CN217444415U - Packaging support, packaging support plate and LED lamp bead - Google Patents
Packaging support, packaging support plate and LED lamp bead Download PDFInfo
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- CN217444415U CN217444415U CN202123246584.5U CN202123246584U CN217444415U CN 217444415 U CN217444415 U CN 217444415U CN 202123246584 U CN202123246584 U CN 202123246584U CN 217444415 U CN217444415 U CN 217444415U
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Abstract
A packaging support plate comprises a substrate unit, a plurality of first dam body units arranged on the substrate unit at intervals along the X-axis direction, and a plurality of second dam body units arranged on the substrate unit at intervals along the Y-axis direction, wherein the first dam body units extend along the Y-axis direction, a plurality of second dam body units are arranged between every two adjacent first dam body units along the Y-axis direction, the second dam body units extend along the X-axis direction, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units; and a crystal fixing area is formed between two adjacent first dam body units and two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, and the height of each second dam body unit is larger than that of a wafer to be crystal fixed. And after the packaging support plate is subjected to die bonding and packaging, cutting to form the LED lamp beads. By adopting the scheme, the quick and efficient glue sealing of the wafer can be realized, and the consistency of the glue sealing amount and the smoothness of the glue surface are ensured.
Description
Technical Field
The utility model belongs to the technical field of the wafer packaging technology and specifically relates to a encapsulation support, LED lamp pearl and encapsulation mounting panel.
Background
The existing wafers are packaged in a dispensing mode, and by adopting the mode, the consistency of the glue sealing amount among the wafers and the smoothness of a glue surface cannot be ensured, so that improvement is needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a packaging support, LED lamp pearl and packaging support plate can realize that wafer high efficiency seals the glue to guarantee to seal the uniformity of gluing the volume and the planarization of gluing the face. In order to achieve the above purpose, the utility model adopts the following technical scheme:
a packaging support comprises a substrate and a cofferdam arranged on the substrate, wherein the cofferdam comprises two first dam bodies arranged at intervals and two second dam bodies arranged at intervals, a die bonding area is formed in the cofferdam, the height of each second dam body is smaller than that of each first dam body, and the height of each second dam body is larger than that of a wafer to be die bonded.
Furthermore, a chamfer is arranged on the inner side of the top of the first dam body, and the chamfer forms a glue overflow groove.
Further, the substrate comprises two bonding pads and an insulator arranged between the two bonding pads, a forward-mounted wafer or a flip-chip wafer is arranged in the die attach region, and the topmost end of a gold wire of the forward-mounted wafer is lower than the top of the second dam body.
The utility model provides an adopt aforementioned LED lamp pearl of encapsulation support, package support and wafer, the wafer sets up in the solid crystal district of support, solid crystal district and second dam body top are located the regional first district of sealing that forms between two first dam bodies, it has the encapsulation glue to fill in the first district of sealing, the jiao miao height that encapsulates the glue is less than the top surface of first dam body or with the top surface parallel and level of first dam body.
A packaging support plate comprises a substrate unit, a plurality of first dam body units arranged on the substrate unit at intervals along the X-axis direction, and a plurality of second dam body units arranged on the substrate unit at intervals along the Y-axis direction, wherein the first dam body units extend along the Y-axis direction, a plurality of second dam body units are arranged between every two adjacent first dam body units along the Y-axis direction, the second dam body units extend along the X-axis direction, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units; and a crystal fixing area is formed between every two adjacent first dam body units and every two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, and the height of each second dam body unit is larger than that of a wafer to be crystal fixed.
Furthermore, a chamfer is arranged on the inner side of the top of the first dam body unit, the chamfer forms a glue overflow groove, and packaging glue is arranged in the second glue sealing area.
Furthermore, a second glue sealing area is formed in the die bonding area and the area, located between the two first dam body units, of the top of the second dam body unit, a wafer is arranged in the die bonding area, and packaging glue is filled in the second glue sealing area.
Furthermore, the middle position of the first dam body unit is cut along the Y-axis direction, the middle position of the second dam body unit is cut along the X-axis direction, and the support plate is cut into a plurality of LED lamp beads.
By adopting the technical scheme, the height of the second dam body unit is greater than that of the wafer to be die-bonded and is smaller than that of the first dam body unit. Therefore, after die bonding in the die bonding area of the support plate, the glue brushing plate can move back and forth between the two adjacent first dam body units, so that quick glue brushing of the second glue sealing area is realized, and further quick glue sealing of a plurality of die bonding areas between the two first dam body units is realized.
After the glue brushing is finished, cutting is carried out at the middle position of the first dam body unit along the Y-axis direction and cutting is carried out at the middle position of the second dam body unit along the X-axis direction, the support plate is divided into a plurality of LED lamp beads after the packaging is finished, and the packaging quality of each LED lamp bead is consistent.
Drawings
Fig. 1 is a schematic view of a package tray board.
Fig. 2 is an enlarged schematic view of a point a in fig. 1.
FIG. 3 is a schematic view of the apron down mechanism.
Fig. 4 is a schematic view of a glue application aid.
Fig. 5 is an enlarged schematic view of B in fig. 4.
Fig. 6 is a schematic view of a stent.
Fig. 7 is a side schematic view of a stent.
FIG. 8 is a schematic view of an LED lamp bead.
Detailed Description
The present invention will be described with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 8, a package support plate 1 includes a substrate unit 2, a plurality of first dam units 3 disposed on the substrate unit 2 and spaced along an X-axis direction, and a plurality of second dam units 4 disposed on the substrate unit 2 and spaced along a Y-axis direction, where the first dam units 3 extend along the Y-axis direction, a plurality of second dam units 4 are disposed between two adjacent first dam units 3 along the Y-axis direction, the second dam units 4 extend along the X-axis direction, and two ends of each second dam unit 4 extend to two adjacent first dam units 3; a crystal fixing area 5 is formed between two adjacent first dam body units 3 and two adjacent second dam body units 4, the height of each second dam body unit 4 is smaller than that of the corresponding first dam body unit 3, the height of each second dam body unit 4 is larger than that of a wafer 8 to be crystal-fixed, a second glue sealing area 6 is formed in an area, located between the two first dam body units 3, of the top of each crystal fixing area 5 and the top of each second dam body unit 4, a chamfer is arranged on the inner side of the top of each first dam body unit 3, and a glue overflow groove 7 is formed by the chamfer.
A method for packaging a wafer 8 by adopting the packaging support plate 1 comprises the following steps:
(1) fixing a wafer 8 in the wafer fixing area 5 on the support plate;
(2) assist utensil brush through the brush glue and glue, the brush glue is assisted the utensil and is included backplate mechanism 9 and last brush apron mechanism 10 down, backplate mechanism 9 includes bounding wall 11 down, the backplate 12 that sets up a plurality of intervals in 11 inboards of bounding wall, backplate 12 corresponds the top that covers at first dam body unit 3, form brush between the backplate 12 and glue district 13, go up brush glue mechanism and include brush glue seat 14 and set up a plurality of brush plywood 15 in brush glue seat 14 bottoms, brush plywood 15 stretches into in brush glue district 13 when the brush is glued. Moving the glue brushing plate 15 between two adjacent first dam body units 3 along the Y axis to brush the second glue sealing area 6 between the two adjacent first dam body units 3 with the packaging glue 16, wherein the bottom end of the glue brushing plate 15 is positioned above the second dam body unit 4;
(3) drying the packaging adhesive 16;
(4) and cutting the packaged support plate 1 to form a single LED lamp bead. Specifically, the support plate is cut into a plurality of LED lamp beads at the middle position of the first dam body unit 3 along the Y-axis direction and at the middle position of the second dam body unit 4 along the X-axis direction.
After a single LED lamp bead is formed, the structure of the packaging support 17 is as follows: the support 17 comprises a base plate 18 and a cofferdam arranged on the base plate 18, the cofferdam comprises two first dam bodies 19 arranged at intervals and two second dam bodies 20 arranged at intervals, the first dam bodies 19 and the second dam bodies 20 are formed by cutting the first dam body units 3 and the second dam body units 4, a die bonding area 5 is formed in the cofferdam, the height of the second dam bodies 20 is smaller than that of the first dam bodies 19, the height of the second dam bodies 20 is larger than that of wafers 8 to be die bonded, and a first glue sealing area 21 is formed in an area between the two first dam bodies 19 at the tops of the die bonding area 5 and the second dam bodies 20. The inner side of the top of the first dam body 19 is provided with a chamfer which forms a glue overflow groove 7, and the first glue sealing area 21 is provided with packaging glue 16.
The substrate 18 includes two bonding pads 22 and an insulator 23 disposed between the two bonding pads 22, a front mounted wafer 8 or a flip chip 8 is disposed in the die attach region 5, and if the wafer 8 is the front mounted wafer 8, the topmost end of the gold wires of the front mounted wafer 8 is lower than the top of the second dam 20.
By adopting the scheme, the height of the second dam body unit 4 is greater than that of the wafer 8 to be die-bonded and is less than that of the first dam body unit 3. Therefore, after die bonding in the die bonding area 5 of the support plate, the glue brushing plate 15 can move back and forth between the two adjacent first dam body units 3, so that quick glue brushing of the second glue sealing area 6 is realized, and then quick glue sealing of the plurality of die bonding areas 5 between the two first dam body units 3 is realized.
After the glue brushing is finished, cutting is carried out at the middle position of the first dam body unit 3 along the Y-axis direction and cutting is carried out at the middle position of the second dam body unit 4 along the X-axis direction, the support plate is divided into a plurality of LED lamp beads after the packaging is finished, and the packaging quality of each LED lamp bead is consistent.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, which may be modified, combined, and varied by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (8)
1. A package support, comprising: the cofferdam comprises a substrate and a cofferdam arranged on the substrate, wherein the cofferdam comprises two first dam bodies arranged at intervals and two second dam bodies arranged at intervals, a crystal fixing area is formed in the cofferdam, the height of each second dam body is smaller than that of each first dam body, and the height of each second dam body is larger than that of a wafer to be crystal fixed.
2. The package support of claim 1, wherein: and a chamfer is arranged on the inner side of the top of the first dam body and forms a glue overflow groove.
3. The package support of claim 1, wherein: the substrate comprises two bonding pads and an insulator arranged between the two bonding pads, a forward-mounted wafer or a flip chip is arranged in the die bonding area, and the topmost end of a gold wire of the forward-mounted wafer is lower than the top of the second dam body.
4. An LED lamp bead using the packaging support of any one of claims 1-3, wherein: the wafer is arranged in a die bonding area of the support, a first glue sealing area is formed in an area between two first dam bodies and located at the top of the die bonding area and the top of the second dam body, packaging glue is filled in the first glue sealing area, and the height of a glue surface of the packaging glue is lower than the top surface of the first dam body or is flush with the top surface of the first dam body.
5. A package tray, comprising: the dam body structure comprises a base plate unit, a plurality of first dam body units and a plurality of second dam body units, wherein the first dam body units are arranged on the base plate unit and are arranged at intervals along the X-axis direction, the second dam body units are arranged on the base plate unit and are arranged at intervals along the Y-axis direction, the first dam body units extend along the Y-axis direction, the second dam body units are arranged between every two adjacent first dam body units along the Y-axis direction, the second dam body units extend along the X-axis direction, and two ends of each second dam body unit extend to the positions of every two adjacent first dam body units;
and a crystal fixing area is formed between every two adjacent first dam body units and every two adjacent second dam body units, the height of each second dam body unit is smaller than that of each first dam body unit, and the height of each second dam body unit is larger than that of a wafer to be crystal fixed.
6. The package support board of claim 5, wherein: and a chamfer is arranged on the inner side of the top of the first dam body unit and forms a glue overflow groove.
7. The package support board of claim 5, wherein: and a second glue sealing area is formed in the die bonding area and the area, between the two first dam body units, of the top of the second dam body unit, a wafer is arranged in the die bonding area, and packaging glue is filled in the second glue sealing area.
8. The package support board of claim 7, wherein: and cutting the middle position of the first dam body unit along the Y-axis direction and cutting the middle position of the second dam body unit along the X-axis direction, and cutting the support plate into a plurality of LED lamp beads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123246584.5U CN217444415U (en) | 2021-12-22 | 2021-12-22 | Packaging support, packaging support plate and LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123246584.5U CN217444415U (en) | 2021-12-22 | 2021-12-22 | Packaging support, packaging support plate and LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217444415U true CN217444415U (en) | 2022-09-16 |
Family
ID=83209803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123246584.5U Active CN217444415U (en) | 2021-12-22 | 2021-12-22 | Packaging support, packaging support plate and LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217444415U (en) |
-
2021
- 2021-12-22 CN CN202123246584.5U patent/CN217444415U/en active Active
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