CN113299582A - Packaging method and cover plate attaching jig - Google Patents
Packaging method and cover plate attaching jig Download PDFInfo
- Publication number
- CN113299582A CN113299582A CN202110476897.5A CN202110476897A CN113299582A CN 113299582 A CN113299582 A CN 113299582A CN 202110476897 A CN202110476897 A CN 202110476897A CN 113299582 A CN113299582 A CN 113299582A
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- attached
- cover plate
- glue
- laminating
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention relates to a packaging method and a cover plate attaching jig, wherein the packaging method comprises the following steps: (1) providing a cover plate to be attached and a substrate to be attached; (2) coating glue on the upper surface of the substrate to be attached; (3) treat the laminating apron with treat that the laminating base plate is along being on a parallel with treat the direction relative motion of laminating base plate upper surface, treat the laminating apron will treat that the glue part on the laminating base plate pushes away from just treat the lower surface of laminating apron overcome its frictional force that receives with treat that the laminating is in the same place after sliding contact between the surplus glue on the base plate, accomplish treat the laminating apron with treat the laminating of laminating base plate. According to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached and the substrate to be attached are attached together after being in smooth contact with glue, so that no bubbles are generated in the attaching process, and the yield of products is improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging method and a cover plate attaching jig.
Background
In the field of liquid crystal display and photoelectric display technology, the attachment of a chip cover plate is an important technology, and along with the rapid development of semiconductor technology, the application of the attachment technology of the chip cover plate is more and more extensive. The laminating of present chip cover plate generally adopts the direct attached process route of apron top-down, and the apron is direct towards the chip, and the in-process can produce a small amount of bubbles and remain in solidifying gluey, influences the product yield, leads to the fault rate of product to increase, seriously influences the cost, consequently how to reduce the production of laminating in-process bubble, is the problem that needs the solution in this field urgently.
Disclosure of Invention
Therefore, the invention aims to provide a packaging method and a cover plate attaching jig, wherein the cover plate to be attached is pushed from the side surface to push away the sacrificial colloid, so that the attachment of the chip and the cover plate to be attached is completed, and no bubble is generated in the attachment process.
In order to solve the technical problem, the invention provides a packaging method, which comprises the following steps:
(1) providing a cover plate to be attached and a substrate to be attached;
(2) coating glue on the upper surface of the substrate to be attached;
(3) treat the laminating apron with treat that the laminating base plate is along being on a parallel with treat the direction relative motion of laminating base plate upper surface, treat the laminating apron will treat that the glue part on the laminating base plate pushes away from just treat the lower surface of laminating apron overcome its frictional force that receives with treat that the laminating is in the same place after sliding contact between the surplus glue on the base plate, accomplish treat the laminating apron with treat the laminating of laminating base plate.
Further, in step (2), first glue is coated on the upper surface of the substrate to be attached, then second glue is coated on the upper surface of the first glue, the viscosity of the second glue is smaller than that of the first glue, in step (3), the second glue on the substrate to be attached is pushed away, and the lower surface of the cover plate to be attached is attached to the first glue on the substrate to be attached after sliding contact.
Further, in step (3), treat that the laminating apron will treat that the glue part on the base plate of laminating pushes away from just treat that the lower surface of laminating apron overcomes its frictional force that receives with treat the in-process of sliding contact between the surplus glue on the laminating base plate, treat that the laminating apron keeps the tilt state, promptly treat that the laminating apron dorsad one end upwarping of frictional force direction makes treat the laminating apron lower surface with treat that the laminating base plate upper surface forms the contained angle.
Further, the included angle is set to be greater than 0 ° and equal to or less than 1 °.
The invention also provides another technical scheme: the utility model provides an apron laminating tool, is including being used for the fixed last anchor clamps of treating the apron of laminating and being used for the fixed lower anchor clamps of treating the laminating base plate, go up anchor clamps with down anchor clamps along with the setting of the parallel direction relative motion of the upper surface of treating the laminating base plate, the lower surface of treating the laminating apron overcome its frictional force that receives with treat to laminate and laminate together after sliding contact between the glue on the base plate.
Furthermore, the lower surface of the cover plate to be attached, which is fixed by the upper clamp, is back to one end in the direction of the friction force is upwarped, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
Further, the included angle is greater than 0 ° and less than or equal to 1 °.
Furthermore, the side surface of the cover plate to be attached comprises a first side surface back to the direction of the friction force, and a first isolation component used for isolating the first side surface from the glue on the substrate to be attached is arranged on the outer side of the first side surface.
Furthermore, the side surface of the cover plate to be attached comprises two second side surfaces parallel to the friction direction, and a second isolation component used for isolating the second side surfaces from the glue on the substrate to be attached is arranged on the outer sides of the second side surfaces.
Furthermore, the lower clamp is provided with a glue drawing channel for guiding out glue pushed away or overflowed between the substrate to be attached and the cover plate to be attached.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1) according to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached and the substrate to be attached are attached together after being in water-level smooth contact with glue, so that no bubbles are generated in the attaching process, and the yield of products is improved;
2) according to the packaging method and the cover plate attaching jig disclosed by the invention, two layers of glue with different viscosities are coated, so that the treatment difficulty and cost of the pushed-off glue are reduced as much as possible on the premise that the cover plate to be attached can be in smooth and movable contact with the glue on the substrate to be attached;
3) according to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached is slightly inclined, so that the rear end of the cover plate can be kept in an attaching state with a colloid after the front end of the cover plate pushes the colloid away;
4) according to the packaging method and the cover plate attaching jig disclosed by the invention, the first isolation part and the second isolation part are arranged, the glue overflowing from the three sides is separated by the first isolation part and the second isolation part, so that redundant glue is prevented from being arranged on the side edges of the cover plate and the substrate, the interference of residual glue on a chip is reduced, and the stability of a product is improved;
5) according to the packaging method and the cover plate attaching jig disclosed by the invention, the glue extracting pipeline is adopted, so that the interference of residual glue on the chip is further reduced, and the stability of the product is increased.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which
FIG. 1 is a schematic diagram of a cover plate to be bonded to prepare for pushing glue on a substrate to be bonded according to the present invention;
FIG. 2 is a schematic working diagram of the cover plate to be bonded for pushing glue on the substrate to be bonded according to the present invention;
FIG. 3 is a schematic view of the bonding operation between the cover plate to be bonded and the substrate to be bonded according to the present invention;
FIG. 4 is a front view of the cover plate attaching jig disclosed in the present invention;
FIG. 5 is a top view of the cover plate attaching jig disclosed in the present invention;
FIG. 6 is a side view of the upper clamp of the present disclosure;
FIG. 7 is a side view of the upper clamp of the present disclosure.
The specification reference numbers indicate: 10. a cover plate is to be attached; 11. a first side surface; 12. a second side surface; 20. a substrate to be bonded; 30. glue; 31. first glue; 32. second glue; 40. an upper clamp; 50. a lower clamp; 51. a glue pumping channel; 52. a base plate; 53. a side plate; 60. a first isolation member; 70. a second isolation member; 81. a guide wheel assembly; 82. a guide groove.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Example one
Referring to fig. 1-3, as illustrated therein, a method of packaging includes the steps of:
(1) providing a cover plate 10 to be attached and a substrate 20 to be attached;
(2) coating glue 30 on the upper surface of the substrate 20 to be attached;
(3) the cover plate 10 to be attached and the substrate 20 to be attached move relatively in the direction parallel to the upper surface of the substrate 20 to be attached, the cover plate 10 to be attached pushes away the glue 30 on the substrate 20 to be attached partially, the lower surface of the cover plate 10 to be attached overcomes the friction force F applied by the lower surface of the cover plate 10 to be attached, and the lower surface of the cover plate 10 to be attached is attached to the residual glue on the substrate 20 to be attached after sliding contact is carried out, and the attachment of the cover plate 10 to be attached and the substrate 20 to be attached is completed.
In the above, theoretically, the substrate to be attached may be fixed and the cover plate to be attached may move, the cover plate to be attached may be fixed and the substrate to be attached may move, and the substrate to be attached and the cover plate to be attached may both move. The optimization mode can be selected according to actual production needs. The substrate to be bonded is generally fixed and the cover plate to be bonded is moved. The cover plate to be attached and the substrate to be attached are attached together after the glue water level smooth contact, so that no bubbles are generated in the attaching process, and the yield of products is improved.
In a preferred embodiment of this embodiment, in step (2), first glue 31 is coated on the upper surface of the substrate 20 to be bonded, then second glue 32 is coated on the upper surface of the first glue 31, the viscosity of the second glue 32 is smaller than that of the first glue 31, in step (3), the second glue 32 on the substrate 20 to be bonded is pushed away, and the lower surface of the cover plate 10 to be bonded is bonded to the first glue 31 on the substrate 20 to be bonded after sliding contact.
In the above, two layers of glue with different viscosities are coated, the viscosity of the pushed-off second glue is lower, the viscosity of the first glue left between the cover plate to be attached and the substrate to be attached is higher, and the processing difficulty and cost of the pushed-off glue are reduced as much as possible on the premise of ensuring that the cover plate to be attached can be in smooth movable contact with glue on the substrate to be attached and the bonding performance of the residual glue.
In the preferred embodiment of the present embodiment, one end of the cover plate 10 to be attached, which is back to the direction of the friction force F, is tilted upward, so that an included angle is formed between the lower surface of the cover plate 10 to be attached and the upper surface of the substrate 20 to be attached.
In the above, because machining tolerance or installation tolerance, the lower surface of waiting to laminate the apron is difficult to accomplish completely horizontally, waits to laminate the apron at the in-process that the side direction flat push was laminated, can appear waiting that the front end of laminating the apron pushes away from behind the glue, waits the rear end of laminating the apron and the contactless condition between the glue of process, leads to the side direction flat push laminating effect unsatisfactory. Through will treating the laminating apron and set up to the slight slope, guarantee that the apron front end pushes away the colloid after, apron rear end can keep the laminating state with the colloid.
In a preferred embodiment of the present invention, the angle is greater than 0 ° and equal to or less than 1 °.
The included angle cannot be too large, otherwise, the lateral flat pushing and fitting effect is not ideal. The included angle is only a slight inclination angle.
Referring to fig. 4 to 7, as shown in the drawings, a cover plate attaching jig includes an upper fixture 40 for fixing a cover plate 10 to be attached and a lower fixture 50 for fixing a substrate 20 to be attached, the upper fixture 40 and the lower fixture 50 are arranged to move relatively in a direction parallel to an upper surface of the substrate 20 to be attached, and a lower surface of the cover plate 10 to be attached is attached to the glue on the substrate 20 to be attached after overcoming a friction force applied thereto so as to be in sliding contact with the glue.
In the above, theoretically, the substrate to be attached may be fixed and the cover plate to be attached may move, the cover plate to be attached may be fixed and the substrate to be attached may move, and the substrate to be attached and the cover plate to be attached may both move. The optimization mode can be selected according to actual production needs. The substrate to be bonded is generally fixed and the cover plate to be bonded is moved. The cover plate to be attached and the substrate to be attached are attached together after the glue water level smooth contact, so that no bubbles are generated in the attaching process, and the yield of products is improved.
In the preferred embodiment of the present embodiment, one end of the lower surface of the to-be-bonded cover plate 10 fixed by the upper fixture 40, which is opposite to the direction of the friction force F, is tilted upward, so that an included angle is formed between the lower surface of the to-be-bonded cover plate 10 and the upper surface of the to-be-bonded substrate 20.
In the above, because machining tolerance or installation tolerance, the lower surface of waiting to laminate the apron is difficult to accomplish completely horizontally, waits to laminate the apron at the in-process that the side direction flat push was laminated, can appear waiting that the front end of laminating the apron pushes away from behind the glue, waits the rear end of laminating the apron and the contactless condition between the glue of process, leads to the side direction flat push laminating effect unsatisfactory. Through will treating the laminating apron and set up to the slight slope, guarantee that the apron front end pushes away the colloid after, apron rear end can keep the laminating state with the colloid.
In a preferred embodiment of the present invention, the angle is greater than 0 ° and equal to or less than 1 °. For example 1 deg. or 0.5 deg..
In the preferred embodiment of the present invention, the side surface of the cover plate 10 to be attached includes a first side surface 11 facing away from the direction of the friction force F, and a first isolation member 60 is disposed outside the first side surface 11 for isolating the first side surface from the glue on the substrate 20 to be attached.
In the preferred embodiment of the present invention, the side surface of the cover plate 10 to be attached includes two second side surfaces 12 parallel to the direction of the friction force F, and the second side surfaces 12 are provided with second isolation members 70 for isolating the second side surfaces from the glue on the substrate 20 to be attached.
In the above, glue does not contact with the side edge of the cover plate to be attached, so that the side edges of the cover plate and the base plate are prevented from being provided with redundant glue, the interference of the residual glue on the chip is reduced, and the stability of the product is improved.
In the preferred embodiment of the present invention, the lower fixture 50 is provided with a glue-extracting channel 51 for guiding out the glue pushed or overflowed from between the substrate 20 to be attached and the cover plate 10 to be attached.
In the above, the redundant glue which is pushed away or overflowed is drawn out in time, so that the interference of the residual glue on the chip is further reduced, and the stability of the product is improved.
Specifically, the upper jig 40 guides the wheel assembly 81, and the lower jig 50 is provided with a guide groove 82, and the guide wheel assembly 81 moves in the guide groove 82.
The cover plate 10 to be attached is vacuum-absorbed on the upper clamp;
the first isolation component 60 covers the whole surface of the first side surface 11 and is used for pushing the pushed glue on the substrate to be attached, the first isolation component is arranged as an isolation strip and is relatively fixed with the upper clamp, and the lower end of the first isolation component 60 is approximately flush with the upper surface of the substrate 20 to be attached;
the second isolation component 70 covers the whole surface of the second side surface 12, or nearly covers the area of the second side surface close to the first side surface, and is used for pushing the part of the substrate to be attached, which is overflowed by the pushed-away glue, the first isolation component is set as an isolation strip or an isolation column, the second isolation component is relatively fixed with the upper clamp, and the lower end of the second isolation component 70 is approximately flush with the lower surface of the cover plate 10 to be attached;
the lower jig 50 includes a bottom plate 52 placed horizontally and a side plate 53 standing vertically, and the bottom plate 52 and the side plate 53 enclose a semi-closed space open at the top and open at one side.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A method of packaging, comprising the steps of:
(1) providing a cover plate to be attached and a substrate to be attached;
(2) coating glue on the upper surface of the substrate to be attached;
(3) treat the laminating apron with treat that the laminating base plate is along being on a parallel with treat the direction relative motion of laminating base plate upper surface, treat the laminating apron will treat that the glue part on the laminating base plate pushes away from just treat the lower surface of laminating apron overcome its frictional force that receives with treat that the laminating is in the same place after sliding contact between the surplus glue on the base plate, accomplish treat the laminating apron with treat the laminating of laminating base plate.
2. The packaging method according to claim 1, wherein in the step (2), a first glue is coated on the upper surface of the substrate to be bonded, and then a second glue is coated on the upper surface of the first glue, the viscosity of the second glue is lower than that of the first glue, in the step (3), the second glue on the substrate to be bonded is pushed away, and the lower surface of the cover plate to be bonded is bonded to the first glue on the substrate to be bonded after sliding contact is made between the lower surface of the cover plate to be bonded and the first glue on the substrate to be bonded.
3. The packaging method according to claim 1, wherein in the step (3), in a process that the cover plate to be attached pushes away the glue portion on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force applied to the lower surface of the cover plate to be attached so as to be in sliding contact with the residual glue on the substrate to be attached, the cover plate to be attached is kept in an inclined state, that is, one end of the cover plate to be attached, which is back to the direction of the friction force, is tilted upwards, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
4. The encapsulation method according to claim 3, wherein the angle is set to be greater than 0 ° and equal to or less than 1 °.
5. The utility model provides a apron laminating tool which characterized in that: including being used for the fixed last anchor clamps of treating the laminating apron and being used for the fixed lower anchor clamps of treating the laminating base plate, go up anchor clamps with down anchor clamps along with the setting of the parallel direction relative motion of the upper surface of treating the laminating base plate, the lower surface of treating the laminating apron overcome its frictional force that receives with the laminating is in the same place after sliding contact between the glue on treating the laminating base plate.
6. The cover plate attaching jig according to claim 5, wherein one end of the lower surface of the cover plate to be attached, which is fixed by the upper jig, facing away from the direction of the frictional force is raised, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
7. The cover plate attaching jig according to claim 6, wherein the included angle is greater than 0 ° and less than or equal to 1 °.
8. The cover plate attaching jig according to claim 5, wherein the side surface of the cover plate to be attached includes a first side surface facing away from the direction of the frictional force, and a first isolation member for isolating the first side surface from the glue on the substrate to be attached is provided on an outer side of the first side surface.
9. The cover plate attaching jig according to claim 5, wherein the side surface of the cover plate to be attached includes two second side surfaces parallel to the direction of the friction force, and a second isolating member for isolating the second side surfaces from the glue on the substrate to be attached is provided on the outer side of the second side surfaces.
10. The cover plate attaching jig according to claim 5, wherein the lower jig is provided with a glue extracting channel for guiding out glue pushed away or overflowed from between the substrate to be attached and the cover plate to be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110476897.5A CN113299582B (en) | 2021-04-29 | 2021-04-29 | Packaging method and cover plate attaching jig |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110476897.5A CN113299582B (en) | 2021-04-29 | 2021-04-29 | Packaging method and cover plate attaching jig |
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| CN113299582A true CN113299582A (en) | 2021-08-24 |
| CN113299582B CN113299582B (en) | 2023-08-25 |
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| CN112382593A (en) * | 2020-11-27 | 2021-02-19 | 苏州茂特斯自动化设备有限公司 | Tool apron of blanking machine is torn open and is closed mechanism in chip assembly |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW515062B (en) * | 2001-12-28 | 2002-12-21 | Delta Optoelectronics Inc | Package structure with multiple glue layers |
| TW200913180A (en) * | 2007-09-12 | 2009-03-16 | Tpk Touch Solutions Inc | Substrate-laminating apparatus |
| CN102300407A (en) * | 2010-06-23 | 2011-12-28 | 昆山意力电路世界有限公司 | Gum bubble-free fitting jig |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113299582B (en) | 2023-08-25 |
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