JP3140061U - Substrate bonding equipment - Google Patents

Abstract

The present invention provides a substrate bonding apparatus that stably bonds substrates and does not shift their positions.
A joint guide portion is formed by forming a concave space between opposing side walls, having an upper surface of the concave space as an open surface, and forming a gas extraction path communicating with the concave space. And is formed in the concave space 32 of the bonding guide portion 31 to support both ends of the flexible substrate 2 and between the flexible substrate 2 and the bonding surface of the target substrate 1 installed in the concave space 32. A flexible board support structure 34 that forms a pitch of the flexible board 4, and a flexible plate 4 that forms an airtight joining chamber 37 between the flexible board 2 and the concave space 32 of the joining guide part 31 on the opening surface of the joining guide part 31. Consists of.
[Selection] Figure 2

Description

The present invention relates to a substrate sticking device, and more particularly to a device for joining a flexible substrate having flexibility to another substrate.

Currently, cellular phones, personal digital assist (PDA), video / audio 3C products, and the like that are widely used generally have at least two different types of substrates bonded to their image display device or touch panel. In the conventional substrate bonding technique, an optical adhesive 12 is applied in advance to the bonding surface 11 of the substrate 1 as disclosed in FIG. Next, a pressure is applied to the pressure contact surface II of the flexible substrate 2 using the roller 3 that rotates in a single direction in order to bond the flexible substrate 2 to the bonding surface 11 of the substrate 1. Pressing and bonding to the bonding surface 11 of the substrate 1 by the optical adhesive 12. In this case, the intervening air is discharged from the opened one end.

As described above, the method of pressing and bonding substrates using a roller has the following drawbacks. That is, the roller has a mechanical structure, and the limitation due to the cycle time is a limitation on the number of joining operations. In addition, since it has an edge effect in which the pressure is concentrated at the corners, the gas is covered by the joint surface, and a defect reduction that forms bubbles is generated.

In view of such drawbacks, the eyeglass lens manufacturing facility disclosed in US Pat. No. 6,106,665 is coated with a light-transmitting flexible film on both upper and lower surfaces of a synthetic lens having optical curvature. The surrounding lens is wrapped around, and a synthetic lens is joined in the state of progress.

U.S. Pat. No. 5,501,910 discloses a technique for forming a laminated structure of glass and a thin plastic plate in a vacuum bag. In this case, in addition to extracting gas in the same manner and performing bonding in a vacuum state, pressure is applied by a metal cover plate to bond the plastic plate and glass.

However, the technique disclosed in the above-mentioned US Pat. No. 6,106,665 performs bonding in an enclosed space, and the technique disclosed in US Pat. No. 5,501,910 is performed in a vacuum bag. None of them proposes a joining guide part that achieves stable joining work. Therefore, the technologies disclosed in both of the above-mentioned patents cannot avoid the situation where the positions of the substrates are shifted and bonded in the bonding process.

In addition, the techniques disclosed in both of the above-mentioned patents, except that vacuum pressure is used, only apply a small amount of pressure using a cover plate, and the bonding surfaces of the substrates are brought into a completely intimate state. Thus, there is no design of a structure that further applies external pressure to join the same.

Further, the technique disclosed in US Pat. No. 6,106,665 is a technique that is applied only for the production of eyeglasses, and is applied to the production of image display devices, touch panels, etc., or other substrate bonding techniques. It is not included in the scope of application.
United States Patent 5,501,910 United States Patent No. 6,106,665

An object of the present invention is to provide a substrate bonding apparatus that includes a jig that achieves stable bonding of substrates, stably bonds the substrates, and does not shift its position.

Moreover, this invention makes it a subject to provide the board | substrate joining apparatus which can closely_contact | adhere both board | substrates, when joining a board | substrate.

Furthermore, an object of the present invention is to provide a substrate bonding apparatus that can be applied to bonding various plate materials and the like.

Therefore, as a result of intensive research in view of the drawbacks found in the prior art, the present inventor has formed a concave space between opposite side walls, the upper surface of the concave space is an opening surface, and the concave space is formed in the concave space. A joining guide portion that forms a gas extraction path that communicates with each other, and is formed in a recessed space of the joining guide portion, supports both ends of the flexible substrate, and is installed in the flexible substrate and the recessed space. A flexible board support structure that forms a predetermined pitch between the flexible board and a flexible board that forms an airtight joint chamber between the flexible board and the concave space of the joint guide part. The present invention has been completed based on such knowledge, focusing on the point that the problem can be solved by the substrate bonding apparatus that bonds the flexible substrate to the bonding surface of the target substrate.

Hereinafter, this device will be specifically described.

The substrate bonding apparatus according to claim 1 is a substrate bonding apparatus for bonding a flexible substrate to a bonding surface of a target substrate, wherein a concave space is formed between opposite side walls, and an upper surface of the concave space is opened. A joint guide portion formed as a surface and forming a gas extraction path communicating with the concave space, and formed in the concave space of the joint guide portion, supporting both ends of the flexible substrate, and the flexible substrate and the A flexible substrate support structure having a predetermined pitch between the bonding surface of the target substrate installed in the concave space, and an opening surface of the bonding guide portion between the flexible substrate and the concave space of the bonding guide portion. And a flexible plate that forms an airtight joining chamber.

The substrate bonding apparatus described above uses a vacuum extraction device from the hermetic bonding chamber formed between the flexible substrate and the bonding guide, and extracts a gas through the gas extraction path to form a vacuum state. In this case, the flexible substrate is deformed and depressed downward under the action of the vacuum pressure of the flexible substrate, the flexible substrate is pressed downward, and the bottom surface of the flexible substrate is bonded to the bonding surface of the target substrate.

According to a second aspect of the present invention, there is provided the substrate bonding apparatus according to the first aspect, wherein a hole is formed in the bottom surface of the fitting jig according to the first aspect, an extrusion structure is provided in the hole, and air in the hermetic bonding chamber is extracted. The push-out structure part is configured to push the other target substrate upward by a predetermined distance so that the target substrate is completely bonded to the bottom surface of the flexible substrate.

According to a third aspect of the present invention, there is provided the substrate bonding apparatus according to the first aspect, wherein the substrate bonding apparatus according to the first aspect is located on the opening surface and the flexible plate tightly covers the opening surface of the bonding guide portion. Further included.

According to a fourth aspect of the present invention, there is provided a substrate bonding apparatus in which an exhaust hole is formed at an appropriate position of the bonding guide portion according to the first aspect.

According to a fifth aspect of the present invention, the flexible substrate supporting structure according to the first aspect is formed in a stepped manner on at least a pair of opposing side walls forming the concave space of the bonding guide portion.

In the substrate bonding apparatus described in claim 6, the flexible plate in claim 1 is replaced by a flexible plate.

The substrate bonding apparatus according to claim 7 is a substrate bonding apparatus for bonding a flexible substrate to a bonding surface of a target substrate, wherein a concave space is formed between opposite side walls, and an upper surface of the concave space is opened. An airtight joint chamber between the flexible substrate and the concave space of the joint guide portion, the joint guide portion formed with a gas extraction path communicating with the concave space and the opening surface of the joint guide portion. And a flexible plate to be formed.

According to the above-described substrate bonding apparatus, a vacuum extraction device is used from the hermetic bonding chamber formed between the flexible substrate and the bonding guide portion, and a gas is extracted through the gas extraction path to obtain a vacuum state. In this case, the flexible substrate is deformed under the action of the vacuum pressure of the flexible substrate and is depressed downward, the flexible substrate is pressed downward, and the bottom surface of the flexible substrate is bonded to the bonding surface of the target substrate.

According to an eighth aspect of the present invention, there is provided a substrate bonding apparatus, wherein a hole is formed in the bottom surface of the bonding guide portion according to the seventh aspect, an extrusion structure is provided in the hole, and the air in the hermetic bonding chamber is extracted. The push-out structure part is configured to push the other target substrate upward by a predetermined distance so that the target substrate is completely bonded to the bottom surface of the flexible substrate.

According to a ninth aspect of the present invention, there is provided the substrate bonding apparatus according to the seventh aspect, wherein the substrate bonding apparatus according to the seventh aspect is located on the opening surface, and the flexible plate tightly covers the opening surface of the bonding guide portion. Further included.

According to a tenth aspect of the present invention, there is provided an apparatus for bonding substrates, wherein the position of the bonding guide portion according to the seventh aspect is selected and an exhaust hole is formed.

According to an eleventh aspect of the present invention, there is provided a substrate bonding apparatus in which the flexible substrate according to the seventh aspect is bonded to the bottom surface of the flexible plate by an electrostatic adhesive applied to the bottom surface of the flexible plate.

A substrate bonding apparatus according to a twelfth aspect of the present invention is the substrate bonding apparatus according to the seventh aspect, wherein at least the relative position between the target substrate and the flexible board is determined and adjusted at a position close to the flexible plate above the flexible plate. One CCD image sensor is provided.

According to a thirteenth aspect of the present invention, there is provided the substrate bonding apparatus, wherein at least one positioning point used for positioning measurement by the CCD image sensor is provided on the upper surface of the flexible plate according to the twelfth aspect.

The substrate bonding apparatus according to claim 14, wherein the flexible plate according to claim 7 is replaced by a flexible plate.

The substrate bonding apparatus according to the present invention has the advantage that the yield of the product can be increased and the production cost can be reduced because the two types of substrates can be stably and tightly bonded without being displaced. .

In addition, the substrate bonding apparatus according to the present invention has an advantage that it can be widely applied to the bonding of plate-like materials, members, etc. like other substrates.

The present invention provides a substrate bonding apparatus for bringing two kinds of substrates into close contact with each other, wherein a concave space is formed between opposite side walls, the upper surface of the concave space is an opening surface, and the concave shape is provided. A joining guide portion that forms a gas extraction path that communicates with the space, and is formed in a recessed space of the joining guide portion, supports both ends of the flexible substrate, and is installed in the flexible substrate and the recessed space. An airtight bonding chamber is formed between the flexible substrate supporting structure that forms a predetermined pitch between the bonding surface of the target substrate and the opening surface of the bonding guide portion between the flexible substrate and the concave space of the bonding guide portion. And a flexible plate. In order to describe in detail the structure and characteristics of such a substrate bonding apparatus, specific examples will be given and described below with reference to the drawings.

 FIG. 2 is a sectional view showing the structure of the substrate bonding apparatus according to the present invention. According to the drawings, the substrate bonding apparatus 100 is used to bond the flexible substrate 2 to the bonding surface 11 of the target substrate. An optical adhesive 12 is applied to the bonding surface of the target substrate 1. The flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1 with the optical adhesive 12.

The substrate bonding apparatus 100 includes a bonding guide portion 31, a flexible plate 4, and a pressure contact member 41. The bonding guide portion 31 is provided between the opposing side walls so as to form a concave space 32 having an upper surface as an opening surface 33 and to set and support the target substrate 1. A flexible substrate support structure 34 that supports both ends of the flexible substrate 2 is formed in the concave space 32. In a state where the flexible substrate 2 is installed on the flexible substrate support structure 34, a predetermined pitch is provided between the bottom surface of the flexible substrate 2 and the bonding surface 11 of the target substrate installed in the concave space 32.

In the embodiment, the flexible substrate support structure 34 is formed in a stepped manner on opposite side walls that form the concave space 32 of the bonding guide portion 31.

A gas extraction path 35 communicating with the concave space 32 is formed in the joining guide portion 31, and an exhaust hole 36 is formed by selecting an appropriate position.

The flexible plate 4 is provided so as to cover the opening surface 33 of the bonding guide portion 31, and an airtight bonding chamber 37 is formed between the flexible plate 4 and the concave space 32. However, the flexible plate may be replaced with a flexible plate.

The pressure contact member 41 is located on the opening surface 33 of the joining guide portion 31 and is provided so that the flexible plate 4 tightly covers the opening surface 33 of the joining guide portion. Further, the flexible plate 4 is placed at a certain distance from the upper surface of the flexible substrate 2.

The flexible plate 4 is made of a soft or elastic material such as rubber, silicon rubber, PVC, PET, or PE.

As disclosed in FIG. 3, the gas extraction path 35 and the gas extraction pipe 51 are used from the airtight bonding chamber 37 formed between the flexible plate 4 and the concave space 32 of the bonding guide portion 31 using the vacuum extraction device 3. When the gas is extracted through the vacuum and the hermetic bonding chamber 37 is brought into a vacuum state, the flexible plate 4 is deformed by the action of the vacuum pressure III and is depressed downward, so that the bottom surface of the flexible substrate 2 is the bottom of the target substrate 1. Bonded to the bonding surface 11.

An opening / closing valve 62 is provided in the exhaust hole 36 of the joining guide portion 31 with a conduit 61 interposed therebetween. Therefore, after the bottom surface of the flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1, the gas remaining in the airtight bonding chamber 37 can be discharged from the exhaust hole 36 and the conduit 61 by operating the opening / closing valve 62.

FIG. 4 discloses a cross-sectional structure of a substrate bonding apparatus according to the second embodiment. According to the drawing, the design structure of the substrate bonding apparatus 200 is substantially the same as that of the first embodiment. Therefore, the same number is assigned to the same member so that the description corresponds to the above description. The second embodiment differs from the first embodiment described above in that the substrate bonding apparatus 200 includes the extruded structure portion 7. The extrusion structure portion 7 is provided in a hole 38 formed in the bottom portion of the joining guide portion 31.

As disclosed in FIG. 5, in the second embodiment, when the gas in the hermetic bonding chamber 37 is extracted, the pushing structure portion 7 applies a pressing force IV to the target substrate 1. For this reason, the target substrate 1 is pushed upward by a predetermined distance, and the bonding surface 11 of the target substrate 1 is completely bonded to the bottom surface of the flexible substrate 2. In this case, the open / close valve 62 is similarly operated to discharge the gas remaining in the airtight joint chamber 37 from the exhaust plan 36 and the conduit 61.

FIG. 6 discloses a cross-sectional structure of a substrate bonding apparatus according to the third embodiment. According to the drawing, the design structure of the substrate bonding apparatus 300 is substantially the same as that of the first embodiment. Therefore, the same number is assigned to the same member so that the description corresponds to the above description. The third embodiment differs from the first embodiment in that the flexible substrate support structure 34 is not formed on the opposite side walls. The flexible substrate 2 is adhered to the bottom surface of the flexible plate 4 by the electrostatic adhesive 42, and the relative relationship between the target substrate 1 and the flexible substrate 2 is achieved by the pair of CCD image sensors 81 and the positioning points 82 provided on the upper surface of the flexible plate 4. Correct position determination and position adjustment.

As disclosed in FIG. 7, in the third embodiment, the vacuum extraction device 3 is used to extract gas from the airtight bonding chamber 37 through the gas extraction path 35 and the gas extraction pipe 51, and the airtight bonding chamber. , The viscous plate 4 is deformed by the action of the vacuum pressure III and is depressed downward, so that the bottom surface of the flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1. After the bottom surface of the flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1, the gas remaining in the airtight bonding chamber 37 is discharged from the exhaust hole 36 and the conduit 61 by operating the opening / closing valve 62.

FIG. 8 discloses a cross-sectional structure of a substrate bonding apparatus according to the fourth embodiment. According to the drawing, the design structure of the substrate bonding apparatus 400 is substantially the same as that of the third embodiment. Therefore, the same number is assigned to the same member so that the description corresponds to the above description. The fourth embodiment differs from the third embodiment in that an extrusion structure is provided in the substrate bonding apparatus according to the third embodiment. That is, the substrate bonding apparatus 400 is provided with the extrusion structure portion 7 by drilling the hole portion 38 in the bottom surface of the bonding guide portion 31.

As disclosed in FIG. 9, in the fourth embodiment, when the gas in the hermetic bonding chamber 37 is extracted, the pushing structure portion 7 applies a pressing force IV to the target substrate 1. For this reason, the target substrate 1 is pushed upward by a predetermined distance, and the bonding surface 11 of the target substrate 1 is completely bonded to the bottom surface of the flexible substrate 2. In this case, the open / close valve 62 is similarly operated to discharge the gas remaining in the airtight joint chamber 37 from the exhaust plan 36 and the conduit 61.

A substrate bonding apparatus according to the present invention includes, for example, a bonding guide portion formed by forming a concave space between opposing side walls, using the upper surface of the concave space as an opening surface, and forming a gas extraction path communicating with the concave space. And supporting the both ends of the soft plate material, and forming a predetermined pitch between the soft plate material and the joint surface of the target plate installed in the concave space. The flexible structure described above is configured by including a supporting structure to be configured and a flexible plate that forms an airtight bonding chamber between the flexible plate material and the concave space of the bonding guide portion on the opening surface of the bonding guide portion. In addition to the bonding of the substrate, the present invention can be widely applied to bonding of other soft materials and members to the target plate.

The above is a preferred embodiment of the present invention, and does not limit the scope of implementation of the present invention. Therefore, any modifications or changes that can be made by those skilled in the art, which are made in the spirit of the present invention and have an equivalent effect on the present invention, shall belong to the scope of the claims for registration of the utility model. To do.

Explanatory drawing showing technology for joining substrates using conventional rollers Sectional view showing the structure of a substrate bonding apparatus according to the present invention (Example 1) Explanatory drawing which showed operation | movement of joining by the board | substrate joining apparatus disclosed in FIG. Sectional drawing which showed the structure of the board | substrate bonding apparatus by this device (Example 2) Explanatory drawing which showed operation | movement of joining by the board | substrate joining apparatus disclosed in FIG. Sectional drawing which showed the structure of the board | substrate bonding apparatus by this device (Example 3) Explanatory drawing which showed operation | movement of joining by the board | substrate joining apparatus disclosed in FIG. Sectional drawing which showed the structure of the board | substrate bonding apparatus by this device (Example 4) Explanatory drawing which showed operation | movement of joining by the board | substrate joining apparatus disclosed in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Substrate bonding apparatus 200 Substrate bonding apparatus 300 Substrate bonding apparatus 400 Substrate bonding apparatus 1 Target substrate 11 Bonding surface 12 Optical adhesive 2 Flexible substrate 3 Roller 31 Bonding guide part 31a Bonding guide part 32 Recessed space 33 Opening surface 34 Flexible substrate support structure 35 Gas Extraction Path 36 Exhaust Hole 37 Airtight Joint Chamber 38 Hole 4 Soft Plate 41 Pressing Member 42 Electrostatic Adhesive 5 Vacuum Extraction Device 51 Extraction Pipe 61 Conduit 62 Opening Valve 7 Extrusion Structure 81 CCD Image Sensor I Direction
II Bonding force
III Vacuum pressure
IV pressing force

Claims (14)

A substrate bonding apparatus for bonding a flexible substrate to a bonding surface of a target substrate,
A joining guide portion formed by forming a concave space between opposite side walls, having an upper surface of the concave space as an opening surface, and forming a gas extraction path communicating with the concave space; and the concave space of the joining guide portion A flexible substrate support structure that is formed inside and supports both ends of the flexible substrate, and that forms a predetermined pitch between the flexible substrate and a bonding surface of the target substrate installed in the concave space, and the bonding guide An airtight joint formed between the flexible substrate and the joint guide portion, the flexible board including a flexible plate forming an airtight joint chamber between the flexible substrate and the concave space of the joint guide portion. When a vacuum is extracted from the chamber and a gas is extracted through the gas extraction path to be in a vacuum state, the flexible substrate is deformed under the action of the vacuum pressure of the flexible substrate and is depressed downward. Write to be pressed push the bottom surface of the flexible substrate is characterized in that it constitutes so as to come into contact with the bonding surface of the target substrate, the substrate bonding device. When a hole is formed in the bottom surface of the bonding guide portion, an extrusion structure portion is provided in the hole portion, and air in the airtight bonding chamber is extracted, the extrusion structure portion raises the other target substrate upward by a predetermined distance. The substrate bonding apparatus according to claim 1, wherein the substrate bonding apparatus is configured to push up and bond the target substrate completely to the bottom surface of the flexible substrate. The said board | substrate joining apparatus is further equipped with the press-contact member provided in order that it may be located in this opening surface, and this soft plate may cover the opening surface of this joining guide part closely. Board bonding equipment. 2. The substrate bonding apparatus according to claim 1, wherein an exhaust hole is formed by selecting a position in the bonding guide portion. 2. The substrate bonding apparatus according to claim 1, wherein the flexible substrate support structure is formed in a step shape on at least a pair of opposing side walls forming a concave space of the bonding guide portion. The substrate bonding apparatus according to claim 1, wherein the flexible plate is replaced with a flexible plate. A substrate bonding apparatus for bonding a flexible substrate to a bonding surface of a target substrate,
A joining guide portion formed by forming a concave space between opposite side walls, an upper surface of the concave space being an opening surface, and forming a gas extraction path communicating with the concave space; and an opening surface of the joining guide portion And a flexible plate forming a hermetic bonding chamber between the flexible substrate and the concave space of the bonding guide portion, and vacuum extraction from the hermetic bonding chamber formed between the flexible substrate and the bonding guide portion. When an apparatus is used to extract a gas through the gas extraction path to be in a vacuum state, the flexible substrate is deformed under the action of the vacuum pressure of the flexible substrate and depressed downward, and the flexible substrate is pressed downward. A substrate bonding apparatus, wherein a bottom surface of the flexible substrate is bonded to a bonding surface of the target substrate. When a hole is formed in the bottom surface of the bonding guide portion, an extrusion structure portion is provided in the hole portion, and air in the airtight bonding chamber is extracted, the extrusion structure portion raises the other target substrate upward by a predetermined distance. The substrate bonding apparatus according to claim 7, wherein the substrate bonding apparatus is configured to be pushed up to completely bond the target substrate to the bottom surface of the flexible substrate. The said board | substrate joining apparatus is further equipped with the press-contacting member provided in order that it may be located in this opening surface, and this soft plate may cover the opening surface of this joining guide part closely. Board bonding equipment. The substrate bonding apparatus according to claim 7, wherein an exhaust hole is formed in an appropriate position of the bonding guide portion. The substrate bonding apparatus according to claim 7, wherein the flexible substrate is bonded to the bottom surface of the flexible plate with an electrostatic adhesive applied to the bottom surface of the flexible plate. The at least one CCD image sensor for determining and adjusting a relative position between the target substrate and the flexible board is provided at a position close to the flexible board above the flexible board. 8. The substrate bonding apparatus according to 7. The substrate bonding apparatus according to claim 12, wherein at least one positioning point used for positioning measurement by the CCD image sensor is provided on the upper surface of the flexible plate. The substrate bonding apparatus according to claim 7, wherein the flexible plate is replaced with a flexible plate.