根據本發明之貼合方法之一態樣，上述第1力係將於上述第1滾軸之彈性模數乘以附加於上述第1滾軸之載荷，並將該乘法值除以上述第1滾軸之直徑後之值作為指標；上述第2力係將於上述第2滾軸之彈性模數乘以附加於上述第2滾軸之載荷，並將該乘法值除以上述第2滾軸之直徑後之值作為指標；且較佳為上述第2力之指標較上述第1力之指標大。 According to one aspect of the bonding method of the present invention, the first force is to multiply the elastic modulus of the first roller by the load added to the first roller, and divide the multiplied value by the first The value after the diameter of the roller is used as an index; the second force is to multiply the elastic modulus of the second roller by the load added to the second roller, and divide the multiplied value by the second roller The value after the diameter is used as an index; and it is preferable that the index of the second force is larger than the index of the first force.

根據本發明之一態樣，將滾軸之彈性模數、載荷、及直徑作為參數使用，將第1力及第2力指標化。第1力及第2力係與滾軸之彈性模數及載荷成正比例而變大，與滾軸之直徑成反比例而變小。即，若縮小滾軸之直徑，則力變大。根據本發明之一態樣，藉由選定滾軸之彈性模數、載荷、及直徑，可設定適宜之第1力及第2力。 According to one aspect of the present invention, the elastic modulus, load, and diameter of the roller are used as parameters to index the first force and the second force. The first force and the second force increase in proportion to the elastic modulus and load of the roller, and decrease in inverse proportion to the diameter of the roller. That is, if the diameter of the roller is reduced, the force becomes larger. According to one aspect of the present invention, by selecting the elastic modulus, load, and diameter of the roller, an appropriate first force and second force can be set.

為了達成上述目的，本發明之電子裝置之製造方法之一態樣係包含如下步驟者：積層體製造步驟，其藉由將第1基板與第2基板隔著吸附層貼合而製造積層體；及功能層形成步驟，其係於上述積層體之上述第1基板之露出面形成功能層；及分離步驟，其係自形成有上述功能層之上述第1基板分離上述第2基板，且其特徵在於：上述積層體製造步驟包含：貼附步驟，其藉由第1滾軸將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動上述第1滾軸，邊藉由自上述第 1滾軸賦予之第1力，將上述第2基板之整面貼附於上述第1基板；及壓接步驟，其對在上述第1基板貼附有上述第2基板之整面之積層體，藉由邊使第2滾軸滾動，邊自上述第2滾軸賦予較上述第1力大之第2力，而將上述第2基板之整面壓接於上述第1基板。 In order to achieve the above object, one aspect of the method for manufacturing an electronic device of the present invention includes the following steps: a step of manufacturing a laminate, which manufactures a laminate by bonding the first substrate and the second substrate via an adsorption layer; And a functional layer forming step, which forms a functional layer on the exposed surface of the first substrate of the laminate; and a separation step, which separates the second substrate from the first substrate on which the functional layer is formed, and is characterized The manufacturing process of the laminated body includes an attaching step, which presses the second substrate to the first substrate in a state of flexural deformation with the first roller, and rolls the first roller while Since the above 1 the first force applied by the roller, attaching the entire surface of the second substrate to the first substrate; and a pressure bonding step, which is applied to the laminate having the entire surface of the second substrate attached to the first substrate By rolling the second roller, a second force greater than the first force is applied from the second roller, and the entire surface of the second substrate is pressure-bonded to the first substrate.

根據本發明之一態樣，可提供一種藉由於電子裝置之製造方法之積層體製造步驟應用本發明之貼合方法，而可減少貼合後之積層體之彎曲，且可減少氣泡之殘存數之電子裝置之製造方法。由於以積層體製造步驟製造之積層體其彎曲減少，且氣泡之殘存數亦減少，故於功能層形成步驟中，可於第1基板之露出面形成品質較佳之功能層。 According to one aspect of the present invention, it is possible to provide a laminated body manufacturing step of the manufacturing method of an electronic device by applying the bonding method of the present invention, which can reduce the bending of the laminated body after bonding and can reduce the number of remaining bubbles Manufacturing method of electronic devices. Since the laminated body manufactured in the laminated body manufacturing step has a reduced curvature and a reduced number of remaining bubbles, a functional layer with better quality can be formed on the exposed surface of the first substrate in the functional layer forming step.

根據本發明之基板之貼合裝置及貼合方法以及電子裝置之製造方法，可減少貼合後之積層體之彎曲，且可減少氣泡之殘存數。 According to the substrate bonding device, bonding method and electronic device manufacturing method of the present invention, the bending of the laminated body after bonding can be reduced, and the number of remaining bubbles can be reduced.

1‧‧‧積層體 1‧‧‧Layered body

1A‧‧‧第1積層體 1A‧‧‧Layer 1

1B‧‧‧第2積層體 1B‧‧‧Layer 2

2‧‧‧基板 2‧‧‧ substrate

2a‧‧‧表面 2a‧‧‧surface

2b‧‧‧背面 2b‧‧‧Back

2A‧‧‧基板 2A‧‧‧Substrate

2Aa‧‧‧表面 2Aa‧‧‧Surface

2B‧‧‧基板 2B‧‧‧Substrate

2Ba‧‧‧表面 2Ba‧‧‧Surface

3‧‧‧加強板 3‧‧‧Reinforced board

3a‧‧‧表面 3a‧‧‧surface

3A‧‧‧加強板 3A‧‧‧Reinforced board

3B‧‧‧加強板 3B‧‧‧Reinforced board

4‧‧‧樹脂層 4‧‧‧Resin layer

4A‧‧‧樹脂層 4A‧‧‧Resin layer

4B‧‧‧樹脂層 4B‧‧‧Resin layer

6‧‧‧積層體 6‧‧‧Layered body

7‧‧‧功能層 7‧‧‧Functional layer

10‧‧‧貼附裝置 10‧‧‧ Attaching device

12‧‧‧上平臺 12‧‧‧ on the platform

14‧‧‧下平臺 14‧‧‧ Lower platform

15‧‧‧樹脂薄片 15‧‧‧Resin sheet

16‧‧‧滾軸 16‧‧‧Roller

16A‧‧‧中心軸 16A‧‧‧Central axis

18‧‧‧滾軸 18‧‧‧Roller

20‧‧‧壓接裝置 20‧‧‧crimping device

22‧‧‧氣缸 22‧‧‧Cylinder

24‧‧‧氣缸本體 24‧‧‧Cylinder body

26‧‧‧桿 26‧‧‧

30‧‧‧壓接裝置 30‧‧‧crimping device

32‧‧‧滾軸輸送機 32‧‧‧Roller conveyor

34‧‧‧滾軸 34‧‧‧Roller

36‧‧‧滾軸 36‧‧‧Roller

38‧‧‧氣缸裝置 38‧‧‧Cylinder device

40‧‧‧貼合裝置 40‧‧‧ Laminating device

42‧‧‧機器人 42‧‧‧Robot

44‧‧‧搬送機構 44‧‧‧Transport organization

46‧‧‧投入部 46‧‧‧ Input Department

A‧‧‧箭頭符號 A‧‧‧Arrow symbol

B‧‧‧箭頭符號 B‧‧‧arrow symbol

C‧‧‧箭頭符號 C‧‧‧arrow symbol

D‧‧‧箭頭符號 D‧‧‧arrow symbol

Pmax‧‧‧最大壓力 Pmax‧‧‧Max pressure

圖1係顯示供給於電子裝置之製造步驟之積層體之一例之主要部分放大側視圖。 FIG. 1 is an enlarged side view of a main part showing an example of a laminate supplied to a manufacturing step of an electronic device.

圖2係顯示於LCD之製造步驟之中途製作之積層體之一例之主要部分放大側視圖。 FIG. 2 is an enlarged side view of a main part showing an example of a laminate manufactured in the middle of the LCD manufacturing process.

圖3(A)~(D)係顯示於積層體製造步驟之貼附步驟使用之貼附裝置之主要部分構成之側視圖。 3(A) to (D) are side views showing the configuration of the main parts of the attaching device used in the attaching step of the laminate manufacturing step.

圖4(A)~(D)係顯示於積層體製造步驟之壓接步驟使用之壓接裝置之主要部分構成之側視圖。 4(A) to (D) are side views showing the configuration of the main parts of the crimping device used in the crimping step of the laminate manufacturing step.

圖5係用以說明滾軸表面之最大壓力Pmax之說明圖。 FIG. 5 is an explanatory diagram for explaining the maximum pressure Pmax on the surface of the roller.

圖6係顯示壓接裝置之其他實施形態之側視圖。 6 is a side view showing another embodiment of the crimping device.

圖7係包含圖6所示之壓接裝置之貼合裝置之俯視圖。 7 is a plan view of a laminating device including the crimping device shown in FIG. 6.

以下，根據附加圖式，對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described based on the attached drawings.

以下，針對於電子裝置之製造步驟中使用本發明之基板之貼合裝置及貼合方法之情形進行說明。 Hereinafter, the case where the substrate bonding apparatus and bonding method of the present invention are used in the manufacturing process of an electronic device will be described.

所謂電子裝置，係指顯示面板、太陽能電池、薄膜二次電池等之電子零件。作為顯示面板，可例示液晶顯示面板(LCD：Liquid Crystal Display)、電漿顯示面板(PDP：Plasma Display Panel)、及有機EL顯示面板(OELD：Organic Electro Luminescence Display)。 The so-called electronic devices refer to electronic components such as display panels, solar cells, and thin-film secondary batteries. Examples of the display panel include a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display).

〔電子裝置之製造步驟〕 [Manufacturing steps of electronic device]

電子裝置係藉由於玻璃製、樹脂製、金屬製等之基板之表面形成電子裝置用之功能層(若為LCD，則為薄膜電晶體(TFT)、及彩色濾光片(CF))而製造。 The electronic device is manufactured by forming a functional layer for an electronic device (if it is an LCD, a thin-film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, etc. .

上述基板係於功能層之形成前，其背面貼合於加強板而作為積層體構成。其後，以積層體之狀態於基板之表面(露出面)形成功能層。然後，於功能層之形成後，將加強板自基板剝離。 The substrate is formed before the functional layer is formed, and its back surface is bonded to the reinforcing plate to form a laminate. Thereafter, a functional layer is formed on the surface (exposed surface) of the substrate in the state of a laminate. Then, after the formation of the functional layer, the reinforcing plate is peeled off from the substrate.

即，於電子裝置之製造步驟，包含有：積層體製造步驟，其貼合基板與加強板，製造積層體；功能層形成步驟，其係以積層體之狀態於基板之表面形成功能層；及分離步驟，其係自形成有功能層之基板分離加強板。於上述積層體製造步驟應用本發明之積層體之貼合裝置及貼合方法。 That is, the manufacturing steps of the electronic device include: a layered body manufacturing step that bonds the substrate and the reinforcing plate to manufacture the layered body; a functional layer forming step that forms the function layer on the surface of the substrate in the state of the layered body; and The separation step is to separate the reinforcing plate from the substrate on which the functional layer is formed. The bonding apparatus and bonding method of the laminated body of the present invention are applied to the above-mentioned manufacturing steps of the laminated body.

〔積層體1〕 [Laminate 1]

圖1係顯示積層體1之一例之主要部分放大側視圖。 FIG. 1 is an enlarged side view of a main part showing an example of a laminate 1.

積層體1包含：基板(第1基板)2，其形成有功能層；及加強板(第2基板)3，其加強該基板2。又，加強板3係於表面3a具備作為吸附層之樹脂層4，於樹脂層4貼合基板2之背面2b。即，基板2係藉由作用於與樹脂層4間之凡德瓦力、或樹脂層4之黏著力，隔著樹脂層4可剝離地貼合於加強板3。 The laminate 1 includes: a substrate (first substrate) 2 on which a functional layer is formed; and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. In addition, the reinforcing plate 3 includes a resin layer 4 as an adsorption layer on the front surface 3a, and the back surface 2b of the substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is peelably bonded to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4.

[基板2] [Substrate 2]

基板2係於其表面2a形成功能層。作為基板2，可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、及半導體基板。於該等基板中，玻璃基板由於耐藥品性、耐透湿性較優異，且線性膨脹係數較小，故作為電子裝置用之基板2較佳。又，亦存在隨著線性膨脹係數變小，在高溫下形成之功能層之圖案於冷卻時不容易偏移之優勢。 The substrate 2 forms a functional layer on its surface 2a. Examples of the substrate 2 include glass substrates, ceramic substrates, resin substrates, metal substrates, and semiconductor substrates. Among these substrates, glass substrates are excellent in chemical resistance and moisture permeability resistance, and have a low linear expansion coefficient, so they are preferable as substrates 2 for electronic devices. In addition, as the linear expansion coefficient becomes smaller, the pattern of the functional layer formed at a high temperature is less likely to shift when cooled.

作為玻璃基板之玻璃，可例示無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃、高矽玻璃、及其他以氧化矽為主要成分之氧化物系玻璃。作為氧化物系玻璃，較佳為根據氧化物換算氧化矽之含有量為40~90質量%之玻璃。 As the glass of the glass substrate, there can be exemplified alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass having silicon oxide as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide.

玻璃基板之玻璃較佳為選擇採用適於所製造之電子裝置之種類之玻璃、及適於其製造步驟之玻璃。例如，液晶面板用之玻璃基板較佳為採用實質性不含鹼金屬成分之玻璃(無鹼玻璃)。 The glass of the glass substrate is preferably a glass suitable for the type of electronic device to be manufactured and a glass suitable for its manufacturing process. For example, it is preferable to use glass (alkali-free glass) that does not substantially contain an alkali metal component as the glass substrate for a liquid crystal panel.

基板2之厚度係根據基板2之種類設定。例如，於基板2採用玻璃基板之情形時，為了電子裝置之輕量化、薄板化，其厚度較佳係設定為0.7mm以下，更佳係設定為0.3mm以下，進而較佳係設定為0.1mm以下。於厚度為0.3mm以下之情形時，可賦予玻璃基板以良好之可撓性。進而，於厚度為0.1mm以下之情形時，可將玻璃基板捲繞為滾軸狀，自玻璃基板之製造之觀點、及玻璃基板之處理之觀點而言，其厚度較佳為0.03mm以上。 The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 uses a glass substrate, in order to reduce the weight and thickness of the electronic device, the thickness is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm. the following. When the thickness is 0.3 mm or less, the glass substrate can be given good flexibility. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roller shape, and the thickness is preferably 0.03 mm or more from the viewpoint of manufacturing of the glass substrate and the viewpoint of processing of the glass substrate.

另，於圖1中基板2係以1片基板構成，但基板2亦可為以複數片基板構成者。即，基板2亦可由積層有複數片基板之積層體構成。 In addition, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of plural substrates. That is, the substrate 2 may be composed of a laminate in which a plurality of substrates are laminated.

[加強板3] [Reinforcement board 3]

作為加強板3，可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、及半導體基板。 As the reinforcing plate 3, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified.

加強板3之厚度係設定為0.7mm以下，係根據加強之基板2之種類、厚度等設定。另，加強板3之厚度可較基板2厚，亦可較薄，為了 加強基板2，較佳為0.4mm以上。 The thickness of the reinforcing plate 3 is set to 0.7 mm or less, which is set according to the type and thickness of the reinforced substrate 2. In addition, the thickness of the reinforcing plate 3 may be thicker than the substrate 2 or thinner, in order to The reinforcing substrate 2 is preferably 0.4 mm or more.

另，於本例中，加強板3係以1片基板構成，但加強板3亦可由積層有複數片基板之積層體構成。 In addition, in this example, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may also be composed of a laminate in which a plurality of substrates are laminated.

[樹脂層4] [Resin layer 4]

樹脂層4為了防止於樹脂層4與加強板3間剝離，將其與加強板3間之結合力設定為較與基板2間之結合力高。藉此，於剝離步驟中，樹脂層4與基板2之界面剝離。 In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the binding force between the resin layer 4 and the reinforcing plate 3 is set to be higher than the binding force with the substrate 2. Thereby, in the peeling step, the interface between the resin layer 4 and the substrate 2 is peeled off.

構成樹脂層4之樹脂並無特別限定，可例示丙稀酸樹脂、聚烯烴樹脂、聚胺酯樹脂、聚醯亞胺樹脂、矽氧樹脂、聚醯亞胺矽氧樹脂。亦可混合使用幾個種類之樹脂。其中，自耐熱性及剝離性之觀點而言，較佳為矽氧樹脂、聚醯亞胺矽氧樹脂。 The resin constituting the resin layer 4 is not particularly limited, and examples thereof include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, and polyimide silicone resin. Several types of resins can also be mixed. Among them, from the viewpoint of heat resistance and peelability, silicone resins and polyimide silicone resins are preferred.

樹脂層4之厚度並未特別限定，較佳為設定為1~50μm，更佳為設定為4~20μm。藉由將樹脂層4之厚度設為1μm以上，於樹脂層4與基板2間混入氣泡或異物時，利用樹脂層4之變形，可吸收氣泡或異物之厚度。另一方面，藉由將樹脂層4之厚度設為50μm以下，可縮短樹脂層4之形成時間，進而不會超過需要地使用樹脂層4之樹脂，故而較經濟。 The thickness of the resin layer 4 is not particularly limited, but it is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign substances can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is more economical.

另，樹脂層4之外形較佳為以加強板3可支持樹脂層4之整體之方式，與加強板3之外形相同，或較加強板3之外形小。又，樹脂層4之外形較佳為以樹脂層4可密著基板2之整體之方式，與基板2之外形相同，或較基板2之外形大。 In addition, the outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 in such a manner that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere to the entire substrate 2.

又，於圖1中樹脂層4係以1層構成，但樹脂層4亦可由2層以上構成。於該情形時，構成樹脂層4之所有層之合計厚度成為樹脂層之厚度。又，於該情形時，構成各層之樹脂之種類亦可不同。 In FIG. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer. In this case, the types of resins constituting each layer may also be different.

進而，於實施形態中，作為吸附層，使用有機膜即樹脂層4，亦可代替樹脂層4而使用無機層。構成無機層之無機膜包含自含有例如 金屬矽化物、氮化物、碳化物、及碳氮化物之群選擇之至少1種。 Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, and an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains self-contained At least one type of metal silicide, nitride, carbide, and carbonitride is selected.

此外，圖1之積層體1雖具備樹脂層4作為吸附層，但亦可設為無樹脂層4而包含基板2與加強板3之構成。於該情形時，藉由作用於基板2與加強板3間之凡德瓦力等，可剝離地貼附基板2與加強板3。又，於該情形時，較佳為以避免玻璃基板即基板2與玻璃板即加強板3因高溫而接著之方式，於加強板3之表面3a形成無機薄膜。 In addition, although the laminate 1 of FIG. 1 includes the resin layer 4 as the adsorption layer, it may be configured to include the substrate 2 and the reinforcing plate 3 without the resin layer 4. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by van der Waals force acting between the substrate 2 and the reinforcing plate 3. Furthermore, in this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 in such a manner that the substrate 2 which is a glass substrate and the reinforcing plate 3 which is a glass plate are adhered due to high temperature.

〔形成有功能層之實施形態之積層體6〕 [Layered body 6 of the embodiment in which the functional layer is formed]

藉由經過功能層形成步驟，於積層體1之基板2之表面2a形成功能層。作為功能層之形成方法，可使用CVD(Chemical Vapor Deposition：化學氣相沉積)法、PVD(Physical Vapor Deposition：物理氣相沉積)法等之蒸鍍法、濺鍍法。功能層係藉由光微影法、蝕刻法而形成為特定之圖案。 The functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 by going through the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method can be used. The functional layer is formed into a specific pattern by photolithography and etching.

圖2係顯示於LCD之製造步驟之中途製作之矩形狀之積層體6之一例之主要部分放大側視圖。 FIG. 2 is an enlarged side view of a main part showing an example of a rectangular laminate 6 produced in the middle of the LCD manufacturing process.

積層體6係將加強板3A、樹脂層4A、基板2A、功能層7、基板2B、樹脂層4B、及加強板3B以該順序積層而構成。即，圖2之積層體6係相當於圖1所示之積層體1夾著功能層7而對稱配置之積層體。以下，將包含基板2A、樹脂層4A、及加強板3A之積層體稱為第1積層體1A，將包含基板2B、樹脂層4B、及加強板3B之積層體稱為第2積層體1B。 The laminate 6 is formed by stacking a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. That is, the laminate 6 of FIG. 2 corresponds to the laminate symmetrically arranged with the functional layer 7 in between the laminate 1 shown in FIG. 1. Hereinafter, the laminate including the substrate 2A, the resin layer 4A, and the reinforcement plate 3A is referred to as a first laminate 1A, and the laminate including the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B.

於第1積層體1A之基板2A之表面2Aa形成作為功能層7之薄膜電晶體(TFT)，於第2積層體1B之基板2B之表面2Ba形成作為功能層7之彩色濾光片(CF)。 A thin film transistor (TFT) as a functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminate 1A, and a color filter (CF) as a functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminate 1B .

第1積層體1A與第2積層體1B彼此重合基板2A、2B之表面2Aa、2Ba而一體化。藉此，製造夾著功能層7對稱配置有第1積層體1A與第2積層體1B之構造之積層體6。 The first layered body 1A and the second layered body 1B are superimposed and integrated with the surfaces 2Aa and 2Ba of the substrates 2A and 2B. With this, the laminated body 6 having the structure in which the first laminated body 1A and the second laminated body 1B are symmetrically arranged with the functional layer 7 therebetween is manufactured.

積層體6係於分離步驟藉由刀之刀鋒使剝離開始部形成其界面後，依次剝離加強板3A、3B，其後，安裝偏光板、背光源等，製造製品即LCD。 In the separation step, after the peeling start portion is formed by the blade edge of the separation step to form its interface, the reinforcing plates 3A and 3B are peeled off in sequence, and then a polarizing plate, a backlight, etc. are installed to manufacture an LCD as a product.

〔實施形態之貼合裝置〕 [Lamination device of embodiment]

圖3(A)~(D)係顯示於包含於積層體製造步驟之貼附步驟使用之貼附裝置10之主要部分構成之側視圖，係以時間順序顯示貼附步驟之動作之說明圖。 FIGS. 3(A) to (D) are side views showing the configuration of the main part of the attaching device 10 used in the attaching step included in the manufacturing step of the laminate, and are explanatory views showing the actions of the attaching step in chronological order.

又，圖4(A)~(D)係顯示於包含於積層體製造步驟之壓接步驟使用之壓接裝置20之主要部分構成之側視圖，係以時間順序顯示壓接步驟之動作之說明圖。藉由貼附裝置10與壓接裝置20構成實施形態之貼合裝置。 4 (A) ~ (D) is a side view showing the main part of the structure of the crimping device 20 used in the crimping step included in the manufacturing process of the laminate, showing the operation of the crimping step in chronological order Figure. The sticking device of the embodiment is constituted by the sticking device 10 and the crimping device 20.

又，於上述之積層體製造步驟中，於藉由貼附裝置10進行之貼附步驟後，進行藉由壓接裝置20進行之壓接步驟。另，圖3之貼附裝置10與圖4之壓接裝置20係共通使用於後述之上平臺12、下平臺14、及氣缸裝置22，第1滾軸即圖3之滾軸16、及第2滾軸即圖4之滾軸18係個別使用。 In addition, in the above-mentioned manufacturing process of the laminate, after the attaching step by the attaching device 10, the crimping step by the crimping device 20 is performed. In addition, the attaching device 10 of FIG. 3 and the crimping device 20 of FIG. 4 are commonly used for the upper platform 12, the lower platform 14, and the cylinder device 22 described later, the first roller is the roller 16 of FIG. 3, and the first 2 The roller 18, which is the roller 18 in FIG. 4, is used individually.

<貼附裝置10> <Attachment device 10>

圖3(A)~(D)所示之貼附裝置10係藉由滾軸16將加強板3以因自重而撓曲變形之狀態按壓於基板2，且邊使滾軸16滾動，邊藉由自滾軸16賦予之第1力使加強板3之整面貼附於基板2之裝置。 The attaching device 10 shown in FIGS. 3(A) to (D) presses the reinforcing plate 3 against the substrate 2 in a state of being flexed and deformed by its own weight through the roller 16, and the roller 16 is rolled while rolling The device for attaching the entire surface of the reinforcing plate 3 to the substrate 2 by the first force given by the self-rolling shaft 16.

如圖3(A)，貼附裝置10包含：上平臺12，其係於其下表面真空吸附基板2；及下平臺14，其係配置於上平臺12之下方，且於其上表面載置加強板3。上平臺12之下表面與下平臺14之上表面係設定為平行。又，於下平臺14之上表面具備減少與加強板3之摩擦之樹脂薄片15，於該樹脂薄片15載置加強板3。 As shown in FIG. 3(A), the attaching device 10 includes: an upper platform 12, which is vacuum adsorbed to the substrate 2 on its lower surface; and a lower platform 14, which is disposed below the upper platform 12 and is placed on its upper surface Reinforced board 3. The lower surface of the upper platform 12 and the upper surface of the lower platform 14 are set parallel. In addition, a resin sheet 15 that reduces friction with the reinforcing plate 3 is provided on the upper surface of the lower platform 14, and the reinforcing plate 3 is placed on the resin sheet 15.

另，基板2與加強板3之配置亦可相反。即，亦可於下平臺14載 置基板2，加強板3吸附於上平臺12。又，於貼附裝置10中，較佳為具備相對於上平臺12及下平臺14，交接基板2及加強板3之搬送機構。 In addition, the arrangement of the substrate 2 and the reinforcing plate 3 may also be reversed. That is, it can also be downloaded on the lower platform 14 The base plate 2 is placed, and the reinforcing plate 3 is attracted to the upper platform 12. In addition, in the sticking device 10, it is preferable to include a conveying mechanism for transferring the substrate 2 and the reinforcing plate 3 with respect to the upper platform 12 and the lower platform 14.

貼附裝置10包含：滾軸16，其與載置於下平臺14之加強板3之下表面接觸，使加強板3因自重而撓曲變形；及氣缸裝置22，其藉由滾軸16將撓曲變形之加強板3按壓於吸附於上平臺12之基板2。 The attaching device 10 includes: a roller 16 that contacts the lower surface of the reinforcing plate 3 placed on the lower platform 14 to flexure and deform the reinforcing plate 3 due to its own weight; and a cylinder device 22 that uses the roller 16 to The flexurally deformed reinforcing plate 3 is pressed against the substrate 2 adsorbed on the upper platform 12.

氣缸裝置22包含氣缸本體24、及自氣缸本體24突出設置之桿26。於該桿26之前端，滾軸16係以中心軸16A為中心支持為旋轉自由。 The cylinder device 22 includes a cylinder body 24 and a rod 26 protruding from the cylinder body 24. At the front end of the rod 26, the roller 16 is supported by the center axis 16A as a center for freedom of rotation.

又，貼附裝置10具備使下平臺14、滾軸16、及氣缸裝置22相對於上平臺12之下表面平行且於水平方向一體移動之移動機構(未圖示)。 In addition, the sticking device 10 includes a moving mechanism (not shown) that moves the lower platform 14, the roller 16, and the cylinder device 22 parallel to the lower surface of the upper platform 12 and integrally moves in the horizontal direction.

如圖3(B)，滾軸16藉由使桿26突出，朝箭頭符號A方向上升，接觸載置於下平臺14之加強板3之下表面，使加強板3因自重而撓曲變形。為了抑制加強板3之損傷，滾軸16係由例如金屬製之滾軸本體、及固定於滾軸本體之外周面之橡膠薄片構成，且橡膠薄片係接觸於加強板3之下表面。 As shown in FIG. 3(B), the roller 16 protrudes in the direction of arrow A by protruding the rod 26, and contacts the lower surface of the reinforcing plate 3 placed on the lower platform 14, so that the reinforcing plate 3 deflects due to its own weight. In order to suppress the damage of the reinforcing plate 3, the roller 16 is composed of, for example, a metal roller body and a rubber sheet fixed to the outer peripheral surface of the roller body, and the rubber sheet contacts the lower surface of the reinforcing board 3.

氣缸裝置22將因滾軸16撓曲變形之加強板3按壓於吸附於上平臺12之基板2。即，賦予自氣缸裝置22附加於滾軸16之載荷，藉由該載荷將加強板3經由滾軸16按壓於基板2。 The air cylinder device 22 presses the reinforcing plate 3 deformed by the deflection of the roller 16 against the substrate 2 adsorbed on the upper stage 12. That is, the load given to the roller 16 from the cylinder device 22 is applied, and the reinforcement plate 3 is pressed against the substrate 2 via the roller 16 by the load.

<藉由貼附裝置10進行之貼附方法> <Attaching method by the attaching device 10>

如圖3(B)，滾軸16係於貼附基板2與加強板3時，藉由氣缸裝置22上升，使載置於下平臺14之加強板3撓曲變形，自下方按壓於吸附於上平臺12之基板2。此時，加強板3係藉由第1力被按壓於基板2。又，由於加強板3係以撓曲變形之狀態貼附於基板2，故氣泡難以咬入於基板2與加強板3間。 As shown in FIG. 3(B), when the roller 16 is attached to the base plate 2 and the reinforcing plate 3, the air cylinder device 22 rises to flex and deform the reinforcing plate 3 placed on the lower platform 14, and is pressed against The substrate 2 of the upper platform 12. At this time, the reinforcing plate 3 is pressed against the substrate 2 by the first force. In addition, since the reinforcing plate 3 is attached to the substrate 2 in a flexed state, it is difficult for air bubbles to bite between the substrate 2 and the reinforcing plate 3.

以該狀態、即維持第1力之狀態，如圖3(C)使滾軸16藉由上述移 動機構朝箭頭符號B方向移動，貼附基板2之右半部分與加強板3之右半部分。其後，如圖3(D)，使滾軸16朝箭頭符號C方向移動，貼附基板2之左半部分與加強板3之左半部分。此時，滾軸16邊藉由與加強板3之下表面之間之摩擦而滾動，邊將加強板3之整面藉由第1力貼附於基板2。藉此，加強板3之整面貼附於基板2而製造積層體1。 In this state, that is, the state where the first force is maintained, as shown in FIG. 3(C), the roller 16 is moved by the above The moving mechanism moves in the direction of the arrow symbol B and attaches the right half of the base plate 2 and the right half of the reinforcing plate 3. Thereafter, as shown in FIG. 3(D), the roller 16 is moved in the direction of arrow C, and the left half of the substrate 2 and the left half of the reinforcing plate 3 are attached. At this time, while the roller 16 rolls by friction with the lower surface of the reinforcing plate 3, the entire surface of the reinforcing plate 3 is attached to the substrate 2 by the first force. As a result, the entire surface of the reinforcing plate 3 is attached to the substrate 2 to manufacture the laminate 1.

根據圖3(A)~(D)所示之貼附步驟，由於加強板3係僅載置於下平臺14，未吸附固定於下平臺14，故能以加強板3之應變較少之狀態將加強板3貼附於基板2。藉此，可減少貼合後之積層體1(參照圖3(D))之彎曲。該效果於基板2及加強板3之兩者包含玻璃板之情形時顯著。 According to the attaching steps shown in FIGS. 3(A) to (D), since the reinforcing plate 3 is only placed on the lower platform 14 and is not adsorbed and fixed to the lower platform 14, the strain of the reinforcing plate 3 can be reduced The reinforcing plate 3 is attached to the substrate 2. Thereby, the bending of the laminated body 1 (refer to FIG. 3(D)) after bonding can be reduced. This effect is remarkable when both the substrate 2 and the reinforcing plate 3 include glass plates.

例如，於將玻璃板與剛性較玻璃板低之樹脂板貼合之情形時，由於樹脂板之剛性較玻璃板之剛性低，故於貼合後之樹脂板產生應變且仿效玻璃板，相對於此，由於玻璃板幾乎不會產生應變，故容易變成平板狀，積層體難以彎曲。另一方面，貼合玻璃板彼此之情形時，由於貼合後兩者之玻璃板產生應變，難以仿效一者，故積層體容易彎曲。 For example, in the case of bonding a glass plate to a resin plate having a lower rigidity than the glass plate, since the rigidity of the resin plate is lower than the rigidity of the glass plate, the resin plate after bonding generates strain and imitates the glass plate, as opposed to Therefore, since the glass plate hardly generates strain, it tends to become flat and difficult to bend. On the other hand, when the glass plates are bonded to each other, since the two glass plates are strained after bonding, it is difficult to imitate the one, so the laminate is easily bent.

另，如圖3(B)，貼附開始時之滾軸16係配置於加強板3之距兩側緣等距離之位置，但亦可配置於加強板3之一者之側緣之附近，自該位置向另一者之側緣移動，將加強板3之整面貼附於基板2。 In addition, as shown in FIG. 3(B), the roller 16 at the beginning of the attachment is arranged at a position equidistant from both side edges of the reinforcing plate 3, but it can also be arranged near the side edge of one of the reinforcing plates 3, Moving from this position to the side edge of the other, the entire surface of the reinforcing plate 3 is attached to the substrate 2.

<壓接裝置20> <crimping device 20>

圖4(A)~(D)所示之壓接裝置20係對於將加強板3之整面貼附於基板2之積層體1，藉由邊使滾軸18滾動，邊自滾軸18賦予較上述第1力大之第2力，而將加強板3之整面壓接於基板2之裝置。 The pressure bonding device 20 shown in FIGS. 4(A) to (D) is applied to the laminate 1 that attaches the entire surface of the reinforcing plate 3 to the substrate 2 by rolling the roller 18 while giving it from the roller 18 A device that presses the entire surface of the reinforcing plate 3 to the substrate 2 with a second force greater than the above-mentioned first force.

如圖3(A)，壓接裝置20具備接觸於積層體1之加強板3之下表面且其直徑較滾軸16之直徑小之滾軸18。又，自滾軸18賦予至加強板3之第2力係藉由氣缸裝置22而調整。 As shown in FIG. 3(A), the crimping device 20 includes a roller 18 that contacts the lower surface of the reinforcing plate 3 of the laminate 1 and has a diameter smaller than that of the roller 16. In addition, the second force applied to the reinforcing plate 3 from the roller 18 is adjusted by the cylinder device 22.

<藉由壓接裝置20進行之壓接方法> <Crimping method by crimping device 20>

如圖4(B)，滾軸18於壓接基板2與加強板3時，藉由氣缸裝置22而朝箭頭符號A方向上升，且按壓於吸附於上平臺12之積層體1之加強板3。此時，加強板3係藉由第2力按壓於基板2。 As shown in FIG. 4(B), the roller 18 rises in the direction of the arrow symbol A by the air cylinder device 22 when the substrate 2 and the reinforcing plate 3 are crimped, and presses against the reinforcing plate 3 of the laminate 1 adsorbed on the upper platform 12 . At this time, the reinforcing plate 3 is pressed against the substrate 2 by the second force.

以該狀態、即維持第2力之狀態，如圖4(C)使滾軸18藉由上述移動機構朝箭頭符號B方向移動，壓接基板2之右半部分與加強板3之右半部分。其後，如圖4(D)，使滾軸18朝箭頭符號C方向移動，壓接基板2之左半部分與加強板3之左半部分。此時，滾軸16邊藉由與加強板3之下表面之間之摩擦滾動，邊藉由第2力將加強板3之整面壓接於基板2。藉此，加強板3之整面壓接於基板2。 In this state, that is, the state where the second force is maintained, as shown in FIG. 4(C), the roller 18 is moved in the direction of arrow B by the above-mentioned moving mechanism, and the right half of the substrate 2 and the right half of the reinforcing plate 3 are crimped . Thereafter, as shown in FIG. 4(D), the roller 18 is moved in the direction of the arrow symbol C, and the left half of the substrate 2 and the left half of the reinforcing plate 3 are crimped. At this time, while the roller 16 rolls by friction with the lower surface of the reinforcing plate 3, the entire surface of the reinforcing plate 3 is pressed against the substrate 2 by the second force. As a result, the entire surface of the reinforcing plate 3 is pressed against the substrate 2.

於圖4(A)~(D)所示之壓接步驟中，由於介存於基板2與加強板3間之氣泡係藉由第2力擴散於樹脂層4之內部，溶入樹脂層4之內部，故可減少氣泡之殘存數。 In the pressure bonding step shown in FIGS. 4(A) to (D), since the air bubbles interposed between the substrate 2 and the reinforcing plate 3 are diffused into the resin layer 4 by the second force, and dissolved into the resin layer 4 Inside, it can reduce the number of remaining bubbles.

另，如圖4(B)，壓接開始時之滾軸18係配置於加強板3之距兩側緣等距離之位置，但亦可配置於加強板3之一者之側緣之附近，自該位置向另一者之側緣移動，將加強板3之整面壓接於基板2。 In addition, as shown in FIG. 4(B), the roller 18 at the start of crimping is arranged at an equal distance from the side edges of the reinforcing plate 3, but it can also be arranged near the side edge of one of the reinforcing plates 3, Moving from this position to the side edge of the other, the entire surface of the reinforcing plate 3 is pressure-bonded to the substrate 2.

〔實施形態之貼合裝置之特徵〕 [Features of the bonding device of the embodiment]

於藉由圖3所示之貼附裝置10進行之貼附步驟中，由於藉由自滾軸16賦予之較第2力小之第1力，將加強板3之整面貼附於基板2，故可減少貼附後之積層體1之彎曲。 In the attaching step performed by the attaching device 10 shown in FIG. 3, the entire surface of the reinforcing plate 3 is attached to the substrate 2 due to the first force that is given by the roller 16 smaller than the second force Therefore, the bending of the laminated body 1 after attachment can be reduced.

然後，於藉由圖4(A)~(D)所示之壓接裝置20進行之壓接步驟中，藉由自滾軸18賦予之較第1力大之第2力，將加強板3之整面壓接於基板2。於壓接步驟中，由於介存於基板2與加強板3間之氣泡係藉由第2力擴散於樹脂層4之內部，溶入於樹脂層4之內部，故可減少氣泡之殘存數。 Then, in the crimping step performed by the crimping device 20 shown in FIGS. 4(A) to (D), the reinforcing plate 3 is reinforced by the second force greater than the first force given by the roller 18 The entire surface is pressed onto the substrate 2. In the crimping step, the air bubbles interposed between the substrate 2 and the reinforcing plate 3 are diffused into the inside of the resin layer 4 by the second force and dissolved into the inside of the resin layer 4, so the number of remaining air bubbles can be reduced.

另，若於貼附步驟之前，進行壓接步驟，則由於較第1力大之第2力係賦予至加強板3，故加強板3局部變形，殘留應變，起因於該應 變，於貼合後之積層體1產生彎曲，故而不佳。 In addition, if the crimping step is performed before the attaching step, the second force greater than the first force is applied to the reinforcing plate 3, so the reinforcing plate 3 is locally deformed and residual strain is caused by the stress. The laminated body 1 after the bonding is bent, which is not good.

因此，根據實施形態之貼合裝置，由於藉由較第2力小之第1力將加強板3之整面貼附於基板2，防止貼附後之彎曲後，藉由較第1力大之第2力將加強板3之整面壓接於基板2，故可減少氣泡之殘存數。 Therefore, according to the bonding device of the embodiment, since the entire surface of the reinforcing plate 3 is attached to the substrate 2 by the first force smaller than the second force, after the bending after attachment is prevented, the larger than the first force The second force presses the entire surface of the reinforcing plate 3 to the substrate 2 so that the number of remaining bubbles can be reduced.

又，由於藉由將實施形態之貼附步驟及壓接步驟應用於電子裝置之製造方法之積層體製造步驟，於積層體製造步驟製造之積層體1彎曲減少，且氣泡之殘存數亦減少，故於功能層形成步驟中，可於積層體1之基板2形成品質較佳之功能層。 Furthermore, by applying the attaching step and the crimping step of the embodiment to the laminated body manufacturing step of the manufacturing method of the electronic device, the bending of the laminated body 1 manufactured in the laminated body manufacturing step is reduced, and the number of remaining bubbles is also reduced. Therefore, in the step of forming the functional layer, a functional layer with better quality can be formed on the substrate 2 of the laminate 1.

<第1力及第2力之原理> <Principles of 1st Force and 2nd Force>

所謂第1力及第2力之「力」，係指滾軸16與積層體1之接觸狀態下之最大壓力Pmax。 The “force” of the first force and the second force refers to the maximum pressure Pmax in the state of contact between the roller 16 and the laminate 1.

圖5係用以說明Pmax之說明圖，係於沿著滾軸16之軸向觀察之滾軸16與積層體1之剖視圖記述有滾軸16表面之壓力分佈者。 FIG. 5 is an explanatory diagram for explaining Pmax. It is a cross-sectional view of the roller 16 and the laminate 1 viewed along the axial direction of the roller 16 in which the pressure distribution on the surface of the roller 16 is described.

藉由滾軸16將積層體1加壓之情形時，作用於滾軸16表面之最大壓力Pmax係由以下之赫茲接觸應力公式之簡易式表示。 When the laminated body 1 is pressurized by the roller 16, the maximum pressure Pmax acting on the surface of the roller 16 is represented by the following simple formula of Hertz contact stress formula.

Figure 104139213-A0202-12-0014-1
Figure 104139213-A0202-12-0014-1

此處，Pmax：作用於滾軸16之表面之最大壓力(Pa)，F：滾軸16之載荷(N)，E：滾軸16之楊氏係數(Pa)，R：滾軸16之半徑(m)，W：滾軸16之加壓寬度(m)，π：圓周率。 Here, Pmax: maximum pressure (Pa) acting on the surface of the roller 16, F: load (N) of the roller 16, E: Young's coefficient (Pa) of the roller 16, R: radius of the roller 16 (m), W: pressure width (m) of the roller 16, π: pi.

又，滾軸16之加壓寬度係指圖5之深度方向之長度。於滾軸16之寬度較積層體1之寬度大之情形時，滾軸16之加壓寬度與積層體1之寬度(圖5之深度方向之長度)相等。 The press width of the roller 16 refers to the length in the depth direction of FIG. 5. When the width of the roller 16 is larger than the width of the laminate 1, the press width of the roller 16 is equal to the width of the laminate 1 (the length in the depth direction in FIG. 5 ).

<第1力與第2力之設定方法> <How to set the first force and second force>

作為第1設定方法，可將滾軸18之直徑設為較滾軸16之直徑小。 As a first setting method, the diameter of the roller 18 may be smaller than the diameter of the roller 16.

藉此，可獲得較第1力大之第2力(參照赫茲接觸應力公式)。 Thereby, a second force larger than the first force can be obtained (refer to Hertz contact stress formula).

作為第2設定方法，可將滾軸18之彈性模數設為較滾軸16之彈性模數大。藉此，可獲得較第1力大之第2力(參照赫茲接觸應力公式)。 As a second setting method, the elastic modulus of the roller 18 can be set larger than the elastic modulus of the roller 16. Thereby, a second force larger than the first force can be obtained (refer to Hertz contact stress formula).

作為第3設定方法，將自氣缸裝置22附加於滾軸18之載荷設為較自氣缸裝置22附加於滾軸16之載荷大。藉此，可獲得較第1力大之第2力。 As a third setting method, the load applied to the roller 18 from the cylinder device 22 is set to be larger than the load applied to the roller 16 from the cylinder device 22. By this, a second force larger than the first force can be obtained.

作為第4設定方法，將第1力與第2力指標化，且將第2力之指標值設定為較第1指標值大。 As a fourth setting method, the first force and the second force are indexed, and the index value of the second force is set to be larger than the first index value.

作為該指標值，於滾軸16之彈性模數(MPa)乘以自氣缸裝置22附加於滾軸16之載荷(N)，並將該乘法值除以滾軸16之直徑(d)後之值設為第1力之指標值。相同地，於滾軸18之彈性模數乘以自氣缸裝置22附加於滾軸18之載荷，並將該乘法值除以滾軸18之直徑後之值設為第2力之指標值。 As the index value, the elastic modulus (MPa) of the roller 16 is multiplied by the load (N) added to the roller 16 from the cylinder device 22, and the multiplied value is divided by the diameter (d) of the roller 16 The value is set as the index value of the first force. Similarly, the elastic modulus on the roller 18 is multiplied by the load applied to the roller 18 from the cylinder device 22, and the value obtained by dividing the multiplied value by the diameter of the roller 18 is set as the index value of the second force.

即，將滾軸16、18之彈性模數、自氣缸裝置22附加於滾軸16、18之載荷、及滾軸16、18之直徑作為參數使用，將第1力及第2力指標化。 That is, the elastic modulus of the rollers 16, 18, the load added to the rollers 16, 18 from the cylinder device 22, and the diameter of the rollers 16, 18 are used as parameters to index the first force and the second force.

第1力及第2力之指標值係與上述彈性模數及上述載荷成正比例變大，與上述直徑成反比例而變小。即，若縮小滾軸之直徑，則力變大。因此，藉由基於基板2及加強板3之材質、厚度選定上述彈性模數、上述載荷、及上述直徑，可設定減少彎曲之較佳之第1力、及減少氣泡之殘存數之較佳之第2力。 The index values of the first force and the second force increase in direct proportion to the elastic modulus and the load, and decrease in inverse proportion to the diameter. That is, if the diameter of the roller is reduced, the force becomes larger. Therefore, by selecting the above-mentioned elastic modulus, the above-mentioned load, and the above-mentioned diameter based on the material and thickness of the substrate 2 and the reinforcing plate 3, a better first force for reducing bending and a better second number for reducing the number of remaining bubbles can be set force.

以下之表1係將第1力及第2力指標化之一例。另，該指標值係將滾軸16、18之長度作為1m計算之值。 Table 1 below is an example of indexing the first force and the second force. In addition, the index value is calculated by taking the length of the rollers 16 and 18 as 1 m.

[表1]

Figure 104139213-A0202-12-0016-2
[Table 1]
Figure 104139213-A0202-12-0016-2

<壓接裝置之其他實施形態> <Other embodiments of crimping device>

圖6係顯示壓接裝置30之其他實施形態之側視圖。 FIG. 6 is a side view showing another embodiment of the crimping device 30.

壓接裝置30包含：滾軸輸送機32，其將藉由圖3所示之貼附裝置10製造之積層體1於水平方向搬送；及一對滾軸34、36，其將藉由滾軸輸送機32搬送之積層體1於上下方向挾壓，將第2力賦予於積層體1。滾軸34係藉由積層體1之箭頭符號D方向之搬送，滑接於積層體1之下表面(加強板3)，藉此而從動旋轉。 The crimping device 30 includes: a roller conveyor 32, which transports the laminate 1 manufactured by the attachment device 10 shown in FIG. 3 in the horizontal direction; and a pair of rollers 34, 36, which The laminated body 1 conveyed by the conveyor 32 is pressed in the vertical direction to give the second force to the laminated body 1. The roller 34 is slidably connected to the lower surface of the laminated body 1 (reinforcement plate 3) by conveying in the direction of arrow D of the laminated body 1, and thereby driven to rotate.

另一方面，滾軸36邊藉由滑接於積層體1之上表面(基板2)而從動旋轉，邊藉由自氣缸裝置38附加之載荷而以第2力將基板2按壓於加強板3。 On the other hand, the roller 36 is driven to rotate by sliding contact with the upper surface of the laminate 1 (substrate 2), and presses the substrate 2 against the reinforcing plate with the second force by the load added from the cylinder device 38 3.

藉此，積層體1藉由通過滾軸34、36形成之壓接部，減少氣泡之殘存數。 Thereby, the laminated body 1 reduces the number of remaining bubbles by the pressure-bonded portion formed by the rollers 34 and 36.

圖7係包含圖6所示之壓接裝置30之貼合裝置40之俯視圖。 FIG. 7 is a top view of the bonding device 40 including the crimping device 30 shown in FIG. 6.

貼合裝置40係將圖3所示之貼附裝置10與圖6所示之壓接裝置30分離配置，邊藉由機器人42、搬送機構44、及滾軸輸送機32，將基板2、加強板3、及積層體1朝特定之方向搬送，邊製造減少彎曲及氣泡之積層體1之裝置。 The laminating device 40 separates the attaching device 10 shown in FIG. 3 from the crimping device 30 shown in FIG. 6, and the substrate 2 is reinforced by the robot 42, the transport mechanism 44, and the roller conveyor 32. The board 3 and the laminate 1 are transported in a specific direction, and a device for manufacturing the laminate 1 that reduces bending and air bubbles is manufactured.

基板2及加強板3投入於貼合裝置40之投入部46，其後，藉由機器人42之接收動作、轉動動作及交接動作依次交接於搬送機構44。基板2及加強板3係藉由搬送機構44依次搬送於貼附裝置10，且藉由貼附裝置10而貼附。藉此，減少彎曲之積層體1係藉由貼附裝置10而製造。 The substrate 2 and the reinforcing plate 3 are put into the putting part 46 of the bonding apparatus 40, and then, the receiving operation, the turning operation, and the handing over operation of the robot 42 are sequentially handed over to the transport mechanism 44. The substrate 2 and the reinforcing plate 3 are sequentially transferred to the attaching device 10 by the conveying mechanism 44 and attached by the attaching device 10. With this, the laminated body 1 with reduced bending is manufactured by the sticking device 10.

積層體1係藉由搬送機構44自貼附裝置10取出，且接收於機器人42。此後，積層體1係藉由機器人42交接於滾軸輸送機32，藉由滾軸輸送機32而搬送，且通過滾軸34、36(參照圖6)形成之壓接部。藉此，製造氣泡之殘存數減少之積層體1。 The laminate 1 is taken out from the sticking device 10 by the transfer mechanism 44 and received by the robot 42. After that, the laminated body 1 is transferred to the roller conveyor 32 by the robot 42 and transported by the roller conveyor 32, and is formed by the roller 34 and 36 (refer to FIG. 6). With this, the laminated body 1 in which the remaining number of bubbles is reduced is manufactured.

如圖7之貼合裝置40，藉由分離貼附裝置10與壓接裝置30，可提高積層體1之生產率。 As shown in the bonding device 40 of FIG. 7, by separating the bonding device 10 and the pressure bonding device 30, the productivity of the laminate 1 can be improved.

以上，對本發明之一實施形態進行說明，但本發明不受上述實施形態限制。於專利申請範圍所記述之本發明之要旨之範圍內，可進行各種變化、及變更。 In the above, one embodiment of the present invention has been described, but the present invention is not limited to the above embodiment. Various changes and modifications can be made within the scope of the gist of the invention described in the scope of the patent application.

例如，實施形態之貼附裝置10及壓接裝置20、30係使用於在電子裝置之製造步驟中使用之積層體1之製造，但貼附裝置10及壓接裝置20、30之用途可為多種多樣。 For example, the sticking device 10 and the crimping devices 20 and 30 of the embodiment are used to manufacture the laminated body 1 used in the manufacturing process of the electronic device, but the purpose of the sticking device 10 and the crimping devices 20 and 30 may be Various.

又，本申請案係基於2014年11月25日申請之日本專利申請案2014-237358者，其內容係以引用之方式併入本文中。 In addition, this application is based on the Japanese patent application 2014-237358 filed on November 25, 2014, and the contents thereof are incorporated herein by reference.

1‧‧‧積層體 1‧‧‧Layered body

2‧‧‧基板 2‧‧‧ substrate

3‧‧‧加強板 3‧‧‧Reinforced board

4‧‧‧樹脂層 4‧‧‧Resin layer

12‧‧‧上平臺 12‧‧‧ on the platform

14‧‧‧下平臺 14‧‧‧ Lower platform

15‧‧‧樹脂薄片 15‧‧‧Resin sheet

16A‧‧‧中心軸 16A‧‧‧Central axis

18‧‧‧滾軸 18‧‧‧Roller

20‧‧‧壓接裝置 20‧‧‧crimping device

22‧‧‧氣缸 22‧‧‧Cylinder

24‧‧‧氣缸本體 24‧‧‧Cylinder body

26‧‧‧桿 26‧‧‧

A‧‧‧箭頭符號 A‧‧‧Arrow symbol

B‧‧‧箭頭符號 B‧‧‧arrow symbol

C‧‧‧箭頭符號 C‧‧‧arrow symbol

Claims (7)

一種基板之貼合裝置，其係將第1基板與第2基板隔著吸附層貼合者，且其特徵在於包含：第1滾軸，其將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動邊藉由第1力將上述第2基板之整面貼附於上述第1基板；及第2滾軸，其對於上述第2基板之整面被貼附在上述第1基板之積層體，藉由邊滾動邊對該積層體賦予較上述第1力大之第2力，將上述第2基板之整面壓接於上述第1基板。 A substrate bonding device which bonds the first substrate and the second substrate via an adsorption layer, and is characterized by comprising: a first roller, which presses the second substrate in a state of deflection and deformation The first substrate, and the entire surface of the second substrate is attached to the first substrate by the first force while rolling; and the second roller is attached to the entire surface of the second substrate In the laminate of the first substrate, a second force greater than the first force is applied to the laminate while rolling, and the entire surface of the second substrate is pressure-bonded to the first substrate. 如請求項1之基板之貼合裝置，其中上述第2滾軸之直徑小於上述第1滾軸之直徑。 The substrate bonding apparatus according to claim 1, wherein the diameter of the second roller is smaller than the diameter of the first roller. 如請求項1之基板之貼合裝置，其中上述第2滾軸之彈性模數大於上述第1滾軸之彈性模數。 The substrate bonding apparatus according to claim 1, wherein the elastic modulus of the second roller is greater than the elastic modulus of the first roller. 如請求項1之基板之貼合裝置，其中附加於上述第2滾軸之載荷大於附加於上述第1滾軸之載荷。 The substrate bonding apparatus according to claim 1, wherein the load applied to the second roller is greater than the load applied to the first roller. 一種基板之貼合方法，其係將第1基板與第2基板隔著吸附層貼合者，且其特徵在於包含：貼附步驟，其藉由第1滾軸將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動上述第1滾軸，邊藉由自上述第1滾軸賦予之第1力，將上述第2基板之整面貼附於上述第1基板；及壓接步驟，其對於上述第2基板之整面被貼附在上述第1基板之積層體，藉由邊使第2滾軸滾動，邊自上述第2滾軸對該積層體賦予較上述第1力大之第2力，將上述第2基板之整面壓接於上述第1基板。 A method for bonding substrates, which is a method in which a first substrate and a second substrate are bonded via an adsorption layer, and is characterized by comprising: a step of flexing the second substrate by a first roller The deformed state is pressed against the first substrate, and while rolling the first roller, the entire surface of the second substrate is attached to the first substrate by the first force applied from the first roller; And a pressure-bonding step, in which the entire surface of the second substrate is attached to the laminate of the first substrate, and by rolling the second roller, the laminated body The second force with the largest first force press-contacts the entire surface of the second substrate to the first substrate. 如請求項5之基板之貼合方法，其中上述第1力係將上述第1滾軸之彈性模數乘以附加於上述第1滾軸之載荷，並將該乘法值除以上述第1滾軸之直徑而得之值作為指標；上述第2力係將上述第2滾軸之彈性模數乘以附加於上述第2滾軸之載荷，並將該乘法值除以上述第2滾軸之直徑而得之值作為指標；且上述第2力之指標較上述第1力之指標大。 The substrate bonding method according to claim 5, wherein the first force is the elastic modulus of the first roller multiplied by the load added to the first roller, and the multiplied value is divided by the first roller The value obtained from the diameter of the shaft is used as an indicator; the second force is to multiply the elastic modulus of the second roller by the load added to the second roller, and divide the multiplied value by the value of the second roller The value derived from the diameter is used as an index; and the index of the second force is larger than the index of the first force. 一種電子裝置之製造方法，其係包含如下步驟者：積層體製造步驟，其藉由將第1基板與第2基板隔著吸附層貼合而製造積層體；及功能層形成步驟，其係於上述積層體之上述第1基板之露出面形成功能層；及分離步驟，其係自形成有上述功能層之上述第1基板分離上述第2基板，且其特徵在於：上述積層體製造步驟包含：貼附步驟，其藉由第1滾軸將上述第2基板以撓曲變形之狀態按壓於上述第1基板，且邊滾動上述第1滾軸，邊藉由自上述第1滾軸賦予之第1力，將上述第2基板之整面貼附於上述第1基板；及壓接步驟，其對於上述第2基板之整面被貼附在上述第1基板之積層體，邊使第2滾軸滾動，邊藉由自上述第2滾軸對該積層體賦予較上述第1力大之第2力，將上述第2基板之整面壓接於上述第1基板。 A method of manufacturing an electronic device, comprising the following steps: a layered body manufacturing step, which manufactures a layered body by bonding a first substrate and a second substrate via an adsorption layer; and a functional layer forming step, which is A functional layer is formed on the exposed surface of the first substrate of the laminate; and a separation step is to separate the second substrate from the first substrate on which the functional layer is formed, and characterized in that the laminate manufacturing step includes: The attaching step of pressing the second substrate against the first substrate in a state of deflection and deformation by the first roller, and rolling the first roller while passing the first roller 1 force, attaching the entire surface of the second substrate to the first substrate; and a pressure bonding step, which is to attach the entire surface of the second substrate to the laminate of the first substrate, while making the second roll When the shaft is rolled, a second force greater than the first force is applied to the laminate from the second roller, so that the entire surface of the second substrate is pressure-bonded to the first substrate.
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Families Citing this family (8)

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CN107039329B (en) * 2017-03-22 2019-12-17 上海凯虹科技电子有限公司 packaging method of small-size package body for thin substrate and package body
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JP6733966B2 (en) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 Board assembly apparatus and board assembly method
US12030281B2 (en) 2019-03-29 2024-07-09 Nitto Denko Corporation Method for manufacturing glass resin laminated body
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US11858244B2 (en) 2020-09-15 2024-01-02 Chengdu Boe Optoelectronics Technology Co., Ltd. Laminating device, laminating method thereof, flexible display module and display device
CN114005370B (en) * 2021-11-19 2024-02-20 云谷（固安）科技有限公司 Bonding device and bonding method
CN114248529B (en) * 2021-12-16 2023-10-27 武汉天马微电子有限公司 Flexible screen laminating device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1606142A (en) * 2003-10-10 2005-04-13 松下电器产业株式会社 Electronic circuit device and its manufacturing method and device
JP2007326358A (en) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd Thin glass laminate, process for manufacturing display apparatus using the same, and supporting glass substrate
JP2009040617A (en) * 2007-08-06 2009-02-26 Kuraimu Prod Kk Method and apparatus for sticking plate glass

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720415A (en) * 1985-07-30 1988-01-19 Kimberly-Clark Corporation Composite elastomeric material and process for making the same
CN1300630C (en) * 2003-03-27 2007-02-14 友达光电股份有限公司 Assembling method of component elements of liquid crystal display device
KR101808629B1 (en) * 2011-06-15 2018-01-18 클라임 프로덕츠 가부시키가이샤 Precision workpiece gluing device and precision workpiece gluing method
JP5311527B1 (en) * 2013-04-04 2013-10-09 株式会社Ｆｕｋ Pasting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1606142A (en) * 2003-10-10 2005-04-13 松下电器产业株式会社 Electronic circuit device and its manufacturing method and device
JP2007326358A (en) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd Thin glass laminate, process for manufacturing display apparatus using the same, and supporting glass substrate
JP2009040617A (en) * 2007-08-06 2009-02-26 Kuraimu Prod Kk Method and apparatus for sticking plate glass

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