TWI600542B - Lamination device and lamination method - Google Patents

Lamination device and lamination method Download PDF

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Publication number
TWI600542B
TWI600542B TW105105262A TW105105262A TWI600542B TW I600542 B TWI600542 B TW I600542B TW 105105262 A TW105105262 A TW 105105262A TW 105105262 A TW105105262 A TW 105105262A TW I600542 B TWI600542 B TW I600542B
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Taiwan
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image
workpiece
upper cavity
bearing fixture
image capturing
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TW105105262A
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Chinese (zh)
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TW201722736A (en
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吳育賢
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宸鴻光電科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

貼合設備及貼合方法 Laminating equipment and bonding method

本發明係關於一種貼合設備及貼合方法,特別是一種承載治具位於上腔體與影像擷取裝置之間的貼合設備及貼合方法。 The invention relates to a bonding device and a bonding method, in particular to a bonding device and a bonding method for a bearing fixture between an upper cavity and an image capturing device.

近年來,隨著科技的進步,許多電子裝置,例如平板電腦、智慧型手機、一體型電腦(All-In-One Computer)、數位相機、手表、音樂播放裝置或掌上型遊戲機等,可搭載一觸控顯示面板,使用者藉由觸控的方式輸入訊號給電子裝置。如此,使用者可不需要使用其他例如滑鼠或鍵盤等的輸入裝置,即可與電子裝置進行互動。如此,因為不需要搭配滑鼠或鍵盤,可大幅減少電子裝置的體積和重量。 In recent years, with the advancement of technology, many electronic devices, such as tablet computers, smart phones, All-In-One Computers, digital cameras, watches, music players or handheld game consoles, can be equipped. A touch display panel allows a user to input a signal to an electronic device by means of touch. In this way, the user can interact with the electronic device without using other input devices such as a mouse or a keyboard. In this way, the volume and weight of the electronic device can be greatly reduced because it does not need to be equipped with a mouse or a keyboard.

一般來說,觸控顯示面板包含一觸控層膜組,其係由多層之薄膜貼合而成。在目前的貼合過程中,主要是利用一對位補償平台(Single Alignment Stage)進行貼合。上述對位補償平台包含一下腔體、一承載台、一校正模組一上腔體以及。承載台設置於下腔體內,且校正模組位於承載台旁。上腔體位於承載台上方,並可封閉下腔體。在進行貼合時,首先會先將其中一薄膜在校正模組進行位置校正後再移至承載台疊放,接著會將另一薄膜固定於上腔體,最後上腔體與下腔體相對靠攏以貼合兩薄膜。然而,雖然兩薄膜的位置關係在經校正模組校正後應幾乎無誤差,但因欲疊 設於承載台之薄膜在經校正模組校正後又需經橫移與升降等位移程序才會放置於承載台。如此一來,兩薄膜間的對位精準度勢必會受校正後之位移程序的影響而降低。 In general, the touch display panel comprises a touch layer film set which is formed by laminating a plurality of layers of film. In the current fitting process, it is mainly to use a single Alignment Stage (Single Alignment Stage) for fitting. The above-mentioned alignment compensation platform comprises a lower cavity, a carrying platform, a correction module and an upper cavity. The carrying platform is disposed in the lower cavity, and the calibration module is located beside the carrying platform. The upper cavity is located above the carrying platform and can close the lower cavity. When the bonding is performed, firstly, one of the films is firstly positionally corrected in the calibration module and then moved to the carrier stack, and then the other film is fixed to the upper cavity, and finally the upper cavity is opposite to the lower cavity. Close together to fit the two films. However, although the positional relationship between the two films should be almost error-free after being corrected by the calibration module, The film set on the carrying platform is placed on the carrying platform after being corrected by the calibration module and subjected to a displacement program such as traverse and lifting. As a result, the alignment accuracy between the two films is bound to be reduced by the corrected displacement program.

本發明在於提供一種貼合設備及貼合方法,藉以避免兩薄膜間的對位精準度會受到校正後之位移程序的影響而降低的問題。 The invention provides a bonding device and a bonding method, so as to avoid the problem that the alignment accuracy between the two films is reduced by the influence of the corrected displacement program.

本發明所揭露的貼合設備,包含一下腔體、一承載治具、一上腔體及一影像擷取裝置。下腔體包含一透明底板及一側板。側板凸出於透明底板以形成一容置空間以及一開口。開口連通容置空間。承載治具位於容置空間內,並用以承載一第一加工件。承載治具位於透明底板與上腔體之間。上腔體具有一固定面及至少一固定標記。固定面面向承載治具,並用以固定一第二加工件。固定標記位於固定面。上腔體可相對下腔體活動而具有一第一位置以及一第二位置。於第一位置時,上腔體與下腔體相分離。於第二位置時,上腔體覆蓋於開口,以封閉容置空間。下腔體介於影像擷取裝置與上腔體之間,並用以擷取包含有承載治具之影像與第一加工件之影像的至少一第一影像或擷取包含承載治具之影像與固定標記之影像的至少一第二影像。 The bonding device disclosed in the present invention comprises a lower cavity, a carrying fixture, an upper cavity and an image capturing device. The lower cavity comprises a transparent bottom plate and a side plate. The side plates protrude from the transparent bottom plate to form an accommodation space and an opening. The opening communicates with the accommodating space. The bearing fixture is located in the accommodating space and is used to carry a first workpiece. The bearing fixture is located between the transparent bottom plate and the upper cavity. The upper cavity has a fixed surface and at least one fixed mark. The fixing surface faces the carrying fixture and is used to fix a second workpiece. The fixed mark is on the fixed side. The upper cavity can have a first position and a second position relative to the lower cavity. In the first position, the upper chamber is separated from the lower chamber. In the second position, the upper cavity covers the opening to close the accommodating space. The lower cavity is interposed between the image capturing device and the upper cavity, and is configured to capture at least one first image containing the image of the bearing fixture and the image of the first processing component or capture the image containing the bearing fixture Fixing at least one second image of the marked image.

本發明所揭露的貼合方法,其步驟包含提供上述的一貼合設備。將第一加工件疊設於承載治具之承載台。透過影像擷取裝置擷取包含承載治具之影像與第一加工件之影像的第一影像。依據第一影像獲得承載治具與第一加工件間之一加工件位置資訊,並令校正裝置依據加工件位置資訊校正第一加工件與承載治具的相對位置。將第二加工件固定於上腔體 之固定面。貼合第一加工件與第二加工件。 The bonding method disclosed in the present invention comprises the steps of providing a bonding apparatus as described above. The first workpiece is stacked on the carrier that carries the fixture. The first image including the image bearing the jig and the image of the first processed piece is captured by the image capturing device. And obtaining, according to the first image, position information of the workpiece between the bearing fixture and the first processing component, and causing the calibration device to correct the relative position of the first processing component and the bearing fixture according to the workpiece position information. Fixing the second workpiece to the upper cavity Fixed surface. The first workpiece and the second workpiece are attached.

根據上述實施例所揭露的貼合設備及貼合方法,因上腔體、承載治具與影像擷取裝置沿縱向依序排列,且下腔體之底板採用透明材質,使得影像擷取裝置能夠直接取得第一加工件放置於承載台上時第一加工件與承載台的位置關係。藉此,可避免習知之加工件在位置校正後仍有可能在加工件移至承載台擺放的過程中產生偏移的問題,進而可提升上述實施例所揭露之貼合設備的貼合品質。 According to the bonding apparatus and the bonding method disclosed in the above embodiments, the upper cavity, the bearing fixture and the image capturing device are sequentially arranged in the longitudinal direction, and the bottom plate of the lower cavity is made of a transparent material, so that the image capturing device can The positional relationship between the first workpiece and the carrier is obtained when the first workpiece is placed on the platform. Therefore, the problem that the conventional workpiece can be offset during the process of moving the workpiece to the loading table after the position correction can be avoided, thereby improving the bonding quality of the bonding device disclosed in the above embodiment. .

此外,因上腔體、承載治具與影像擷取裝置沿縱向依序排列,且下腔體之底板採用透明材質,使得影像擷取裝置能夠直接取得承載台與固定標記的位置關係,進而能夠讓承載台與第一加工件皆以固定標記為基準進行對位,以進一步地提升第一加工件與第二加工件間的對位精準度。 In addition, since the upper cavity, the bearing fixture and the image capturing device are arranged in the longitudinal direction, and the bottom plate of the lower cavity is made of a transparent material, the image capturing device can directly obtain the positional relationship between the carrying platform and the fixed mark, thereby enabling The positioning table and the first processing member are aligned on the basis of the fixed mark to further improve the alignment accuracy between the first workpiece and the second workpiece.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

10‧‧‧貼合設備 10‧‧‧Fitting equipment

20‧‧‧第一加工件 20‧‧‧First processed parts

30‧‧‧第二加工件 30‧‧‧Second processed parts

100‧‧‧下腔體 100‧‧‧ lower cavity

110‧‧‧透明底板 110‧‧‧Transparent backplane

120‧‧‧側板 120‧‧‧ side panels

130‧‧‧容置空間 130‧‧‧ accommodating space

140‧‧‧開口 140‧‧‧ openings

200‧‧‧承載治具 200‧‧‧bearing fixture

210‧‧‧框架 210‧‧‧Frame

211‧‧‧穿槽 211‧‧‧through slot

220‧‧‧承載台 220‧‧‧bearing station

221‧‧‧承載面 221‧‧‧ bearing surface

300‧‧‧上腔體 300‧‧‧Upper cavity

310‧‧‧固定面 310‧‧‧Fixed surface

320‧‧‧固定標記 320‧‧‧fixed mark

400‧‧‧影像擷取裝置 400‧‧‧Image capture device

410‧‧‧攝影機 410‧‧‧ camera

500‧‧‧第一移動裝置 500‧‧‧First mobile device

600‧‧‧校正裝置 600‧‧‧ calibration device

700‧‧‧第二移動裝置 700‧‧‧Second mobile device

第1圖為根據本發明第一實施例所述之貼合設備的部分剖面示意圖。 Fig. 1 is a partial cross-sectional view showing a laminating apparatus according to a first embodiment of the present invention.

第2圖為第1圖之承載治具的下視示意圖。 Fig. 2 is a schematic bottom view of the bearing fixture of Fig. 1.

第3圖為第1圖之上腔體之局部下視示意圖。 Figure 3 is a partial bottom plan view of the cavity above Figure 1.

第4圖至第9圖為第1圖之貼合設備的作動式意圖。 Figures 4 through 9 are the operational intent of the bonding apparatus of Figure 1.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

請參閱第1圖至第3圖。第1圖為根據本發明第一實施例所述之貼合設備的部分剖面示意圖。第2圖為第1圖之承載治具的下視示意圖。第3圖為第1圖之上腔體之局部下視示意圖。 Please refer to Figures 1 to 3. Fig. 1 is a partial cross-sectional view showing a laminating apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic bottom view of the bearing fixture of Fig. 1. Figure 3 is a partial bottom plan view of the cavity above Figure 1.

如第1圖所示,本實施例之貼合設備10包含一下腔體100、一承載治具200、一上腔體300、一影像擷取裝置400及一校正裝置600。在本實施例中,貼合設備10更包含一第一移動裝置500及一第二移動裝置700,以分別驅動影像擷取裝置400與校正裝置600位移。 As shown in FIG. 1 , the bonding apparatus 10 of the present embodiment includes a lower cavity 100 , a bearing fixture 200 , an upper cavity 300 , an image capturing device 400 , and a calibration device 600 . In this embodiment, the bonding device 10 further includes a first mobile device 500 and a second mobile device 700 to drive the image capturing device 400 and the correcting device 600 to be respectively displaced.

下腔體100包含一透明底板110及多個側板120。透明底板110例如為玻璃。這些側板120凸出並環繞於透明底板110以形成一容置空間130以及一開口140。開口140連通容置空間130。 The lower cavity 100 includes a transparent bottom plate 110 and a plurality of side plates 120. The transparent substrate 110 is, for example, glass. The side plates 120 protrude and surround the transparent bottom plate 110 to form an accommodating space 130 and an opening 140. The opening 140 communicates with the accommodating space 130.

如第2圖所示,承載治具200位於容置空間130內,並用以承載一第一加工件20。詳細來說,承載治具200包含一框架210及多個承載台220。框架210具有多個陣列式排列的穿槽211。這些承載台220分別位於這些穿槽211內。這些承載台220各具有一承載面221。承載面用以承載第一加工件20。舉例來說,第一加工件20可以是一觸控薄膜,但非用以限定本發明。在其他實施例中,第一加工件20例如為一感應玻璃(Sensor Glass)。 As shown in FIG. 2, the bearing fixture 200 is located in the accommodating space 130 and is used to carry a first processing member 20. In detail, the carrying fixture 200 includes a frame 210 and a plurality of carrying platforms 220. The frame 210 has a plurality of arrayed through slots 211. These carriers 220 are located in these slots 211, respectively. These carriers 220 each have a bearing surface 221 . The bearing surface is used to carry the first workpiece 20 . For example, the first workpiece 20 can be a touch film, but is not intended to limit the invention. In other embodiments, the first workpiece 20 is, for example, a sensor glass.

如第3圖所示,上腔體300可活動地位於承載治具200上方。 詳言之,承載治具200位於下腔體100之透明底板110與上腔體300之間。上腔體300具有一固定面310及多個固定標記320。固定面310面向這些承載台220之承載面221,並用以固定一第二加工件30。本實施例中,第二加工件30例如為一遮蓋玻璃(Cover Glass),但非用以限定本發明。這些固定標記320位於固定面310。每一個固定標記320例如為位於斜對角的兩個L形線條。但並不以此為限,在其他實施例中,每一個固定標記320也可以為一個方形線條或是把線條型式改為多個點的型式。舉例來說,固定標記320是透過曝光製程形成於上腔體300之固定面310,藉此能夠使固定標記320的精度達到微米級精度。 As shown in FIG. 3, the upper chamber 300 is movably positioned above the load fixture 200. In detail, the bearing fixture 200 is located between the transparent bottom plate 110 of the lower cavity 100 and the upper cavity 300. The upper cavity 300 has a fixing surface 310 and a plurality of fixing marks 320. The fixing surface 310 faces the bearing surface 221 of the loading platform 220 and is used to fix a second processing member 30. In this embodiment, the second processing member 30 is, for example, a cover glass, but is not intended to limit the present invention. These fixed marks 320 are located on the fixed surface 310. Each of the fixed marks 320 is, for example, two L-shaped lines located diagonally opposite to each other. However, it is not limited thereto. In other embodiments, each of the fixed marks 320 may also be a square line or a type in which the line type is changed to a plurality of points. For example, the fixed mark 320 is formed on the fixing surface 310 of the upper cavity 300 through an exposure process, whereby the accuracy of the fixed mark 320 can be made to a micron-level precision.

此外,上腔體300可相對下腔體100活動而具有一第一位置(如第1圖所示)以及一第二位置(請暫參閱第9圖)。於第一位置時,上腔體300與下腔體100相分離。於第二位置時,上腔體300覆蓋於開口140,以封閉容置空間130,且這些固定標記320分別對應於承載治具200之這些承載台220。在本實施例及其他實施例中,上腔體300或下腔體100也可另具有抽氣孔(未繪示),抽氣孔可與抽氣設備(未繪示)連接,以對封閉後之容置空間進行真空製程,以讓第一加工件20與第二加工件30在真空環境下進行貼合,進而提升第一加工件20與第二加工件30的貼合品質。 In addition, the upper cavity 300 can be moved relative to the lower cavity 100 to have a first position (as shown in FIG. 1) and a second position (please refer to FIG. 9 for details). In the first position, the upper chamber 300 is separated from the lower chamber 100. In the second position, the upper cavity 300 covers the opening 140 to close the accommodating space 130, and the fixing marks 320 correspond to the carrying platforms 220 of the carrying fixture 200, respectively. In this embodiment and other embodiments, the upper cavity 300 or the lower cavity 100 may further have an air vent (not shown), and the air vent may be connected to an air suction device (not shown) to The accommodating space is subjected to a vacuum process to bond the first workpiece 20 and the second workpiece 30 in a vacuum environment, thereby improving the bonding quality of the first workpiece 20 and the second workpiece 30.

值得注意的是,在本實施例中,是以上腔體300為活動式且下腔體100為固定式為例,但並不以此為限,在其他實施例中,也可以改為下腔體100為活動式且上腔體300為固定式,或是上腔體300與下腔體100皆為活動式。 It should be noted that, in this embodiment, the upper cavity 300 is movable and the lower cavity 100 is fixed, but it is not limited thereto. In other embodiments, the lower cavity may also be changed. The body 100 is movable and the upper chamber 300 is stationary, or both the upper chamber 300 and the lower chamber 100 are movable.

再者,在本實施例中,承載台220、穿槽211與固定標記320 的數量為32個,並以4乘8陣列的方式排列,但並不以此為限,在其他實施例中,承載台220、穿槽211與固定標記320的數量也可以為一個或不同陣列的方式排列。 Furthermore, in this embodiment, the carrying platform 220, the through slot 211 and the fixed mark 320 The number is 32, and is arranged in a 4 by 8 array, but is not limited thereto. In other embodiments, the number of the carrier 220, the through slot 211 and the fixed mark 320 may also be one or different arrays. Arranged in a way.

請再次參閱第1圖。下腔體100介於影像擷取裝置400與上腔體300之間。詳細來說,上腔體300、承載治具200與影像擷取裝置400沿縱向依序排列,使得影像擷取裝置400能夠從下腔體100下方直接擷取包含有承載治具200之影像與第一加工件20之影像的一第一影像(如第7A圖與第7B圖),或是直接擷取包含承載治具200之影像與固定標記320之影像的一第二影像(如第5A圖與第5B圖)。此外,影像擷取裝置400係連接於第一移動裝置500,使得影像擷取裝置400能受第一移動裝置500的驅動而相對下腔體100移動。 Please refer to Figure 1 again. The lower cavity 100 is interposed between the image capturing device 400 and the upper cavity 300. In detail, the upper cavity 300, the bearing fixture 200 and the image capturing device 400 are sequentially arranged in the longitudinal direction, so that the image capturing device 400 can directly capture the image containing the bearing fixture 200 from below the lower cavity 100. a first image of the image of the first processing component 20 (such as FIGS. 7A and 7B), or a second image (eg, 5A) directly capturing the image of the image bearing the fixture 200 and the fixed marker 320 Figure and Figure 5B). In addition, the image capturing device 400 is coupled to the first mobile device 500 such that the image capturing device 400 can be moved relative to the lower cavity 100 by the first mobile device 500.

在本實施例中,影像擷取裝置400是以兩個單鏡頭的攝影機410為例,但並不以此為限,在其他實施例中,影像擷取裝置400也可以為一個雙鏡頭的攝影機或是一個單鏡頭的廣角攝影機。 In this embodiment, the image capturing device 400 is exemplified by two single-lens cameras 410. However, in other embodiments, the image capturing device 400 may also be a two-lens camera. Or a single-lens wide-angle camera.

此外,影像擷取裝置400係位於下腔體100之容置空間130外,可縮小容置空間130,進而縮短真空設備對容置空間130抽真空的時間。 In addition, the image capturing device 400 is located outside the accommodating space 130 of the lower cavity 100, and can reduce the accommodating space 130, thereby shortening the time for the vacuum device to evacuate the accommodating space 130.

校正裝置600連接於第二移動裝置700,使得校正裝置600能夠透過第二移動裝置700而可活動地位於上腔體與下腔體之間。校正裝置600例如為吸嘴型式之機械手臂,用以透過吸力來吸附第一加工件20。藉此,來移動第一加工件20,並校正第一加工件20的位置。校正裝置600用以依據第一影像中承載治具200與第一加工件20間的位置關係校正第一加工件20與承載治具200之承載台220的相對位置。 The calibration device 600 is coupled to the second mobile device 700 such that the calibration device 600 is movably movable between the upper and lower chambers through the second mobile device 700. The correcting device 600 is, for example, a nozzle type robot arm for sucking the first workpiece 20 by suction. Thereby, the first workpiece 20 is moved and the position of the first workpiece 20 is corrected. The correcting device 600 is configured to correct the relative position of the first workpiece 20 and the carrier 220 of the bearing fixture 200 according to the positional relationship between the bearing fixture 200 and the first workpiece 20 in the first image.

請參閱第4圖至第9圖。第4圖至第9圖為第1圖之貼合設備的作動式意圖。 Please refer to Figures 4 to 9. Figures 4 through 9 are the operational intent of the bonding apparatus of Figure 1.

如第4圖所示,先沿箭頭a所指示的方向驅動上腔體300下降而靠近下腔體100。接著,透過影像擷取裝置400擷取包含承載治具200之影像與固定標記320之影像的第二影像(沿箭頭L所指示的方向向上拍攝)。由於在影像擷取時,上腔體300較為靠近下腔體100,故能夠提升影像擷取裝置400之成像品質,以利於提升後續貼合的精準度。 As shown in Fig. 4, the upper chamber 300 is driven to descend toward the lower chamber 100 in the direction indicated by the arrow a. Then, the second image (including the image taken in the direction indicated by the arrow L) containing the image of the fixture 200 and the fixed mark 320 is captured by the image capturing device 400. Since the upper cavity 300 is closer to the lower cavity 100 when the image is captured, the imaging quality of the image capturing device 400 can be improved to improve the accuracy of subsequent bonding.

接著,依據第二影像獲得承載治具200與固定標記320間之一承載治具位置資訊,並依據承載治具位置資訊更新校正裝置600用來放置第一加工件20的座標資料。詳細來說,如第5A圖所示,若框架210與固定標記320間之X軸向間距X1與Y軸向間距Y1不等於預設值,則判定框架210相較於固定標記320有歪斜。此時,校正裝置600後續在放置第一加工件20時,則需加入誤差補償值來更新第一加工件20的放置位置。另,如第5B圖所示,若框架210與固定標記320間之X軸向間距X1與Y軸向間距Y1等於預設值,則判定框架210相較於固定標記320無歪斜。此時,校正裝置600後續在放置第一加工件20時,則無需加入誤差補償值。換言之,校正裝置600能夠直接依預設位置放置於承載台220上即可。 Then, the position information of the bearing fixture between the bearing fixture 200 and the fixed mark 320 is obtained according to the second image, and the coordinate data used by the correcting device 600 for placing the first processing component 20 is updated according to the bearing fixture position information. In detail, as shown in FIG. 5A, if the X-axis pitch X1 and the Y-axis pitch Y1 between the frame 210 and the fixed mark 320 are not equal to the preset value, it is determined that the frame 210 is skewed compared to the fixed mark 320. At this time, when the calibration device 600 subsequently places the first workpiece 20, an error compensation value is added to update the placement position of the first workpiece 20. In addition, as shown in FIG. 5B, if the X-axis spacing X1 and the Y-axis spacing Y1 between the frame 210 and the fixed mark 320 are equal to a preset value, it is determined that the frame 210 is not skewed compared to the fixed mark 320. At this time, when the correcting device 600 subsequently places the first workpiece 20, it is not necessary to add an error compensation value. In other words, the correcting device 600 can be placed on the carrying platform 220 directly according to the preset position.

接著,待完成所有框架210與固定標記320的校正後,則沿箭頭b所指示的方向將上腔體300復位(移回第一位置),並透過第二移動裝置700的驅動,使得校正裝置600沿箭頭c所指示的方向位移,以分別將各第一加工件20疊設於各承載台220。 Then, after the correction of all the frames 210 and the fixed marks 320 is completed, the upper cavity 300 is reset (returned to the first position) in the direction indicated by the arrow b, and transmitted through the driving of the second moving device 700, so that the correcting device The 600 is displaced in the direction indicated by the arrow c to superpose the first workpieces 20 on the respective stages 220, respectively.

接著,透過影像擷取裝置400擷取包含承載治具200之影像與 第一加工件20之影像的第一影像。 Then, the image capturing device 400 is used to capture the image of the bearing fixture 200. The first image of the image of the first workpiece 20.

接著,依據第一影像獲得承載治具200與第一加工件20間之一加工件位置資訊,並令校正裝置600依據加工件位置資訊校正第一加工件20與承載治具200的相對位置。詳細來說,如第7A圖所示,若框架210與第一加工件20間之X軸向間距X3與Y軸向間距Y3不等於預設值,則判定第一加工件20相較於框架210有歪斜。此時,可直接透過校正裝置600來修正第一加工件20與框架210的相對位置。另,如第7B圖所示,若框架210與第一加工件20間之X軸向間距X4與Y軸向間距Y4等於預設值,則判定第一加工件20相較於框架210無歪斜。此時,校正裝置600無需再進行校正。 Then, the position information of the workpiece between the bearing fixture 200 and the first processing component 20 is obtained according to the first image, and the calibration device 600 corrects the relative position of the first processing component 20 and the bearing fixture 200 according to the workpiece position information. In detail, as shown in FIG. 7A, if the X-axis spacing X3 and the Y-axis spacing Y3 between the frame 210 and the first workpiece 20 are not equal to the preset value, it is determined that the first workpiece 20 is compared to the frame. 210 has a skew. At this time, the relative position of the first workpiece 20 and the frame 210 can be corrected directly by the correction device 600. In addition, as shown in FIG. 7B, if the X-axis distance X4 and the Y-axis spacing Y4 between the frame 210 and the first workpiece 20 are equal to a preset value, it is determined that the first workpiece 20 is not skewed compared to the frame 210. . At this time, the correction device 600 does not need to perform correction.

待完成所有框架210與第一加工件20的校正後,則如第8圖所示,沿箭頭d所指示的方向退回校正裝置600與影像擷取裝置400,並將第二加工件30固定於上腔體300之固定面310。 After the correction of all the frames 210 and the first workpiece 20 is completed, as shown in FIG. 8, the correction device 600 and the image capturing device 400 are retracted in the direction indicated by the arrow d, and the second workpiece 30 is fixed to The fixed surface 310 of the upper cavity 300.

接著,如第9圖所示,沿箭頭e所指示的方向將上腔體300下壓,以完成第一加工件20與第二加工件30的貼合製成。 Next, as shown in FIG. 9, the upper cavity 300 is pressed down in the direction indicated by the arrow e to complete the bonding of the first workpiece 20 and the second workpiece 30.

值得注意的是,上述實施例分別是透過框架210與固定標記320間的位置關係以及框架210與第一加工件20間的位置關係來進行校正,但並不以此為限,在其他實施例中,也可以分別是透過承載台220與固定標記320間的位置關係以及承載台220與第一加工件20間的位置來進行校正。 It should be noted that the above embodiments are respectively corrected by the positional relationship between the frame 210 and the fixed mark 320 and the positional relationship between the frame 210 and the first workpiece 20, but not limited thereto, in other embodiments. In this case, the positional relationship between the stage 220 and the fixed mark 320 and the position between the stage 220 and the first workpiece 20 may be corrected.

根據上述實施例所揭露的貼合設備及貼合方法,因上腔體、承載治具與影像擷取裝置沿縱向依序排列,且下腔體之底板採用透明材質,使得影像擷取裝置能夠直接取得第一加工件放置於承載台上時第一加工件與承載台的位置關係。藉此,可避免習知之加工件在位置校正後仍有 可能在加工件移至承載台擺放的過程中產生偏移的問題,進而可提升上述實施例所揭露之貼合設備的貼合品質。 According to the bonding apparatus and the bonding method disclosed in the above embodiments, the upper cavity, the bearing fixture and the image capturing device are sequentially arranged in the longitudinal direction, and the bottom plate of the lower cavity is made of a transparent material, so that the image capturing device can The positional relationship between the first workpiece and the carrier is obtained when the first workpiece is placed on the platform. Thereby, it can be avoided that the conventional workpiece is still after the position correction The problem of offset may occur during the process of moving the workpiece to the stage, and the bonding quality of the bonding apparatus disclosed in the above embodiments may be improved.

此外,因上腔體、承載治具與影像擷取裝置沿縱向依序排列,且下腔體之底板採用透明材質,使得影像擷取裝置能夠直接取得承載台與固定標記的位置關係,進而能夠讓承載台與第一加工件皆以固定標記為基準進行對位,以進一步地提升第一加工件與第二加工件間的對位精準度。 In addition, since the upper cavity, the bearing fixture and the image capturing device are arranged in the longitudinal direction, and the bottom plate of the lower cavity is made of a transparent material, the image capturing device can directly obtain the positional relationship between the carrying platform and the fixed mark, thereby enabling The positioning table and the first processing member are aligned on the basis of the fixed mark to further improve the alignment accuracy between the first workpiece and the second workpiece.

10‧‧‧貼合設備 10‧‧‧Fitting equipment

20‧‧‧第一加工件 20‧‧‧First processed parts

30‧‧‧第二加工件 30‧‧‧Second processed parts

100‧‧‧下腔體 100‧‧‧ lower cavity

110‧‧‧透明底板 110‧‧‧Transparent backplane

120‧‧‧側板 120‧‧‧ side panels

130‧‧‧容置空間 130‧‧‧ accommodating space

140‧‧‧開口 140‧‧‧ openings

200‧‧‧承載治具 200‧‧‧bearing fixture

210‧‧‧框架 210‧‧‧Frame

211‧‧‧穿槽 211‧‧‧through slot

220‧‧‧承載台 220‧‧‧bearing station

221‧‧‧承載面 221‧‧‧ bearing surface

300‧‧‧上腔體 300‧‧‧Upper cavity

310‧‧‧固定面 310‧‧‧Fixed surface

400‧‧‧影像擷取裝置 400‧‧‧Image capture device

410‧‧‧攝影機 410‧‧‧ camera

500‧‧‧第一移動裝置 500‧‧‧First mobile device

600‧‧‧校正裝置 600‧‧‧ calibration device

700‧‧‧第二移動裝置 700‧‧‧Second mobile device

Claims (10)

一種貼合設備,包含:一下腔體,包含一透明底板及一側板,該側板凸出於該透明底板以形成一容置空間以及一開口,該開口連通該容置空間;一承載治具,位於該容置空間內,並用以承載一第一加工件;一上腔體,該承載治具位於該透明底板與該上腔體之間,該上腔體具有一固定面及至少一固定標記,該固定面面向該承載治具,並用以固定一第二加工件,該固定標記位於該固定面,該上腔體可相對該下腔體活動而具有一第一位置以及一第二位置,於該第一位置時,該上腔體與該下腔體相分離,於該第二位置時,該上腔體覆蓋於該開口,以封閉該容置空間;以及一影像擷取裝置,該下腔體介於該影像擷取裝置與該上腔體之間,並用以擷取包含有該承載治具之影像與該第一加工件之影像的至少一第一影像或擷取包含該承載治具之影像與該固定標記之影像的至少一第二影像。 A bonding device comprising: a lower cavity, comprising a transparent bottom plate and a side plate, the side plate protruding from the transparent bottom plate to form a receiving space and an opening, the opening communicating with the receiving space; Located in the accommodating space and configured to carry a first processing component; an upper cavity, the bearing fixture is located between the transparent bottom plate and the upper cavity, the upper cavity has a fixing surface and at least one fixing mark The fixing surface faces the supporting fixture, and is configured to fix a second processing component, the fixing mark is located on the fixing surface, and the upper cavity is movable relative to the lower cavity to have a first position and a second position. In the first position, the upper cavity is separated from the lower cavity. In the second position, the upper cavity covers the opening to close the accommodating space; and an image capturing device, The lower cavity is disposed between the image capturing device and the upper cavity, and is configured to capture at least one first image or the image containing the image of the bearing fixture and the image of the first processing component Image of the jig and the fixed mark At least a second video image. 如請求項1所述之貼合設備,其中該上腔體、該承載治具與該影像擷取裝置沿縱向依序排列。 The bonding apparatus of claim 1, wherein the upper cavity, the bearing fixture and the image capturing device are sequentially arranged in a longitudinal direction. 如請求項1所述之貼合設備,其中該至少一固定標記的數量為多個,該承載治具包含一框架及多個承載台,該框架具有多個陣列式排列的穿槽,該些承載台分別位於該些穿槽內,並對應該些固定標記。 The bonding apparatus of claim 1, wherein the number of the at least one fixed mark is plural, the carrying fixture comprises a frame and a plurality of carrying platforms, the frame has a plurality of arrayed through slots, The carrying platforms are respectively located in the through slots, and the corresponding marks are fixed. 如請求項3所述之貼合設備,其中該影像擷取裝置可活動地位於該下腔體之一側,以分別擷取對應該框架的該些第一影像與該些第二影像。 The bonding device of claim 3, wherein the image capturing device is movably located on one side of the lower cavity to respectively capture the first image and the second image corresponding to the frame. 如請求項4所述之貼合設備,更包含一第一移動裝置,該第一移動裝置連接於該影像擷取裝置,以驅動該影像擷取裝置移動。 The bonding device of claim 4, further comprising a first mobile device, wherein the first mobile device is coupled to the image capturing device to drive the image capturing device to move. 如請求項5所述之貼合設備,更包含一校正裝置,該校正裝置可活動地位於該上腔體與該下腔體之間,用以校正該第一加工件的位置,該校正裝置用以依據該第一影像中該承載治具與該第一加工件間的位置關係校正該第一加工件。 The bonding apparatus of claim 5, further comprising a correcting device movably located between the upper cavity and the lower cavity for correcting the position of the first workpiece, the correcting device The first workpiece is corrected according to a positional relationship between the bearing fixture and the first workpiece in the first image. 如請求項6所述之貼合設備,更包含一第二移動裝置,該第二移動裝置連接於該校正裝置,以驅動該影像擷取裝置移動。 The bonding device of claim 6, further comprising a second mobile device, wherein the second mobile device is coupled to the correcting device to drive the image capturing device to move. 如請求項1所述之貼合設備,其中該固定標記是透過曝光製程形成於該上腔體之該固定面。 The bonding apparatus of claim 1, wherein the fixing mark is formed on the fixing surface of the upper cavity through an exposure process. 一種貼合方法,其步驟包含:提供如請求項1至請求項8之任一項所述之一貼合設備;將該第一加工件疊設於該承載治具;透過該影像擷取裝置擷取包含該承載治具之影像與該第一加工件之影像的該第一影像;依據該第一影像獲得該承載治具與該第一加工件間之一加工件位置資訊,並令該校正裝置依據該加工件位置資訊校正該第一加工件與該承載治具的相對位置;將該第二加工件固定於該上腔體之該固定面;以及貼合該第一加工件與該第二加工件。 A bonding method, the method comprising: providing a bonding device according to any one of claim 1 to claim 8; stacking the first processing member on the bearing fixture; and transmitting the image capturing device Extracting the first image including the image of the bearing fixture and the image of the first processing component; obtaining, according to the first image, position information of a workpiece between the bearing fixture and the first processing component, and Correcting device corrects the relative position of the first workpiece and the bearing fixture according to the workpiece position information; fixing the second workpiece to the fixing surface of the upper cavity; and fitting the first workpiece with the The second machined part. 如請求項9所述之貼合方法,於將該第一加工件疊設於該承載治具的步驟前,更包含: 透過該影像擷取裝置擷取包含該承載治具之影像與該固定標記之影像的該第二影像;以及依據該第二影像獲得該承載治具與該固定標記間之一承載治具位置資訊,並依據該承載治具位置資訊校正該校正裝置。 The method of claim 9, wherein before the step of stacking the first workpiece on the carrying fixture, the method further comprises: And acquiring, by the image capturing device, the second image including the image of the bearing fixture and the image of the fixed marking; and obtaining a position information of the bearing fixture between the bearing fixture and the fixed marking according to the second image And correcting the correction device according to the bearing fixture position information.
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