TW200908125A - Methods and apparatus for polishing a notch of a substrate using a polishing pad - Google Patents

Methods and apparatus for polishing a notch of a substrate using a polishing pad Download PDF

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Publication number
TW200908125A
TW200908125A TW097118580A TW97118580A TW200908125A TW 200908125 A TW200908125 A TW 200908125A TW 097118580 A TW097118580 A TW 097118580A TW 97118580 A TW97118580 A TW 97118580A TW 200908125 A TW200908125 A TW 200908125A
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
polishing pad
recess
notch
Prior art date
Application number
TW097118580A
Other languages
English (en)
Chinese (zh)
Inventor
Gary C Ettinger
Paul D Butterfield
Antoine P Manens
zhen-hua Zhang
Eashwer Kollata
Shou-Sung Chang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200908125A publication Critical patent/TW200908125A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/002—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW097118580A 2007-05-21 2008-05-20 Methods and apparatus for polishing a notch of a substrate using a polishing pad TW200908125A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US93921907P 2007-05-21 2007-05-21
US93935107P 2007-05-21 2007-05-21
US4679908P 2008-04-21 2008-04-21

Publications (1)

Publication Number Publication Date
TW200908125A true TW200908125A (en) 2009-02-16

Family

ID=40072862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097118580A TW200908125A (en) 2007-05-21 2008-05-20 Methods and apparatus for polishing a notch of a substrate using a polishing pad

Country Status (3)

Country Link
US (1) US20080293344A1 (ja)
JP (1) JP2008288599A (ja)
TW (1) TW200908125A (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
JP2008284682A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 効率的なテープのルーティング配置を有する斜面研磨ヘッドを使用する方法及び装置
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
JP2009004765A (ja) * 2007-05-21 2009-01-08 Applied Materials Inc 基板研磨のためにローリングバッキングパッドを使用する方法及び装置
JP2008306180A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置
JP2008306179A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置
JP5274993B2 (ja) 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
US20090264053A1 (en) * 2008-04-21 2009-10-22 Applied Materials, Inc. Apparatus and methods for using a polishing tape cassette
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
US20100105290A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for indicating a polishing tape end
KR101151001B1 (ko) 2009-11-25 2012-05-30 주식회사 엘지실트론 웨이퍼의 노치 가공 방법 및 장치
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
JP6204848B2 (ja) 2014-02-17 2017-09-27 株式会社荏原製作所 研磨装置および研磨方法
US10717646B2 (en) * 2016-05-20 2020-07-21 Board Of Regents, The University Of Texas System Precision alignment of the substrate coordinate system relative to the inkjet coordinate system
JP7451324B2 (ja) * 2020-06-26 2024-03-18 株式会社荏原製作所 基板処理装置および基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
US6306016B1 (en) * 2000-08-03 2001-10-23 Tsk America, Inc. Wafer notch polishing machine and method of polishing an orientation notch in a wafer
JP3949941B2 (ja) * 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP4116583B2 (ja) * 2004-03-24 2008-07-09 株式会社東芝 基板処理方法
JP4077439B2 (ja) * 2004-10-15 2008-04-16 株式会社東芝 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
US20080293344A1 (en) 2008-11-27
JP2008288599A (ja) 2008-11-27

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