200903700 九、發明說明 【發明所屬之技術領域】 本發明係關於在半導體晶圓等的板狀構件和用來保持 板狀構件之環狀框架等的框架上，貼合切割膠帶等的薄片 之薄片貼合裝置及薄片貼合方法。 【先前技術】 例如，在半導體製程，爲了進行半導體晶圓（以下稱 「晶圓」）之切割’係在環狀框架和配置於其中央之晶圓 上貼合切割膠帶’透過該切割膠帶用環狀框架來保持晶 圓。 前述切割膠帶之貼合裝置，例如揭示於專利文獻1。 專利文獻1之貼合裝置’係在可動台（31)的上面配置晶 圓（20) ’在配置於可動台（31)周圍之固定台（35)的 上面配置環狀框架（36) ’在該晶圓（2〇)和環狀框架 (36)的上面’用輥（46)來緊壓貼合切割膠帶之膠帶 (3 )。括弧內之符號乃專利文獻1中使用的符號（下個 段落也是相同）。 〔專利文獻1〕日本特開2006-5080號公報 【發明內容】 然而’依據上述習知的貼合裝置，配置於可動台 (31)的周圍之固定台（35)被固定成一定高度，因此只 能對應於環狀框架（3 6 )的厚度之些微差異。亦即，關於 -4- 200903700 環狀框架（3 6 )和晶圓（2 0 )的厚度’依其規格和精度難 以避免會有偏差產生’例如像第6圖那樣當環狀框架 (36 )比標準品更薄的情形，當輥（46 )到達下降極限 時，不管可動台（31)如何上下移動’仍無法使膠帶 (3)緊壓於環狀框架（36) ’而發生膠帶貼合不良。這 種狀況，當膠帶（3 )太薄的情形也會發生。相反地，當 環狀框架（3 6 )和膠帶（3 )比標準品更厚的情形，會對 輥（46 )的支承軸賦予極大的負荷，而發生裝置破損等的 問題。總之，必須將晶圓（20 )厚度、膠帶（3 )厚度及 環狀框架（3 6 )厚度全都納入考慮來進行貼合，才能進行 正確的貼合。 本發明係爲了解決前述問題點而構成者，其目的係提 供一種薄片貼合裝置及薄片貼合方法1可確實地在晶圓等 的板狀構件和環狀框架等的框架上貼合切割薄片等的薄 片，且能減輕裝置本身的負荷。 爲了達成前述目的，本發明之薄片貼合裝置，係在板 狀構件的上面將薄片送出手段所送出之薄片用緊壓手段緊 壓而進行貼合之薄片貼合裝置，其特徵在於：前述薄片貼 合裝置係具備：用來支承前述板狀構件之內側台、配置成 圍繞前述內側台’用來支承框架（用來保持前述板狀構 件）之外側台、使前述緊壓手段、內側台及外側台分別朝 與薄片貼合面大致正交的方向移動之移動手段、以及用來 將前述緊壓手段、內側台及外側台之各移動手段予以各別 控制之控制手段；前述控制手段，係以前述薄片的下面和 -5- 200903700 板狀構件的上面相接觸的位置爲貼合基準位置，按照前述 薄片的厚度來移動緊壓手段，按照前述板狀構件的厚度來 移動內側台，按照前述框架的厚度來移動外側台，而以前 述板狀構件和框架成爲一體化的方式貼合薄片。 前述本發明之薄片貼合裝置，可進一步含有：用來檢 測施加於前述緊壓手段、內側台及外側台各別的壓力之壓 力檢測手段；前述控制手段，係選擇性的取消其功能，而 使前述緊壓手段、內側台及外側台中之任一構件不根據壓 力檢測來進行移動手段的控制，另外兩個構件則根據各別 的壓力檢測手段所檢測的壓力，來控制前述各移動手段而 使前述板狀構件之單位面積的壓力成爲既定値。 前述本發明之薄片貼合裝置，能以和從薄片送出手段 送出之薄片的速度同步的方式，使內側台和外側台朝與該 薄片的送出方向大致平行的方向移動，並用前述緊壓手段 將薄片貼合於板狀構件和框架；或者，使內側台和外側台 移動，以和其移動速度同步的方式從薄片送出手段送出薄 片’並用前述緊壓手段將薄片貼合於板狀構件和框架。 本發明之薄片貼合方法，係在板狀構件的上面將薄片 送出手段所送出之薄片用緊壓手段緊壓而進行貼合之薄片 貼合方法’其特徵在於：前述薄片貼合方法，係將前述板 狀構件用內側台支承’用圍繞前述內側台之外側台來支承 框架’前述緊壓手段、內側台及外側台可藉由各別的移動 手段而朝與薄片貼合面大致正交的方向移動，前述緊壓手 段、內側台及外側台之各移動手段可各別控制；以前述薄 -6 - 200903700 片的下面和 置’按照前 構件的厚度 側台，而以 片。 依據本 之各移動手 構件的上面 度、板狀構 側台及外側 厚度產生變 此外， 於前述緊壓 手段；前述 外側台中之 力檢測手段 狀構件之單 之單位面積 效防止面壓 在框架和板 止過大的面 或框架之破 板狀構件的上面相接觸的位置爲貼合基準位 述薄片的厚度來移動緊壓手段，按照前述板狀 來移動內側台，按照前述框架的厚度來移動外 前述板狀構件和框架成爲一體化的方式貼合薄 發明，藉由採用將緊壓手段、內側台及外側台 段予以各別控制的方式，以薄片的下面和板狀 相接觸的位置爲基準位置，可按照薄片的厚 件的厚度以及框架的厚度，來使緊壓手段、內 台移動。因此，即使薄片、板狀構件及框架之 動，很容易就能對應，而能進行正確的貼合。 所採用的構造，係進一步含有：用來檢測施加 手段、內側台及外側台各別的壓力之壓力檢測 控制手段，係選擇性地以緊壓手段、內側台及 一構件爲基準，另外兩個構件則根據各別的壓 所檢測的壓力來進行控制。因此，除施加於板 位面積的緊壓力（面壓力）以外，施加於框架 的緊壓力（面壓力）也能維持於一定値，可有 力不足所造成之薄片的貼合不良，而能確實地 狀構件上貼合薄片。此外，同時也能發揮：防 壓力造成緊壓手段的支承系統破損、板狀構件 損等的作用效果。 【實施方式】 200903700 以下’針對用來實施本發明之最佳形態，參照所附圖 式進行詳細的說明。 第1圖係本發明的薄片貼合裝置之立體圖。第2圖係 薄片貼合裝置之前視圖及其控制系統方塊圖。 本薄片貼合裝置Μ ’如弟1圖、第2圖所示，係在晶 圓W (板狀構件）和用來保持板狀構件之環狀框架ρ (框 架）的上面’將薄片送出手段1所送出之切割膠帶DT (薄片）用加壓輥2(緊壓手段）緊壓而進行貼合之裝 置’本裝置Μ，係在滑動單元3上具備··用來支承晶圓W 之內側台4、配置成圍繞內側台4且用來支承前述環狀框 架F之外側台5。 滑動單元3係具備：透過安裝於下面的滑件6而在軌 道7上移動之滑座SB、滑座用馬達8、藉由該滑座用馬達 8進行旋轉之螺桿軸9、安裝於滑座SB下面且和螺桿軸9 卡合之螺帽構件N。藉此，使滑動單元3，朝與後述薄片 送出手段1所送出之切割膠帶DT的送出方向大致平行的 X軸方向移動。該滑座用馬達8係輸出旋轉脈衝D1。 前述加壓輥2，係在第1單軸機器人16(移動手段） 之可動部1 6 A上，透過測力器2 1 (壓力檢測手段）和框 架13安裝成可旋轉，且安裝在未圖示之裝置框架上。依 據此構造，加壓輥2能朝與薄片貼合面大致正交的方向、 亦即Z軸方向移動，又藉由第1測力器21可檢測施加於 該加壓輥2的壓力，並輸出其壓力資料。在框架13和加 壓輥2之間，爲了確保剛性而設有軸支承具1〇。 200903700 前述內側台4，其上面可吸附保持晶圓W，係在第2 單軸機器人18(移動手段）之可動部18A上，透過框架 14和第2測力器22 (壓力檢測手段）來安裝，且設置於 豎設在滑座SB上之架台1 7上。依據此構造，內側台4能 朝與薄片貼合面大致正交的方向、亦即Z軸方向移動，又 藉由第2測力器22可檢測施加於該內側台4的壓力，並 輸出其壓力資料。又在框架1 4和內側台4之間，爲了確 保剛性而設有軸支承具U。該內側台4，藉由滑動單元 3，也能朝與後述薄片送出手段1所送出之切割膠帶DT的 送出方向大致平行的X軸方向移動。 前述外側台5，其上面可吸附保持環狀框架F，係在 第3單軸機器人19(移動手段）之可動部19A上，透過 框架1 2和第3測力器23 (壓力檢測手段）來安裝，且設 置於滑座S B上。依據此構造，外側台5能朝與薄片貼合 面大致正交的方向、亦即Z軸方向移動，又藉由第3測力 器2 3可檢測施加於該外側台5的壓力，並輸出其壓力資 料。又在框架1 2和外側台5之間，爲了確保透過框架20 之剛性而設有軸支承具1 5。該外側台5，藉由滑動單元 3 ’和內側台4同樣的也能朝X軸方向移動。 前述薄片送出手段1，係在帶狀的剝離薄片RL上透 過未圖示的黏著劑層以既定間隔暫時黏著複數個切割膠帶 DT而構成原料帶R，將該原料帶R捲繞在支承軸24，藉 由旋轉驅動輥25並經由導輥26而將該原料帶R朝剝離板 27的方向引導，利用其前端部27A使原料帶r急劇折 200903700 返，藉此從剝離帶RL剝離切割膠帶DT而朝剝離板27前 方送出。將切割膠帶DT剝離後之剝離薄片RL，係通過驅 動輥2 5和夾輥2 8之間後捲繞在捲取軸2 9上。 接著說明本薄片貼合裝置Μ之控制部3 0。 本薄片貼合裝置Μ之控制部3 0係具備：滑座用馬達 8之控制手段（以下稱「滑動單元控制手段3 1」）、第1 單軸機器人1 6之控制手段（以下稱「加壓輥控制手段 3 2」）、第2單軸機器人1 8之控制手段（以下稱「內側 台控制手段3 3」）、第3單軸機器人1 9之控制手段（以 下稱「外側台控制手段3 4」）、用來對各控制手段3 2、 33、34之任一者輸出選擇訊號之選擇手段35。 前述選擇手段35，如第2圖所示係具備：用來在加壓 輥2、內側台4、外側台5中選擇一個當作貼合基準之開 關SW1〜SW3，例如按壓加壓輥選擇用的開關swi時，係 對加壓輥控制手段3 2輸出選擇訊號。當按壓內側台選擇 用的開關S W 2時，係對內側台控制手段3 3輸出選擇訊 號。又當按壓外側台選擇用的開關S W 3時，係對外側台 控制手段3 4輸出選擇訊號。輸入選擇訊號後之各控制手 段32、33、34’係取消其功能，而不根據第1、第2、第 3測力器21、22、23所檢測的壓力來進行第1、第2、第 3單軸機器人1 6、1 8、1 9的控制。 前述滑動單元控制手段3 1係具備：根據滑座用馬達8 所輸出之旋轉脈衝D 1來運算滑座s Β的位置之位置感測 器3 1 A、根據該位置感測器3 1 Α的資料來對滑座用馬達8 -10- 200903700 進行進退指不之驅動指示部3 1 B。 前述加壓輥控制手段3 2係具備：用來將第1測力器 2 1所檢測之施加於加壓輥2的壓力和既定壓力做比較之壓 力控制部32 A、根據該壓力比較結果爲過多或不足來對第 1單軸機器人16進行進退指示之驅動指示部32B。在此， 如第3 ( b )圖所示，在內側台4上配置晶圓W且在外側 台5上配置環狀框架F的狀態下，使加壓輥2從環狀框架 F之一端F1移動到另一端F2的情形，加壓輥2和晶圓W 及環狀框架F之接觸面積會如第3 (a)圖所示般改變。前 述既定壓力是指，按照所改變之接觸面積，乘上預先由輸 入手段（未圖示）輸入之單位面積的壓力所得的値（參照 第3 ( c )圖）。 內側台控制手段3 3係具備：用來將第2測力器22所 檢測之施加於晶圓 W的壓力和既定壓力做比較之壓力控 制部33A、根據該壓力比較結果爲過多或不足來對第2單 軸機器人1 8進行進退指示之驅動指示部33B。在此，如 第4 ( b )圖所示，在內側台4上配置晶圓W的狀態下， 使加壓輥2從晶圓W之一端W1移動到另一端W2的情 形，晶圓W和加壓輥2之接觸面積會如第4 ( a )圖所示 般改變。前述既定壓力是指，按照所改變之接觸面積’乘 上預先由輸入手段（未圖示）輸入之單位面積的壓力所得 的値（參照第4 ( c )圖）。 外側台控制手段34係具備：用來將第3測力器23所 檢測之施加於環狀框架F的壓力和既定壓力做比較之壓力 -11 - 200903700 控制部3 4 A、根據該壓力比較結果爲過多或不足來對第3 單軸機器人1 9進行進退指示之驅動指示部34B。在此， 如第5 ( b )圖所示，在外側台5上配置環狀框架f的狀 態下，使加壓輥2從環狀框架F之一端F1移動到另一端 F2的情形，環狀框架F和加壓輥2之接觸面積會如第5 (a )圖所示般改變。前述既定壓力是指，按照所改變之 接觸面積，乘上預先由輸入手段（未圖示）輸入之單位面 積的壓力所得的値（參照第5 ( c )圖）。 其次，說明具備上述構造之薄片貼合裝置Μ的動作。 首先，未圖示之搬運裝置，係如第1、2圖所示在內 側台4和外側台5的上面分別配置晶圓W和環狀框架F， 並進行吸附保持。接著，藉由第2及第3單軸機器人18、 1 9使兩個台4、5進行昇降時，利用感測器（未圖示）來 檢測晶圓W的上面和環狀框架F的上面，並使該等上面 停止於貼合基準位置Ρ。又加壓輥2是退到剝離板前端部 27Α的上方。在此，貼合基準位置Ρ是指，從剝離板27 送出之切割膠帶DT的下面和晶圓W上面接觸之理論上的 位置，可任意設定。又關於切割膠帶DT之厚度，係藉由 未圖示之輸入裝置來輸入。 然後，依驅動指示部3 1 Β的指示來驅動滑座用馬達 8，而使晶圓W和環狀框架F朝-X軸方向以既定速度行 進。當前述位置檢測器3 1 Α檢測出已到達既定的貼合開始 位置時，依驅動指示部32B之指示，加壓輥2會透過第1 單軸機器人16將切割膠帶DT緊壓於環狀框架F。該加壓 -12- 200903700 輥2之下降量，係考慮預先輸入之切割膠帶DT厚度和其 壓力來決定。接著，以和滑動單元3之移動速度同步的方 式從薄片送出手段1送出切割膠帶DT，藉此將切割膠帶 DT緊壓並貼合於環狀框架F和晶圓W上。 在貼合切割膠帶DT時第1、第2、第3單軸機器人 16、1 8、1 9之各控制動作，依加壓輥2 '內側台4、外側 台5中何者爲基準而有不同，因此以下分成各個基準的情 形來說明各控制動作。 <以加壓輥2爲基準的情形之控制動作> 以加壓輥2爲基準的情形，係預先按壓開關S W 1來 進行設定。這時，係取消其功能，而不進行第1測力器2 1 所測出之施加於加壓輥2的壓力和既定壓力之比較。又將 加壓輥2定位固定於既定位置，亦即使加壓輥2的下部， 位於前述貼合基準位置P的上方（距離大致相當於切割膠 帶DT的厚度）。在這種狀態下，第2單軸機器人18,係 將施加於晶圓W之壓力和既定壓力做比較，並根據該比 較結果爲過多或不足來使內側台4上下移動，而且，第3 單軸機器人1 9，係將施加於環狀框架F之壓力和既定壓 力做比較，並根據該比較結果爲過多或不足來使外側台5 上下移動，藉此將切割膠帶DT貼合於環狀框架F和晶圓 W上。 <以內側台4爲基準的情形之控制動作> -13- 200903700 以內側台4爲基準的情形，係預先按壓開關SW2來 進行設定。這時，係取消其功能，而不進行第2測力器22 所測出之施加於內側台4的壓力和既定壓力之比較。又將 內側台4定位固定於既定位置，亦即用檢測器來進行檢測 (未圖示）而使晶圓W的上面和前述貼合基準P —致的 位置。在這種狀態下，第1單軸機器人1 6，係將施加於加 壓輥2之壓力和既定壓力做比較，並根據該比較結果爲過 多或不足來使加壓輥2上下移動，而且，第3單軸機器人 1 9，係將施加於環狀框架F之壓力和既定壓力做比較，並 根據該比較結果爲過多或不足來使外側台5上下移動，藉 此將切割膠帶DT貼合於環狀框架F和晶圓W上。 <以外側台5爲基準的情形之控制動作> 以外側台5爲基準的情形，係預先按壓開關SW3來 進行設定。這時，係取消其功能，而不進行第3測力器2 3 所測出之施加於外側台5的壓力和既定壓力之比較。又將 外側台5定位固定於既定位置，亦即用檢測器來進行檢測 (未圖示）而使環狀框架F的上面和前述貼合基準P —致 的位置。在這種狀態下，第1單軸機器人1 6，係將施加於 加壓輥2之壓力和既定壓力做比較，並根據該比較結果爲 過多或不足來使加壓輥2上下移動，而且，第2單軸機器 人1 8，係將施加於晶圓W之壓力和既定壓力做比較，並 根據該比較結果爲過多或不足來使內側台4上下移動，藉 此將切割膠帶DT貼合於環狀框架F和晶圓w上。 -14- 200903700 如上述般，藉由選擇性地以加壓輥2、內側 側台5各個爲基準來進行控制，例如即使像第6 環狀框架F的厚度產生偏差時，仍不致因緊壓力 成切割膠帶DT之貼合不良，而能確實地在環狀 貼合切割膠帶DT，又即使是環狀框架F太厚的 能防止因過大面壓力而造成加壓輥2之支承系統 以上所說明之實施形態的薄片貼合裝置Μ， 側台4及外側台5的移動速度同步的方式，從薄 段1送出切割膠帶DT，並用加壓輥2將切割膠费 於晶圓W和環狀框架F上；但也能以和從薄片g 送出切割膠帶DT的速度同步的方式，使內側台 台5朝與切割膠帶DT的送出方向大致平行的方 並用加壓輥2將切割膠帶DT貼合於晶圓w和環 上。 以上係揭示本發明的實施形態，但本發明並 此。例如，就板狀構件而言，雖是以晶圓W爲 也能使用玻璃、鋼板\樹脂等其他的板狀構件爲 晶圓是包括矽晶圓、化合物晶圓等。又關於板狀 不限於圓形，也可以是多角形的。 又在前述實施形態，作爲薄片是使用切割膠 框架是使用環狀框架’但也適用於使用其他的薄 來進行一體化的情形。 此外’緊壓手段不限於加壓輕，例如也能使 噴吹空氣等來進行緊壓。 台 4、外 圖所示當 不足而造 框架F上 情形，仍 破損。 係以和內 片送出手 ;DT貼合 出手段1 4和外側 向移動， 狀框架F 不限定於 對象，但 對象。又 構件，並 帶，作爲 片或框架 用板材、 -15- 200903700 又關於移動手段，不限於單軸機器人’只要是可控制 壓力的機器即可，例如可由多關節機器人、氣缸、油壓缸 等來構成。 再者，關於控制手段，可採用個人電腦或定序器等， 只要是可控制機器的手段即可，並沒有特別的限定。 又關於壓力檢測手段，除測力器以外，只要是能檢測 壓力的手段即可，不管採用什麼構造都可以。 【圖式簡單說明】 第1圖係本發明的薄片貼合裝置之立體圖。 第2圖係第1圖的薄片貼合裝置之前視圖和其控制系 統方塊圖。 第3 ( a )圖，係在晶圓及環狀框架上加壓輥的位置、 與晶圓及環狀框架和加壓輥的接觸面積雙方的關係之說明 圖；第3 ( b )圖，係晶圓及環狀框架和加壓輥的位置關係 之說明圖；第3 ( c )圖，係在晶圓及環狀框架上加壓輥的 位置、與加壓輥的緊壓力雙方的關係之說明圖。 第4 ( a )圖，係在晶圓上加壓輥的位置、與晶圓和加 壓輥的接觸面積雙方的關係之說明圖；第4(b)圖係晶圓 和加壓輥的位置關係之說明圖；第4 ( c )圖係在晶圓上加 壓輥的位置、與內側台的緊壓力雙方的關係之說明圖。 第5(a)圖，係在環狀框架上加壓輥的位置、與環狀 框架和加壓輥的接觸面積雙方的關係之說明圖；第5(b) 圖係環狀框架和加壓輥的位置關係之說明圖；第5 ( c )圖 -16- 200903700 係在環狀框架上加壓輥的位置、與外側台的緊壓力雙方的 關係之說明圖。 第6圖係晶圓和環狀框架的厚度關係之說明圖。 【主要元件符號說明】 Μ :薄片貼合裝置 F :環狀框架（框架） W :晶圓（板狀構件） DT :切割膠帶（薄片） Ρ :貼合基準位置 1 :薄片送出手段 2 :加壓輥（緊壓手段） 4 :內側台 5 :外側台 16:第1單軸機器人（移動手段） 18:第2單軸機器人（移動手段） 19:第3單軸機器人（移動手段） 21 :第1測力器（壓力檢測手段） 22 :第2測力器（壓力檢測手段） 23 :第3測力器（壓力檢測手段） 3 2 :加壓輥控制手段（控制手段） 3 3 :內側台控制手段（控制手段） 3 4 :外側台控制手段（控制手段） -17-In the present invention, a sheet of a sheet of a dicing tape or the like is attached to a frame such as a plate-like member such as a semiconductor wafer or an annular frame for holding a plate-like member. Bonding device and sheet bonding method. [Prior Art] For example, in a semiconductor process, in order to perform a semiconductor wafer (hereinafter referred to as "wafer"), a dicing tape is attached to a ring frame and a wafer disposed at the center thereof. A ring frame to hold the wafer. The bonding device of the above-mentioned dicing tape is disclosed, for example, in Patent Document 1. In the bonding apparatus of Patent Document 1, a wafer (20) is disposed on the upper surface of the movable table (31). The annular frame (36) is disposed on the upper surface of the fixed table (35) disposed around the movable table (31). The wafer (2 〇) and the upper surface of the annular frame (36) are pressed by a roller (46) to press the tape (3) of the dicing tape. The symbols in parentheses are the symbols used in Patent Document 1 (the next paragraph is also the same). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-5080. SUMMARY OF THE INVENTION However, according to the above-described conventional bonding apparatus, the fixing table (35) disposed around the movable table (31) is fixed to a constant height. It can only correspond to some slight difference in the thickness of the annular frame (36). That is, regarding the thickness of the -4-200903700 ring frame (36) and the wafer (20), it is difficult to avoid deviation depending on its specifications and accuracy, for example, as shown in Fig. 6 when the ring frame (36) Thinner than the standard, when the roller (46) reaches the lower limit, no matter how the movable table (31) moves up and down, it still cannot press the tape (3) against the annular frame (36). bad. In this case, the tape (3) is too thin to occur. On the contrary, when the annular frame (36) and the tape (3) are thicker than the standard, a great load is applied to the support shaft of the roller (46), and problems such as breakage of the device occur. In short, it is necessary to combine the thickness of the wafer (20), the thickness of the tape (3), and the thickness of the annular frame (36) in order to be properly bonded. The present invention has been made to solve the above problems, and an object of the invention is to provide a sheet bonding apparatus and a sheet bonding method 1 which can reliably laminate a dicing sheet on a frame such as a wafer or a frame such as an annular frame. The sheet is equal and can reduce the load on the device itself. In order to achieve the above object, a sheet bonding apparatus according to the present invention is a sheet bonding apparatus in which a sheet fed by a sheet feeding means is pressed against a sheet by means of a pressing means, and is bonded to the sheet member. The bonding apparatus includes: an inner table for supporting the plate-like member, a side table disposed to surround the inner table 'for supporting the frame (for holding the plate-like member), the pressing means, the inner table, and a moving means for moving the outer table in a direction substantially orthogonal to the sheet bonding surface, and a control means for separately controlling the respective moving means of the pressing means, the inner table and the outer table; and the control means a position at which the lower surface of the sheet is in contact with the upper surface of the plate member of the -5 to 200903700 is a bonding reference position, and the pressing means is moved in accordance with the thickness of the sheet, and the inner table is moved in accordance with the thickness of the sheet member, as described above. The thickness of the frame moves the outer table, and the sheet is bonded in such a manner that the plate member and the frame are integrated. The sheet bonding apparatus according to the present invention may further include: a pressure detecting means for detecting a pressure applied to each of the pressing means, the inner side, and the outer side; wherein the control means selectively cancels the function; The member of the pressing means, the inner table, and the outer table is controlled not by the pressure detecting means, and the other two members control the moving means according to the pressure detected by the respective pressure detecting means. The pressure per unit area of the plate-like member is set to a predetermined value. In the sheet bonding apparatus of the present invention, the inner table and the outer table can be moved in a direction substantially parallel to the feeding direction of the sheet so as to be synchronized with the speed of the sheet fed from the sheet feeding means, and the pressing means can be used. The sheet is attached to the plate member and the frame; or the inner table and the outer table are moved, and the sheet is fed out from the sheet feeding means in synchronization with the moving speed thereof, and the sheet is attached to the sheet member and the frame by the pressing means described above. . The sheet bonding method of the present invention is a sheet bonding method in which a sheet fed by a sheet feeding means is pressed against a sheet by a pressing means on a sheet-like member, and the sheet bonding method is characterized in that the sheet bonding method is The plate-like member is supported by the inner table "supporting the frame by the outer table surrounding the inner table". The pressing means, the inner table and the outer table can be substantially orthogonal to the sheet bonding surface by the respective moving means. In the direction of movement, the moving means of the pressing means, the inner side table and the outer side table can be separately controlled; and the lower side of the thin -6 - 200903700 piece and the side of the front member are arranged in a sheet. According to the upper surface of each of the moving hand members, the plate-shaped side table and the outer thickness are changed, and the pressing means is provided; the unit area of the force detecting means-like member in the outer table is prevented from being pressed against the frame and The position where the upper surface of the broken plate-shaped member of the frame is in contact with the upper surface of the frame-like member is a thickness of the reference sheet, and the pressing means is moved, and the inner table is moved in the shape of the plate to move the thickness of the frame. The sheet-like member and the frame are integrally bonded to each other, and the pressing means, the inner table, and the outer stage are individually controlled, and the lower surface of the sheet is in contact with the plate. The position can move the pressing means and the inner table according to the thickness of the thick piece of the sheet and the thickness of the frame. Therefore, even if the sheet, the plate member, and the frame move, it is easy to match, and the correct bonding can be performed. The structure used further includes: pressure detecting and controlling means for detecting respective pressures of the applying means, the inner side table and the outer side table, and selectively using the pressing means, the inner side table and a member as a reference, and the other two The components are controlled according to the pressure detected by the respective pressures. Therefore, in addition to the tight pressure (face pressure) applied to the plate area, the pressing pressure (surface pressure) applied to the frame can be maintained at a certain level, and the sheet can be poorly bonded due to insufficient force, and can be surely The sheet is attached to the member. In addition, it can also exert the effect of preventing the damage of the support system of the pressing means and the damage of the plate-shaped member due to the pressure. [Embodiment] 200903700 Hereinafter, the best mode for carrying out the invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a perspective view of a sheet bonding apparatus of the present invention. Figure 2 is a front view of the sheet laminating apparatus and a block diagram of its control system. The sheet bonding apparatus Μ ', as shown in FIG. 1 and FIG. 2, is a sheet feeding means on the wafer W (plate-like member) and the upper surface of the annular frame ρ (frame) for holding the plate-shaped member. A device for splicing a dicing tape DT (sheet) to be pressed by a pressure roller 2 (squeezing means) and attaching it to the inside of the wafer W is provided on the slide unit 3 The table 4 is disposed to surround the inner table 4 and is used to support the outer side table 5 of the aforementioned annular frame F. The slide unit 3 includes a slide SB that moves on the rail 7 through a slider 6 attached to the lower surface, a slider motor 8, a screw shaft 9 that is rotated by the carriage motor 8, and is attached to the slide. A nut member N below the SB and engaged with the screw shaft 9. As a result, the slide unit 3 is moved in the X-axis direction substantially parallel to the feeding direction of the dicing tape DT fed by the sheet feeding means 1 to be described later. The carriage motor 8 outputs a rotation pulse D1. The pressure roller 2 is attached to the movable portion 16A of the first uniaxial robot 16 (moving means), and is rotatably mounted through the dynamometer 2 1 (pressure detecting means) and the frame 13, and is attached to the unillustrated Shown on the device frame. According to this configuration, the pressure roller 2 can be moved in a direction substantially orthogonal to the sheet bonding surface, that is, in the Z-axis direction, and the pressure applied to the pressure roller 2 can be detected by the first load cell 21, and Output its pressure data. Between the frame 13 and the pressure roller 2, a shaft support 1 is provided to ensure rigidity. 200903700 The inner table 4 is capable of adsorbing and holding the wafer W thereon, and is attached to the movable portion 18A of the second single-axis robot 18 (moving means), and is mounted through the frame 14 and the second load cell 22 (pressure detecting means). And disposed on the gantry 17 that is erected on the carriage SB. According to this configuration, the inner table 4 can be moved in a direction substantially orthogonal to the sheet bonding surface, that is, in the Z-axis direction, and the second dynamometer 22 can detect the pressure applied to the inner table 4 and output the same. Stress data. Further, between the frame 14 and the inner table 4, a shaft support U is provided to ensure rigidity. The inner table 4 can also be moved in the X-axis direction substantially parallel to the feeding direction of the dicing tape DT sent by the sheet feeding means 1 described later by the slide unit 3. The outer table 5 has a ring frame F adsorbed and held thereon, and is attached to the movable portion 19A of the third single-axis robot 19 (moving means) through the frame 1 2 and the third load cell 23 (pressure detecting means). Installed and placed on the slide SB. According to this configuration, the outer table 5 can be moved in a direction substantially orthogonal to the sheet bonding surface, that is, in the Z-axis direction, and the pressure applied to the outer table 5 can be detected by the third load cell 23 and output. Its pressure data. Further, between the frame 12 and the outer table 5, a shaft support 15 is provided to secure the rigidity of the frame 20. The outer table 5 can also be moved in the X-axis direction by the slide unit 3' and the inner table 4. In the sheet-like release sheet 1 , a plurality of dicing tapes DT are temporarily adhered to the strip-shaped release sheet RL through a non-illustrated adhesive layer at predetermined intervals to form a raw material tape R, and the raw material tape R is wound around the support shaft 24 . By rotating the driving roller 25 and guiding the raw material tape R to the peeling plate 27 via the guide roller 26, the raw material tape r is sharply folded back by the front end portion 27A, thereby peeling off the dicing tape DT from the peeling tape RL. It is sent to the front of the peeling plate 27. The release sheet RL after the dicing tape DT is peeled off is passed between the driving roller 25 and the nip roller 28 and then wound around the take-up shaft 29. Next, the control unit 30 of the sheet bonding apparatus will be described. The control unit 30 of the sheet bonding apparatus includes a control means for the slider motor 8 (hereinafter referred to as "sliding unit control means 3 1") and a control means of the first single-axis robot 16 (hereinafter referred to as "plus The pressure roller control means 3 2"), the control means of the second single-axis robot 18 (hereinafter referred to as "inner stage control means 3 3"), and the control means of the third single-axis robot 19 (hereinafter referred to as "outside stage control means" 3 4"), means 35 for selecting a selection signal for each of the control means 3 2, 33, 34. As shown in FIG. 2, the selection means 35 includes switches SW1 to SW3 for selecting one of the pressure roller 2, the inner table 4, and the outer table 5 as a bonding reference, for example, pressing pressure roller selection. When the switch swi is turned on, the selection signal is outputted to the pressure roller control means 32. When the switch S W 2 for the inner stage selection is pressed, the selection signal is output to the inner stage control means 33. When the switch S W 3 for selecting the outer table is pressed, the selection signal is output to the outer table control means 34. Each of the control means 32, 33, 34' after inputting the selection signal cancels its function, and does not perform the first and second steps based on the pressures detected by the first, second, and third load cells 21, 22, and 23. Control of the third single-axis robots 1, 6, 18, and 19. The slide unit control unit 31 includes a position sensor 3 1 A that calculates a position of the slider s Β based on the rotation pulse D 1 output from the carriage motor 8 , and according to the position sensor 3 1 Α The data is used to advance and retract the drive instructing unit 3 1 B to the carriage motor 8 -10- 200903700. The pressure roller control unit 32 includes a pressure control unit 32A for comparing the pressure applied to the pressure roller 2 detected by the first load cell 21 with a predetermined pressure, and the result of the pressure comparison is The drive instructing unit 32B that advances and retracts the first single-axis robot 16 too much or too much. Here, as shown in Fig. 3(b), in a state where the wafer W is placed on the inner stage 4 and the annular frame F is placed on the outer stage 5, the pressure roller 2 is brought from one end F1 of the annular frame F. In the case of moving to the other end F2, the contact area between the pressure roller 2 and the wafer W and the annular frame F is changed as shown in Fig. 3(a). The predetermined pressure is obtained by multiplying the changed contact area by the pressure per unit area input by an input means (not shown) (see Fig. 3 (c)). The inner stage control means 33 includes a pressure control unit 33A for comparing the pressure applied to the wafer W detected by the second load cell 22 with a predetermined pressure, and the result of the pressure comparison is excessive or insufficient. The second single-axis robot 18 performs the drive instruction unit 33B for the forward/backward instruction. Here, as shown in FIG. 4(b), in a state where the wafer W is placed on the inner stage 4, the pressure roller 2 is moved from one end W1 of the wafer W to the other end W2, and the wafer W and The contact area of the pressure roller 2 changes as shown in Fig. 4(a). The predetermined pressure is obtained by multiplying the changed contact area ′ by the pressure per unit area input by an input means (not shown) (see Fig. 4 (c)). The outer table control means 34 includes a pressure -11 - 200903700 control unit 3 4 A for comparing the pressure applied to the annular frame F detected by the third load cell 23 with a predetermined pressure, and based on the pressure comparison result The drive instructing unit 34B that advances and retracts the third single-axis robot 1 9 in order to excessive or insufficient. Here, as shown in Fig. 5(b), in a state where the annular frame f is placed on the outer table 5, the pressure roller 2 is moved from one end F1 of the annular frame F to the other end F2, and the ring shape is formed. The contact area between the frame F and the pressure roller 2 is changed as shown in Fig. 5(a). The predetermined pressure is obtained by multiplying the changed contact area by the pressure of the unit area input by the input means (not shown) (see Fig. 5 (c)). Next, the operation of the sheet bonding apparatus 具备 having the above structure will be described. First, in the conveying device (not shown), the wafer W and the ring frame F are placed on the upper surfaces of the inner side table 4 and the outer side table 5 as shown in Figs. 1 and 2, respectively, and are sucked and held. Next, when the two stages 4 and 5 are moved up and down by the second and third uniaxial robots 18 and 19, the upper surface of the wafer W and the upper surface of the annular frame F are detected by a sensor (not shown). And let the top stop at the fit reference position Ρ. Further, the pressure roller 2 is retracted above the front end portion 27 of the peeling plate. Here, the bonding reference position Ρ means that the theoretical position of the lower surface of the dicing tape DT fed from the peeling plate 27 and the upper surface of the wafer W can be arbitrarily set. Further, the thickness of the dicing tape DT is input by an input device (not shown). Then, the carriage motor 8 is driven in accordance with the instruction of the drive instructing unit 3 1 而, and the wafer W and the ring frame F are advanced at a predetermined speed in the -X-axis direction. When the position detector 3 1 Α detects that the predetermined bonding start position has been reached, the pressure roller 2 presses the dicing tape DT to the annular frame through the first single-axis robot 16 in accordance with the instruction of the driving instruction portion 32B. F. The pressurization -12-200903700 The amount of drop of the roll 2 is determined by considering the thickness of the dicing tape DT which is input in advance and the pressure thereof. Then, the dicing tape DT is fed from the sheet feeding means 1 in synchronization with the moving speed of the slide unit 3, whereby the dicing tape DT is pressed and bonded to the ring frame F and the wafer W. When the dicing tape DT is bonded, the respective control operations of the first, second, and third uniaxial robots 16, 18, and 19 are different depending on which of the inner roller 4 and the outer table 5 of the pressure roller 2 Therefore, each control operation will be described below in the case of dividing into respective standards. <Control Operation in the Case of Pressurizing Roller 2> When the pressure roller 2 is used as a reference, the switch S W 1 is pressed in advance to perform setting. At this time, the function is canceled, and the comparison between the pressure applied to the pressure roller 2 and the predetermined pressure measured by the first load cell 2 1 is not performed. Further, the pressure roller 2 is positioned and fixed at a predetermined position, and even the lower portion of the pressure roller 2 is positioned above the bonding reference position P (the distance substantially corresponds to the thickness of the dicing tape DT). In this state, the second single-axis robot 18 compares the pressure applied to the wafer W with a predetermined pressure, and moves the inner table 4 up and down based on the comparison result being excessive or insufficient, and the third single The axis robot 197 compares the pressure applied to the annular frame F with a predetermined pressure, and moves the outer table 5 up and down according to the comparison result, too much or insufficient, thereby attaching the dicing tape DT to the annular frame. F and wafer W. <Control operation in the case of the inner table 4> -13- 200903700 In the case of the inner table 4, the switch SW2 is pressed in advance to perform setting. At this time, the function is canceled, and the comparison between the pressure applied to the inner table 4 and the predetermined pressure measured by the second load cell 22 is not performed. Further, the inner table 4 is positioned and fixed at a predetermined position, that is, a position is detected by a detector (not shown) so that the upper surface of the wafer W and the bonding reference P are aligned. In this state, the first single-axis robot 16 compares the pressure applied to the pressure roller 2 with a predetermined pressure, and causes the pressure roller 2 to move up and down according to the comparison result being excessive or insufficient. The third single-axis robot 197 compares the pressure applied to the annular frame F with a predetermined pressure, and moves the outer table 5 up and down based on the result of the comparison, too much or insufficient, thereby bonding the dicing tape DT to The ring frame F and the wafer W. <Control Operation in the Case of the Outer Table 5> When the outer table 5 is used as a reference, the switch SW3 is pressed in advance to perform setting. At this time, the function is canceled, and the comparison between the pressure applied to the outer table 5 and the predetermined pressure measured by the third load cell 2 3 is not performed. Further, the outer table 5 is positioned and fixed at a predetermined position, that is, a position is detected by a detector (not shown) so that the upper surface of the annular frame F and the bonding reference P are aligned. In this state, the first single-axis robot 16 compares the pressure applied to the pressure roller 2 with a predetermined pressure, and causes the pressure roller 2 to move up and down according to the comparison result being excessive or insufficient. The second single-axis robot 18 compares the pressure applied to the wafer W with a predetermined pressure, and moves the inner table 4 up and down based on the comparison result being excessive or insufficient, thereby bonding the dicing tape DT to the ring. Frame F and wafer w. -14- 200903700 As described above, by selectively controlling each of the pressure roller 2 and the inner side table 5 as a reference, for example, even if the thickness of the sixth annular frame F is different, the pressing force is not caused. The dicing tape DT is poorly bonded, and the dicing tape DT can be surely attached to the ring, and even if the annular frame F is too thick, the support system of the pressure roller 2 due to excessive surface pressure can be prevented. In the sheet bonding apparatus of the embodiment, the dicing tape DT is sent from the thin section 1 in such a manner that the moving speeds of the side table 4 and the outer table 5 are synchronized, and the dicing adhesive is applied to the wafer W and the ring frame by the pressure roller 2. However, the inner table 5 can be attached to the dicing tape DT by the pressure roller 2 so as to be substantially parallel to the feeding direction of the dicing tape DT so as to be synchronized with the speed at which the dicing tape DT is fed from the sheet g. Wafer w and ring. The embodiments of the present invention have been disclosed above, but the present invention is also the same. For example, in the case of the plate member, other plate members such as glass, steel sheet, and resin can be used as the wafer W. The wafer includes a tantalum wafer, a compound wafer, and the like. Further, the plate shape is not limited to a circular shape, and may be polygonal. Further, in the above embodiment, the use of the dicing rubber frame as the sheet is an annular frame ‘, but it is also suitable for integration using other thin sheets. Further, the pressing means is not limited to being light in pressure, and for example, it is also possible to perform air pressing by blowing air or the like. Table 4, the external picture shows that when it is insufficient, the frame F is still damaged. The hand is sent out with the inner piece; the DT attaches the means 14 and moves outward, and the frame F is not limited to the object, but the object. Further, the member is used as a sheet for sheet or frame, -15-200903700, and the means for moving is not limited to a single-axis robot. As long as it is a machine that can control pressure, for example, a multi-joint robot, a cylinder, a hydraulic cylinder, or the like can be used. Come to form. Further, as the control means, a personal computer, a sequencer, or the like can be used, and it is not particularly limited as long as it is a means for controlling the machine. Further, the pressure detecting means may be any means other than the force measuring device as long as it can detect the pressure, regardless of the structure. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a sheet bonding apparatus of the present invention. Fig. 2 is a front view of the sheet bonding apparatus of Fig. 1 and a block diagram of its control system. Fig. 3( a ) is an explanatory view showing the relationship between the position of the pressure roller on the wafer and the annular frame, and the contact area between the wafer and the annular frame and the pressure roller; Fig. 3 (b), A diagram showing the positional relationship between the wafer and the annular frame and the pressure roller; and the third (c) diagram showing the relationship between the position of the pressure roller on the wafer and the annular frame and the pressing pressure of the pressure roller Description of the figure. Fig. 4(a) is an explanatory view showing the relationship between the position of the pressure roller on the wafer and the contact area between the wafer and the pressure roller; and the position of the wafer and the pressure roller in Fig. 4(b) Explanation of the relationship; Fig. 4 (c) is an explanatory view showing the relationship between the position of the pressure roller on the wafer and the pressing force of the inner table. Fig. 5(a) is an explanatory view showing the relationship between the position of the pressure roller on the annular frame and the contact area between the annular frame and the pressure roller; and Fig. 5(b) is an annular frame and pressurization. Explanation of the positional relationship of the roller; Fig. 5 (c) Fig.-16 - 200903700 is an explanatory view showing the relationship between the position of the pressure roller on the annular frame and the pressing force of the outer table. Fig. 6 is an explanatory view showing the relationship between the thickness of the wafer and the annular frame. [Description of main component symbols] Μ : Sheet bonding device F : Ring frame (frame) W : Wafer (plate member) DT : Cutting tape (sheet) Ρ : Bonding reference position 1: Sheet feeding means 2 : Add Pressing roller (pressing means) 4 : Inner table 5 : Outer table 16 : 1st single-axis robot (moving means) 18 : 2nd single-axis robot (moving means) 19: 3rd single-axis robot (moving means) 21 : First dynamometer (pressure detecting means) 22 : 2nd dynamometer (pressure detecting means) 23 : 3rd dynamometer (pressure detecting means) 3 2 : Pressurizing roller control means (control means) 3 3 : Inside Station control means (control means) 3 4 : Outer stage control means (control means) -17-