TW200908123A - Methods and apparatus to control substrate bevel and edge polishing profiles of films - Google Patents
Methods and apparatus to control substrate bevel and edge polishing profiles of films Download PDFInfo
- Publication number
- TW200908123A TW200908123A TW097118571A TW97118571A TW200908123A TW 200908123 A TW200908123 A TW 200908123A TW 097118571 A TW097118571 A TW 097118571A TW 97118571 A TW97118571 A TW 97118571A TW 200908123 A TW200908123 A TW 200908123A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- film
- edge
- backing plate
- grinding
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 137
- 238000005498 polishing Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003082 abrasive agent Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 19
- 230000007717 exclusion Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- WFLOTYSKFUPZQB-UHFFFAOYSA-N 1,2-difluoroethene Chemical group FC=CF WFLOTYSKFUPZQB-UHFFFAOYSA-N 0.000 description 1
- 229920004943 Delrin® Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93934307P | 2007-05-21 | 2007-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200908123A true TW200908123A (en) | 2009-02-16 |
Family
ID=40072855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097118571A TW200908123A (en) | 2007-05-21 | 2008-05-20 | Methods and apparatus to control substrate bevel and edge polishing profiles of films |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20080293336A1 (enrdf_load_stackoverflow) |
| JP (1) | JP2008306180A (enrdf_load_stackoverflow) |
| TW (1) | TW200908123A (enrdf_load_stackoverflow) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288600A (ja) * | 2007-05-21 | 2008-11-27 | Applied Materials Inc | 基板の縁部除外領域の大きさを制御する方法及び装置 |
| US20080293337A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for polishing a notch of a substrate by substrate vibration |
| JP2008284684A (ja) * | 2007-05-21 | 2008-11-27 | Applied Materials Inc | 研磨アームを使用して基板の縁部を研磨する方法及び装置 |
| US20080293329A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile |
| TW200908122A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for using a rolling backing pad for substrate polishing |
| US20080291448A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for finding a substrate notch center |
| US8142260B2 (en) * | 2007-05-21 | 2012-03-27 | Applied Materials, Inc. | Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads |
| TW200908124A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement |
| JP2009119537A (ja) * | 2007-11-12 | 2009-06-04 | Toshiba Corp | 基板処理方法及び基板処理装置 |
| JP5393039B2 (ja) | 2008-03-06 | 2014-01-22 | 株式会社荏原製作所 | 研磨装置 |
| US20090264053A1 (en) * | 2008-04-21 | 2009-10-22 | Applied Materials, Inc. | Apparatus and methods for using a polishing tape cassette |
| US20100105290A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for indicating a polishing tape end |
| JP5663295B2 (ja) * | 2010-01-15 | 2015-02-04 | 株式会社荏原製作所 | 研磨装置、研磨方法、研磨具を押圧する押圧部材 |
| JP2011224680A (ja) * | 2010-04-16 | 2011-11-10 | Ebara Corp | 研磨方法及び研磨装置 |
| US8968537B2 (en) | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
| JP5886602B2 (ja) | 2011-03-25 | 2016-03-16 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US9457447B2 (en) | 2011-03-28 | 2016-10-04 | Ebara Corporation | Polishing apparatus and polishing method |
| JP6223873B2 (ja) * | 2014-03-14 | 2017-11-01 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| EP3567139B1 (en) | 2018-05-11 | 2021-04-07 | SiCrystal GmbH | Chamfered silicon carbide substrate and method of chamfering |
| EP3567138B1 (en) | 2018-05-11 | 2020-03-25 | SiCrystal GmbH | Chamfered silicon carbide substrate and method of chamfering |
| JP2021037585A (ja) * | 2019-09-03 | 2021-03-11 | 株式会社荏原製作所 | 研磨装置 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4533399A (en) * | 1983-04-12 | 1985-08-06 | Minnesota Mining And Manufacturing Company | Contact lens cleaning method |
| US5117590A (en) * | 1988-08-12 | 1992-06-02 | Shin-Etsu Handotai Co., Ltd. | Method of automatically chamfering a wafer and apparatus therefor |
| JP2719855B2 (ja) * | 1991-05-24 | 1998-02-25 | 信越半導体株式会社 | ウエーハ外周の鏡面面取り装置 |
| JP2559650B2 (ja) * | 1991-11-27 | 1996-12-04 | 信越半導体株式会社 | ウエーハ面取部研磨装置 |
| US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
| AT408856B (de) * | 1997-12-02 | 2002-03-25 | Lisec Peter | Vorrichtung zum automatischen säumen von plattenförmigen gegenständen |
| JP3197253B2 (ja) * | 1998-04-13 | 2001-08-13 | 株式会社日平トヤマ | ウエーハの面取り方法 |
| US6739947B1 (en) * | 1998-11-06 | 2004-05-25 | Beaver Creek Concepts Inc | In situ friction detector method and apparatus |
| JP2001205549A (ja) * | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
| US6629875B2 (en) * | 2000-01-28 | 2003-10-07 | Accretech Usa, Inc. | Machine for grinding-polishing of a water edge |
| JP2002043267A (ja) * | 2000-07-21 | 2002-02-08 | Ebara Corp | 基板洗浄装置、基板洗浄方法及び基板処理装置 |
| US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| US6488567B1 (en) * | 2000-11-09 | 2002-12-03 | Axsun Technologies, Inc. | System and method for automated fiber polishing |
| JP2002219642A (ja) * | 2001-01-24 | 2002-08-06 | Fuji Electric Co Ltd | 磁気記録媒体用ガラス基板およびその製造方法、並びに該基板を用いた磁気記録媒体 |
| JP2002329687A (ja) * | 2001-05-02 | 2002-11-15 | Speedfam Co Ltd | デバイスウエハの外周研磨装置及び研磨方法 |
| JP3949941B2 (ja) * | 2001-11-26 | 2007-07-25 | 株式会社東芝 | 半導体装置の製造方法および研磨装置 |
| JP4090247B2 (ja) * | 2002-02-12 | 2008-05-28 | 株式会社荏原製作所 | 基板処理装置 |
| JP4125148B2 (ja) * | 2003-02-03 | 2008-07-30 | 株式会社荏原製作所 | 基板処理装置 |
| US7682225B2 (en) * | 2004-02-25 | 2010-03-23 | Ebara Corporation | Polishing apparatus and substrate processing apparatus |
| JP4284215B2 (ja) * | 2004-03-24 | 2009-06-24 | 株式会社東芝 | 基板処理方法 |
| KR101249430B1 (ko) * | 2004-10-15 | 2013-04-03 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 및 폴리싱방법 |
| JP2006142388A (ja) * | 2004-11-16 | 2006-06-08 | Nihon Micro Coating Co Ltd | 研磨テープ及び方法 |
| WO2006116263A1 (en) * | 2005-04-25 | 2006-11-02 | Applied Materials, Inc. | Methods and apparatus for cleaning and edge of a substrate |
| US20070131653A1 (en) * | 2005-12-09 | 2007-06-14 | Ettinger Gary C | Methods and apparatus for processing a substrate |
| JP2008036783A (ja) * | 2006-08-08 | 2008-02-21 | Sony Corp | 研磨方法および研磨装置 |
| TW200908122A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for using a rolling backing pad for substrate polishing |
| JP2008284684A (ja) * | 2007-05-21 | 2008-11-27 | Applied Materials Inc | 研磨アームを使用して基板の縁部を研磨する方法及び装置 |
| US20080293329A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile |
| US8142260B2 (en) * | 2007-05-21 | 2012-03-27 | Applied Materials, Inc. | Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads |
| TW200908125A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for polishing a notch of a substrate using a polishing pad |
| TW200908124A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement |
| JP2008290233A (ja) * | 2007-05-21 | 2008-12-04 | Applied Materials Inc | 半導体製造における基板斜面及び縁部の研磨用の高性能及び低価格の研磨テープのための方法及び装置 |
| JP2008288600A (ja) * | 2007-05-21 | 2008-11-27 | Applied Materials Inc | 基板の縁部除外領域の大きさを制御する方法及び装置 |
| US20080291448A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for finding a substrate notch center |
| US20080293337A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for polishing a notch of a substrate by substrate vibration |
-
2008
- 2008-05-20 US US12/124,128 patent/US20080293336A1/en not_active Abandoned
- 2008-05-20 TW TW097118571A patent/TW200908123A/zh unknown
- 2008-05-20 JP JP2008132105A patent/JP2008306180A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008306180A (ja) | 2008-12-18 |
| US20080293336A1 (en) | 2008-11-27 |
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