CN114242870B - Wafer support, wafer support plate and wafer packaging method - Google Patents
Wafer support, wafer support plate and wafer packaging method Download PDFInfo
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- CN114242870B CN114242870B CN202111583072.XA CN202111583072A CN114242870B CN 114242870 B CN114242870 B CN 114242870B CN 202111583072 A CN202111583072 A CN 202111583072A CN 114242870 B CN114242870 B CN 114242870B
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- dam body
- wafer
- glue
- brush
- dam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
A wafer support plate comprises a substrate unit, a plurality of first dam body units arranged on the substrate unit and a plurality of second dam body units arranged on the substrate unit, wherein a plurality of second dam body units are arranged between every two adjacent first dam body units, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units; a crystal fixing area is formed between every two adjacent first dam body units and every two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, the height of each second dam body unit is larger than that of a wafer to be crystal fixed, and a second glue sealing area is formed in the crystal fixing area and the area, located between every two first dam body units, of the top of each second dam body unit. The wafer support plate is cut into wafer supports after die bonding and glue sealing. By adopting the scheme, the wafer can be quickly and efficiently sealed, the consistency of the sealing glue amount and the smoothness of the glue surface are ensured, and in addition, the invention also provides a corresponding packaging method.
Description
Technical Field
The invention relates to the technical field of wafer packaging, in particular to a wafer support, a wafer support plate and a wafer packaging method.
Background
The existing wafers are packaged in a dispensing mode, and by adopting the mode, the consistency of the glue sealing amount among the wafers and the smoothness of a glue surface cannot be ensured, so that improvement is needed.
Disclosure of Invention
The invention aims to provide a wafer support, a wafer support plate and a wafer packaging method, which can realize fast and efficient glue sealing of a wafer and ensure the consistency of glue sealing amount and the smoothness of a glue surface. In order to achieve the purpose, the invention adopts the following technical scheme:
a wafer support comprises a substrate and a cofferdam arranged on the substrate, wherein the cofferdam comprises two first dam bodies arranged at intervals and two second dam bodies arranged at intervals, a die bonding area is formed in the cofferdam, the height of each second dam body is smaller than that of each first dam body, the height of each second dam body is larger than that of a wafer to be die bonded, and a first glue sealing area is formed in the die bonding area and the area, located between the two first dam bodies, of the top of each second dam body.
Furthermore, a chamfer is arranged on the inner side of the top of the first dam body, the chamfer forms a glue overflow groove, and packaging glue is arranged in the first glue sealing area.
Further, the substrate comprises two bonding pads and an insulator arranged between the two bonding pads, a forward-mounted wafer or a flip-chip wafer is arranged in the die attach region, and the topmost end of a gold wire of the forward-mounted wafer is lower than the top of the second dam body.
A wafer support plate comprises a substrate unit, a plurality of first dam body units and a plurality of second dam body units, wherein the first dam body units are arranged on the substrate unit and are arranged at intervals along the X-axis direction, the second dam body units are arranged on the substrate unit and are arranged at intervals along the Y-axis direction, the first dam body units extend along the Y-axis direction, the second dam body units are arranged between every two adjacent first dam body units along the Y-axis direction, the second dam body units extend along the X-axis direction, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units; a crystal bonding area is formed between every two adjacent first dam body units and every two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, the height of each second dam body unit is larger than that of a wafer to be subjected to crystal bonding, and a second glue sealing area is formed in an area, located between the two first dam body units, of the crystal bonding area and the top of each second dam body unit.
Furthermore, a chamfer is arranged on the inner side of the top of the first dam body unit, the chamfer forms a glue overflow groove, and packaging glue is arranged in the second glue sealing area.
A wafer packaging method adopting the wafer support plate comprises the following steps:
(1) fixing a wafer in a wafer fixing area on the support plate;
(2) the glue brushing plate moves between two adjacent first dam body units along the Y axis to brush packaging glue on a second glue sealing area between the two adjacent first dam body units, and the bottom end of the glue brushing plate is located above the second dam body unit.
Further, the method also comprises the following steps:
(3) drying the packaging adhesive;
(4) and cutting the packaged support plate to form a single packaged wafer.
Further, in the step (4), cutting is performed in the Y-axis direction at the middle position of the first dam unit and in the X-axis direction at the middle position of the second dam unit, and the support plate is cut into a plurality of package wafers.
Further, still include the brush and glue and assist the utensil, the brush is glued and is assisted the utensil and include backplate mechanism and last brush offset plate mechanism down, backplate mechanism includes the bounding wall down, sets up the backplate that sets up at a plurality of intervals of bounding wall inboard, the backplate corresponds the top that covers at first dam body unit, form the brush between the backplate and glue the district, go up brush offset plate mechanism and glue the seat and set up a plurality of brush offset plates in brush offset plate bottom including the brush, the brush offset plate stretches into in the brush offset plate district when the brush is glued.
By adopting the scheme, the height of the second dam body unit is greater than that of the wafer to be die-bonded and is smaller than that of the first dam body unit. Therefore, after die bonding in the die bonding area of the support plate, the glue brushing plate can move back and forth between the two adjacent first dam body units, so that quick glue brushing of the second glue sealing area is realized, and further quick glue sealing of a plurality of die bonding areas between the two first dam body units is realized.
After the glue brushing is finished, cutting is carried out at the middle position of the first dam body unit along the Y-axis direction and cutting is carried out at the middle position of the second dam body unit along the X-axis direction, the support plate is divided into a plurality of packaged wafers after the packaging is finished, and the packaging quality of each packaged wafer is consistent.
Drawings
FIG. 1 is a schematic view of a wafer support plate.
Fig. 2 is an enlarged schematic view of a point a in fig. 1.
FIG. 3 is a schematic view of the apron down mechanism.
Fig. 4 is a schematic view of a glue application aid.
Fig. 5 is an enlarged view of B in fig. 4.
Fig. 6 is a schematic view of a stent.
Fig. 7 is a side schematic view of a stent.
FIG. 8 is a diagram of a packaged wafer.
Detailed Description
The invention is described below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 8, a wafer support plate 1 includes a substrate unit 2, a plurality of first dam units 3 disposed on the substrate unit 2 and spaced along an X-axis direction, and a plurality of second dam units 4 disposed on the substrate unit 2 and spaced along a Y-axis direction, wherein the first dam units 3 extend along the Y-axis direction, a plurality of second dam units 4 are disposed between two adjacent first dam units 3 along the Y-axis direction, the second dam units 4 extend along the X-axis direction, and two ends of each second dam unit 4 extend to two adjacent first dam units 3; a crystal fixing area 5 is formed between two adjacent first dam body units 3 and two adjacent second dam body units 4, the height of each second dam body unit 4 is smaller than that of the corresponding first dam body unit 3, the height of each second dam body unit 4 is larger than that of a wafer 8 to be crystal-fixed, a second glue sealing area 6 is formed in an area, located between the two first dam body units 3, of the top of each crystal fixing area 5 and the top of each second dam body unit 4, a chamfer is arranged on the inner side of the top of each first dam body unit 3, and a glue overflow groove 7 is formed by the chamfer.
A method for packaging a wafer 8 by using the wafer support plate 1 comprises the following steps:
(1) fixing a wafer 8 in the wafer fixing area 5 on the support plate;
(2) assist utensil brush through the brush glue and glue, the brush glue is assisted the utensil and is included backplate mechanism 9 and last brush apron mechanism 10 down, backplate mechanism 9 includes bounding wall 11 down, the backplate 12 that sets up a plurality of intervals in 11 inboards of bounding wall, backplate 12 corresponds the top that covers at first dam body unit 3, form brush between the backplate 12 and glue district 13, go up brush glue mechanism and include brush glue seat 14 and set up a plurality of brush plywood 15 in brush glue seat 14 bottoms, brush plywood 15 stretches into in brush glue district 13 when the brush is glued. Moving the glue brushing plate 15 between two adjacent first dam body units 3 along the Y axis to brush the second glue sealing area 6 between the two adjacent first dam body units 3 with the packaging glue 16, wherein the bottom end of the glue brushing plate 15 is positioned above the second dam body unit 4;
(3) drying the packaging adhesive 16;
(4) and cutting the packaged support plate 1 to form a single packaged wafer. Specifically, the support plate is cut in the Y-axis direction at the middle position of the first dam unit 3 and in the X-axis direction at the middle position of the second dam unit 4, and the support plate is cut into a plurality of package chips.
After forming the single packaged wafer, the wafer support 17 has the following structure: the support 17 comprises a base plate 18 and a cofferdam arranged on the base plate 18, the cofferdam comprises two first dam bodies 19 arranged at intervals and two second dam bodies 20 arranged at intervals, the first dam bodies 19 and the second dam bodies 20 are formed by cutting the first dam body units 3 and the second dam body units 4, a die bonding area 5 is formed in the cofferdam, the height of the second dam bodies 20 is smaller than that of the first dam bodies 19, the height of the second dam bodies 20 is larger than that of wafers 8 to be die bonded, and a first glue sealing area 21 is formed in an area between the two first dam bodies 19 at the tops of the die bonding area 5 and the second dam bodies 20. The inner side of the top of the first dam body 19 is provided with a chamfer which forms a glue overflow groove 7, and the first glue sealing area 21 is provided with packaging glue 16.
The substrate 18 includes two bonding pads 22 and an insulator 23 disposed between the two bonding pads 22, a front mounted wafer 8 or a flip chip 8 is disposed in the die attach region 5, and if the wafer 8 is the front mounted wafer 8, the topmost end of the gold wires of the front mounted wafer 8 is lower than the top of the second dam 20.
By adopting the scheme, the height of the second dam body unit 4 is greater than that of the wafer 8 to be die-bonded and is less than that of the first dam body unit 3. Therefore, after die bonding in the die bonding area 5 of the support plate, the glue brushing plate 15 can move back and forth between the two adjacent first dam body units 3, so that quick glue brushing of the second glue sealing area 6 is realized, and then quick glue sealing of the plurality of die bonding areas 5 between the two first dam body units 3 is realized.
After the glue brushing is finished, cutting is carried out at the middle position of the first dam body unit 3 along the Y-axis direction and cutting is carried out at the middle position of the second dam body unit 4 along the X-axis direction, the support plate is divided into a plurality of packaged wafers after the packaging is finished, and the packaging quality of each packaged wafer is consistent.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, as it will be apparent to those skilled in the art that various modifications, combinations and variations can be made in the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A wafer support, comprising: the cofferdam comprises a substrate and a cofferdam arranged on the substrate, wherein the cofferdam comprises two first dam bodies arranged at intervals and two second dam bodies arranged at intervals, a crystal fixing area is formed in the cofferdam, the height of each second dam body is smaller than that of each first dam body, the height of each second dam body is larger than that of a wafer to be crystal fixed, and a first glue sealing area is formed in an area between the two first dam bodies and at the top of each second dam body.
2. The wafer carrier as recited in claim 1, wherein: and a chamfer is arranged on the inner side of the top of the first dam body, the chamfer forms a glue overflow groove, and packaging glue is arranged in the first glue sealing area.
3. The wafer carrier as recited in claim 1, wherein: the substrate comprises two bonding pads and an insulator arranged between the two bonding pads, a forward-mounted wafer or a flip chip is arranged in the die bonding area, and the topmost end of a gold wire of the forward-mounted wafer is lower than the top of the second dam body.
4. A wafer support plate, comprising: the dam body structure comprises a base plate unit, a plurality of first dam body units and a plurality of second dam body units, wherein the first dam body units are arranged on the base plate unit and are arranged at intervals along the X-axis direction, the second dam body units are arranged on the base plate unit and are arranged at intervals along the Y-axis direction, the first dam body units extend along the Y-axis direction, the second dam body units are arranged between every two adjacent first dam body units along the Y-axis direction, the second dam body units extend along the X-axis direction, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units;
a crystal fixing area is formed between every two adjacent first dam body units and every two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, the height of each second dam body unit is larger than that of a wafer to be crystal fixed, and a second glue sealing area is formed in an area, located between every two first dam body units, of the crystal fixing area and the top of each second dam body unit.
5. The wafer carrier plate of claim 4, wherein: and a chamfer is arranged on the inner side of the top of the first dam body unit, the chamfer forms a glue overflow groove, and packaging glue is arranged in the second glue sealing area.
6. A method for packaging a wafer by using the wafer support plate of any one of claims 4 and 5, wherein: the method comprises the following steps:
(1) fixing a wafer in a wafer fixing area on the support plate;
(2) the glue brushing plate moves between two adjacent first dam body units along the Y axis to brush packaging glue on a second glue sealing area between the two adjacent first dam body units, and the bottom end of the glue brushing plate is located above the second dam body unit.
7. The wafer packaging method according to claim 6, wherein: further comprising the steps of:
(3) drying the packaging adhesive;
(4) and cutting the packaged support plate to form a single packaged wafer.
8. The wafer packaging method according to claim 7, wherein: and (4) cutting the middle position of the first dam body unit along the Y-axis direction and the middle position of the second dam body unit along the X-axis direction, and cutting the support plate into a plurality of packaging wafers.
9. The wafer packaging method according to claim 6, wherein: still glue and assist the utensil including the brush, the brush is glued and is assisted the utensil and include backplate mechanism and last brush apron mechanism down, backplate mechanism includes the bounding wall down, sets up the backplate that sets up at a plurality of intervals of bounding wall inboard, the backplate corresponds the top that covers at first dam body unit, it glues the district to form the brush between the backplate, go up brush apron mechanism and glue the seat and set up a plurality of brush slabs in brush gluey seat bottom including the brush, the brush slab extends into the brush when the brush glues and glues in the district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111583072.XA CN114242870B (en) | 2021-12-22 | 2021-12-22 | Wafer support, wafer support plate and wafer packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111583072.XA CN114242870B (en) | 2021-12-22 | 2021-12-22 | Wafer support, wafer support plate and wafer packaging method |
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| Publication Number | Publication Date |
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| CN114242870A CN114242870A (en) | 2022-03-25 |
| CN114242870B true CN114242870B (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111583072.XA Active CN114242870B (en) | 2021-12-22 | 2021-12-22 | Wafer support, wafer support plate and wafer packaging method |
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