JP2669455B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus in a semiconductor manufacturing process such as an etching apparatus, a plasma CVD apparatus, and a sputtering apparatus. BACKGROUND OF THE INVENTION Recent progress in semiconductor manufacturing process technology has been remarkable, and a type of processing a 1 μm pattern has appeared even in a dry etching apparatus, and has been receiving attention. As such miniaturization progresses, the substrate becomes larger in diameter, and accordingly, the throughput per occupied floor area of the semiconductor manufacturing apparatus (the number of processed substrates per time) is improved and the manufacturing process technology is diversified. Is a major issue. In order to solve such demands, it is necessary to reduce the size of the apparatus and perform multipurpose processing using a plurality of vacuum processing chambers. A vacuum processing module that can configure or organize a system by freely changing the number of chambers has been required. On the other hand, in a conventional type in which a module in which a vacuum processing chamber and a substrate transfer line in the atmosphere can be added as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-128929, can be added, the air quality is poor. Since the substrate is transported to the next vacuum processing chamber through the inside, it is not suitable for application to a process step in which processing is transferred to the next vacuum processing chamber during processing. Further, in a type in which a substrate is transported between several vacuum processing chambers and one buffer chamber and continuously processed as disclosed in Japanese Utility Model Laid-Open No. 57-39430. There is a problem that the number of vacuum processing chambers is fixed, and there is no freedom to change the number of vacuum processing chambers in response to a process change or a line change, making it difficult to use. An object of the present invention is to provide a substrate processing method and a substrate processing apparatus capable of improving throughput and responding to diversification of manufacturing process technologies. SUMMARY OF THE INVENTION A feature of the present invention is that a vacuum preliminary chamber, a buffer chamber, a vacuum processing chamber, and a transport means for transporting the substrate between the vacuum preliminary chamber and the vacuum processing chamber. In the provided substrate processing apparatus, the vacuum preparatory chamber has first and second vacuum preparatory chambers for independently accommodating cassettes, and the vacuum processing chambers independently perform predetermined vacuum processing. First and second vacuum processing chambers, wherein the transfer means transfers the substrates taken out of the cassettes of the first vacuum preliminary chamber one by one through the buffer chamber according to the substrate processing mode. Transported to the processing chamber, unloads the substrate after the vacuum processing from the first vacuum processing chamber, and transfers the unloaded substrate via the buffer chamber to the cassette in one of the first and second vacuum preparatory chambers At the same time, Substrates removed one by one from the cassette in the vacuum prechamber
The substrate is transported to the second vacuum processing chamber via the buffer chamber according to the substrate processing mode, and the substrate after the vacuum processing is carried out of the second vacuum processing chamber, and the unloaded substrate is transferred to the buffer chamber. Each of the cassettes is collected via the cassette into the cassette of the first or second vacuum preparatory chamber. Another feature of the present invention is that the first and second vacuum preparatory chambers for independently accommodating cassettes, the buffer chamber, and the first and second vacuum preparatory chambers for independently performing predetermined vacuum processing are provided. In a substrate processing method using a substrate processing apparatus, comprising: a vacuum processing chamber; and a transfer unit configured to transfer the substrate between the vacuum preparatory chamber and the vacuum processing chamber. The substrates taken out one by one from the cassette are transferred to the first vacuum processing chamber via the buffer chamber in accordance with the substrate processing mode, and the substrates after the vacuum processing are unloaded from the first vacuum processing chamber. And recovering each of the unloaded substrates via the buffer chamber into the cassette in one of the first and second vacuum preparatory chambers, and removing the substrates one by one from the cassette in the second vacuum preparatory chamber. a substrate processing mode Transported to the second vacuum processing chamber via the buffer chamber in response to de, the substrate on which the vacuum processing has been completed is unloaded from the second vacuum processing chamber, said substrate out該搬via the buffer chamber recovering one by one to the first, second or preparatory vacuum chamber of the cassette, it the
There is . According to the present invention, the transfer means performs the substrate processing on the substrates taken out one by one from the cassette in the first vacuum preliminary chamber.
Depending on the mode, the substrate is transferred to the first vacuum processing chamber via the buffer chamber, the substrate after the vacuum processing is carried out of the first vacuum processing chamber, and the substrate is again transferred to the first and second via the buffer chamber .
Recovering one by one into two or preparatory vacuum chamber of the cassette.
On the other hand, the substrates taken out one by one from the cassette of the second vacuum preparatory chamber are transported to the second vacuum processing chamber via the buffer chamber according to the substrate processing mode, and the substrate subjected to the vacuum processing is subjected to the second vacuum processing. The substrates are taken out from the chamber and recovered again one by one via the buffer chamber into the cassette of the first or second vacuum reserve chamber. Thus, the first and second vacuum spare chambers are:
Each of them has a function as a load chamber and an unload chamber, and supplies and collects the substrates separately from the cassettes provided in the first and second vacuum preparatory chambers. Can be easily controlled, and throughput can be improved and diversification of manufacturing process technology can be responded to. An embodiment of the present invention will be described with reference to FIGS. In FIG. 1, a vacuum processing apparatus includes a buffer chamber 10 capable of evacuating, and a vacuum processing chamber 2 provided in the buffer chamber 10.
0 and the buffer chamber 1 capable of transporting the substrate 30 in the direction of arrow A.
And a vacuum opening / closing means 4 such as a gate valve and a partition provided on the side wall of the buffer chamber 10 at both ends of the first substrate transfer means.
0, 41 and, in this case, a gate valve provided on the side wall corresponding to the vacuum processing chamber 20 at right angles to the side wall on which the vacuum opening / closing means 40, 41 are provided and sandwiching the first substrate transfer means. Of the buffer chamber 10 through the vacuum opening / closing means 50 and 51 of FIG.
The second substrate transporting means (which transports the substrate 30 in the directions of arrows B and C via the other vacuum opening / closing means 50 and 51 between the pre-vacuum chamber 60 provided in the apparatus and the first substrate transporting means ( A substrate transfer means (not shown) provided on the substrate transfer path of the first substrate transfer means and corresponding to the vacuum processing chamber 20, and a connection between the substrate transfer means and the vacuum processing chamber 20. And a third substrate carrying means (not shown) for carrying the substrate 30 in the direction of the arrow D between them. In this case, in the vacuum preparatory chamber 60, a cassette table (not shown) of a cassette elevating device (not shown) for driving the substrate cassettes 70 and 71 up and down corresponds to the other vacuum opening / closing means 50 and 51 so as to be able to go up and down. It is installed inside. The first to third substrate transfer means and the substrate transfer means will be described in more detail with reference to FIG. In FIG. 2, the first substrate transfer means is a belt transfer device 80. The belt transfer device 80 is entirely driven up and down by an elevating device, for example, a cylinder 81, and a belt 82 is driven by a motor 82. It is driven to rotate. The second substrate transfer means is a belt transfer device 90, 1 provided in the vacuum preliminary chamber 60 with the other vacuum opening / closing means 50, 51 interposed therebetween.
00 and a belt transport device 11 provided in the buffer chamber 10
0,120. The pulley 91 of the belt conveying device 90,
Belt 9 that is endlessly wound around a pulley 92 and pulleys 91 and 92
3 is the cassette table 1 of the cassette elevating device 130
It is arranged so as to correspond to No. 31 and be located above the cassette table 131 even when the cassette table 131 is raised to the highest position. The belt 93 is driven to rotate by a motor 94. The belt conveying device 110 is driven to rotate the belt 112 by a motor 111, and the end of the belt conveying device 110 on the side of the belt conveying device 80 does not hinder one of the movements of the belt 83 of the belt conveying device 80. in this case,
The V-shaped bent pulley 113 at the final end is provided so as to be located between the belts 83 of the belt conveyor 80. The belt 93 of the belt conveyance device 90 and the belt 112 of the belt conveyance device 110 are at the same level, and the interval between the belt conveyance device 90 and the other end of the belt opening / closing means 50 on the side of the vacuum conveyance means 50 It is a size that does not hinder delivery. The pulleys 101 and 102 of the belt transport device 100 and the belt 103 wound around the pulleys 101 and 102 endlessly are disposed in the same manner as the belt transport device 90, and the belt 103 is rotated by a motor 104. The belt conveying device 120 uses the motor 121 to drive the belt 12
2 and the end portion of the belt conveying device 120 on the side of the belt conveying device 80 is folded in a V-shape so as not to hinder one of the movements of the belt 83 of the belt conveying device 80 as in the case of the belt conveying device 110. Bending and pulley 123 at the end
Are provided between the belts 83 of the belt transport device 80. The belt 10 of the belt conveying device 100
3 and the belt 122 of the belt conveying device 120 are at the same level, and the belt conveying device 100 and the belt conveying device 12
The distance between the other end of the vacuum opening / closing means 51 and 0 is a size that does not hinder delivery of the substrate 30. The distance between the pulleys 113 of the belt transport device 110 and the pulleys 114 corresponding to the pulleys 113 is large enough to prevent the substrate 30 from dropping and to be satisfactorily delivered.
The distance between the pulley 123 corresponding to the zero pulley 123 and the corresponding pulley 124 is the same size. The belt conveying device 80 is driven to move up and down so that the level of the belt 83 is equal to or lower than the level of the belts 112 and 122 of the belt conveying devices 110 and 120. The substrate transfer means 140 is smaller than the dimension between the belts 83 of the belt transfer device 80.
41 and an elevating device, for example, a cylinder 142. The substrate table 141 is located at a position corresponding to the vacuum processing chamber 20, and in this case, the belt transfer devices 110, 120
Between the belts 83 of the belt conveying device 80 so that the cylinder 142 can move up and down. Third
The substrate transfer means is the arm transfer devices 150 and 160. The arm transfer device 150 includes a board scooping tool 151, an arm 152, and a rotation device, for example, a pulse motor 153. The pulse motor 153 is provided between the belt transfer device 80 and the vacuum processing chamber 20, and between the center of the substrate table 141 of the substrate transfer means 140 and the vacuum processing chamber 20.
2 is provided on one side (the left side in FIG. 2) of the line connecting the center of the substrate electrode 21 of FIG.
One end of 52 is provided. A board scooping tool 151 is provided at the other end of the arm 152. The arm transfer device 160 is composed of a substrate scooping tool 161, an arm 162, and a rotating device, for example, a pulse motor 163. The pulse motor 163 is provided between the belt transfer device 80 and the vacuum processing chamber 20, and at the center of the substrate table 141 of the substrate transfer means 140 and the substrate electrode 21 of the vacuum processing chamber 20.
It is provided on the other side (the right side in FIG. 2) of the line connecting the center of the pulse motor 163, and the pulse motor 163 is provided with one end of the arm 162. At the other end of the arm 162, a board scooping tool 161 is provided. In this case, the substrate scooping tool 15
When the substrate 30 is placed on the substrate table 141 and the substrate electrode 21, the dimensions of the substrates 161, 161, arms 152, 162 are the substrate scooping tools 151, 161.
It is a size that can be scooped. Also, the arms 152, 16
2 is partially rotated by pulse motors 153 and 163, respectively, so that the substrate 30 can be transported between the substrate table 141 and the substrate electrode 21 by the substrate scooping tools 151 and 161. In this case, the operating planes of the arms 152 and 162 are different from the upper surface of the arm 152 and the lower surface of the arm 162, and for example, the substrate 30 is placed on the substrate table 1 by the arm transfer device 150.
When the substrate 30 is transferred from the substrate electrode 21 to the substrate table 14 by the arm transfer device 160 when the substrate 30 is transferred from the substrate electrode 41 to the substrate electrode 21.
It is designed so that it does not hinder the transportation to item 1. The cassette elevating device 130 is provided by meshing with a cassette table 131, an elevating rod 132 suspended from the cassette table 131 and having a screw formed at a lower end thereof, a gear 134 rotationally driven by a motor 133, and a gear 134. And a gear 135 with which the lower end of the lifting rod 132 is screwed. The substrate electrode 21 is driven up and down by rotation of a motor 23 via a rack and pinion mechanism 22. Further, a claw 24 for supporting the substrate is provided at the center of the substrate electrode 21 so as to be able to move up and down by a lifting device, for example, a cylinder 25. The claw 24 is driven to move up and down between a position where the surface thereof is equal to or lower than the surface of the substrate electrode 21 and a position where the substrate rakes 151 and 161 of the arm transfer devices 150 and 160 and the substrate 30 can be transferred. In the vacuum processing apparatus shown in FIGS. 1 and 2,
The following substrate processing can be performed. First, the cassette table 131 corresponding to the other vacuum opening / closing means 50 is lowered to the lowermost position, and the cassette table (not shown) corresponding to the other vacuum opening / closing means 51 is raised to the uppermost position. Other vacuum switching means 5
For example, the cylinders 52 and 53 are closed by driving the cylinders 52 and 53, and the communication between the buffer chamber 10 and the vacuum preparatory chamber 60 is air-tightly cut off. Communication with the outside is also airtightly shut off. In this state, the buffer chamber 10 is evacuated to a predetermined pressure by operating a vacuum exhaust device (not shown). On the other hand, when the outside is on the atmospheric side, a predetermined number of substrates 30 are opened by opening an atmospheric vacuum opening / closing means (not shown) such as a door provided in the vacuum preliminary chamber 60. Loaded with a substrate cassette (hereinafter abbreviated as a supply cassette) 70 and an empty substrate cassette (hereinafter, abbreviated as a substrate cassette) for collecting a substrate.
A collection cassette 71 is carried in, and the supply cassette 70 is placed on a cassette table 131 corresponding to the other vacuum opening / closing means 50, and the collection cassette 71 is placed in another vacuum opening / closing means 51.
Are placed on the cassette tables corresponding to. Thereafter, the atmospheric vacuum opening / closing means is closed, and the vacuum preliminary chamber 60 is
The pressure in the buffer chamber 10 is reduced and evacuated by a vacuum evacuator (not shown). Then, the cylinder 52
Drives the other vacuum opening / closing means 50 to open, whereby the buffer chamber 10 communicates with the vacuum preparatory chamber 60. In this state, the motor 133 is driven to lower the cassette table 131 by one pitch, whereby the substrate 30 loaded at the lowermost part of the supply cassette 70 in this case, is placed on the belt 93. Thereafter, the substrate 30 placed by rotating the belt 93 by the motor 94 is conveyed to the other vacuum opening / closing means 50 side, and the belt 112 driven by the motor 111 is rotated by the other vacuum opening / closing means. Passed through 50. The substrate 30 transferred to the belt 112 is transported to the belt transport device 80 side. At this time, the entire belt conveying device 80 is lowered by the cylinder 81 so that the level of the belt 83 is lower than the level of the belt 112. After that, when the substrate 30 is conveyed to the extent that the pulleys 113 and 114 are conveyed, the belt conveying device 8 is set so that the level of the belt 83 becomes equal to or higher than the level of the belt 112.
The whole 0 is raised by the cylinder 81, whereby the substrate 30 is transferred from the belt 112 to the belt 83. The substrate 30 transferred to the belt 83 is conveyed to a position corresponding to the substrate table 141 by driving of the motor 82, and then received by the substrate table 141 by lifting the substrate table 141 by the cylinder 142. The substrate 30 received on the substrate table 141
For example, the orientation flat is adjusted by the orientation flat adjustment device 170. Thereafter, the substrate 30 is, for example, the substrate brace 15
By being driven to rotate the arm 152 to the side of the vacuum processing chamber 20 by the pulse motor 153, the arm 152 is transported to above the substrate electrode 21 of the vacuum processing chamber 20 via the buffer chamber 10.
Thereafter, the claw 24 is raised by the cylinder 25, so that the substrate 30 of the substrate placing tool 151 is received by the claw 24. After that, the substrate placing tool 151 that has passed the substrate 30 to the nail 24 is
It is retracted to the buffer chamber 10 outside the vacuum processing chamber 20. Thereafter, the nail 24 is placed on the surface of the substrate electrode 2.
By lowering the surface of the substrate 30 with the cylinder 25 so that the surface of the substrate 30 is less than or equal to 1, the substrate 30 is passed from the claw 24 to the substrate electrode 21 and placed. Thereafter, a partitioning means comprising a partitioning flange 180, a bellows 181 laid over the back surface of the flange 180 and the bottom wall of the buffer chamber 10, and a lifting device for driving the flange 180 up and down, for example, a cylinder 182. The buffer chamber 10 and the vacuum processing chamber 20 are partitioned by 183. In this state, first, the electrode interval between the substrate electrode 20 and a counter electrode (not shown) provided above the substrate electrode 30 in the vacuum processing chamber 20 so as to oppose the substrate electrode 30 is adjusted to an appropriate interval by driving the motor 23. Adjusted. Thereafter, the process gas is introduced into the vacuum processing chamber 20 at a controlled flow rate, and the pressure of the vacuum processing chamber 20 is adjusted to the processing pressure by driving a vacuum exhaust device (not shown). Thereafter, high frequency power is applied to the substrate electrode 21 from, for example, a power supply connected to the substrate electrode 21, for example, a high frequency power supply (not shown), so that a glow is applied between the counter electrode and the substrate electrode 21. Discharge occurs and the process gas turns the process gas into plasma. The substrate 30 placed on the substrate electrode 21 by this plasma is subjected to a predetermined process such as an etching process. During this time, the substrate 30 is taken out of the supply cassette 70 by the above-described operation, transported by the belt transport devices 110 and 80, transferred to the substrate table 141, aligned with the orientation flat, and then transferred to the substrate placing tool 151. After the processing in the vacuum processing chamber 20 is completed, the partition between the buffer chamber 10 and the vacuum processing chamber 20 by the partitioning means 183 is released, and the vacuum processing chamber 20 is communicated with the buffer chamber 10 again. Thereafter, the substrate electrode 21 is lowered to a predetermined position, and the claw 24 is raised by the cylinder 25, whereby the processed substrate 30 is removed from the substrate electrode 21 and passed to the claw 24. After that, the claws 161 of the substrate are fixed.
After being rotated to a position corresponding to the back surface of the substrate 30 transferred to the substrate 30, the claw 24 is lowered by the cylinder 25, so that the processed substrate 30 is transferred to the substrate holder 161. Thereafter, the substrate 30 transferred to the substrate holder 151 is transferred from the substrate table 141 to the substrate electrode 21, and the processed substrate 30 transferred to the substrate holder 161 is transferred from the substrate electrode 21 to the substrate table 141. Each is transported. The substrate 30 transported to the substrate electrode 21 is subjected to predetermined processing by the above-described operation. During this time, the substrate table 14
The processed substrate 30 transported to the substrate table 1
41 is passed down to the belt 83 of the belt conveying device 80 by being lowered by the cylinder 142, and thereafter, the belts 83, 1
It is conveyed to another vacuum opening / closing means 51 side by the rotation drive by the motors 82 and 121 of 22. Delivery of the processed substrate 30 from the belt 83 to the belt 122 is performed by the reverse operation of delivery of the substrate 30 from the belt 112 to the belt 83. The other vacuum opening / closing means 51 is opened by the driving of the cylinder 53, and the processed substrate 30 conveyed to the other vacuum opening / closing means 51 is driven by rotating the belt 103 by the motor 104. It is carried into the vacuum preparatory chamber 60 via 51, and is then collected in the collection cassette 71 by raising the cassette table by one pitch.
Further, the substrate 30 is taken out of the supply cassette 70 by the above-described operation, transported by the belt transport devices 110 and 80, transferred to the substrate table 141, aligned with the orientation flat, and then transferred to the substrate placing tool 151. By repeatedly performing the above-described operations, the substrates 30 are taken out one by one from the supply cassette 70, transferred from the pre-vacuum chamber 60 to the vacuum processing chamber 20 via the buffer chamber 10, and stored in the vacuum processing chamber 20. It is processed one by one at 20,
The processed substrate 30 is conveyed from the vacuum processing chamber 20 to the pre-vacuum chamber 60 via the buffer chamber 10 and is collected one by one in the collection cassette 71. FIG. 3 shows an example in which the vacuum processing apparatus shown in FIGS. 1 and 2 is provided as one module and two modules are continuously connected via vacuum opening / closing means 40 and 41. Note that the components in FIG. 3 are all the same as those in FIG. 2, and therefore, the description of the configuration, operation, and the like is omitted. FIG.
4 (a) to 4 (c)
Can be performed. That is, as shown in FIG. 4A, series processing of the substrate 30 in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series is performed, or as shown in FIG.
4 may be processed in parallel in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series, or as shown in FIG.
Can be processed in parallel. In the substrate processing mode shown in FIGS. 4A and 4B in such a substrate processing mode, at least one supply cassette (not shown) is set in the vacuum preliminary chamber 60 of the preceding vacuum processing apparatus. At least one collection cassette (not shown) is set in the vacuum preparatory chamber 60 of the subsequent vacuum processing apparatus. In the case of the substrate processing mode shown in FIG. 4C, one supply cassette (not shown) and one recovery cassette (not shown) are set in the vacuum preparatory chamber 60 of each vacuum processing apparatus. To do. Further, the vacuum processing apparatus shown in FIGS.
In the case where two modules are connected in series via 1, the transfer of the substrate 30 in each vacuum processing apparatus is performed by passing through the buffer chamber 10. Further, when the vacuum processing apparatus shown in FIGS. 1 and 2 is connected as one module and three or more modules are connected via the vacuum opening / closing means 40 and 41, in addition to the substrate processing mode shown in FIG. Substrate processing as shown in FIGS. 5A and 5B can be performed. That is, as shown in FIG.
In the vacuum processing chamber 20 of the preceding vacuum processing apparatus of the vacuum processing apparatus and the vacuum processing chamber 20 of the middle vacuum processing apparatus in this case, parallel processing is performed first, and then the subsequent vacuum processing apparatus As shown in FIG. 5B, the series processing is performed in the vacuum processing chamber 20 of the vacuum processing chamber 20 of the first and middle vacuum processing apparatuses in which the substrate 30 is connected in series.
In addition to performing the series processing at 0, the series processing can be performed in the vacuum processing chambers 20 of the vacuum processing apparatuses at the first and second stages. In the case of such a substrate processing mode,
Two supply cassettes (not shown) are set in the vacuum preparatory chamber 60 of the preceding vacuum processing apparatus, and two collection cassettes (not shown) are set in the vacuum preparatory chamber 60 of the subsequent vacuum processing apparatus. When series processing of the substrate 30 is performed in the vacuum processing chamber 20 of each vacuum processing apparatus, one supply cassette is set in the vacuum preparatory chamber 60 of the preceding vacuum processing apparatus, and the vacuum of the subsequent vacuum processing apparatus is set. Make sure to set one recovery cassette in the spare room. When the substrates 30 are processed in parallel in the vacuum processing chambers of the respective vacuum processing apparatuses, at least one supply cassette is set in the vacuum preparatory chamber of the preceding vacuum processing apparatus, and the collection cassette is set in the vacuum preparatory chamber of the subsequent vacuum processing apparatus. Is set at least one. When the vacuum processing apparatuses are made independent and the substrates are processed in parallel in the respective vacuum processing chambers, one supply cassette and one recovery cassette are set in the vacuum preparatory chamber of each vacuum processing apparatus. . In addition, even when three or more modules are connected to each other via the vacuum opening / closing means 40 and 41 as one module of the vacuum processing apparatus shown in FIGS. 1 and 2, the substrate 30 in each vacuum processing apparatus is transferred to the buffer chamber 10. It is done by going through. The following effects can be obtained with the vacuum processing apparatus of this embodiment. (1) The system configuration or organization can be changed by freely changing the number of vacuum processing chambers in response to process changes and line changes. (2) Since the substrate is conveyed to the next vacuum processing chamber via the evacuated buffer chamber, it can be applied to a process step in which processing is transferred to the next vacuum processing chamber during processing without any problem. . (3) The horizontal width of the front surface of the vacuum processing apparatus can be reduced by making the second substrate transfer means and the third substrate transfer means parallel, which facilitates the multi-module configuration. (4) Since the vacuum preparatory chamber is a cassette chamber capable of evacuating, the depth of the vacuum processing apparatus can be reduced. In a multi-module system, two cassettes can be set in one module. It is possible to extend the cassette setting time interval at the time of improving the throughput. (5) Since the arm transfer device having a different operation plane is used as the third substrate transfer means, the transfer of the substrate into and out of the vacuum processing chamber can be performed simultaneously, so that the throughput can be improved. (6) Since series processing or parallel processing by multiple modules becomes possible, the throughput per floor area can be improved together with downsizing of the vacuum processing apparatus. (7) The opening area of the vacuum opening / closing means provided in the buffer chamber only needs to be an area through which one substrate can pass. Therefore, in the case of a multi-module, mixing of residual process gas between vacuum processing apparatuses. Rarely occurs,
Independence from the process gas in each vacuum processing apparatus can be secured. When reducing the depth of the vacuum processing apparatus and aiming for continuous and continuous processing with other apparatuses,
As shown in FIG. 6, a vacuum preparatory chamber 60 'is provided in the buffer chamber 10 via the vacuum opening / closing means 40, for example.
A second substrate transfer device (not shown), which is a first substrate transfer means for transferring the substrate 30 in the direction of arrow A, is capable of transferring the substrate 30 in the direction of arrow E via the vacuum opening / closing means 40.
A belt transfer device (not shown) as a substrate transfer means is provided in the vacuum preliminary chamber 60 '. In this case, no other vacuum opening / closing means is required. In the embodiment described above, the vacuum preparatory chamber is a vacuum preparatory chamber in which the supply cassette and the recovery cassette are loaded and set from the outside, but it is particularly necessary to limit the vacuum preparatory chamber to such a vacuum preparatory chamber. There is no. For example, a supply cassette and a recovery cassette are fixed and set in a vacuum spare chamber, a predetermined number of substrates are loaded from the outside into the supply cassette, and the substrates recovered in the recovery cassette are taken out of the recovery cassette and carried out. It may be done. Further, the first substrate carrying means may be any one that carries the substrate to and from the vacuum opening / closing means provided in the buffer chamber in addition to the belt carrying device. In addition to the belt transfer device, the second substrate transfer means may use, for example, an arm transfer device in which an arm moves straight, an arm transfer device in which an arm rotates, or the like. According to the present invention, each of the first and second vacuum preparatory chambers has a function as a load chamber and an unload chamber, and the substrate is stored in the first and second vacuum preparatory chambers. Since they are separately supplied and collected separately from the cassettes provided in the apparatus, the control for supplying and collecting the substrates is simplified, thereby improving the throughput and responding to the diversification of the manufacturing process technology. There is an effect. That is, according to the present invention, according to the substrate processing mode, control is performed so that the substrate can be transported to either of the first and second vacuum preliminary chambers provided with the cassette for storing the substrate. Even if one of the vacuum preparatory chambers is at atmospheric pressure, etc., if another vacuum preparatory chamber is in a vacuum state, it can be recovered in any vacuum preparatory chamber. There is an effect that the degree of freedom in loading and unloading the wafer is increased, the processing can be continued without causing a problem with the recovery timing, and the throughput is improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing one embodiment of a vacuum processing apparatus according to the present invention. FIG. 2 is a perspective configuration diagram of a substrate transfer unit of the vacuum processing apparatus of FIG. FIG. 3 is a perspective view of a substrate transfer means of a vacuum processing apparatus in which two modules of the vacuum processing apparatus of FIG. 1 are connected in series. 4A to 4C are substrate processing mode diagrams in a two-module vacuum processing apparatus. FIGS. 5A and 5B are other substrate processing mode diagrams in a three-module vacuum processing apparatus. FIG. 6 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention. [Description of References] 10: buffer chamber, 20: vacuum processing chamber, 30: substrate, 4
0, 41: vacuum opening / closing means, 50, 51: other vacuum opening / closing means, 60, 60 ': vacuum preparatory chamber, 80 to 120: belt conveying device, 140: substrate transfer means, 15
0,160: arm transfer device.

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location C23F 4/00 C23F 4/00 A H01L 21/205 H01L 21/205 21/3065 21/302 B (72) Invention Person Fumio Shibata 794, Higashi-Toyoi, Oaza, Kudamatsu City, Yamaguchi Prefecture Inventor, Hitachi, Ltd., Kasado Factory (72) Keno Yamaguchi Prefecture, Kudamatsu City, Oita 794, Higashi-Toyoi, Ltd. Hitachi Ltd., Kasado Plant (56) References JP 57-149748 (JP, A) Actual 57-39430 (JP, U)

Claims (1)

(57) [Claims] In a substrate processing apparatus including a vacuum preliminary chamber, a buffer chamber, a vacuum processing chamber, and a transfer unit configured to transport the substrate between the vacuum preliminary chamber and the vacuum processing chamber, the vacuum preliminary chambers are independent of each other. First and second vacuum preparatory chambers for accommodating cassettes, and the vacuum processing chambers have first and second vacuum processing chambers for independently performing predetermined vacuum processing, and The means transports the substrates taken out one by one from the cassette of the first vacuum preliminary chamber to the first vacuum processing chamber via the buffer chamber according to the substrate processing mode, and removes the substrate after the vacuum processing. The substrate is unloaded from the first vacuum processing chamber, and the unloaded substrate is collected one by one into a cassette in one of the first and second vacuum preliminary chambers via the buffer chamber, and the second vacuum preliminary Removed one by one from the cassette in the room Plate was conveyed to the second vacuum processing chamber via the buffer chamber according to the substrate processing mode, the substrate is carried out of the vacuum process has been completed from the second vacuum processing chamber, the said substrate which issued該搬A substrate processing apparatus configured to collect one by one in a cassette in the first or second vacuum auxiliary chamber via a buffer chamber. 2. First and second vacuum preparatory chambers for independently accommodating cassettes, buffer chambers, first and second vacuum processing chambers for independently performing predetermined vacuum processing, the vacuum preparatory chamber and the In a substrate processing method using a substrate processing apparatus, comprising: a transfer unit that transfers the substrate between vacuum processing chambers. The transfer unit transfers a substrate taken out of a cassette in the first vacuum preliminary chamber to the substrate. The substrate is conveyed to the first vacuum processing chamber via the buffer chamber according to the processing mode, and the substrate on which the vacuum processing is completed is carried out of the first vacuum processing chamber, and the substrate carried out is carried out. Are collected one by one into the cassettes of the first and second vacuum spare chambers via the buffer chamber, and the substrates taken out one by one from the cassettes of the second vacuum spare chamber according to the substrate processing mode. the buffer chamber through Te Transported to the second vacuum processing chamber, and unloads the substrate after the vacuum processing from the second vacuum processing chamber, and transfers the unloaded substrate via the buffer chamber to the first or second vacuum processing chamber. A method of processing a substrate, characterized in that each one is collected in a cassette of the vacuum preliminary chamber.