200910507 九、發明說明 【發明所屬之技術領域】 本發明是具備：對液晶表示裝 板顯示器（FPD )製造用的玻璃基 板實施乾蝕刻等的處理的處理室、 置台進行基板的搬送的基板搬送裝 搬送室之基板處理裝置及基板搬送 【先前技術】 在以液晶顯示器（LCD )爲代 FPD )的製造過程中，是使用所謂 ’其係具備複數個在真空下對玻璃 成§吴等的所疋處理之處理室。 如此的基板處理裝置是具備： 置的搬送室、及設於其周圍的複數 送室内的搬送裝置來將被處理基板 理完成的基板會從各處理裝置的處 室連接預載室，在大氣側的基板的 及搬送室維持於真空狀態，處理複 型的處理系統例如揭示於專利文獻 在如此的處理系統中，將玻璃 是使玻璃基板載於搬送裝置的拾取 基板載置台的上方搬入玻璃基板， 銷而使玻璃基板載於昇降銷上之後 置（LCD )等的平板面 板或半導體晶圓等的基 及對處理室内的基板載 置，及收容搬送裝置的 裝置。 表的平板面板顯示器（ 多室型的基板處理裝置 基板施以蝕刻、灰化、 設有搬送基板的搬送裝 個處理室，藉由設於搬 搬入各處理室内，且處 理室搬出。而且，搬送 搬出入時，可使處理室 數的基板。如此的多室 1 ° 基板搬入至處理室時， 器部份，在製程室内的 從基板載置台突出昇降 ，使拾取器部分退避至 -4- 200910507 搬送室内。然後使昇降銷下降來將玻璃基板載置於基板載 置台。並且，在從製程室搬出玻璃基板時，是藉由昇降銷 來使載置台上的玻璃基板上昇，交接至搬送裝置的拾取器 部分。 可是，近年來隨著玻璃基板的日益大型化，基板處理 裝置的各室大型化也跟進，搬送裝置的搬送距離（室間搬 送距離）也有變長的傾向，出現有距離長達5m者。 其結果，搬送裝置的臂的行程會變長，該行程的部份 會造成搬送室大型化。爲了迴避搬送室的大型化，例如有 效的是使搬送裝置形成具備多段的伸縮臂的構造來對應於 基板搬送的行程，但在使用多段的伸縮臂時，不得不使用 以驅動臂的機構部也進入處理室内，其結果造成處理室的 開口廣。 並且，在拾取器支持玻璃基板的狀態下延伸而進行處 理室内時，拾取器是形成單方支持樑的狀態，形成對其基 端部的拾取器的機構部之力矩負荷大者，因此機構部會大 型化。 〔專利文獻1〕特開平1 1-34〇2〇8號公報 【發明內容】 (發明所欲解決的課題） 本發明是有鑑於上述情事而硏發者，其目的是在於提 供一種可迴避搬送室的大型化，且不會有擴大處理室的基 板搬送用的開口之情況，更不會有施加過度的負擔至機構 -5- 200910507 部的情況之基板搬送裝置及搭載如此的基板搬送裝置之基 板處理裝置。 (用以解決課題的手段） 爲了解決上述課題，本發明的第1觀點係提供一種基 板處理裝置，其特徵係具備： 處理室，其係對基板載置台上的基板實施所定的處理 1 基板搬送裝置，其係對上述基板載置台搬送基板·，及 搬送室’其係收容上述基板搬送裝置，連結上述處理 室； 又，上述基板搬送裝置係具有： 拾取器，其係在支持基板的狀態下進入上述處理室内 ’將基板搬送至上述基板載置台；及 主驅動機構，其係驅動拾取器， 又，上述拾取器係具有： 基部， 複數的支持構件’其係從上述基部延伸成叉子狀，支 持基板；及 副驅動機構’其係使該等支持構件伸縮作動， 在伸長上述支持構件的狀態下搬送基板。 在上述第1觀點中’上述支持構件係具有：連結至上 述基部的第1構件、及設成對上述第1構件可進出退避的 第2構件，又，上述副驅動機構可驅動第2構件。 -6 - 200910507 上述副驅動機構係連動於上述主驅動機構之上述拾取 器的滑移，可將上述第2構件進出驅動。 此情況’上述基板搬送裝置更具有上述拾取器滑動可 能的基底’上述拾取器係滑動於上述基底上而可從上述搬 送室進入上述處理室内。 又’上述拾取器係具有連結上述複數的第2構件之連 結部， 上述副驅動機構係具有： 第1滑輪，其係從上述基部或第1構件往上述基底吊 持，隨著上述拾取器的滑移而旋轉； 第2滑輪，其係配置於上述基部或第1構件上，隨著 上述第1滑輪的旋轉而旋轉； 第3滑輪，其係配置於上述基部或第1構件上，隨著 上述第2滑輪的旋轉而經由輪帶來旋轉；及 夾緊構件’其係設於上述輪帶，機械性連結至上述第 2構件’隨著上述輪帶的移動而移動，使上述複數的第2 構件一起移動。 在此構成中，在上述第i滑輪與上述第2滑輪之間介 裝有減速機。 上述副驅動機構係與上述拾取器的移動獨立，可將上 述第2構件進出驅動。 此情況，上述副驅動機構係具有： 伸縮用缸’其係配置於上述基部或第1構件上，具有 伸縮桿； 200910507 第4滑輪，其係配置於上述基部或第1構件上’隨著 上述伸縮桿的移動而旋轉； 第5滑輪，其係配置於上述基部或第1構件上’隨著 上述第4滑輪的旋轉而經由輪帶來旋轉；及 夾緊構件，其係設於上述輪帶，機械性連結至上述第 2構件，隨著上述輪帶的移動而移動’使上述第2構件移 動。 在如此的構成中，上述第4滑輪係具有： 小滑輪，其係隨著上述伸縮桿的移動而旋轉； 大滑輪，其係與上述小滑輪一起旋轉，掛著上述輪帶 〇 又，上述副驅動機構係具備：配置於上述基部或上述 第1構件上，具有以上述第2構件能夠從上述第1構件進 出，恢復至上述第1構件上的方式，使上述第2構件移動 的伸縮桿之伸縮用缸。 又，上述副驅動機構係具有： 波紋管，其係藉由導入上述被加壓的氣體來從上述第 1構件突出，隨同，使上述第2構件從上述第1構件上進 出； 彈簧’其係於上述波紋管的内部被減壓時，以上述第 2構件能夠恢復至上述第1構件上的方式彈壓。 而且，在與該等那樣的拾取器的移動獨立而將第2構 件進出驅動的構成中，上述基板搬送裝置更具有上述拾取 器滑動可能的基底，上述拾取器係滑動於上述基底上而可 -8 - 200910507 從上述搬送室進入上述處理室内。 在上述第1觀點中，在上述複數的支持構件之間形成 有容許從上述處理室的基板載置台昇降的昇降銷插通之插 通空間。 並且’在上述搬送室連接複數的處理室。 本發明的第2觀點是在於提供一種基板搬送裝置，係 搬送基板的基板搬送裝置，其特徵係具有： 拾取器，其係於支持基板的狀態下搬送基板；及 主驅動機構，其係驅動拾取器； 又，上述拾取器係具有： 基部； 複數的支持構件，其係從上述基部延伸成叉子狀，支 持基板；及 副驅動機構，其係使該等支持構件伸縮作動， 在伸長上述支持構件的狀態下搬送基板。 在上述第2觀點中，上述支持構件係具有：連結至上 述基部的第1構件、及設成對上述第1構件可進出退避的 第2構件，又，上述副驅動機構係驅動第2構件。 又，上述副驅動機構係連動於上述主驅動機構之上述 拾取器的滑移，可將上述第2構件進出驅動。 此情況，更具有上述拾取器滑動可能的基底，上述拾 取器係滑動於上述基底上來搬送基板。 又，上述拾取器係具有連結上述複數的第2構件之連 結部， 200910507 上述副驅動機構係具有： 第1滑輪’其係從上述基部或第1構件往上述基底吊 持，隨著上述拾取器的滑移而旋轉； 第2滑輪，其係配置於上述基部或第1構件上，隨著 上述第1滑輪的旋轉而旋轉； 第3滑輪’其係配置於上述基部或第1構件上，隨著 上述第2滑輪的旋轉而經由輪帶來旋轉；及 夾緊構件，其係設於上述輪帶’機械性連結至上述第 2構件’ Ka者上述輪帶的移動而移動，使上述複數的第2 構件一起移動。 在此構成中’在上述第1滑輪與上述第2滑輪之間介 裝有減速機。 上述副驅動機構係與上述拾取器的移動獨立，可將上 述第2構件進出驅動。 此情況，上述副驅動機構係具有： 伸縮用缸，其係配置於上述基部或第1構件上，具有 伸縮桿； 第4滑輪，其係配置於上述基部或第1構件上，隨著 上述伸縮桿的移動而旋轉； 第5滑輪，其係配置於上述基部或第1構件上，隨著 上述第4滑輪的旋轉而經由輪帶來旋轉；及 夾緊構件，其係設於上述輪帶，機械性連結至上述第 2構件，隨著上述輪帶的移動而移動，使上述第2構件移 動。 -10- 200910507 在如此的構成中，上述第4滑輪係具有： 小滑輪’其係隨著上述伸縮桿的移動而旋轉； 大滑輪，其係與上述小滑輪一起旋轉，掛著上述輪帶 〇 又’上述副驅動機構係具備：配置於上述基部或上述 第1構件上，具有以上述第2構件能夠從上述第1構件進 出’恢復至上述第1構件上的方式，使上述第2構件移動 的伸縮桿之伸縮用缸。 又，上述副驅動機構係具有： 波紋管’其係藉由導入上述被加壓的氣體來從上述第 1構件突出’隨同’使上述第2構件從上述第1構件上進 出； 彈簧’其係於上述波紋管的内部被減壓時，以上述第 2構件能夠恢復至上述第1構件上的方式彈壓。 而且’在與該等那樣的拾取器的移動獨立而將第2構 件進出驅動的構成中，更具有上述拾取器滑動可能的基底 ’上述拾取器係滑動於上述基底上而可從上述搬送室進入 上述處理室内。 在上述第2觀點中，在上述複數的支持構件之間形成 有容許從上述處理室的基板載置台昇降的昇降銷插通之插 通空間。 並且’設於連接至對基板載置台上的基板實施所定的 處理的處理室之搬送室内，可將基板搬送至設於上述處理 室内的基板載置台。 -11 - 200910507 〔發明的效果〕 若根據本發明’則因爲使拾取器構成具有··基部、及 從上述基部延伸成叉子狀的複數個支持構件、及使該等支 持構件伸縮作動的副驅動機構，在伸長上述支持構件的狀 態下載置基板，所以在拾取器退避至搬送室内時，是縮短 支持構件，在拾取器進入處理室時’是可形成支持構件進 出的狀態。因此，在搬送室内可縮短拾取器本身，進而能 夠謀求搬送室的小型化，且在基板的搬送時只要伸長拾取 器的支持構件本身即可’因此在處理室内不必插入以往那 樣驅動拾取器的機構部，僅伸縮支持構件之簡易且薄型的 機構部被插入，可被迴避擴大處理室的開口。並且，在拾 取器進入處理室内時，支持構件的進出量是只要其全長的 一半以下的短距離即可，不會有彎曲力矩從支持構件施加 至拾取器的基端部，因此可使施加於副驅動機構等的機構 部之負荷形成低負荷。 【實施方式】 以下，一邊參照圖面一邊說明有關本發明的較佳形態 。在此’舉本發明的基板處理裝置之一實施形態、搭載對 FPD用的玻璃基板G進行電漿蝕刻的電漿蝕刻裝置之多室 型的電漿蝕刻系統爲例來説明。在此，FPD可舉液晶顯示 窃（LCD)、電激發光（Electro Luminescence ; EL )顯示 器、電漿顯示器面板（PDP)等。 圖1是槪略表示本發明的基板處理裝置之一實施形態 -12- 200910507 的多室型的電漿蝕刻裝置的立體圖，圖2是槪略表示其内 部的水平剖面圖。 此電漿蝕刻裝置1是在其中央部接連設有搬送室20 及預載室（load lock) 30。在搬送室20的周圍連接用以 進行3個電漿飩刻的處理室1〇。 在搬送室20與預載室30之間、搬送室20與各處理 室1 〇之間、及連通預載室3 0與外側的大氣環境的開口部 ，是氣密地密封該等之間，且分別介插有構成可開閉的閘 閥22。 在預載室30的外側設有2個的卡匣索引器（indexer )41，在其上載置有分別收容玻璃基板G的卡匣4 0。該 等卡匣40是例如可在其一方收容未處理基板，在另一方 收容處理完成基板。該等卡匣40可藉由昇降機構42來昇 降。 在該等2個卡匣40之間，於支持台44上設有搬送機 構43，此搬送機構43是具備：設成上下2段的拾取器（ pick) 45，46、及可使該等一體進出退避及旋轉支撐的基 底（base) 47。 搬送室20是與真空處理室同樣可保持於所定的減壓 環境，其中如圖2所示，配設有搬送裝置50。然後，藉由 該搬送裝置50在預載室30及3個電槳蝕刻裝置10之間 搬送玻璃基板G。搬送裝置5〇是在迴旋可能及上下動可 能的基底51上2個基板搬送臂52設成可前後動。搬送裝 置5 0的詳細構造會在往後敘述。 -13- 200910507 預載室30是與各處理室10及搬送室20同樣可保持 於所定的減壓環境。並且，預載室30是用以在處於大氣 環境的卡匣40與減壓環境的處理室10之間進行玻璃基板 G的授受者，重複大氣環境與減壓環境的關係上，極力縮 小構成其内容積。又，預載室30是基板収容部31會被設 成上下2段（在圖2僅圖示上段），在各基板収容部31 内設有用以支持玻璃基板G的緩衝器3 2及進行玻璃基板 G的對位之定位器（Positioner) 33。 在處理室1〇内，如圖3的剖面圖所示，具備用以進 行蝕刻處理的構成。處理室1 〇是例如表面被防蝕鈍化鋁 (alumite)處理（陽極氧化處理）之鋁所構成的角筒形狀 ，在該處理室1 〇内的底部設有用以載置被處理基板亦即 玻璃基板G的基板載置台亦即基座1 〇 1。在該基座1 〇 1插 通有可昇降的昇降銷130，其係用以進行往其上之玻璃基 板G的載置或卸載。此昇降銷1 3 0是在搬送玻璃基板G 時，上昇至基座1 〇 1上方的搬送位置，除此以外時是形成 沒入基座1 〇 1内的狀態。基座1 0 1是隔著絕緣構件1 04來 支持於處理室10的底部，具有金屬製的基材102與設於 基材102的周緣之絕緣構件1〇3。 在基座1 0 1的基材1 0 2連接有用以供給高頻電力的給 電線123’在此給電線123連接整合器124及高頻電源 125。由高頻電源125來對基座101供給例如13.56MHz的 高頻電力。 在上述基座101的上方，與該基座101平行對向設有 -14- 200910507 具有作爲上部電極的機能之蓮蓬頭1 11。蓮蓬頭11 1是被 支持於處理室10的上部，在内部具有内部空間112，且在 與基座101對向的面形成有用以吐出處理氣體的複數個吐 出孔113。此蓮蓬頭111會被接地，與基座101 —起構成 一對的平行平板電極。 在蓮蓬頭111的上面設有氣體導入口 114，在該氣體 導入口 U 4連接有處理氣體供給管1 1 5，該處理氣體供給 管1 1 5是經由閥1 1 6及質量流控制器1 1 7來連接處理氣體 供給源1 1 8。從處理氣體供給源1 1 8供給蝕刻用的處理氣 體。處理氣體可使用鹵素系的氣體、〇2氣體、Ar氣體等 通常使用於該領域的氣體。 在處理室1 0的底部形成有排氣管1 1 9，此排氣管1 1 9 連接排氣裝置120。排氣裝置120是具備渦輪分子泵等的 真空泵，藉此可將處理室10内真空吸引至所定的減壓環 境。並且，在處理室10的側壁設有基板搬出入口 121，此 基板搬出入口 121可藉由上述閘閥22來開閉。而且，可 在開啓該閘閥22的狀態下藉由搬送室20内的搬送裝置50 來搬入玻璃基板G。 如圖2所示，電漿蝕刻裝置1的各構成部是形成藉由 具備微處理器的製程控制器70來進行控制的構成。在該 製程控制器7 0連接有鍵盤或使用者介面，該鍵盤是供以 操作者管理電漿蝕刻裝置1的指令輸入操作等，該使用者 介面是由使電漿蝕刻裝置1的操業狀況可視化的顯示器等 所構成。並且，在製程控制器70連接記憶部72，其係儲 -15- 200910507 存有用以藉由製程控制器70的控制來實現在電 置1所被實行的各種處理、或按照處理條件來使 理實行於電漿蝕刻裝置1的控制程式亦即處方， 、或各種資料庫等。記憶部72是具有記憶媒體 是被記憶於該記憶媒體。記憶媒體可爲硬碟或半 體，或者CDROM、DVD、快閃記憶體等的可攜 後，按照所需，以來自使用者介面7 1的指示等 部7 2叫出任意的處方，而使實行於製程控制器 在製程控制器70的控制下，在電漿蝕刻裝置1 的處理。 其次，說明有關如此構成的電漿蝕刻裝置1 作。 首先，使搬送機構4 3的2個拾取器4 5、4 6 ，從收容未處理基板的一方卡匣40來將2片的 G搬入預載室30的2段基板収容室31。 拾取器45，46退避後，關閉預載室30的大 閥22。然後，將預載室30内予以排氣，而使内 所定的真空度。抽真空後，藉由定位器3 3來按 進行玻璃基板G的對位。 如以上那樣定位後，開啓搬送室2 0與預載_ 的閘閥22，藉由搬送室20内的搬送裝置50來接 預載室30的基板収容部31之玻璃基板G，搬入! ，在基座上載置玻璃基板G。 然後，關閉閘閥2 2，藉由排氣裝置1 2 0來 漿蝕刻裝 所定的處 〔recipe ) ，處方等 導體記憶 帶者。然 ，從記憶 70，藉此 進行所望 的處理動 進退驅動 玻璃基板 氣側的閘 部減壓至 壓基板而 〔3 0之間 受收容於 靈理室10 將處理室 -16- 200910507 1 〇内抽真空至所定的真空度。然後，開放閥1 1 6，從處理 氣體供給源1 1 8使處理氣體一邊藉由質量流控制器1 1 7來 調整其流量，一邊經由處理氣體供給管1 1 5、氣體導入口 1 1 4來導入至蓮蓬頭1 1 1的内部空間1 1 2，更經由吐出孔 1 1 3來對基板G均一地吐出，一面調節排氣量一面將處理 室1 〇内控制於所定壓力。 在此狀態下從處理氣體供給源1 1 8將所定的處理氣體 導入至處理室10内，且由高頻電源125來將高頻電力施 加於基座1 〇 4，使高頻電場產生於作爲下部電極的基座 101及作爲上部電極的蓮蓬頭111之間，而生成處理氣體 的電漿，藉由此電漿來對玻璃基板G實施蝕刻處理。 如此實施蝕刻處理後，停止來自高頻電源1 25的高頻 電力施加，停止處理氣體導入。然後，排除殘留於處理室 10内的處理氣體，藉由昇降銷130來使玻璃基板G上昇 至搬送位置。在此狀態下開放閘閥22，藉由搬送裝置5 0 來將玻璃基板G從處理室1 0内搬出至搬送室20。 從處理室10搬出的玻璃基板G是被搬送至預載室30 ，藉由搬送機構43來收容於卡匣40。此時’可回到原本 的卡匣40，或收容於他方的卡匣40。 以收容於卡匣4 0的玻璃基板G的片數量重複以上那 樣的一連串動作，完成處理。 其次，詳細說明有關搬送室20的搬送裝置50。 首先，說明有關第1實施形態。 圖4是表示第1實施形態的拾取器部滑移的搬送裝置 -17- 200910507 的槪略構成圖，圖5是藉由圖4所示的搬送裝置來從搬送 室往處理單元搬送玻璃基板時的槪略構成剖面圖’圖6是 表示圖4及圖5所示的搬送裝置的立體圖’ （a)是滑動 拾取器位於搬送室内的原點位置時的狀態’ （b )是滑動 拾取器進入處理室内時的狀態。 如圖4所示，搬送裝置50是具有：長的基底51、及 獨立於基底5 1上可滑動地設成上下2段的滑動拾取器52 、5 3、及使基底51旋轉驅動（Θ驅動）的同時使昇降（Z 驅動），且使滑動拾取器52驅動的驅動機構54、及藉由 控制驅動機構5 4的驅動來控制搬送裝置的搬送之搬送控 制部5 5。 滑動拾取器5 2是移動於基底5 1上，設成可進行處理 室10内，具備本體部56、及可從本體部56進出退避的進 出退避部57。並且，滑動拾取器53是移動於基底51上， 設成可進入處理室1〇内，具備本體部256、及可從本體部 256進出退避的進出退避部257。另外，由於滑動拾取器 5 2，5 3是同樣構成，所以以下主要針對滑動拾取器5 2來 進行説明。 如圖6所示，構成滑動拾取器52的本體部56是具有 :包含與基底5 1的連結部的基部56b、及形成從基部56b 水平延伸成叉子狀之長尺狀的複數的第1支持構件56a。 並且，進出退避部57是具有可分別進出退避地連結於該 等複數的第1支持構件56a之複數的第2支持構件57a。 然後，以第〗支持構件56a及第2支持構件57a來構成伸 -18- 200910507 縮可能的支持構件，在第2支持構件5 7 a上配置玻璃基板 G。在該等複數的第1支持構件56a及第2支持構件57a 之間形成有容許昇降銷1 3 0的插通的插通空間1 3 1。另外 ，支持構件的個數是可適當自由設定，在圖6中是支持構 件的一部份省略描繪。 複數的第2支持構件57a是藉由連結構件57b來機械 性地連結，可一體移動。 並且，在基底51内設有用以驅動本體部56的主驅動 機構60。主驅動機構60是具備：設於基底51的基端部之 驅動側的滑輪6 2、及設於基底5 1的前端部之從動側的滑 輪64、及捲掛於滑輪62、64的輪帶63 (同步帶）、及設 於輪帶63，機械性連結於本體部56，隨著輪帶63的移動 而移動，來移動本體部5 6的夾緊構件6 5。驅動側的滑輪 62是藉由屬於驅動機構54的馬達61 (參照圖7等）來旋 轉。另外，輪帶63是除了同步帶以外’亦可爲鋼索（輪 帶）等其他者。 如圖6(b)所示，本體部56是僅移動圖示的距離Lm ，進出退避部57是僅移動圖示的距離Ls。當滑動拾取器 52進入處理室10内時，進出退避部57是只要其全長的一 半以下的長度從本體部5 6進出即可。 其次，說明有關第1實施形態的搬送裝置的滑動拾取 器的機構部的詳細。圖7、8是表示本發明的第】實施形 態的搬送裝置的滑動拾取器的機構部的模式圖’圖7是表 示滑動拾取器5 2位於搬送室2 0的原點位置的狀態圖，圖 -19* 200910507 8是表示滑動拾取器52進入處理室1 〇内的狀態圖。又， 圖9 ( a )是沿著圖7的IXa線的剖面圖，（b )是沿著圖 7的IXb線的剖面圖。另外，在該等圖面中也是只針對2 個滑動拾取器5 2、5 3之中的滑動拾取器5 2進行説明。 本實施形態的搬送裝置5 0是除了用以驅動滑動拾取 器52的本體部56的上述主驅動機構60設於基底51内以 外，還設有用以滑動驅動進出退避部5 7的副驅動機構8 0 〇 副驅動機構8 0是具有設於本體部5 6的基部5 6b的基 盤8 1。並且，副驅動機構8 0是從本體部5 6往基底5 1吊 持，具有隨著本體部56的移動來旋轉的第1滑輪82a。亦 即，設於主驅動機構6 0的輪帶6 3之一對的空轉輪8 2 b、 8 2b會一邊與輪帶63 —起移動一邊旋轉，隨同，第1滑輪 82a會一邊隨著輪帶63與本體部56的移動而移動一邊旋 轉。 桌1滑輪8 2 a是經由減速機8 3來連結至配置於基盤 8 1上的第2滑輪8 4 (參照圖9 ( b ))。 副驅動機構80是更具有：配置於基盤81上，隨著第 2滑輪84的旋轉而經由輪帶85(同步帶）來旋轉的第3 滑輪86、及設於輪帶85，機械性連結至進出退避部57， 隨著輪帶85的移動而移動’來移動進出退避部57的夾緊 構件87。另外，輪帶85是除了同步帶以外，亦可爲鋼索 (輪帶）等其他者。 又，如圖9 ( a ) ( b )所示’在基底5 1的兩側上面與 -20- 200910507 本體部56的基部56b的下面之間介裝有一對的引導構件 8 8，8 8。並且，在副驅動機構8 0的基盤8 1的兩側上面與 進出退避部57的連結構件57b的下面之間介裝有一對的 引導構件89a，89a。在本體部56的第1支持構件56a的 上面與第2支持構件5 7a的下面之間分別介裝有薄型的引 導構件89b，.··。 以上那樣構成的搬送裝置5 0，是如圖5所示，在進出 退避部5 7載置玻璃基板G的狀態下，滑動拾取器5 2會進 入處理室10内，進出退避部57會成爲從本體部56進出 的狀態。 其次，昇降銷130會上昇，從進出的進出退避部57 接受玻璃基板G。然後，滑動拾取器52會從處理室1 〇退 出至搬送室20，且昇降銷130會降下，而於基座1〇1上載 置玻璃基板G。另一方面’從昇降銷130至進出退避部57 交接處理完成的基板G時，是藉由與上述情況相反的工程 來進行。 如此藉由搬送裝置50來將玻璃基板G搬送至處理室 10時，如圖6及圖7所示，使主驅動機構6〇的馬達6丨驅 動來使滑輪62旋轉’藉此使輪帶63及滑輪64旋轉。此 時’設於輪帶03的夾緊構件65會移動，而使得機械性連 結於該夾緊構件65的滑動拾取器52的本體部56會移動 〇 在本實施形態，副驅動機構80是如上述那樣，其驅 動源是與主驅動機構60相同，因此連動於本體部56的移 -21 - 200910507 動，進出退避部57會被移動。 並且，副驅動機構8 0是其驅動部與主驅動機榍 樣構成，但在動力的傳達路徑介裝有上述減速機83 進出驅動部5 7是形成本體部5 6的動作量所被減速 進。 亦即，就副驅動機構8 0而言，隨著本體部5 6 ，從本體部56吊持的第1滑輪82a是一邊隨著輪费 本體部56的移動而移動一邊旋轉，第1滑輪82a 是一邊藉由減速機83來減速一邊傳達至第2滑輪 此被捲掛於第2滑輪84及第3滑輪8 6的輪帶8 5 ，隨著該移動，設於輪帶85的夾緊構件87會移動 得機械性連結至該夾緊構件8 7的進出退避部5 7會 從本體部56進出。 藉由如此載置玻璃基板G的進出退避部57的 可將玻璃基板G搬送至處理單元1 〇内的所望位置。 此情況，滑動拾取器5 2是在位於搬送室2 0内 出退避部5 7位於本體部5 6上，該等形成重疊的狀 此可使搬送室2 0小型化。 又，此情況，將玻璃基板G搬送至處理室1 〇 只要使進出退避部57進出，而伸長由第1支持構 及第2支持構件57a所構成的支持構件本身即可， 必在處理室1 0内插入以往那樣驅動拾取器的機構 用以伸縮支持構件的簡易且薄型的機構部插入處理； 可迴避擴大處理室10的開口。 奏60同 ，因此 的量前 的移動 ^ 63與 的旋轉 84，藉 會移動 ，而使 移動， 進出， 時，進 態，因 時，是 件 5 6a 因此不 部，僅 g 10， -22- 200910507 並且’在滑動拾取器52進入處理室10内時，進出退 避部57是只要其全長的一半以下的長度從本體部56進出 即可，因此從進出退避部5 7往本體部5 6主要僅施加向下 的荷重，可縮小彎曲力矩。因此，可縮小施加於設在本體 部5 6的副驅動機構8 0的機構部之負荷，藉此可謀求副驅 動機構80等的構造的簡略化。 而且，可壓低進出退避部5 7的重量及阻抗，藉此驅 動用的輪帶85 (同步帶）的尺寸也可縮小，因此可使搬送 機構小型化。 其次，說明有關搬送裝置5 0的第2實施形態。 本實施形態是搬送裝置的槪略構成與第1實施形態同 樣，但僅滑動拾取器的機構部的構造相異。 圖1 〇是表示第2實施形態的拾取器部滑移的搬送裝 置的滑動拾取器的機構部的模式圖，表示滑動拾取器進行 處理室内的狀態。另外，在此圖中亦以2個滑動拾取器的 其中滑動拾取器5 2爲中心來進行説明。 本實施形態是使用配置於滑動拾取器5 2的本體部5 6 的基部5 6b上，具備具有伸縮桿9 1 a的伸縮用缸9 1 (汽缸 )的副驅動機構90。 在本體部56的基部56b上設有：滑輪92、及具有小 滑輪9 3 a的第4滑輪（大滑輪）9 3、及掛於滑輪9 2與小 滑輪93 a之間的輪帶94。伸縮用缸9 1 (汽缸）的伸縮桿 91a是被連結至輪帶94。 副驅動機構90是更具有：隨著第4滑輪93(大滑輪 -23- 97、 200910507 )的旋轉經由輪帶96 (同步帶）來旋轉的第5滑輪 及設於輪帶9 6，機械性連結至進出退避部5 7，隨著 96的移動而移動，來移動進出退避部57的夾緊構件 另外’輪帶96是除了同步帶以外，亦可爲鋼索（輪 等其他者。 因此，一旦將加壓空氣供給至伸縮用缸9 1 (汽缸 則伸縮桿9 1 a會移動，輪帶9 4會移動，小滑輪9 3 a 轉。藉此，第4滑輪93(大滑輪）會旋轉，輪帶％ 5滑輪9 7會旋轉。設於輪帶9 6的夾緊構件9 8會移動 使得機械性連結至該夾緊構件9 8的進出退避部5 7會 〇 就本實施形態而言，如上述，副驅動機構90是 動源有別於主驅動機構6 〇，因此可獨立於本體部5 6 動，來移動進出退避部57。 並且，副驅動機構9 0在動力的傳達路徑具有上述 滑輪93 (大滑輪）'及其小滑輪93a。因此，進出退 5 7可比伸縮桿9 1 a的動作量只增速第4滑輪9 3 (大 )與小滑輪9 3 a的増速比部份來前進。 圖1 1是第2實施形態的拾取器部滑移的搬送裝 模式剖面圖。在此是顯示設成2段的滑動拾取器52 的雙方。如上述，下側的滑動拾取器5 2是在基底5 1 側上面與本體部5 6的基部5 6b的下面之間介裝一對 導構件8 8，8 8。而且，在本體部5 6的第1支持構件 的上面與進出退避部57的第2支持構件57a的下面 TO W 98 ° 帶） 會旋 與第 ，而 移動 其驅 的移 第4 避部 滑輪 置的 ，53 的兩 的引 5 6a 之間 -24- 200910507 分別介裝有薄型的引導構件8 9b，…。 就上側的滑動拾取器5 3而言，雖未詳細圖示， 際具備同様構造的主驅動機構，在基底5 1的兩側上 支持構件2 0 1的下面之間介裝有一對的引導構件2 8 8 。在支持構件20 1的側方經由構造構件202來連結本 256。 亦即，在構造構件202支持基部256b，從基部 延伸本體部256之未圖示的複數根第1支持構件。 在本體部25 6的第1支持構件的上面與進出退 2 5 7的第2支持構件2 5 7 a的下面之間分別介裝有薄型 導構件2 8 9 b，…。 並且，在圖11中有用以移動上側的進出退避部 的伸縮用缸291 (汽缸）、及第4滑輪293被圖示。 在基底51的左側方設有對滑動拾取器5 2的進出 部5 7用的伸縮用缸9 1 (汽缸）供給加壓空氣的氣管 tube) 99a用的電纜支承99b。 同樣，在基底51的右側方設有對滑動拾取器5 3 出退避部257用的伸縮用缸291 (汽缸）供給加壓空 氣管299a用的電纜支承299b。 其次，說明有關搬送裝置的第3實施形態。 圖1 2是表示第3實施形態的拾取器部滑移的搬 置的立體圖，（a)是表示滑動拾取器位於搬送室内 點位置時的狀態，（b )是表示滑動拾取器進入處理 時的狀態。另外，在此圖中是只顯示滑動拾取器52 但實 面與 ，288 體部 2 5 6b 避部 的引 25 7 退避 (air 的進 氣的 送裝 的原 室内 -25- '53 200910507 中的滑動拾取器52。 本實施形態是使用配置於本體部5 6的基部5 6 b上， 具備將該伸縮桿3 1 1連結至進出退避部57的連結部57b 的伸縮用缸3 1 0 (汽缸）之副驅動機構3 0 0。 因此，一旦供給加壓空氣至伸縮用缸3 1 0 (汽缸）， 則伸縮桿3 1 1會移動，機械性連結至該伸縮桿3 1 1的進出 退避部5 7會移動。 就本實施形態而言，如上述，副驅動機構3 00是其驅 動源有別於主驅動機構6 0，因此可獨立於本體部5 6的移 動，來移動進出退避部57。 在圖12 ( b )以波線所示的領域（p )中設有供給加 壓空氣至進出退避部57用的伸縮用缸310(汽缸）之氣管 (圖示略）用的電纜支承。 其次，說明有關搬送裝置的第4實施形態。 圖1 3是表示第4實施形態的拾取器部滑移的搬送裝 置的立體圖，（a )是滑動拾取器位於搬送室内的原點位 置時的狀態，（b )是表示滑動拾取器進入處理室内時的 狀態。另外，在此圖中亦只顯示滑動拾取器5 2、5 3中的 滑動拾取器52。 本實施形態是使用副驅動機構400，該副驅動機構 400是具備：設於進出退避部57的複數根第2支持構件 57a内的複數個波紋管410、及設於1個第2支持構件57a 的基端部與本體部5 6的1個第1支持構件5 6 a的基端部 之間的彈簧42 0。 -26- 200910507 波紋管410是被連接至空氣配管430，空氣配管430 是經由電磁閥431來連接至空氣供給源432及真空泵433 〇 因此’在移動進出退避部57來進入處理室10内時， 是將電磁閥4 3 1切換至空氣供給源4 3 2側。從空氣供給源 432經由空氣配管430等，供給壓縮空氣至波紋管41〇， 波紋管410是藉由加壓内部的氣體（壓縮空氣），以能夠 從本體部56上進出的方式，移動進出退避部57。另外， 在以該進出退避部5 7能夠進出的方式移動時，彈簧42〇 是抗過其彈壓力而延伸。 另一方面’在移動進出退避部57而從處理室1〇退出 時，將電磁閥43 1切換至真空泵4 3 3側。從真空泵43 3經 由空氣配管4 3 0等，波紋管4 1 0的内部會減壓，波紋管 4 1 0収縮。此時，延伸後的彈簧4 2 0會藉由其彈壓力來使 進出退避部57回到本體部56上。 就本實施形態而言，如上述，副驅動機構400是其驅 動源有別於主驅動機構6 0，因此可獨立於本體部5 6的移 動，來移動進出退避部57。 另外，本發明並非限於上述實施形態，亦可實施各種 的變形。例如，就上述實施形態而言，進出退避部的複數 個第2支持構件是以連結部連結’但在各第2支持構件具 有副驅動機構時不需要連結部。並且’使用具有支持基板 的拾取器部滑移的滑動拾取器之搬送機構’但亦可爲具有 關節的標量型的搬送機構的拾取器等其他的搬送機構。又 -27- 200910507 ，上述實施形態是說明有關真空中進行搬送時，但並非限 於此，亦可適用於大氣中進行搬送的搬送裝置。 又’上述實施形態是將本發明適用於蝕刻裝置，但並 非限於蝕刻處理，當然亦可適用於成膜等的其他處理。又 ，上述實施形態是舉多室型的裝置爲例來進行説明，但處 理室僅爲一個的單室型的裝置亦可適用。 又’上述實施形態是基板爲使用FPD用玻璃基板的例 子，但並非限於此，亦可爲半導體晶圓等的其他基板。 【圖式簡單說明】 圖1是表示本發明的基板處理裝置之一實施形態的電 漿鈾刻裝置的槪略立體圖。 圖2是表示圖1的電漿飩刻裝置的内部的槪略水平剖 面圖。 圖3是表示使用於圖1的電漿蝕刻裝置的處理室的剖 面圖。 圖4是表示第1實施形態的拾取器部滑移的搬送裝置 的槪略構成圖。 圖5是藉由圖4所示的搬送裝置來從搬送室往處理單 元搬送玻璃基板時的槪略構成剖面圖。 圖6是表示圖4及圖5所示的搬送裝置的立體圖，（ a )是滑動拾取器位於搬送室内的原點位置時的狀態，（b )是滑動拾取器進入處理室内時的狀態。 圖7是表示本發明的第1實施形態的搬送裝置的滑動 -28- 200910507 拾取器位於搬送室的原點位置時的其機構部的模式圖。 圖8是表示本發明的第1實施形態的搬送裝置的滑動 拾取器進入處理室内時的其機構部的模式圖。 圖9 ( a )是沿著圖7的IXa線的剖面圖’ （b )是沿 著圖7的IXb線的剖面圖。 圖10是表示第2實施形態的拾取器部滑移的搬送裝 置的滑動拾取器的機構部的模式圖。 圖1 1是表示第2實施形態的拾取器部滑移的搬送裝 置的模式剖面圖。 圖1 2是表示第3實施形態的拾取器部滑移的搬送裝 置的立體圖，（a )是滑動拾取器位於搬送室内的原點位 置時的狀態，（b )是滑動拾取器進入處理室内時的狀態 〇 圖13是表示第4實施形態的拾取器部滑移的搬送裝 置的立體圖，（a )是滑動拾取器位於搬送室内的原點位 置時的狀態，（b )是滑動拾取器進入處理室内時的狀態 【主要元件符號說明】 1 :電漿蝕刻裝置 1 〇 :處理室 20 :搬送室 22 :閘閥 3〇 :預載室 -29- 200910507 50 :搬送裝置 5 1 :基底 5 2，5 3 :滑動拾取器 5 6 :本體部 5 7 :進出退避部 5 4 ‘·驅動機構 5 5 :搬送控制部 60 :主驅動機構 7 0 :製程控制器 8 0 _·副驅動機構 8 2 a :第1滑輪 8 3 :減速機 8 4 :第2滑輪 8 5 :輪帶 8 6 :第3滑輪 8 7 :夾緊構件 90 :副驅動機構 9 1 :伸縮用缸 9 3 :第4滑輪 9 6 :輪帶 9 7 :第5滑輪 9 8 :夾緊構件 1 0 1 :基座 1 3 0 :昇降銷 -30- 200910507 1 3 1 :插通空間 3 0 0 :副驅動機構 3 1 〇 :伸縮用缸 4 0 0 :副驅動機構 4 1 0 :波紋管 4 2 0 :彈簧 G :玻璃基板In the present invention, the present invention provides a processing chamber for performing dry etching or the like on a glass substrate for manufacturing a liquid crystal display panel display (FPD), and a substrate transfer device for transporting a substrate. Substrate processing apparatus and substrate transfer in the transfer chamber [Prior Art] In the manufacturing process using a liquid crystal display (LCD) as the FPD, the so-called 'the system has a plurality of s Processing chamber. In the substrate processing apparatus, the substrate is provided with a transfer chamber and a transfer device provided in the plurality of transfer chambers, and the substrate on which the substrate to be processed is completed is connected to the preload chamber from the chamber of each processing device, and is on the atmosphere side. The substrate and the transfer chamber are maintained in a vacuum state, and the processing system for processing the complex is disclosed, for example, in the processing system of the patent document. The glass is carried on the glass substrate by placing the glass substrate on the pick-up substrate mounting table of the transport device. The glass substrate is placed on the lift pin, and the substrate such as a flat panel or a semiconductor wafer is placed on the lift pin, and the substrate is placed on the substrate in the processing chamber, and the transfer device is housed. The flat panel display of the table (the multi-chamber type substrate processing apparatus substrate is etched, ashed, and the transfer processing is provided with the transfer substrate, and is placed in each processing chamber, and the processing chamber is carried out. When moving in and out, the number of substrates in the processing chamber can be increased. When such a multi-chamber 1 ° substrate is carried into the processing chamber, the device portion is lifted and lowered from the substrate mounting table in the process chamber, and the pickup portion is retracted to -4-200910507. The transfer chamber is lowered to lower the lift pins to mount the glass substrate on the substrate stage. When the glass substrate is carried out from the process chamber, the glass substrate on the mounting table is raised by the lift pins and delivered to the transfer device. However, in recent years, as the size of the glass substrate has increased, the size of each chamber of the substrate processing apparatus has also increased, and the transport distance (inter-room transport distance) of the transport apparatus tends to become longer, and the distance is longer. As a result, the stroke of the arm of the transfer device becomes long, and the portion of the stroke causes the transfer chamber to be enlarged. In order to avoid the large transfer chamber For example, it is effective to form the transport apparatus with a structure including a plurality of telescopic arms to correspond to the stroke of the substrate transport. However, when a plurality of telescopic arms are used, the mechanism that drives the arm also has to enter the processing chamber. The opening of the processing chamber is wide. When the pickup is supported in a state in which the glass substrate is extended and the processing chamber is extended, the pickup is in a state of forming a single support beam, and the moment load of the mechanism portion of the pickup at the base end portion thereof is formed. In the case of the above-mentioned case, the subject matter of the present invention is increased. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. The purpose of the present invention is to provide an increase in the size of the transfer chamber, and there is no need to enlarge the opening for substrate transfer in the processing chamber, and there is no need to apply an excessive load to the substrate of the mechanism-5-200910507. A transfer device and a substrate processing device equipped with such a substrate transfer device. (Means for Solving the Problems) In order to solve the above problems, the first aspect of the present invention The present invention provides a substrate processing apparatus including: a processing chamber that performs a predetermined processing on a substrate on a substrate mounting table; a substrate transfer device that transports a substrate to the substrate mounting table, and a transfer chamber The substrate transport apparatus is configured to receive the processing chamber, and the substrate transport apparatus includes a pick-up device that enters the processing chamber in a state of supporting the substrate, and transports the substrate to the substrate mounting table; and a main driving mechanism The pickup device has a base portion, a plurality of support members that extend from the base portion into a fork shape and support the substrate, and a sub-drive mechanism that causes the support members to expand and contract. In the first aspect, the support member has a first member that is coupled to the base portion and a second member that is retractable from the first member, and further includes a second member that is retractable from the first member. The sub-drive mechanism can drive the second member. -6 - 200910507 The sub-drive mechanism is configured to move the second member in and out in conjunction with the slip of the pickup of the main drive mechanism. In this case, the substrate transfer apparatus further includes a base on which the pickup is slidable. The pickup is slid on the base and can enter the processing chamber from the transfer chamber. Further, the pickup device includes a coupling portion that connects the plurality of second members, and the sub-driving mechanism includes: a first pulley that is hung from the base portion or the first member toward the base, and the pick-up device Sliding and rotating; the second pulley is disposed on the base or the first member and rotates in accordance with the rotation of the first pulley; and the third pulley is disposed on the base or the first member, The rotation of the second pulley is rotated by the wheel belt; and the clamp member is attached to the belt, and is mechanically coupled to the second member to move along with the movement of the belt, so that the plurality of 2 The components move together. In this configuration, a speed reducer is interposed between the i-th pulley and the second pulley. The sub-drive mechanism is independent of the movement of the pickup, and the second member can be driven in and out. In this case, the sub-drive mechanism has a telescopic cylinder that is disposed on the base or the first member and has a telescopic rod, and a fourth pulley that is disposed on the base or the first member. Rotation of the telescopic rod; the fifth pulley is disposed on the base or the first member; 'rotates through the wheel belt as the fourth pulley rotates; and the clamping member is attached to the belt The second member is mechanically coupled to the second member and moves "with the movement of the belt" to move the second member. In such a configuration, the fourth pulley system includes: a small pulley that rotates in accordance with movement of the telescopic rod; and a large pulley that rotates together with the small pulley to hang the belt pulley, and the pair The drive mechanism includes a telescopic rod that is disposed on the base or the first member and that is movable from the first member and returned to the first member, and moves the second member. Telescopic cylinder. Further, the sub-drive mechanism includes a bellows that protrudes from the first member by introducing the pressurized gas, and causes the second member to pass in and out from the first member; When the inside of the bellows is depressurized, the second member can be biased so as to be restored to the first member. Further, in a configuration in which the second member is driven in and out independently of the movement of the pickups, the substrate transfer device further includes a base on which the pickup is slidable, and the pickup is slidably attached to the base. 8 - 200910507 Entering the processing chamber from the transfer chamber. In the above first aspect, an insertion space through which the lift pins that are lifted and lowered from the substrate stage of the processing chamber are inserted is formed between the plurality of support members. Further, a plurality of processing chambers are connected to the transfer chamber. According to a second aspect of the present invention, there is provided a substrate transfer apparatus comprising: a pick-up device that transports a substrate while supporting a substrate; and a main drive mechanism that drives pick-up Further, the pickup device has: a base portion; a plurality of support members extending from the base portion into a fork shape to support the substrate; and a sub-drive mechanism for causing the support members to expand and contract, and elongating the support member The substrate is transported. In the above second aspect, the support member includes a first member coupled to the base portion and a second member that is retractable from the first member, and the sub-drive mechanism drives the second member. Further, the sub-drive mechanism is configured to move the second member in and out in conjunction with the slip of the pickup of the main drive mechanism. In this case, there is further provided a substrate on which the pickup is slidable, and the pickup is slid on the substrate to transport the substrate. Further, the pickup has a coupling portion that connects the plurality of second members, and the secondary drive mechanism has a first pulley that is suspended from the base or the first member toward the base, along with the pickup. Sliding and rotating; the second pulley is disposed on the base or the first member and rotates in accordance with the rotation of the first pulley; the third pulley is disposed on the base or the first member, and The rotation of the second pulley is rotated by the wheel belt; and the clamping member is moved by the movement of the belt of the belt 'the second member' of the second member' Ka to move the plurality of The second member moves together. In this configuration, a speed reducer is interposed between the first pulley and the second pulley. The sub-drive mechanism is independent of the movement of the pickup, and the second member can be driven in and out. In this case, the sub-drive mechanism includes: a telescopic cylinder that is disposed on the base or the first member and has a telescopic rod; and a fourth pulley that is disposed on the base or the first member, and that expands and contracts Rotation of the rod; the fifth pulley is disposed on the base or the first member, and is rotated by the wheel belt as the fourth pulley rotates; and the clamp member is attached to the belt. The second member is mechanically coupled to the second member and moves in accordance with the movement of the belt to move the second member. -10-200910507 In the above configuration, the fourth pulley system includes: a small pulley that rotates in accordance with movement of the telescopic rod; and a large pulley that rotates together with the small pulley to hang the belt 〇 Further, the sub-drive mechanism includes: a second sub-member that is disposed on the base or the first member, and that is capable of moving back and forth from the first member to the first member, and moving the second member The telescopic cylinder of the telescopic rod. Further, the sub-drive mechanism has a bellows that protrudes from the first member by introducing the pressurized gas, and causes the second member to pass in and out from the first member; When the inside of the bellows is depressurized, the second member can be biased so as to be restored to the first member. Further, in the configuration in which the second member is driven in and out independently of the movement of the pickups, the base of the pickup may be slid. The pickup is slid on the base and is accessible from the transfer chamber. The above treatment room. In the second aspect described above, an insertion space through which the lift pins that are lifted and lowered from the substrate stage of the processing chamber are inserted is formed between the plurality of support members. Further, the substrate can be transported to a substrate mounting table provided in the processing chamber in a transfer chamber provided in a processing chamber that is connected to a substrate on the substrate mounting table. -11 - 200910507 [Effect of the Invention] According to the present invention, the pickup unit is configured to have a base portion, a plurality of support members extending from the base portion into a fork shape, and a sub-driver for causing the support members to expand and contract. The mechanism downloads the substrate in a state in which the support member is stretched. Therefore, when the pickup is retracted into the transfer chamber, the support member is shortened, and when the pickup enters the processing chamber, the support member can be formed in and out. Therefore, the pickup itself can be shortened in the transfer chamber, and the transfer chamber can be downsized, and the support member itself of the pickup can be extended during the conveyance of the substrate. Therefore, it is not necessary to insert a mechanism for driving the pickup in the processing chamber. In the portion, only the simple and thin mechanism portion of the telescopic support member is inserted, and the opening of the processing chamber can be avoided. Further, when the pickup enters the processing chamber, the amount of the support member to be moved in and out is a short distance of less than half of the total length thereof, and no bending moment is applied from the supporting member to the base end portion of the pickup, so that it can be applied to The load of the mechanism portion such as the sub-drive mechanism forms a low load. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, an embodiment of a substrate processing apparatus according to the present invention and a multi-chamber plasma etching system in which a plasma etching apparatus for plasma etching a glass substrate G for FPD is mounted will be described as an example. Here, the FPD may be a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), or the like. Fig. 1 is a perspective view schematically showing a multi-chamber plasma etching apparatus according to an embodiment of the substrate processing apparatus of the present invention -12-200910507, and Fig. 2 is a horizontal cross-sectional view schematically showing the inside. In the plasma etching apparatus 1, a transfer chamber 20 and a load lock 30 are successively provided at a central portion thereof. A processing chamber 1 for performing three plasma etchings is connected around the transfer chamber 20. The gap between the transfer chamber 20 and the preload chamber 30, between the transfer chamber 20 and each of the processing chambers 1 and between the preload chamber 30 and the outside atmosphere is hermetically sealed. A gate valve 22 constituting the opening and closing is interposed. Two cassette indexers 41 are provided on the outer side of the preload chamber 30, and cassettes 40 for accommodating the glass substrates G are placed thereon. For example, the cassette 40 can accommodate an unprocessed substrate on one side and a processed substrate on the other side. The cassettes 40 can be raised by the lifting mechanism 42. Between the two cassettes 40, a transfer mechanism 43 is provided on the support table 44. The transfer mechanism 43 includes pickers 45 and 46 which are provided in two stages, and can be integrated. A base 47 that enters and exits the retracted and rotative support. The transfer chamber 20 can be held in a predetermined reduced pressure environment in the same manner as the vacuum processing chamber. As shown in Fig. 2, a transfer device 50 is disposed. Then, the glass substrate G is transferred between the preload chamber 30 and the three paddle etching apparatuses 10 by the transfer device 50. The transfer device 5 is configured such that the two substrate transfer arms 52 are movable forward and backward on the base 51 which is likely to be rotated and moved up and down. The detailed structure of the transport device 50 will be described later. -13- 200910507 The preloading chamber 30 is maintained in a predetermined decompression environment in the same manner as each of the processing chamber 10 and the transfer chamber 20. Further, the preloading chamber 30 is for the recipient of the glass substrate G between the cassette 40 in the atmospheric environment and the processing chamber 10 in the decompression environment, and repeats the relationship between the atmospheric environment and the decompression environment, and minimizes the configuration. The content of the content. Further, in the preloading chamber 30, the substrate accommodating portion 31 is provided in two stages (only the upper stage is shown in Fig. 2), and the buffer 312 for supporting the glass substrate G is provided in each of the substrate accommodating portions 31, and the glass is placed. A positioner (Positioner) 33 of the alignment of the substrate G. In the processing chamber 1A, as shown in the cross-sectional view of Fig. 3, a structure for performing an etching process is provided. The processing chamber 1 is, for example, a corner cylinder formed of aluminum treated with an alumite treatment (anodizing treatment), and a bottom portion of the processing chamber 1 is provided with a substrate for mounting a substrate to be processed. The substrate mounting table of G is the susceptor 1 〇1. A liftable lift pin 130 is inserted into the base 1 〇 1 for mounting or unloading the glass substrate G thereto. The lift pin 130 is a transport position that rises above the susceptor 1 〇 1 when the glass substrate G is transported, and is otherwise in a state of being immersed in the susceptor 1 〇 1 . The susceptor 101 is supported at the bottom of the processing chamber 10 via an insulating member 104, and has a metal substrate 102 and an insulating member 1?3 provided on the periphery of the substrate 102. The substrate 110 of the susceptor 101 is connected to a supply line 123' for supplying high-frequency power, and the electric line 123 is connected to the integrator 124 and the high-frequency power source 125. The susceptor 101 is supplied with a high frequency power source 125, for example, 13. 56MHz high frequency power. Above the susceptor 101, a shower head 1 11 having a function as an upper electrode is provided in parallel with the susceptor 101 in a direction of -14-200910507. The shower head 11 1 is supported by the upper portion of the processing chamber 10 and has an internal space 112 therein, and a plurality of discharge holes 113 for discharging a processing gas are formed on a surface facing the susceptor 101. The shower head 111 is grounded and forms a pair of parallel plate electrodes together with the base 101. A gas introduction port 114 is provided on the upper surface of the shower head 111, and a processing gas supply pipe 1 15 is connected to the gas introduction port U 4 . The process gas supply pipe 1 15 is via the valve 1 16 and the mass flow controller 1 1 . 7 is connected to the processing gas supply source 1 1 8 . A processing gas for etching is supplied from the processing gas supply source 1 1 8 . As the processing gas, a halogen-based gas, a helium gas, an Ar gas, or the like which is generally used in the field can be used. An exhaust pipe 1 1 9 is formed at the bottom of the processing chamber 10, and the exhaust pipe 1 1 9 is connected to the exhaust device 120. The exhaust device 120 is a vacuum pump including a turbo molecular pump or the like, whereby the vacuum in the processing chamber 10 can be sucked to a predetermined decompression environment. Further, a substrate carry-out port 121 is provided on the side wall of the processing chamber 10, and the substrate carry-in/out port 121 can be opened and closed by the gate valve 22. Further, the glass substrate G can be carried in by the transfer device 50 in the transfer chamber 20 while the gate valve 22 is opened. As shown in Fig. 2, each component of the plasma etching apparatus 1 is configured to be controlled by a process controller 70 having a microprocessor. A keyboard or a user interface is connected to the process controller 70, and the keyboard is an instruction input operation for the operator to manage the plasma etching apparatus 1. The user interface is visualized by the operating condition of the plasma etching apparatus 1. The display is composed of a display or the like. Moreover, the process controller 70 is connected to the memory unit 72, which is stored -15-200910507 for use in the control of the process controller 70 to implement various processes performed in the electric device 1, or to comply with the processing conditions. The control program implemented in the plasma etching apparatus 1 is a prescription, a database, or the like. The memory unit 72 has a memory medium that is stored in the memory medium. The memory medium can be a hard disk or a half body, or a portable CDROM, a DVD, a flash memory, etc., and an arbitrary prescription can be called by the instruction portion 7 from the user interface 71 as needed. The process controller is processed by the plasma etching apparatus 1 under the control of the process controller 70. Next, the plasma etching apparatus 1 thus constructed will be described. First, the two pickups 4 5 and 4 6 of the transport mechanism 43 are loaded into the two-stage substrate storage chamber 31 of the preload chamber 30 from the one cassette 40 that accommodates the unprocessed substrate. After the pickups 45, 46 are retracted, the large valve 22 of the preload chamber 30 is closed. Then, the inside of the preload chamber 30 is evacuated to have a predetermined degree of vacuum. After the vacuum is applied, the alignment of the glass substrate G is performed by the positioner 3 3 . After the positioning as described above, the transfer chamber 20 and the pre-loaded gate valve 22 are opened, and the glass substrate G of the substrate accommodating portion 31 of the preload chamber 30 is connected by the transfer device 50 in the transfer chamber 20, and is carried in. The glass substrate G is placed on the holder. Then, the gate valve 2 2 is closed, and the predetermined portion, the prescription, and the like of the conductor memory are etched by the exhaust device 120. Then, from the memory 70, the desired process is moved forward and backward to drive the gate portion of the glass substrate gas side to be depressurized until the substrate is pressed, and [30 is accommodated in the mentality room 10, and the processing chamber is -16-200910507 1 Vacuum is applied to the specified degree of vacuum. Then, the open valve 116 is used to adjust the flow rate of the process gas from the process gas supply source 1 1 8 by the mass flow controller 1 1 7 while passing through the process gas supply pipe 1 1 5 and the gas introduction port 1 1 4 The inside space 1 1 2 of the shower head 11 1 is introduced, and the substrate G is uniformly discharged through the discharge hole 1 1 3 , and the inside of the processing chamber 1 is controlled to a predetermined pressure while adjusting the amount of exhaust gas. In this state, the predetermined processing gas is introduced into the processing chamber 10 from the processing gas supply source 1 18, and the high-frequency power source 125 applies high-frequency power to the susceptor 1 〇 4 to generate a high-frequency electric field. A plasma of a processing gas is generated between the susceptor 101 of the lower electrode and the shower head 111 as the upper electrode, and the glass substrate G is etched by the plasma. After the etching treatment is performed in this manner, the application of the high-frequency power from the high-frequency power source 125 is stopped, and the introduction of the processing gas is stopped. Then, the processing gas remaining in the processing chamber 10 is removed, and the glass substrate G is raised to the transfer position by the lift pins 130. In this state, the gate valve 22 is opened, and the glass substrate G is carried out from the processing chamber 10 to the transfer chamber 20 by the transfer device 50. The glass substrate G carried out from the processing chamber 10 is transported to the preload chamber 30, and is accommodated in the cassette 40 by the transport mechanism 43. At this time, you can return to the original cassette 40 or the cassette 40 contained in the other side. The above-described series of operations are repeated with the number of sheets of the glass substrate G accommodated in the cassette 40, and the processing is completed. Next, the conveying device 50 concerning the transfer chamber 20 will be described in detail. First, the first embodiment will be described. Fig. 4 is a schematic structural view showing a transport device -17-200910507 in which the pickup unit is slipped in the first embodiment, and Fig. 5 is a view showing a transporting device shown in Fig. 4 when transporting a glass substrate from the transfer chamber to the processing unit. Fig. 6 is a perspective view showing the conveying device shown in Fig. 4 and Fig. 5 (a) is a state in which the sliding pickup is located at the origin position in the transfer chamber (b) is a slide pickup entry The state when processing indoors. As shown in FIG. 4, the conveying device 50 has a long base 51, and slide pickups 52 and 53 which are slidably provided in the upper and lower stages independently of the base 51, and the base 51 is rotationally driven (Θ drive). At the same time, the drive mechanism 54 that drives the slide pickup 52 is lifted and lowered (Z drive), and the transport control unit 55 that controls the transport of the transport device by controlling the drive of the drive mechanism 54. The slide pickup unit 5 2 is moved to the base 51 and is provided in the processing chamber 10, and includes a main body portion 56 and an entry/retraction portion 57 that can be retracted from the main body portion 56. Further, the slide pickup 53 is moved to the base 51, and is provided to be movable into the processing chamber 1B, and includes a main body portion 256 and an ingress and egress portion 257 which can be retracted from the main body portion 256. Further, since the slide pickers 5 2, 5 3 have the same configuration, the following description will mainly be made on the slide picker 52. As shown in Fig. 6, the main body portion 56 constituting the slide pickup 52 has a base portion 56b including a connection portion with the base 51, and a first support having a plurality of long legs extending horizontally from the base portion 56b into a fork shape. Member 56a. Further, the entry/exit relief portion 57 is a plurality of second support members 57a having a plurality of first support members 56a that are connectable to the plurality of the first support members 56a. Then, the support member 56a and the second support member 57a are used to form a support member which is -18-200910507, and the glass substrate G is placed on the second support member 579a. An insertion space 1 3 1 that allows the insertion of the lift pins 1 300 is formed between the plurality of first support members 56a and the second support members 57a. Further, the number of supporting members can be appropriately set freely, and a part of the supporting members in Fig. 6 is omitted. The plurality of second supporting members 57a are mechanically coupled by the connecting member 57b, and are integrally movable. Further, a main drive mechanism 60 for driving the main body portion 56 is provided in the base 51. The main drive mechanism 60 includes a pulley 6 provided on the drive side of the base end portion of the base 51, a pulley 64 provided on the driven side of the front end portion of the base 51, and a wheel wound around the pulleys 62 and 64. The belt 63 (synchronous belt) and the belt 63 are mechanically coupled to the main body portion 56, and move along with the movement of the belt 63 to move the clamp member 65 of the main body portion 56. The pulley 62 on the driving side is rotated by a motor 61 (refer to Fig. 7 and the like) belonging to the drive mechanism 54. Further, the belt 63 may be a steel cable (belt) or the like other than the timing belt. As shown in FIG. 6(b), the main body portion 56 is a distance Lm for moving only the illustration, and the entrance and exit retracting portion 57 is a distance Ls for moving only the illustration. When the slide pickup 52 enters the processing chamber 10, the entrance and exit relief portion 57 may be inserted into and out of the main body portion 56 as long as it is half or less of the entire length. Next, the details of the mechanism portion of the slide pickup of the conveying device according to the first embodiment will be described. 7 and 8 are schematic diagrams showing a mechanism portion of a slide pickup device of a conveyance device according to a first embodiment of the present invention. FIG. 7 is a view showing a state in which the slide pickup 52 is located at an origin position of the transfer chamber 20, and FIG. -19* 200910507 8 is a state diagram showing that the slide pickup 52 enters the processing chamber 1 . 9(a) is a cross-sectional view taken along line IXa of Fig. 7, and (b) is a cross-sectional view taken along line IXb of Fig. 7. Further, in the drawings, only the slide pickup 5 2 among the two slide pickups 5 2, 5 3 will be described. The transport device 50 of the present embodiment is provided with a sub-drive mechanism 8 for slidingly driving the ingress and egress portion 57 in addition to the main drive mechanism 60 for driving the main body portion 56 of the slide pickup 52. The 〇 sub-drive mechanism 80 is a base plate 8 1 having a base portion 56b provided in the main body portion 56. Further, the sub-drive mechanism 80 is suspended from the main body portion 56 toward the base 51, and has a first pulley 82a that rotates in accordance with the movement of the main body portion 56. That is, the idlers 8 2 b and 8 2b of one of the belts 6 3 of the main drive mechanism 60 rotate while moving together with the belt 63, and the first pulley 82a follows. The belt 63 rotates while moving along with the movement of the body portion 56. The table 1 pulley 8 2 a is coupled to the second pulley 8 4 disposed on the base 8 1 via a speed reducer 8 3 (see Fig. 9(b)). The sub-drive mechanism 80 further includes a third pulley 86 that is disposed on the base plate 81 and that rotates via the belt 85 (synchronous belt) as the second pulley 84 rotates, and is provided on the belt 85 to be mechanically coupled to The entrance and exit relief portion 57 moves "to move the clamp member 87 that moves in and out of the escape portion 57 as the belt 85 moves. Further, the belt 85 may be other than a timing belt, and may be a cable (belt) or the like. Further, as shown in Fig. 9 (a) (b), a pair of guiding members 8 8, 8 are interposed between the both sides of the base 5 1 and the lower surface of the base portion 56b of the body portion 56 of the -20-200910507. Further, a pair of guiding members 89a, 89a are interposed between the upper surface of both sides of the base plate 8 1 of the sub-drive mechanism 80 and the lower surface of the connecting member 57b of the inlet and outlet retracting portion 57. A thin guide member 89b is interposed between the upper surface of the first support member 56a of the main body portion 56 and the lower surface of the second support member 57a. ··. As shown in FIG. 5, in the state in which the glass substrate G is placed on the entrance and exit retracting unit 57, the slide pickup 52 enters the processing chamber 10, and the entrance and exit retracting unit 57 becomes a slave. The state in which the main body portion 56 enters and exits. Next, the lift pins 130 are raised, and the glass substrate G is received from the entrance and exit evacuation portion 57. Then, the slide pickup 52 is ejected from the processing chamber 1 to the transfer chamber 20, and the lift pins 130 are lowered, and the glass substrate G is placed on the susceptor 1〇1. On the other hand, when the substrate G which has been processed is transferred from the lift pin 130 to the entrance and exit avoidance portion 57, the process is reversed by the above-described case. When the glass substrate G is transported to the processing chamber 10 by the transport device 50 as described above, as shown in FIGS. 6 and 7, the motor 6 of the main drive mechanism 6 is driven to rotate the pulley 62, thereby causing the belt 63 to be rotated. And the pulley 64 rotates. At this time, the clamp member 65 provided on the belt 03 moves, and the body portion 56 of the slide pickup 52 mechanically coupled to the clamp member 65 moves. In the present embodiment, the sub-drive mechanism 80 is as As described above, since the drive source is the same as that of the main drive mechanism 60, the movement of the main body portion 56 is moved, and the entrance and exit avoidance portion 57 is moved. Further, the sub-drive mechanism 80 has a configuration in which the drive unit is configured similarly to the main drive unit. However, in the transmission path of the power, the reduction gear 83 is inserted into and out of the drive unit 57, and the amount of movement forming the main body unit 56 is decelerated. . In other words, with respect to the sub-drive mechanism 80, the first pulley 82a that is hoisted from the main body portion 56 rotates as the wheel body portion 56 moves, and the first pulley 82a rotates. While being decelerated by the speed reducer 83, the second pulley is wound around the second pulley 84 and the third pulley 8.6, and the pulley 8 is provided on the belt 85. The entrance and exit relief portion 57 that is mechanically coupled to the clamp member 87 will move in and out of the main body portion 56. By placing the entrance/exit portion 57 of the glass substrate G in this manner, the glass substrate G can be transported to a desired position in the processing unit 1 . In this case, the slide pickup unit 5 2 is located in the transfer chamber 20, and the escape portion 57 is located on the main body portion 56. These overlapping shapes allow the transfer chamber 20 to be downsized. In this case, the glass substrate G is transported to the processing chamber 1 and the support member itself composed of the first support structure and the second support member 57a may be extended as long as the entry and exit relief portion 57 is moved in and out, and must be in the processing chamber 1 A mechanism for driving the pickup in the past is inserted into the simple and thin mechanism portion insertion process for telescopically supporting the support member, and the opening of the processing chamber 10 can be avoided. Playing 60 with the same amount, so the movement of the front ^ 63 and the rotation 84, borrowing will move, and make the movement, in and out, when, the state, due to the time, is a piece of 5 6a, therefore no part, only g 10, -22- In the case where the slide pickup 52 enters the processing chamber 10, the entry/exit relief portion 57 may be inserted into and out of the main body portion 56 as long as it is less than half of the total length. Therefore, only the main body portion 56 is mainly moved from the entrance and exit retracting portion 57 to the main body portion 56. Applying a downward load reduces the bending moment. Therefore, the load applied to the mechanism portion of the sub-drive mechanism 80 provided in the main body portion 56 can be reduced, whereby the structure of the sub-drive mechanism 80 and the like can be simplified. Further, since the weight and the impedance of the ingress and egress portion 57 can be lowered, the size of the belt 85 (synchronous belt) for driving can be reduced, so that the conveying mechanism can be downsized. Next, a second embodiment of the transport device 50 will be described. In the present embodiment, the schematic configuration of the conveying device is the same as that of the first embodiment, but the structure of only the mechanism portion of the sliding pickup is different. Fig. 1 is a schematic view showing a mechanism portion of a slide pickup device of a conveyance device in which the pickup portion of the second embodiment is slid, and shows a state in which the slide pickup device performs a processing chamber. In addition, in this figure, the slide pickup 5 2 of the two slide pickups will be mainly described. In the present embodiment, the sub-drive mechanism 90 provided with the telescopic cylinder 9 1 (cylinder) having the telescopic rod 9 1 a is disposed on the base portion 56 6 of the main body portion 56 of the slide pickup unit 5 2 . The base portion 56b of the main body portion 56 is provided with a pulley 92, a fourth pulley (large pulley) 9 3 having a small pulley 913a, and a belt 94 hung between the pulley 9 2 and the small pulley 93a. The telescopic rod 91a of the telescopic cylinder 9 1 (cylinder) is coupled to the belt 94. The sub-drive mechanism 90 further includes a fifth pulley that is rotated by the rotation of the fourth pulley 93 (large pulleys-23-97, 200910507) via the belt 96 (synchronous belt) and is provided on the belt 96. The belt member 96 that is connected to the ingress and egress avoiding portion 5, 7 moves in accordance with the movement of 96 to move in and out of the evacuation portion 57, and the belt 96 is not limited to the timing belt, but may be a cable (a wheel or the like. The pressurized air is supplied to the telescopic cylinder 9 1 (the cylinder moves the telescopic rod 9 1 a, the belt 94 moves, and the small pulley 9 3 a rotates. Thereby, the fourth pulley 93 (large pulley) rotates. The belt pulley 5 is rotated. The clamp member 98 provided on the belt 96 is moved so that the ingress and egress portion 57 that is mechanically coupled to the clamp member 98 is in the present embodiment. As described above, since the sub-drive mechanism 90 is different from the main drive mechanism 6 动, the sub-drive mechanism 90 can move independently of the main body portion 56 to move in and out of the evacuation portion 57. Further, the sub-drive mechanism 90 has the above-described power transmission path. Pulley 93 (large pulley)' and its small pulley 93a. Therefore, the entry and exit 5 7 can be compared with the telescopic rod 9 1 a The amount of movement is increased only by the speed of the fourth pulley 9 3 (large) and the small pulley 9 3 a. Fig. 1 is a cross-sectional view showing the transport mode of the pick-up portion of the second embodiment. This is the display of both sides of the slide pickup 52 which is provided in two stages. As described above, the lower slide pickup 52 is disposed between the upper surface of the base 5 1 side and the lower surface of the base portion 56b of the main body portion 56. The guide members 8 8 8 8 8 . The upper surface of the first support member of the main body portion 56 and the lower surface of the second support member 57 a that enters and exits the escape portion 57 are rotated by the TO W 98 ° band. The shifting of the fourth eliminator pulley is set, and the two guides 53 of 53 are between -24-200910507, respectively, and the thin guide members 8 9b, ... are provided. The upper slide pickup 5 3 is not detailed. As shown in the figure, a main drive mechanism having a homogenous structure is provided, and a pair of guide members 2 8 8 are interposed between the lower surfaces of the support members 210 on both sides of the base 51. The side of the support member 20 1 is configured via the side. The member 202 is coupled to the 256. That is, the structural member 202 supports the base 256b and the base portion 256 extends from the base. A plurality of first support members are shown. A thin guide member 2 8 9 is interposed between the upper surface of the first support member of the main body portion 25 6 and the lower surface of the second support member 2 5 7 a of the inlet and outlet 257. In addition, the telescopic cylinder 291 (cylinder) and the fourth pulley 293 which are used to move the upper and lower retraction portions are shown in Fig. 11. A pair of slide pickups 52 are provided on the left side of the base 51. The telescopic cylinder 9 1 (cylinder) for the inlet and outlet portion 57 is supplied with a cable support 99b for the air tube tube 99a for the pressurized air. Similarly, a cable support 299b for supplying the pressurized air tube 299a to the expansion/contraction cylinder 291 (cylinder) for the slide pickup 5 3 retracting portion 257 is provided on the right side of the base 51. Next, a third embodiment of the conveying device will be described. Fig. 12 is a perspective view showing the sliding of the pickup unit in the third embodiment, wherein (a) shows a state in which the slide pickup is at the position of the conveyance chamber, and (b) shows a state in which the slide pickup is in the process of entering the slide pickup. status. In addition, in this figure, only the slide pickup 52 is shown, but the solid surface is the same as that of the 288 body 2 5 6b avoidance section 25 7 retreat (air supply of the air intake of the original indoor -25- '53 200910507 In the present embodiment, the base portion 5 6 b disposed on the main body portion 56 is provided, and the telescopic cylinder 3 1 0 (cylinder) that connects the telescopic rod 31 1 to the connecting portion 57b of the inlet and outlet retracting portion 57 is provided. The sub-drive mechanism 300 is supplied. Therefore, when the pressurized air is supplied to the telescopic cylinder 3 1 0 (cylinder), the telescopic rod 31 1 moves, and is mechanically coupled to the retracting and retracting portion of the telescopic rod 3 1 1 . In the present embodiment, as described above, since the sub-driving mechanism 300 has a driving source different from that of the main driving mechanism 60, the ingress and egress portion 57 can be moved independently of the movement of the main body portion 56. In the field (p) indicated by the wavy line in Fig. 12 (b), a cable support for supplying a pressurized air to the air pipe (not shown) of the expansion/contraction cylinder 310 (cylinder) for entering and leaving the escape portion 57 is provided. A fourth embodiment of the transport apparatus will be described. Fig. 13 is a view showing the picking up of the fourth embodiment. (a) is a state in which the slide pickup is located at the origin position in the transfer chamber, and (b) shows a state in which the slide pickup enters the processing chamber. The slide pickup 52 of the slide pickers 5 2, 5 3 is displayed. In the present embodiment, the sub drive mechanism 400 is provided, and the sub drive mechanism 400 is provided in the plurality of second support members 57a provided in the entrance and exit relief portion 57. The plurality of bellows 410 and the spring 42 0 provided between the proximal end portion of the one second supporting member 57a and the proximal end portion of the one first supporting member 596a of the main body portion 56. -26- 200910507 The bellows 410 is connected to the air pipe 430, and the air pipe 430 is connected to the air supply source 432 and the vacuum pump 433 via the electromagnetic valve 431. Therefore, when the vehicle enters the process chamber 10 while moving in and out of the evacuation portion 57, the solenoid valve is 4 3 1 is switched to the air supply source 4 3 2 side. The compressed air is supplied to the bellows 41 from the air supply source 432 via the air pipe 430 or the like, and the bellows 410 is pressurized by the internal gas (compressed air). Can be accessed from the body portion 56 In the case of moving in and out of the evacuation portion 57, the spring 42 is extended against the elastic pressure when the ingress and egress portion 57 is movable in and out. On the other hand, the vehicle is moved in and out of the evacuation portion 57. When the processing chamber 1 is evacuated, the electromagnetic valve 43 1 is switched to the vacuum pump 4 3 3 side. From the vacuum pump 43 3 via the air piping 430 or the like, the inside of the bellows 410 is decompressed, and the bellows 410 is shrunk. At this time, the extended spring 410 will return the escape/removal portion 57 to the main body portion 56 by its elastic pressure. In the present embodiment, as described above, since the sub-driving mechanism 400 has a driving source different from that of the main driving mechanism 60, the ingress and egress portion 57 can be moved independently of the movement of the main body portion 56. Further, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above embodiment, the plurality of second supporting members that enter and exit the retracting portion are connected by the connecting portion. However, when each of the second supporting members has the sub-driving mechanism, the connecting portion is not required. Further, the transport mechanism of the slide pickup having the pick-up portion that supports the substrate is used, but it may be another transport mechanism such as a pick-up device having a joint type scalar transport mechanism. Further, -27-200910507, the above embodiment is for explaining a transfer operation in a vacuum, but is not limited thereto, and may be applied to a transfer device that performs transport in the air. Further, in the above embodiment, the present invention is applied to an etching apparatus. However, the present invention is not limited to the etching treatment, and may be applied to other processing such as film formation. Further, the above embodiment is described by taking a multi-chamber type device as an example, but a single-chamber type device having a single processing chamber may be applied. In the above embodiment, the substrate is an example in which a glass substrate for FPD is used. However, the substrate is not limited thereto, and may be another substrate such as a semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing a plasma uranium engraving apparatus according to an embodiment of a substrate processing apparatus of the present invention. Fig. 2 is a schematic horizontal cross-sectional view showing the inside of the plasma etching apparatus of Fig. 1. Fig. 3 is a cross-sectional view showing a processing chamber used in the plasma etching apparatus of Fig. 1. Fig. 4 is a schematic block diagram showing a conveying device in which the pickup unit of the first embodiment slips. Fig. 5 is a schematic cross-sectional view showing a state in which a glass substrate is transferred from a transfer chamber to a processing unit by the transfer device shown in Fig. 4; Fig. 6 is a perspective view showing the conveying device shown in Fig. 4 and Fig. 5, wherein (a) is a state in which the slide pickup is located at the origin position in the transfer chamber, and (b) is a state in which the slide pickup enters the processing chamber. Fig. 7 is a schematic view showing a mechanism portion of the sliding device -28-200910507 of the conveying device according to the first embodiment of the present invention when the pickup is positioned at the origin position of the conveying chamber. FIG. 8 is a schematic view showing a mechanism portion of the transport device of the transport device according to the first embodiment of the present invention when it enters the processing chamber. Fig. 9 (a) is a cross-sectional view taken along line IXa of Fig. 7 (b) is a cross-sectional view taken along line IXb of Fig. 7. Fig. 10 is a schematic view showing a mechanism portion of the slide pickup of the conveying device in which the pickup unit is slid in the second embodiment. Fig. 11 is a schematic cross-sectional view showing a conveying device in which the pickup unit of the second embodiment is slid. Fig. 12 is a perspective view showing a conveying device in which the pickup unit of the third embodiment slips, wherein (a) is a state in which the slide pickup is located at the origin position in the transfer chamber, and (b) is a state in which the slide pickup enters the processing chamber. FIG. 13 is a perspective view showing the transport device in which the pickup unit of the fourth embodiment slips, wherein (a) is a state in which the slide pickup is located at the origin position in the transfer chamber, and (b) is a slide pickup entry process. State at room [Description of main component symbols] 1 : Plasma etching device 1 〇: Processing chamber 20: Transfer chamber 22: Gate valve 3: Preload chamber -29- 200910507 50: Transfer device 5 1 : Base 5 2, 5 3: slide pickup 5 6 : main body portion 5 7 : entrance and exit retracting portion 5 4 '· drive mechanism 5 5 : transport control unit 60 : main drive mechanism 7 0 : process controller 8 0 _· sub drive mechanism 8 2 a : First pulley 8 3 : Reducer 8 4 : Second pulley 8 5 : Wheel 8 6 : Third pulley 8 7 : Clamping member 90 : Sub-drive mechanism 9 1 : Telescopic cylinder 9 3 : 4th pulley 9 6 : Wheel 9 7 : 5th pulley 9 8 : Clamping member 1 0 1 : Base 1 3 0 : Lifting pin -30- 200910507 1 3 1 : Through space 300: auxiliary drive mechanism 31 ○: Telescopic cylinders 400: auxiliary drive mechanism 410: Bellows 420: spring G: glass substrate