JP2883597B2 - Vacuum processing apparatus and semiconductor substrate processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] The present invention relates to an etching apparatus and a plasma.
Suitable for semiconductor manufacturing processes such as CVD equipment and sputtering equipment
The present invention relates to a vacuum processing apparatus and a semiconductor substrate processing method.
You. [0002] BACKGROUND OF THE INVENTION Recent advances in semiconductor manufacturing process technology
Remarkably, 1μm pattern even in dry etching equipment
A model for processing garbage has appeared and is receiving attention. This
As the miniaturization progresses, the substrate becomes larger in diameter.
Is the throughput per occupied floor area of semiconductor manufacturing equipment
(Number of substrates processed per hour) and
A major challenge is to respond to the diversification of manufacturing process technology.
Has become. In order to solve such a demand, an apparatus must be used.
Miniaturized and versatile using multiple vacuum processing chambers
Processing needs to be performed, and
System by freely changing the number of vacuum processing chambers
Requires vacuum processing modules that can be configured or organized.
It has come to be. In contrast, the conventional
For example, it is disclosed in JP-A-57-128828.
Combine such a vacuum processing chamber with a substrate transfer line in the atmosphere
Air with poor cleanliness with a type that can add additional modules
The substrate is transported to the next vacuum processing chamber through
A process that takes over the processing to the next vacuum processing chamber on the way
Not suitable for process application. Further, Japanese Utility Model Laid-Open No. 57-39430 discloses
Several vacuum chambers and one bag as shown
The substrate is transported between the vacuum chamber and is continuously processed.
For such types, the number of vacuum processing chambers is fixed and process changes
Or change the number of vacuum processing chambers in response to changes in line or line
Lack of flexibility and difficult to use
You. [0005] OBJECTS OF THE INVENTION The object of the present invention is to provide
While improving the board yield,Process changes and licenses
System configuration freely in response toPossible vacuum processing
An object of the present invention is to provide an apparatus and a semiconductor substrate processing method. [0006] SUMMARY OF THE INVENTION The feature of the vacuum processing apparatus of the present invention is that
The required chambers are connected via the transfer space and
A vacuum processing chamber for processing, and a
Means for loading each plate one by one, and into the evacuated space
The orientation flat of the loaded substrate is moved in the evacuated space.
Positioning means, and a base having the orientation flat
The board is moved in parallel according to the substrate processing mode.
When processing, the vacuum processing is performed via the vacuum transfer space.
Transporting the substrate to each of the laboratories,
In the case where the processing is performed in a vacuum,
Empty processing roomThe substrate from one of the above into another vacuum processing chamberCarrying
Means for transferring, and the transferred substrate to the vacuum processing chamber.
And means for processing one sheet at a time. According to the vacuum processing apparatus of the present invention, the substrate processing
RiffLagoThe operation is performed in a evacuated space.
Orifice in the airLagoDust on the surface of the substrate
DustyBankProduct and adhesion are suppressed. For this reason, semiconductor manufacturing
PutBoardThe yield can be improved.In addition,
The combined substrate is processed according to the substrate processing mode.
When processing in parallel, vacuum processing via the vacuum transfer space
Transferring substrates to each of the laboratory and processing the substrates into series
If you want to use one of the vacuum processing chambers through the vacuum transfer space
Are transported to another vacuum processing chamber.
System in response to process and line changes.
System configuration. Further, the features of the semiconductor substrate processing method of the present invention.
Removes the substrate from the cassette and removes the substrate
Transporting to a space for transporting under vacuum, the transported
Aligning the orientation flat of the substrate in the space,
Depending on the substrate processing mode,
When processing the substrate in parallel, the vacuum transfer air
The substrate is transferred to each of the vacuum processing chambers through the space
When processing the substrates in series, the vacuum transfer
From one of the vacuum processing chambers to another vacuum processing chamber via a transfer space.
Transporting the substrate into a laboratory, and
Processing a substrate one by one in the vacuum processing chamber;,PreviousRecord
The processed substrates are collected in a cassette via the space.
And a step of [0009]ClearlyAccording toOri-Fla
Substrates are processed in parallel according to the substrate processing mode.
When processing, each of the vacuum processing chamber through the vacuum transfer space
True when transferring substrates to
Vacuum processing from one of the vacuum processing chambers through the empty transfer space
Since it is transported into the laboratory, it is not
Can respond flexibly. [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS.
I do. In FIG. 1, the vacuum processing apparatus is a buffer that can be evacuated.
Chamber 10 and a vacuum processing chamber 2 provided in the buffer chamber 10.
0 and the buffer chamber 1 capable of transporting the substrate 30 in the direction of arrow A.
0, a first substrate transfer means (not shown) provided inside
1 side of the buffer chamber 10 corresponding to both ends of the substrate transfer means.
Vacuum opening / closing means 4 such as a gate valve and a partition provided on the wall
0, 41, and in this case, vacuum opening / closing means 40, 41 are provided.
At right angles to the side wall and sandwich the first substrate transfer means
Gate valve and the like provided on the side wall corresponding to the vacuum processing chamber 20
Buffer chamber 10 via other vacuum opening / closing means 50, 51.
Vacuum preparatory chamber 60 provided in
Between the substrate 30 via the other vacuum opening / closing means 50, 51.
Second substrate transfer means for transferring in the directions of arrows B and C (not shown)
Omitted) on the substrate transfer path of the first substrate transfer means.
And a substrate delivery means provided corresponding to the vacuum processing chamber 20
(Not shown), between the substrate delivery means and the vacuum processing chamber 20
Substrate transfer means for transferring the substrate 30 in the direction of arrow D by using
(Not shown). In this case, the vacuum
In the storage room 60, the substrate cassettes 70 and 71 are driven up and down.
Cassette table of cassette elevating device (not shown)
(Not shown) is paired with other vacuum opening / closing means 50 and 51 so as to be able to move up and down.
It is installed accordingly. [0011] First to third substrate transfer means, substrate delivery means
Are described in more detail with reference to FIG. In FIG. 2, the first
The substrate transfer means is a belt transfer device 80,
The device 80 is entirely composed of a lifting device, for example, a cylinder 8
1 and the motor 82 drives the belt 83
It is driven to rotate. [0012] The second substrate transfer means is another vacuum opening / closing means.
A bell provided in the vacuum preparatory chamber 60 sandwiching 50 and 51
Transfer devices 90 and 100 and the buffer chamber 10.
They are belt conveyance devices 110 and 120. Belt transport device
90 endlessly wound around pulleys 91 and 92 and pulleys 91 and 92
The hung belt 93 corresponds to the cassette elevating device 130.
Corresponds to the cassette table 131 and
Even when Bull 131 is raised to the highest position,
It is arranged so as to be located above. The belt 93 is driven to rotate by a motor 94.
You. The belt conveying device 110 uses the motor 111 to drive the belt 11
2, the belt is conveyed by the belt conveying device 110
The end of the device 80 on the side of the belt 83 of the belt conveying device 80
In this case, a V-shaped
The pulley 113 at the end of the bending is connected to the belt conveying device 80.
Are provided between the belts 83. What
The belt 93 of the belt transport device 90 and the belt transport device
110 is at the same level as the belt 112,
Another vacuum opening / closing hand between the feeding device 90 and the belt conveying device 110
The distance between the end of the step 50 and the end of the step 50 is large enough to prevent the transfer of the substrate 30
It has become a size. The pulleys 101, 1 of the belt conveying device 100
02 and a bell wound endlessly on pulleys 101 and 102
The belt 103 is disposed in the same manner as the belt conveying device 90,
The belt 103 is driven to rotate by a motor 104. belt
The transport device 120 rotates the belt 122 with the motor 121.
Is moved to the side of the belt conveying device 80 of the belt conveying device 120.
The end is the same as the belt conveying device 110.
Do not hinder one of the movements of the belt 83 of the feeding device 80.
And the pulley 123 at the final end is bent into a V-shape.
Provided between the belts 83 of the transfer device 80.
ing. The belt 10 of the belt conveying device 100
3 and the belt 122 of the belt conveying device 120 have the same level.
The belt transport device 100 and the belt transport device 12
0 and the other end of the vacuum opening / closing means 51 on the side
It is a size that does not hinder delivery. Also the belt
The pulley 113 of the transfer device 110 corresponds to the pulley 113.
To prevent the substrate 30 from falling.
It is of a size that can be delivered well, and the belt transport device 12
The distance between the pulley 123 and the pulley 123 corresponding to the
Size. Note that the belt conveying device 80 is a bell
83 is at the level of the belt conveyors 110 and 120
So that they are below and above the level of
It is driven up and down. The substrate delivery means 140 is provided in the belt conveying device 8.
Substrate table 141 smaller than the dimension between belts 83
And a lifting device, for example, a cylinder 142.
You. The substrate table 141 has a position corresponding to the vacuum processing chamber 20.
In this case, between the belt conveying devices 110 and 120
At a position between the belts 83 of the belt conveying device 80.
The cylinder 142 is provided so as to be able to move up and down. The third substrate transfer means includes an arm transfer device 1
50 and 160. The arm transfer device 150
A stake 151, an arm 152, and a rotating device, for example, a pallet
And a motor 153. Pulse motor 15
3 is between the belt transfer device 80 and the vacuum processing chamber 20,
The center of the substrate table 141 of the substrate delivery means 140
Of the line connecting the center of the substrate electrode 21 of the vacuum processing chamber 20
2 (the left side in FIG. 2), and the pulse motor 15
3 is provided with one end of an arm 152. arm
A board scooping tool 151 is provided at the other end of 152.
You. Further, the arm transfer device 160 is provided with the board rake tool 16.
1, an arm 162 and a rotating device, for example, the pulse motor 1
63. The pulse motor 163 is a bell
Between the transfer device 80 and the vacuum processing chamber 20 and the substrate
Center of substrate table 141 of delivery means 140 and vacuum processing chamber
The other side of the line connecting the center of the substrate electrode 21 of FIG.
On the right), and the pulse motor 163 has an arm
One end of the system 162 is provided. The other end of the arm 162
Is provided with a board scooping tool 161. This place
In this case, the board scooping tools 151 and 161 and the arms 152 and 16
The size of 2 corresponds to the substrate table 141 and the substrate electrode 21.
When the substrate 30 is mounted, the substrate 30 is
It is a dimension that can be scooped with the scoops 151 and 161. Further, the arms 152 and 162 are used to remove the substrate.
The substrate 30 is connected to the substrate table 141 with the tools 151 and 161.
A pulse motor 153 capable of being conveyed to and from the substrate electrode 21;
At 163, each is partially rotated. In this case, a
The operation plane of the arms 152 and 162 is as follows.
The arm 162 is different from the lower surface.
At 150, the substrate 30 is moved from the substrate table 141 to the substrate electrode 2.
1 is transferred to the substrate 30 by the arm transfer device 160.
The transfer from the substrate electrode 21 to the substrate table 141 is prevented.
It does not hurt. The cassette elevating device 130 includes a cassette table
Table 131 and the lower end of the cassette table 131
Lifting and lowering rod 132 having a thread formed in
3, the gear 134 is driven to rotate, and meshes with the gear 134.
The lower end of the lifting rod 132 is screwed
Gear 135. The substrate electrode 21 is
Rotation of the motor 23 via the pinion mechanism 22
It is driven up and down. The base of the substrate electrode 21 is
The plate supporting claw 24 is moved by an elevating device, for example, a cylinder 25.
It is provided to be able to move up and down. The surface of the nail 24 is a substrate.
The position below the surface of the electrode 21 and the arm transfer device 15
0, 160 board scooping tools 151, 161 and the board 30
It is moved up and down between the transferable positions. In the vacuum processing apparatus shown in FIGS. 1 and 2,
The following substrate processing can be performed. First, the power corresponding to the other vacuum opening / closing means 50 will be described.
The set table 131 is lowered to the bottom, and the other
Cassette table corresponding to the vacuum opening / closing means 51 (not shown)
Abbreviation) is raised to the top. Other vacuum switching means 5
0, 51, for example, by driving the cylinders 52, 53
The communication between the buffer chamber 10 and the vacuum preparatory chamber 60 is closed.
Closed tightly, and vacuum opening / closing means 40, 41 closed
Or it is partitioned and the communication between the buffer chamber 10 and the outside is airtight.
Will be shut off. In this state, the buffer chamber 10 is evacuated.
(Not shown) to reduce the pressure to a predetermined pressure.
It is. On the other hand, the outside of the vacuum preliminary chamber 60 is on the atmosphere side.
, The atmosphere such as a door provided in the pre-vacuum chamber 60
By opening the vacuum opening / closing means (not shown),
A substrate cassette loaded with the substrates 30 (hereinafter referred to as a supply cassette)
70) and an empty substrate cassette for collecting substrates (hereinafter, referred to as a substrate cassette).
(Abbreviated as a collection cassette) 71 is loaded into the supply cassette.
70 is a cassette table corresponding to the other vacuum opening / closing means 50
The collection cassette 71 includes another vacuum opening / closing unit 51.
Are placed on the cassette tables corresponding to. Thereafter, the atmospheric vacuum switching means is closed and the vacuum
The preliminary chamber 60 is provided with a buffer chamber by a vacuum exhaust device (not shown).
The pressure is reduced and evacuated to a pressure approximately equal to the pressure of 10. That
Thereafter, the other vacuum opening / closing means 50 is driven by the driving of the cylinder 52.
The buffer chamber 10 and the vacuum preparatory chamber 60 are opened.
Becomes a communication state. In this state, the motor 133 is driven.
To lower the cassette table 131 by one pitch.
The supply cassette 70 is loaded at the bottom in this case.
The substrate 30 is placed on a belt 93. Thereafter, the belt 93 is rotated by the motor 94.
The substrate 30 placed by being rolled is driven by another vacuum switch.
It is conveyed to the step 50 side and is rotationally driven by the motor 111.
To another belt 112 via another vacuum opening / closing means 50.
Is done. The substrate 30 transferred to the belt 112 is transported by a belt.
It is transported to the device 80 side. At this time, the belt 83
Belt so that the level is below the level of belt 112
The entire transfer device 80 is lowered by the cylinder 81
I have. After that, the substrate 30 is moved to the pulleys 113 and 114.
When the belt 83 is transported to such an extent that
Belt transport so that the level is higher than the level of belt 112
The entire device 80 is raised by a cylinder 81, which
The substrate 30 is transferred from the belt 112 to the belt 83 by
You. The substrate 30 passed over the belt 83 is driven by a motor 82.
To the position corresponding to the substrate table 141
The substrate table 141 is moved up by the cylinder 142
Then, it is received by the substrate table 141. Board
The substrate 30 received by the cable 141 is, for example, an orifice.
The orientation flat is aligned by the alignment device 170. Thereafter, the substrate 30 is, for example,
151 and the arm 152 is
By rotating to the empty processing chamber 20 side, the buffer chamber 10 is rotated.
Through the substrate electrode 21 of the vacuum processing chamber 20
You. Then, raise the pawl 24 with the cylinder 25.
Then, the substrate 30 of the substrate placing tool 151 is received by the claw 24.
You. After that, the substrate placing tool 15 with the substrate 30 passed over the nail 24
1 is the evacuation in the buffer chamber 10 outside the vacuum processing chamber 20.
It is. Then, the nail 24 is placed on the surface of the substrate electrode 21.
By lowering with the cylinder 25 so that it is below the surface,
The substrate 30 is passed from the nail 24 to the substrate electrode 21 and placed thereon.
You. Thereafter, a partition flange 180 and a flange
It is laid on the back surface of the flange 180 and the bottom wall of the buffer chamber 10.
Drive the bellows 181 and the flange 180
A partition composed of a lifting device, for example, a cylinder 182
Buffer chamber 10 and vacuum processing chamber 20
Are separated. In this state, first, the substrate electrode 20 and the base
The vacuum processing chamber 20 is provided so as to face above the plate electrode 30.
The distance between the electrode and the counter electrode (not shown) is
It is adjusted to an appropriate interval by driving. Then true
The process gas is introduced into the empty processing chamber 20 by adjusting the flow rate.
And driven by a vacuum exhaust device (not shown).
The pressure in the vacuum processing chamber 20 is adjusted to the processing pressure. Thereafter, for example, a connection is made to the substrate electrode 21.
Substrate electrode from a power supply, for example, a high frequency power supply (not shown).
By applying high-frequency power to the counter electrode 21 and the substrate electrode,
A glow discharge is generated between the electrode 21 and the electrode 21 and the discharge causes a glow discharge.
The process gas is turned into plasma. With this plasma
The substrate 30 placed on the plate electrode 21 is subjected to an etching process or the like.
Predetermined processing is performed. During this time, the supply cassette 70
The substrate 30 is taken out by the operation described above,
It is transported at 110 and 80 and passed to the substrate table 141.
After the orientation flat is aligned, it is passed to the
You. After the processing in the vacuum processing chamber 20 is completed,
Buffer chamber 10 and vacuum processing chamber 20 by cutting means 183
Is released, and the vacuum processing chamber 20 becomes the buffer chamber 10
Is again communicated with. Thereafter, the substrate electrode 21 is
The claw 24 with the cylinder 25
As a result, the processed substrate 30 is separated from the substrate electrode 21 by
It is removed and passed to the nail 24. Then, the substrate mounting tool 161
To the position corresponding to the back surface of the substrate 30 passed to the nail 24.
After rotating, lower the pawl 24 with the cylinder 25.
Then, the processed substrate 30 is transferred to the substrate placing tool 161.
You. After that, the substrate passed to the substrate placing tool 151
Reference numeral 30 denotes a substrate from the substrate table 141 to the substrate electrode 21.
The processed substrate 30 passed to the substrate placing tool 161 is
Transported from the substrate electrode 21 to the substrate table 141, respectively.
It is. The substrate 30 transported to the substrate electrode 21 is as described above.
The predetermined processing is performed by the operation. During this time, the substrate table 14
The processed substrate 30 transported to the substrate table 1
41 is lowered by the cylinder 142 so that the belt
Is passed to the belt 83 of the device 80, and then the belts 83, 1
Another vacuum is opened by the rotation drive by the 22 motors 82 and 121.
It is conveyed to the closing means 51 side. Note that the belt 83
Delivery of the processed substrate 30 to the belt 122
The transfer of the substrate 30 from the belt 12 to the belt 83 and the reverse operation.
Is performed. Another vacuum opening / closing hand by driving the cylinder 53
The step 51 is opened, and the belt 103 is
By being driven to rotate, it is transported to another vacuum opening / closing means 51 side.
The processed substrate 30 is processed by another vacuum opening / closing means 51.
Through the pre-vacuum chamber 60, and then the cassette
The collection cassette 71 is raised by raising the cable by one pitch.
Will be collected. The above-described operation is performed from the supply cassette 70.
The substrate 30 is taken out by the operation, and the belt transport device 110,
80 and transferred to the substrate table 141 for orientation flat
After they are combined, they are transferred to the substrate placing tool 151. Repeating the above operation
The substrate 30 is taken out of the supply cassette 70 one by one.
Vacuum processing from the pre-vacuum chamber 60 through the buffer chamber 10
Transported to the chamber 20 and processed one by one in the vacuum processing chamber 20,
The processed substrate 30 is transferred from the vacuum processing chamber 20 to the buffer chamber.
10 and transferred to the vacuum preparatory chamber 60 to collect
And is collected in the slot 71. FIG. 3 shows the vacuum processing apparatus shown in FIGS.
Unit as one module via vacuum opening / closing means 40, 41
2 shows an example of a case where two modules are continuously provided. What
The components in FIG. 3 are all the same as those in FIG.
Therefore, description of the configuration, operation, and the like is omitted. FIG.
4 (a) to 4 (c)
Can be performed. That is, as shown in FIG.
In two vacuum processing chambers 20 of the vacuum processing apparatus
4B, as shown in FIG.
0 in two vacuum processing chambers 20 of a vacuum processing apparatus connected in series.
Parallel processing can also be performed as shown in FIG.
The plate 30 is connected to the vacuum processing chamber 20 of each of the vacuum processing apparatuses connected in series.
Can be processed in parallel. In such a substrate processing mode, FIG.
In the case of the substrate processing mode shown in FIGS.
Supply cassette (not shown) in the vacuum preparatory chamber 60 of the vacuum processing apparatus.
(Omitted) is set at least, and a vacuum processing device at the subsequent stage
Collection cassettes (not shown) in vacuum pre-chamber 60
Set one for each. Also, as shown in FIG.
In the substrate processing mode, the vacuum
Supply cassette (not shown), collection cassette in storage room 60
(Not shown) are set one each. The vacuum processing apparatus shown in FIGS. 1 and 2
As one module via vacuum opening / closing means 40 and 41
When two modules are connected in a row,
The transport of the plate 30 is performed by passing through the buffer chamber 10. Further, the vacuum processing apparatus shown in FIGS. 1 and 2
As one module via vacuum opening / closing means 40 and 41
If three or more modules are installed in a row,
In addition to the plate processing mode, as shown in FIGS.
Substrate processing can be performed. That is, as shown in FIG.
As shown in FIG.
The vacuum processing chamber 20 of the vacuum processing apparatus and, in this case, the middle stage
First, the parallel processing is performed with the vacuum processing chamber 20 of the vacuum processing apparatus.
Then, in the vacuum processing chamber 20 of the subsequent vacuum processing apparatus,
Release processing can also be performed as shown in FIG.
Vacuum processing at the front and middle stages of a vacuum processing apparatus with 30 units connected in series
Series processing in the vacuum processing chamber 20 of the apparatus
And series processing in the vacuum processing chamber 20 of the subsequent vacuum processing device
You can also. In the case of such a substrate processing mode,
Supply cassette to vacuum preparatory chamber 60 of the preceding vacuum processing apparatus
(Not shown) are set in two, and the true vacuum processing equipment
Two collection cassettes (not shown) set in the empty spare room 60
To do it. In the vacuum processing chamber 20 of each vacuum processing apparatus,
When the substrate 30 is processed in series, the vacuum processing equipment in the preceding stage is used.
One supply cassette is set in the vacuum preparatory chamber 60, and
One collection cassette is placed in the vacuum pre-chamber
To make sure that Further, the substrate is placed in a vacuum processing chamber of each vacuum processing apparatus.
30 in parallel processing, the vacuum
After setting at least one supply cassette in the vacuum spare chamber
Fewer collection cassettes in the vacuum preparatory chamber of the stage vacuum processing equipment
Set one for each. Further, each vacuum processing apparatus is made independent and
When processing substrates in parallel in a vacuum processing chamber,
Supply cassettes and recovery cassettes in the pre-vacuum chamber of the processing equipment
Are set one by one. Also, shown in FIG. 1 and FIG.
Opening / closing means using a vacuum processing apparatus as one module
In the case of connecting three or more modules via 40 and 41
The transfer of the substrate 30 in each vacuum processing apparatus is performed by a buffer.
This is performed by passing through the locker room 10. In the vacuum processing apparatus of this embodiment, the following
Such effects can be obtained. (1) Vacuum processing chamber in response to process changes and line changes
The system can be configured or organized by freely changing the number. (2) The substrate passes through the evacuated buffer chamber and
Since it is transported to the vacuum processing chamber, the next vacuum processing
Applicable to process steps that take over processing to the room without any problems
it can. (3) Flatten the second substrate transport means and the third substrate transport means.
The line can reduce the width of the front of the vacuum processing equipment.
In this case, a multi-module configuration is easy. (4) The pre-vacuum chamber is a cassette chamber that can be evacuated.
Therefore, the depth dimension of the vacuum processing device can be reduced.
In a multi-module system, two
Cassettes can be set to improve throughput
The time interval for setting the cassette can be extended. (5) An arc having a different operation plane as the third substrate transfer means.
Transporting substrates to the vacuum processing chamber
Since the loading and unloading can be performed simultaneously, the throughput
Can be improved. (6) Series processing or parallel processing by multiple modules
Processing can be performed, which is compatible with downsizing of vacuum processing equipment.
Can increase the throughput per floor area
You. (7) Opening area of vacuum opening / closing means provided in buffer chamber
Should be an area through which one substrate can pass.
In the case of multiple modules, the residual process between vacuum processing
Process gas is hardly mixed.
Independence of the process gas from the process gas. It should be noted that the depth dimension of the vacuum processing apparatus was reduced.
In addition, when aiming for continuous integrated processing with other equipment,
As shown in FIG. 6, the vacuum preliminary chamber 60 '
While being provided in the buffer chamber 10 via the closing means 40,
A first substrate transport unit that transports the substrate 30 in the direction of arrow A
Vacuum opening / closing means between a certain belt conveyance device (not shown)
The substrate 30 can be transferred in the direction of arrow E through the second
Of the belt transfer device (not shown),
The empty spare room 60 'is provided. In this case, the other true
An empty opening / closing means is unnecessary. In the embodiment described above, the vacuum spare chamber is
Supply cassettes and collection cassettes are loaded from outside and
The vacuum preparatory chamber is designed to be
It is not necessary to limit to such a vacuum spare chamber. For example, supply
Set and set the recovery cassette in the vacuum spare chamber
When a predetermined number of substrates are loaded into the supply cassette from outside,
In both cases, the substrates collected in the collection cassette
May be taken out and carried out. Further, the first substrate transfer means includes a belt transfer
Vacuum opening / closing means provided for the substrate in the buffer chamber in addition to the device
What is necessary is just a thing which conveys between. Also, the second
In addition to the belt transport device, the substrate transport means of
Arm transfer device for moving the arm straight, arm for rotating the arm
For example, a memory transfer device or the like may be used. [0046] Effect of the InventionClearlyAccording to the substrate orificeLagoLet
Is performed in a evacuated space.
LagoDust on the processed surface of the substrateBankProduct
Wear is suppressed. For this reason, in semiconductor manufacturingBoard
The yield can be improved. Also,The substrate with orientation flat
When processing substrates in parallel according to the plate processing mode
Transfer the substrates to each of the vacuum processing chambers through the vacuum transfer space.
Vacuum transfer space when transferring and processing substrates in series
From one of the vacuum processing chambers to another vacuum processing chamber via
For flexible process and line changes
Can deal with.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing one embodiment of a vacuum processing apparatus according to the present invention. FIG. 2 is a perspective configuration diagram of a substrate transfer unit of the vacuum processing apparatus of FIG. FIG. 3 is a perspective view of a substrate transfer means of a vacuum processing apparatus in which two modules of the vacuum processing apparatus of FIG. 1 are connected in series. 4A to 4C are substrate processing mode diagrams in a two-module vacuum processing apparatus. FIGS. 5A and 5B are other substrate processing mode diagrams in a three-module vacuum processing apparatus. FIG. 6 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention. [Description of References] 10: buffer chamber, 20: vacuum processing chamber, 30: substrate, 4
0, 41: Vacuum opening / closing means, 50, 51: Other vacuum opening / closing means, 60, 60 ': Vacuum spare chamber, 80 to 120: Belt transfer device, 140: Substrate delivery means, 150, 160
… Arm transfer device

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Fumio Shibata 794, Higashi Toyoi, Kazamatsu, Kudamatsu City, Yamaguchi Prefecture Inside Hitachi, Ltd. Kasado Plant (72) Inventor, Tsunehiko Tsunehiko 794, Higashi Toyoi, Kudamatsu City, Yamaguchi Prefecture, Ltd.Hitachi Co., Ltd. In the Kasado Plant (72) Inventor Keno Kanai 794, Higashi-Toyoi, Kazamatsu City, Yamaguchi Prefecture Inside the Kasado Plant Hitachi, Ltd. (56) References JP-A-57-149748 (JP, A) (58) Field (Int.Cl. ⁶ , DB name) H01L 21/68

Claims (1)

(57) [Claims] A vacuum processing chamber connected to a required chamber via a vacuum transfer space and performing a predetermined process on a substrate; a unit for loading the substrates one by one into a evacuated space; Means for aligning the orientation flat of the loaded substrate in the evacuated space; and processing the substrate in parallel with the orientation flat in accordance with a substrate processing mode, wherein the substrate is transferred in a vacuum. When transferring the substrates to each of the vacuum processing chambers through a space and processing the substrates in series, separate from one of the vacuum processing chambers through the vacuum transfer space.
And a means for processing the transferred substrates one by one in the vacuum processing chamber. 2. Removing the substrate from the cassette, transporting the removed substrate to a space for transporting the substrate under vacuum, aligning the transported substrate orientation flat in the space, and processing the substrate aligned with the orientation flat for substrate processing. According to the mode, when processing the substrate in parallel, transfer the substrate to each of the vacuum processing chambers via the vacuum transfer space, and when processing the substrate in series, the vacuum transfer space a step of transporting another of the substrate into the vacuum processing chamber from one of said vacuum processing chamber through the steps of the substrate that has been said conveyed to process the vacuum processing one each at room, pre-Symbol processed substrate And recovering the same in a cassette via the space.