JP2695403B2 - Semiconductor substrate processing method and semiconductor substrate processing apparatus - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing method and a semiconductor substrate processing apparatus in a semiconductor manufacturing process such as an etching apparatus, a plasma CVD apparatus and a sputtering apparatus. BACKGROUND OF THE INVENTION Recent progress in semiconductor manufacturing process technology has been remarkable, and a type of processing a 1 μm pattern has appeared even in a dry etching apparatus, and has been receiving attention. As such miniaturization progresses, the substrate becomes larger in diameter, and accordingly, the throughput per occupied floor area of the semiconductor manufacturing apparatus (the number of processed substrates per time) is improved and the manufacturing process technology is diversified. Is a major issue. In order to solve such demands, it is necessary to reduce the size of the apparatus and perform multipurpose processing using a plurality of vacuum processing chambers. A vacuum processing module that can configure or organize a system by freely changing the number of chambers has been required. On the other hand, in a conventional type in which a module in which a vacuum processing chamber and a substrate transfer line in the atmosphere can be added as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-128929, can be added, the air quality is poor. Since the substrate is transported to the next vacuum processing chamber through the inside, it is not suitable for application to a process step in which processing is transferred to the next vacuum processing chamber during processing. Further, in a type in which a substrate is transported between several vacuum processing chambers and one buffer chamber and continuously processed as disclosed in Japanese Utility Model Laid-Open No. 57-39430. There is a problem that the number of vacuum processing chambers is fixed, and there is no freedom to change the number of vacuum processing chambers in response to a process change or a line change, making it difficult to use. SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor substrate processing method and apparatus in which a substrate is not damaged by transportation in order to improve throughput in semiconductor manufacturing. A feature of the present invention is that in a semiconductor substrate processing method, a substrate taken out from a cassette one by one is transferred to the vacuum processing chamber by a transfer means in a state where the vacuum transfer chamber and the vacuum processing chamber are in communication with each other. transported to the substrate support position opposed to the substrate supporting surface of, after supporting the substrate with the supporting member rise of <br/> so the support member from the substrate support table beneath side, said conveying means
Evacuate , lower the support member to place the substrate on the substrate support, then partition the vacuum processing chamber,
After the predetermined vacuum processing,
The support member raised from below the substrate support is moved to a position separated from the substrate support, and then the transfer unit is moved to a position below the substrate,
By lowering the supporting member, the substrates are transferred to the transfer means, the transfer means carry out the substrates from the vacuum processing chamber, and the carried-out substrates are collected in a cassette one by one. Another feature of the present invention is a semiconductor provided with a vacuum processing chamber for performing a predetermined vacuum processing on a substrate, a transfer means for transferring the substrate between the cassette and the vacuum processing chamber, and a supporting member. In the substrate processing apparatus, the transfer means holds the substrates taken out one by one from the cassette on the back surface of the substrate, and holds the substrate in the vacuum processing chamber while the vacuum transfer chamber and the vacuum processing chamber are in communication with each other. The substrate is transported to a position facing the substrate support surface of the substrate, the substrates that have undergone the vacuum processing are unloaded from the vacuum processing chamber, and the unloaded substrates are collected in a cassette one by one. rises from the substrate support table beneath side supporting the substrate at its rear surface, a substrate support of the vacuum processing chamber of said conveying means
After evacuating from the position facing the substrate support surface of the table, descend
The substrate is placed on the substrate support table by the above, and after the vacuum processing is completed , the substrate is raised from below the substrate support table and is supported from the substrate support table while supporting the substrate on its back surface. It is configured to transfer the substrate to the transfer means by moving it to a separated position and lowering it. According to the present invention, the processing apparatus using the transfer mechanism for holding the back surface of the substrate during transfer can prevent the substrate from being damaged during transfer. Further, since the transfer mechanism is of a type in which the gripping means does not grip the substrate and pushes it up from the back side, by combining this with the orientation flat alignment, there is no risk of misalignment when gripping the substrate with the gripping means. Highly accurate positioning can be performed. The transport mechanism may be a vacuum suction type or an electrostatic suction type. An embodiment of the present invention will be described with reference to FIGS. In FIG. 1, a vacuum processing apparatus includes a buffer chamber 10 capable of evacuating, and a vacuum processing chamber 2 provided in the buffer chamber 10.
0 and the buffer chamber 1 capable of transporting the substrate 30 in the direction of arrow A.
And a vacuum opening / closing means 4 such as a gate valve and a partition provided on the side wall of the buffer chamber 10 at both ends of the first substrate transfer means.
0, 41 and, in this case, a gate valve provided on the side wall corresponding to the vacuum processing chamber 20 at right angles to the side wall on which the vacuum opening / closing means 40, 41 are provided and sandwiching the first substrate transfer means. Of the buffer chamber 10 through the vacuum opening / closing means 50 and 51 of FIG.
The second substrate transporting means (which transports the substrate 30 in the directions of arrows B and C via the other vacuum opening / closing means 50 and 51 between the pre-vacuum chamber 60 provided in the apparatus and the first substrate transporting means ( A substrate transfer means (not shown) provided on the substrate transfer path of the first substrate transfer means and corresponding to the vacuum processing chamber 20, and a connection between the substrate transfer means and the vacuum processing chamber 20. And a third substrate carrying means (not shown) for carrying the substrate 30 in the direction of the arrow D between them. In this case, in the vacuum preparatory chamber 60, a cassette table (not shown) of a cassette elevating device (not shown) for driving the substrate cassettes 70 and 71 up and down corresponds to the other vacuum opening / closing means 50 and 51 so as to be able to go up and down. It is installed inside. The first to third substrate transfer means, substrate transfer means and the like will be described in more detail with reference to FIG. In FIG. 2, the first substrate transfer means is a belt transfer device 80. The belt transfer device 80 is entirely composed of an elevating device, for example, a cylinder 8
1, the belt 83 is driven to rotate by the motor 82. The second substrate transfer means includes belt transfer devices 90 and 100 provided in the vacuum preliminary chamber 60 and belt transfer devices 110 provided in the buffer chamber 10 with the other vacuum opening / closing means 50 and 51 interposed therebetween. 120. The pulleys 91 and 92 of the belt conveying device 90 and the belt 93 wound around the pulleys 91 and 92 endlessly correspond to the cassette table 131 of the cassette elevating device 130, and the cassette table 131 is raised to the highest position. It is arranged so that it is located above it even at the point of time. The belt 93 is driven to rotate by a motor 94. The belt conveying device 110 uses the motor 111 to drive the belt 11
In this case, the end of the belt conveying device 110 on the side of the belt conveying device 80 is bent into a V-shape so as not to hinder the up-and-down movement of one of the belts 83 of the belt conveying device 80. The pulley 113 is connected to the belt conveying device 80
Are provided between the belts 83. The belt 93 of the belt conveyance device 90 and the belt 112 of the belt conveyance device 110 are at the same level, and the interval between the belt conveyance device 90 and the other end of the belt opening / closing means 50 on the side of the vacuum conveyance means 50 It is a size that does not hinder delivery. Pulleys 101, 1 of the belt conveying device 100
02 and the belt 103 wound around the pulleys 101 and 102 endlessly are disposed in the same manner as the belt conveying device 90,
The belt 103 is driven to rotate by a motor 104. The belt conveying device 120 is driven to rotate the belt 122 by the motor 121, and the end of the belt conveying device 120 on the side of the belt conveying device 80 is moved up and down by one of the belts 83 of the belt conveying device 80 similarly to the belt conveying device 110. The pulley 123 is bent in a V-shape so as not to obstruct the position, and is provided so as to be located between the belts 83 of the belt conveying device 80. The belt 10 of the belt conveying device 100
3 and the belt 122 of the belt conveying device 120 are at the same level, and the belt conveying device 100 and the belt conveying device 12
The distance between the other end of the vacuum opening / closing means 51 and 0 is a size that does not hinder delivery of the substrate 30. The distance between the pulleys 113 of the belt transport device 110 and the pulleys 114 corresponding to the pulleys 113 is large enough to prevent the substrate 30 from dropping and to be satisfactorily delivered.
The distance between the pulley 123 corresponding to the zero pulley 123 and the corresponding pulley 124 is the same size. The belt conveying device 80 is driven to move up and down so that the level of the belt 83 is equal to or lower than the level of the belts 112 and 122 of the belt conveying devices 110 and 120. The substrate delivery means 140 is provided in the belt conveying device 8.
Substrate table 141 smaller than the dimension between belts 83
And an elevating device, for example, a cylinder 142. The substrate table 141 is provided at a position corresponding to the vacuum processing chamber 20, in this case, at a position between the belt transfer devices 110 and 120, so as to pass between the belts 83 of the belt transfer device 80 and to be able to move up and down by the cylinder 142. I have. The third substrate transfer means includes an arm transfer device 1
50,160. The arm transfer device 150 includes a board scooping tool 151, an arm 152, and a rotation device, for example, a pulse motor 153. Pulse motor 15
3 is between the belt transfer device 80 and the vacuum processing chamber 20,
The pulse motor 15 is provided on one side (the left side in FIG. 2) of a line connecting the center of the substrate table 141 of the substrate delivery means 140 and the center of the substrate electrode 21 of the vacuum processing chamber 20.
3 is provided with one end of an arm 152. A board scooping tool 151 is provided at the other end of the arm 152. Further, the arm transfer device 160 is provided with the board rake tool 16.
1, an arm 162 and a rotating device, for example, the pulse motor 1
63. The pulse motor 163 is connected to the other side of the line connecting the center of the substrate table 141 of the substrate transfer means 140 and the center of the substrate electrode 21 of the vacuum processing chamber 20 between the belt transfer device 80 and the vacuum processing chamber 20. (Figure 2
The pulse motor 163 is provided with one end of an arm 162. At the other end of the arm 162, a board scooping tool 161 is provided. In this case, substrate scooping tools 151, 161, arms 152, 16
When the substrate 30 is placed on the substrate table 141 and the substrate electrode 21, the dimension 2 is a dimension that allows the substrate 30 to be scooped by the board scooping tools 151 and 161. Further, the arm 152, 162 is a pulse motor 153, so that the substrate 30 can be conveyed between the substrate table 141 and the substrate electrode 21 by the substrate scooping tools 151, 161.
At 163, each is partially rotated. In this case, the operation plane of the arms 152 and 162 is as follows.
The arm 162 is different from the lower surface. For example, the substrate 30 is moved from the substrate table 141 to the substrate electrode 2 by the arm transfer device 150.
When the substrate 30 is transferred to the substrate table 141, the transfer of the substrate 30 from the substrate electrode 21 to the substrate table 141 by the arm transfer device 160 is not hindered. The cassette elevating device 130 includes a cassette table 131, an elevating rod 132 which is suspended from the cassette table 131 and has a screw formed at a lower end, and a motor 13.
3 and a gear 135 meshed with the gear 134 and having a lower end of the lifting rod 132 screwed into the gear 134. The substrate electrode 21 is driven up and down by rotation of a motor 23 via a rack and pinion mechanism 22. Further, a claw 24 for supporting the substrate is provided at the center of the substrate electrode 21 so as to be able to move up and down by a lifting device, for example, a cylinder 25. The position of the claw 24 is equal to or less than the surface of the substrate electrode 21 and the position of the arm transfer device 15.
The board 30 is driven to move up and down between the 0,160 board scooping tools 151,161 and a position at which the board 30 can be transferred. In the vacuum processing apparatus shown in FIGS. 1 and 2,
The following substrate processing can be performed. First, the cassette table 131 corresponding to the other vacuum opening / closing means 50 is lowered to the lowermost position, and the cassette table (not shown) corresponding to the other vacuum opening / closing means 51 is raised to the uppermost position. Other vacuum switching means 5
For example, the cylinders 52 and 53 are closed by driving the cylinders 52 and 53, and the communication between the buffer chamber 10 and the vacuum preparatory chamber 60 is air-tightly cut off. Communication with the outside is also airtightly shut off. In this state, the buffer chamber 10 is evacuated to a predetermined pressure by operating a vacuum exhaust device (not shown). On the other hand, when the outside is on the atmospheric side, a predetermined number of substrates 30 are opened by opening an atmospheric vacuum opening / closing means (not shown) such as a door provided in the vacuum preliminary chamber 60. Loaded with a substrate cassette (hereinafter abbreviated as a supply cassette) 70 and an empty substrate cassette (hereinafter, abbreviated as a substrate cassette) for collecting a substrate.
A collection cassette 71 is carried in, and the supply cassette 70 is placed on a cassette table 131 corresponding to the other vacuum opening / closing means 50, and the collection cassette 71 is placed in another vacuum opening / closing means 51.
Are placed on the cassette tables corresponding to. Thereafter, the atmospheric vacuum opening / closing means is closed, and the vacuum preparatory chamber 60 is evacuated to a pressure substantially equal to the pressure of the buffer chamber 10 by a vacuum evacuation device (not shown). Thereafter, the other vacuum opening / closing means 50 is opened by driving the cylinder 52, whereby the buffer chamber 10 and the vacuum preliminary chamber 60 are opened.
Becomes a communication state. In this state, the motor 133 is driven to lower the cassette table 131 by one pitch, whereby the substrate 30 loaded at the lowermost part of the supply cassette 70 in this case, is placed on the belt 93. Thereafter, the substrate 30 placed by rotating the belt 93 by the motor 94 is conveyed to the other vacuum opening and closing means 50 side, and the other vacuum opening and closing means is rotated by the belt 112 driven by the motor 111. Passed through 50. The substrate 30 transferred to the belt 112 is transported to the belt transport device 80 side. At this time, the entire belt conveying device 80 is lowered by the cylinder 81 so that the level of the belt 83 is lower than the level of the belt 112. After that, the substrate 30 is moved to the pulleys 113 and 114.
The entire belt transporting device 80 is raised by the cylinder 81 so that the level of the belt 83 becomes equal to or higher than the level of the belt 112 when the substrate 30 is transported to such an extent that the substrate 30 is transferred from the belt 112 to the belt 83. . The substrate 30 transferred to the belt 83 is conveyed to a position corresponding to the substrate table 141 by driving of the motor 82, and then received by the substrate table 141 by lifting the substrate table 141 by the cylinder 142. The substrate 30 received on the substrate table 141 is aligned with the orientation flat by, for example, an orientation flat alignment device 170. Thereafter, the substrate 30 is transferred to, for example, a substrate holder 151, and the arm 152 is rotated toward the vacuum processing chamber 20 by a pulse motor 153, whereby the buffer chamber 10 is rotated.
Is transported above the substrate electrode 21 in the vacuum processing chamber 20. Thereafter, the claw 24 is raised by the cylinder 25, so that the substrate 30 of the substrate placing tool 151 is received by the claw 24. After that, the substrate placing tool 15 with the substrate 30 passed over the nail 24
1 is retracted to the buffer chamber 10 outside the vacuum processing chamber 20. Then, the claw 24 is lowered by the cylinder 25 so that the surface thereof is below the surface of the substrate electrode 21,
The substrate 30 is passed from the nail 24 to the substrate electrode 21 and placed thereon. Thereafter, it is composed of a partitioning flange 180, a bellows 181 laid over the back surface of the flange 180 and the bottom wall of the buffer chamber 10, and an elevating device for driving the flange 180 up and down, for example, a cylinder 182. The buffer chamber 10 and the vacuum processing chamber 20 are partitioned by the partitioning means 183. In this state, first, the electrode interval between the substrate electrode 20 and a counter electrode (not shown) provided above the substrate electrode 30 in the vacuum processing chamber 20 so as to oppose the substrate electrode 30 is adjusted to an appropriate interval by driving the motor 23. Adjusted. Thereafter, the process gas is introduced into the vacuum processing chamber 20 at a controlled flow rate, and the pressure of the vacuum processing chamber 20 is adjusted to the processing pressure by driving a vacuum exhaust device (not shown). Thereafter, a high frequency power is applied to the substrate electrode 21 from a power supply connected to the substrate electrode 21, for example, a high frequency power supply (not shown), so that a glow is applied between the counter electrode and the substrate electrode 21. Discharge occurs and the process gas turns the process gas into plasma. The substrate 30 placed on the substrate electrode 21 by this plasma is subjected to a predetermined process such as an etching process. During this time, the substrate 30 is taken out of the supply cassette 70 by the above-described operation, transported by the belt transport devices 110 and 80, transferred to the substrate table 141, aligned with the orientation flat, and then transferred to the substrate placing tool 151. After the processing in the vacuum processing chamber 20 is completed, the buffer chamber 10 and the vacuum processing chamber 20 are separated by the partitioning means 183.
Is released, and the vacuum processing chamber 20 becomes the buffer chamber 10
Is again communicated with. Thereafter, the substrate electrode 21 is lowered to a predetermined position, and the claw 24 is raised by the cylinder 25, whereby the processed substrate 30 is removed from the substrate electrode 21 and passed to the claw 24. Then, the substrate mounting tool 161
Is rotated to a position corresponding to the back surface of the substrate 30 transferred to the claw 24, and then the claw 24 is lowered by the cylinder 25, whereby the processed substrate 30 is transferred to the substrate placing tool 161. Thereafter, the substrate 30 delivered to the substrate mount 151 is transferred from the substrate table 141 to the substrate electrode 21, and the processed substrate 30 delivered to the substrate mount 161 is transferred from the substrate electrode 21 to the substrate table 141. Each is transported. The substrate 30 transported to the substrate electrode 21 is subjected to predetermined processing by the above-described operation. During this time, the substrate table 14
The processed substrate 30 transported to the substrate table 1
41 is passed down to the belt 83 of the belt conveying device 80 by being lowered by the cylinder 142, and thereafter, the belts 83, 1
It is conveyed to another vacuum opening / closing means 51 side by the rotation drive by the motors 82 and 121 of 22. The delivery of the processed substrate 30 from the belt 83 to the belt 122 is performed by the belt 1
The transfer of the substrate 30 from the belt 12 to the belt 12 is performed in a reverse operation. The other vacuum opening / closing means 51 is opened by the driving of the cylinder 53, and the processed substrate 30 conveyed to the other vacuum opening / closing means 51 is driven by rotating the belt 103 by the motor 104. The cassette cassette is carried into the pre-vacuum chamber 60 via the storage unit 51, and then the cassette table is raised by one pitch to thereby collect the collection cassette 71.
Will be collected. Further, the substrate 30 is taken out from the supply cassette 70 by the above-mentioned operation, and the belt conveying device 110,
After being conveyed at 80 and transferred to the substrate table 141 and aligned with the orientation flat, it is transferred to the substrate holder 151. By repeating the above operations, the substrates 30 are taken out of the supply cassette 70 one by one, transferred from the pre-vacuum chamber 60 to the vacuum processing chamber 20 via the buffer chamber 10, and then transferred to the vacuum processing chamber 20. Each sheet is processed at 20,
The processed substrate 30 is conveyed from the vacuum processing chamber 20 to the pre-vacuum chamber 60 via the buffer chamber 10 and is collected one by one in the collection cassette 71. FIG. 3 shows an example in which the vacuum processing apparatus shown in FIGS. 1 and 2 is used as one module and two modules are connected in series via the vacuum opening / closing means 40 and 41. Note that the components in FIG. 3 are all the same as those in FIG. 2, and therefore, the description of the configuration, operation, and the like is omitted. FIG.
4 (a) to 4 (c)
Can be performed. That is, as shown in FIG. 4A, series processing of the substrate 30 in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series is performed, or as shown in FIG.
4 may be processed in parallel in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series, or as shown in FIG.
Can be processed in parallel. In such a substrate processing mode, FIG.
In the case of the substrate processing mode shown in (a) and (b), at least one supply cassette (not shown) is set in the vacuum preliminary chamber 60 of the vacuum processing apparatus of the first stage, and the vacuum preliminary chamber 60 of the vacuum processing apparatus of the second stage is set. At least one recovery cassette (not shown) is set in the. In the case of the substrate processing mode shown in FIG. 4C, one supply cassette (not shown) and one recovery cassette (not shown) are set in the vacuum preparatory chamber 60 of each vacuum processing apparatus. Further, when the vacuum processing apparatus shown in FIGS. 1 and 2 is used as one module and two modules are connected in series via the vacuum opening / closing means 40 and 41, the substrate 30 is transferred in the buffer chamber 10 in each vacuum processing apparatus. It is done by passing. Furthermore, when the vacuum processing apparatus shown in FIGS. 1 and 2 is used as one module and three or more modules are connected in series via the vacuum opening / closing means 40 and 41, in addition to the substrate processing mode shown in FIG. Substrate processing as shown in FIGS. 5A and 5B can be performed. That is, as shown in FIG.
In the vacuum processing chamber 20 of the preceding vacuum processing apparatus of the vacuum processing apparatus and the vacuum processing chamber 20 of the middle vacuum processing apparatus in this case, parallel processing is performed first, and then the subsequent vacuum processing apparatus As shown in FIG. 5B, the series processing is performed in the vacuum processing chamber 20 of the vacuum processing chamber 20 of the first and middle vacuum processing apparatuses in which the substrate 30 is connected in series.
In addition to performing the series processing at 0, the series processing can be performed in the vacuum processing chambers 20 of the vacuum processing apparatuses at the first and second stages. In the case of such a substrate processing mode,
Two supply cassettes (not shown) are set in the vacuum preparatory chamber 60 of the preceding vacuum processing apparatus, and two collection cassettes (not shown) are set in the vacuum preparatory chamber 60 of the subsequent vacuum processing apparatus. When the substrates 30 are processed in series in the vacuum processing chamber 20 of each vacuum processing apparatus, one supply cassette is set in the vacuum preliminary chamber 60 of the vacuum processing apparatus of the preceding stage, and the vacuum of the vacuum processing apparatus of the subsequent stage is set. Make sure to set one recovery cassette in the spare room. When the substrates 30 are processed in parallel in the vacuum processing chamber of each vacuum processing apparatus, at least one supply cassette is set in the vacuum preliminary chamber of the preceding vacuum processing apparatus and the vacuum preliminary chamber of the subsequent vacuum processing apparatus is set. Make sure to set at least one collection cassette in. When each vacuum processing apparatus is independent and the substrates are processed in parallel in the respective vacuum processing chambers, one supply cassette and one recovery cassette are set in the vacuum preliminary chamber of each vacuum processing apparatus. . In addition, even when three or more modules are connected to each other via the vacuum opening / closing means 40 and 41 as one module of the vacuum processing apparatus shown in FIGS. 1 and 2, the substrate 30 in each vacuum processing apparatus is transferred to the buffer chamber 10. It is done by going through. The vacuum processing apparatus of this embodiment has the following effects. (1) The system configuration or organization can be changed by freely changing the number of vacuum processing chambers in response to process changes and line changes. (2) Since the substrate is conveyed to the next vacuum processing chamber via the evacuated buffer chamber, it can be applied without problem to a process step in which processing is transferred to the next vacuum processing chamber during processing. (3) The width of the front surface of the vacuum processing apparatus can be reduced by making the second substrate transfer means and the third substrate transfer means parallel,
Multi-module configuration is easy. (4) Since the vacuum preliminary chamber is a cassette chamber that can be evacuated, it is possible to reduce the depth of the vacuum processing equipment. In a multi-module system, it is possible to set two cassettes in one module and throughput. It is possible to lengthen the cassette set time interval during improvement. (5) Since the arm transfer device having different operation planes is used as the third substrate transfer means, the substrates can be loaded into and unloaded from the vacuum processing chamber at the same time, so that the throughput can be improved. (6) Since multiple modules can perform series processing or parallel processing, the vacuum processing apparatus can be downsized and the throughput per combined floor area can be improved. (7) The opening area of the vacuum opening / closing means provided in the buffer chamber only needs to be an area through which one substrate can pass. Therefore, in the case of a multi-module, mixing of the residual process gas between the vacuum processing apparatuses hardly occurs. Therefore, independence from the process gas in each vacuum processing apparatus can be ensured. When the depth of the vacuum processing apparatus is reduced and the continuous processing with other apparatus is aimed at,
As shown in FIG. 6, a vacuum preparatory chamber 60 'is provided in the buffer chamber 10 via the vacuum opening / closing means 40, for example.
A second substrate transfer device (not shown), which is a first substrate transfer means for transferring the substrate 30 in the direction of arrow A, is capable of transferring the substrate 30 in the direction of arrow E via the vacuum opening / closing means 40.
A belt transfer device (not shown) as a substrate transfer means is provided in the vacuum preliminary chamber 60 '. In this case, no other vacuum opening / closing means is required. In the embodiment described above, the vacuum preliminary chamber is a vacuum preliminary chamber in which the supply cassette and the recovery cassette are loaded and set from the outside, but it is particularly necessary to limit the vacuum preliminary chamber to such a vacuum preliminary chamber. There is no. For example, a supply cassette and a collection cassette are fixed and set in a vacuum spare chamber, a predetermined number of substrates are loaded from the outside into the supply cassette, and the substrates collected in the collection cassette are taken out of the collection cassette and carried out. May be. Further, the first substrate carrying means may be any one that carries the substrate to and from the vacuum opening / closing means provided in the buffer chamber in addition to the belt carrying device. Also, the second
As the substrate transfer means, other than the belt transfer device, for example, an arm transfer device in which an arm moves straight, an arm transfer device in which an arm rotates, or the like may be used. According to the present invention, the processing apparatus using the transfer mechanism for holding the back surface of the substrate at the time of transfer is provided.
There is an effect that it is possible to prevent the substrate from being damaged when the substrate is transported. Further, since the transfer mechanism is a system in which the substrate is pushed up from the back without grasping the substrate by the grasping device, by combining this with the orientation flat alignment, there is no fear of misalignment when grasping the substrate by the grasping device. There is an effect that high-precision positioning can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing one embodiment of a vacuum processing apparatus according to the present invention. FIG. 2 is a perspective configuration diagram of a substrate transfer unit of the vacuum processing apparatus of FIG. FIG. 3 is a perspective view of a substrate transfer means of a vacuum processing apparatus in which two modules of the vacuum processing apparatus of FIG. 1 are connected in series. 4A to 4C are substrate processing mode diagrams in a two-module vacuum processing apparatus. FIGS. 5A and 5B are other substrate processing mode diagrams in a three-module vacuum processing apparatus. FIG. 6 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention. [Description of References] 10: buffer chamber, 20: vacuum processing chamber, 30: substrate, 4
0, 41: Vacuum opening / closing means, 50, 51: Other vacuum opening / closing means, 60, 60 ': Vacuum spare chamber, 80 to 120: Belt transfer device, 140: Substrate delivery means, 150, 160
... Arm transfer device.

Continuation of front page    (72) Inventor Fumio Shibata               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant (72) Inventor Tsunehiko Tsubone               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant (72) Inventor Keno Kanai               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant

Claims (1)

(57) [Claims] The substrates taken out one by one from the cassette are transferred to a position facing the substrate support surface of the substrate support of the vacuum processing chamber by the transfer means in a state where the vacuum transfer chamber and the vacuum processing chamber communicate with each other, and the substrate support after supporting the substrate with the supporting member to raise the support member from below how the retracts the conveying means,
The substrate is placed on the substrate support by lowering the support member, then the vacuum processing chamber is partitioned, and a predetermined vacuum process is performed, and the substrate after the vacuum process is below the substrate support.
The substrate is moved to a position separated from the substrate support base by the supporting member raised from above, and then the transfer means is moved to a position below the substrate , and the support member is lowered to transfer the substrate to the transfer means. The semiconductor substrate processing method, wherein the substrate is delivered to the vacuum processing chamber by the transfer means, and the transported substrate is collected in a cassette one by one. 2. The substrates taken out one by one from the cassette are transferred to a position facing the substrate support surface of the substrate support of the vacuum processing chamber by the first transfer means in a state where the vacuum transfer chamber and the vacuum processing chamber are in communication with each other, after supporting the substrate with the supporting member to raise the support member from the substrate support table beneath side, retracting the first transport means
Is, the support member is lowered by placing the substrate on the substrate support table, then partition the vacuum processing chamber, performs predetermined vacuum treatment, the substrate on which the vacuum processing is completed for the substrate support Down
The substrate is moved to a position separated from the substrate support base by the supporting member raised from above, and then the second transfer unit provided in the same chamber as the vacuum transfer chamber in which the first transfer unit is provided is provided on the substrate. Below
It is moving to a position, transfer the substrate to the second conveying means by lowering the support member, by said second transport means is unloaded from the vacuum processing chamber, the substrate which issued該搬the cassette 1 A method of processing a semiconductor substrate, characterized by recovering each piece. 3. A vacuum processing chamber for performing a predetermined vacuum processing on the substrate,
In a semiconductor substrate processing apparatus comprising a carrier and a support member for carrying the substrate between a cassette and the vacuum processing chamber, the carrier holds the substrates taken out from the cassette one by one on the back surface of the substrate. However, in a state where the vacuum transfer chamber and the vacuum processing chamber are in communication with each other, the vacuum transfer chamber is transferred to a position facing the substrate support surface of the substrate support table, and the substrate on which the vacuum processing is completed is unloaded from the vacuum processing chamber. and is composed of the substrate that issued該搬to recover one by one to the cassette, the support member is raised from the substrate support table beneath side supporting the substrate at its rear surface, the vacuum of the transport means Evacuate from the position facing the substrate support surface of the substrate support in the processing chamber.
After that, the substrate is lowered to place the substrate on the substrate support, and after the vacuum processing is completed , the substrate is supported from below the substrate support.
Semiconductor temperature and, while supporting the substrate at its rear surface is moved to a position spaced from the substrate support is configured to be transfer the substrate to the conveying means by falling, it is characterized by Substrate processing equipment.