JP6118922B2 - Peeling device, peeling system and peeling method - Google Patents

Description

  The disclosed embodiments relate to a peeling apparatus, a peeling system, and a peeling method.

  In recent years, for example, in the semiconductor device manufacturing process, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport or polishing process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed.

  For example, in Patent Document 1, the first holding unit is used to hold the semiconductor substrate from above, the second holding unit is used to hold the support substrate from below, and the outer periphery of the second holding unit is vertically A technique for peeling a supporting substrate from a semiconductor substrate by moving in a direction is disclosed.

JP2012-69914A

  However, the above-described conventional technology has room for further improvement in terms of increasing the efficiency of the peeling process.

  For example, in the above-described prior art, the semiconductor substrate after the peeling process is held from above by the first holding unit, that is, the bonding surface with the support substrate is located on the lower surface. For this reason, in order to clean the bonding surface of the semiconductor substrate using a cleaning device, it may be necessary to perform a process of inverting the semiconductor substrate after receiving the semiconductor substrate after the peeling process from the first holding unit. There is a risk that the throughput may be hindered.

  An object of one embodiment is to provide a peeling apparatus, a peeling system, and a peeling method that can improve the efficiency of a peeling process.

A peeling apparatus according to an aspect of the embodiment is a peeling apparatus that peels a superposed substrate in which a first substrate and a second substrate are bonded to a first substrate and a second substrate. The superposed substrate is disposed in the opening of the frame having an opening having a larger diameter than the superposed substrate, and the non-joint surface of the first substrate is attached to the tape provided in the open portion. Retained in the frame. The peeling apparatus includes a first holding unit, a second holding unit, a moving mechanism, a frame holding unit, and a control unit. A 1st holding | maintenance part hold | maintains a 2nd board | substrate from upper direction among superposition | polymerization boards. A 2nd holding | maintenance part hold | maintains a 1st board | substrate from the downward direction via a tape among superposition | polymerization boards. The moving mechanism moves the first holding unit in a direction away from the second holding unit. The frame holding part is disposed outside the second holding part and holds the frame from below. The control unit controls the frame holding unit to hold the frame, controls the second holding unit to hold the first substrate, and controls the moving mechanism to hold the second substrate. The part is moved away from the second holding part holding the first substrate. The first holding portion includes a thin plate-like elastic member and a resin member that is attached to the surface of the elastic member and contacts the second substrate, and is sucked from an air inlet formed in the resin member. Two substrates are held by suction.

  According to one aspect of the embodiment, the efficiency of the peeling process can be improved.

FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the first embodiment. FIG. 2 is a schematic side view of a superposed substrate held by a dicing frame. FIG. 3 is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 4 is a flowchart showing the processing procedure of the substrate processing executed by the peeling system. FIG. 5A is a schematic diagram illustrating a transfer route of the DF-attached superposition substrate. FIG. 5B is a schematic diagram illustrating a transfer route of the substrate to be processed and the support substrate. FIG. 6 is a schematic side view showing the configuration of the peeling apparatus according to the first embodiment. FIG. 7A is a vertical perspective view showing the configuration of the first holding portion. FIG. 7B is a schematic plan view showing the configuration of the suction pad. FIG. 8A is a schematic plan view of the main body of the first holding unit. FIG. 8B is a schematic plan view of the main body portion of the first holding portion. FIG. 9 is a flowchart showing a processing procedure of the peeling process. FIG. 10A is an explanatory diagram of a peeling operation by the peeling device. FIG. 10B is an explanatory diagram of a peeling operation by the peeling device. FIG. 10C is an explanatory diagram of a peeling operation by the peeling device. FIG. 10D is an explanatory diagram of a peeling operation by the peeling device. FIG. 10E is an explanatory diagram of the peeling operation by the peeling device. FIG. 11A is a schematic side view showing the configuration of the first cleaning device. FIG. 11B is a schematic side view showing the configuration of the first cleaning device. FIG. 11C is a schematic plan view showing the configuration of the cleaning jig. FIG. 12 is a schematic side view showing the configuration of the third transport device. FIG. 13A is a vertical side view showing the configuration of the second cleaning device. FIG. 13B is a schematic plan view showing the configuration of the second cleaning device. FIG. 14 is a schematic side view showing the configuration of the peeling apparatus according to the second embodiment. FIG. 15 is a schematic perspective view showing the configuration of the cut portion. FIG. 16 is a flowchart illustrating a processing procedure of the position adjustment processing of the cut portion. FIG. 17A is an operation explanatory diagram of the peeling device. FIG. 17B is an operation explanatory diagram of the peeling device. FIG. 18A is a schematic plan view showing another configuration of the suction pad. FIG. 18B is a schematic plan view showing another configuration of the suction pad. FIG. 18C is a schematic plan view showing another configuration of the suction pad.

  Hereinafter, embodiments of a peeling system disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<1. Peeling system>
First, the configuration of the peeling system according to the first embodiment will be described with reference to FIGS. FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the first embodiment. 2 and 3 are a schematic side view and a schematic plan view of the superposed substrate held by the dicing frame. In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  The peeling system 1 according to the first embodiment shown in FIG. 1 includes a polymerization substrate T (see FIG. 2) in which a substrate to be processed W and a support substrate S are bonded with an adhesive G, a substrate to be processed W and a support substrate. Peel to S.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is defined as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the target substrate W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 100 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. Moreover, the thickness of the adhesive G which joins these to-be-processed substrate W and the support substrate S is about 40-150 micrometers.

  As described above, the substrate W to be processed is very thin and easily damaged, and thus is more reliably protected by the dicing frame F. As shown in FIG. 3, the dicing frame F is a substantially rectangular member having an opening Fa having a diameter larger than that of the superposed substrate T at the center, and is formed of a stainless steel metal. The dicing frame F and the superposed substrate T are bonded to the dicing frame F by applying the dicing tape P so as to close the opening Fa from the back surface.

  Specifically, the superposed substrate T is disposed in the opening Fa of the dicing frame F, and the dicing tape P is attached to the non-joint surface Wn of the substrate to be processed W and the dicing frame F. As a result, the superposed substrate T is held by the dicing frame F. The superposed substrate T is held by the dicing frame F with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface (see FIG. 2).

  As shown in FIG. 1, the peeling system 1 according to the first embodiment includes a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged in the X-axis direction in the order of the second processing block 20 and the first processing block 10.

  The first processing block 10 is a block that performs processing on the substrate held by the dicing frame F, specifically, the superposed substrate T or the target substrate W after peeling. The first processing block 10 includes a carry-in / out station 11, a first transfer area 12, a standby station 13, an edge cut station 14, a peeling station 15, and a first cleaning station 16.

  The second processing block 20 is a block that performs processing on a substrate that is not held by the dicing frame F, specifically, the support substrate S after being peeled off. The second processing block 20 includes a delivery station 21, a second cleaning station 22, a second transfer area 23, and a carry-out station 24.

  The first transfer area 12 of the first processing block 10 and the second transfer area 23 of the second processing block 20 are arranged side by side in the X-axis direction. In addition, on the Y axis negative direction side of the first transfer area 12, the carry-in / out station 11 and the standby station 13 are arranged side by side in the X-axis direction in the order of the carry-in / out station 11 and the standby station 13, and the second transfer area 23. An unloading station 24 is arranged on the Y axis negative direction side.

  Further, on the opposite side of the carry-in / out station 11 and the standby station 13 across the first transfer region 12, a peeling station 15 and a first cleaning station 16 are arranged in the X-axis direction in the order of the peeling station 15 and the first cleaning station 16. Are arranged side by side. In addition, the delivery station 21 and the second cleaning station 22 are arranged side by side in the X-axis direction in the order of the second cleaning station 22 and the delivery station 21 on the opposite side of the carry-out station 24 across the second transfer area 23. An edge cut station 14 is disposed on the positive X-axis direction side of the first transfer region 12.

  First, the configuration of the first processing block 10 will be described. In the carry-in / out station 11, a cassette Ct in which a superposed substrate T (hereinafter referred to as “DF superposed substrate T”) held in a dicing frame F is accommodated and a cassette Cw in which a substrate to be processed W after peeling is accommodated. Is carried in and out of the outside. The loading / unloading station 11 is provided with a cassette mounting table, and a plurality of cassette mounting plates 110a and 110b on which the cassettes Ct and Cw are respectively mounted are provided on the cassette mounting table.

  In the 1st conveyance area | region 12, the superposition | polymerization board | substrate T with DF or the to-be-processed substrate W after peeling is performed. In the first transfer region 12, a first transfer device 30 for transferring the DF-attached superposition substrate T or the substrate to be processed W after peeling is installed.

  The first transfer device 30 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. A substrate transfer device. The first transfer device 30 holds the substrate using the substrate holding unit and transfers the substrate held by the substrate holding unit to a desired place by the transfer arm unit.

  The substrate holding unit provided in the first transfer device 30 holds the dicing frame F by suction or gripping, etc., thereby holding the DF-attached superposed substrate T or the substrate to be processed W after peeling substantially horizontally.

  The standby station 13 is provided with an ID reading device for reading the ID (Identification) of the dicing frame F, and the ID reading device can identify the DF-attached superposed substrate T being processed.

  In the standby station 13, in addition to the ID reading process, a standby process for temporarily waiting for the DF-attached superposed substrate T to be processed is performed as necessary. The standby station 13 is provided with a mounting table on which the DF-attached superposition substrate T transferred by the first transfer device 30 is mounted. On the mounting table, an ID reader and a temporary standby unit are mounted. Is done.

  In the edge cut station 14, an edge cut process is performed in which the peripheral portion of the adhesive G (see FIG. 2) is dissolved and removed with a solvent. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S can be easily separated in the peeling process described later. The edge cut station 14 is provided with an edge cut device that dissolves the peripheral portion of the adhesive G with the solvent by immersing the polymerization substrate T in the solvent of the adhesive G.

  In the peeling station 15, a peeling process is performed to peel the DF-attached superposed substrate T transported by the first transport device 30 into the target substrate W and the support substrate S. The peeling station 15 is provided with a peeling device that performs a peeling process. The specific configuration and operation of such a peeling apparatus will be described later.

  In the first cleaning station 16, the substrate to be processed W after being peeled is cleaned. The first cleaning station 16 is provided with a first cleaning device that cleans the substrate to be processed W after being peeled off while being held by the dicing frame F. A specific configuration of the first cleaning device will be described later.

  In the first processing block 10, the ID reading process of the dicing frame F is performed in the standby station 13, the edge cut process of the DF-attached superposition substrate T is performed in the edge cut station 14, and then the DF-attachment superposition substrate in the peeling station 15. T stripping treatment is performed. In the first processing block 10, the substrate to be processed W after separation is cleaned in the first cleaning station 16, and then the substrate to be processed W after cleaning is transferred to the carry-in / out station 11. Thereafter, the substrate to be processed W after cleaning is unloaded from the loading / unloading station 11.

  Next, the configuration of the second processing block 20 will be described. In the delivery station 21, a delivery process is performed in which the peeled support substrate S is received from the peeling station 15 and delivered to the second cleaning station 22. The delivery station 21 is provided with a third transport device 50 for holding and transporting the support substrate S after peeling without contact, and the third transport device 50 performs the above delivery process. A specific configuration of the third transport device 50 will be described later.

  In the second cleaning station 22, a second cleaning process for cleaning the support substrate S after peeling is performed. The second cleaning station 22 is provided with a second cleaning device for cleaning the support substrate S after peeling. A specific configuration of the second cleaning device will be described later.

  In the second transfer region 23, the support substrate S cleaned by the second cleaning device is transferred. A second transport device 40 that transports the support substrate S is installed in the second transport region 23.

  The second transfer device 40 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. A substrate transfer device. The second transfer device 40 holds the substrate using the substrate holding unit and transfers the substrate held by the substrate holding unit to the unloading station 24 by the transfer arm unit. In addition, the board | substrate holding part with which the 2nd conveying apparatus 40 is provided is the fork etc. which hold | maintain the support substrate S substantially horizontally, for example by supporting the support substrate S from the downward direction.

  In the carry-out station 24, the cassette Cs in which the support substrate S is accommodated is carried in / out. The unloading station 24 is provided with a cassette mounting table, and the cassette mounting table is provided with a plurality of cassette mounting plates 240a and 240b on which the cassette Cs is mounted.

  In the second processing block 20, the support substrate S after peeling is transported from the peeling station 15 to the second cleaning station 22 via the delivery station 21 and cleaned in the second cleaning station 22. Thereafter, in the second processing block 20, the cleaned support substrate S is transported to the carry-out station 24, and the cleaned support substrate S is carried out from the carry-out station 24 to the outside.

  Further, the peeling system 1 includes a control device 60. The control device 60 is a device that controls the operation of the peeling system 1. The control device 60 is a computer, for example, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 by reading and executing the program stored in the storage unit.

  Such a program may be recorded on a computer-readable recording medium and installed in the storage unit of the control device 60 from the recording medium. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  Next, operation | movement of the peeling system 1 mentioned above is demonstrated with reference to FIG. 4 and FIG. 5A, 5B. FIG. 4 is a flowchart showing a processing procedure of substrate processing executed by the peeling system 1. FIG. 5A is a schematic diagram showing a transport route of the superposed substrate T with DF, and FIG. 5B is a schematic diagram showing a transport route of the substrate to be processed W and the support substrate S. Note that the peeling system 1 executes each processing procedure shown in FIG. 4 based on the control of the control device 60.

  First, the first transfer device 30 (see FIG. 1) disposed in the first transfer region 12 of the first processing block 10 carries the DF-attached superposed substrate T into the standby station 13 based on the control of the control device 60. (See step S101 in FIG. 4 and T1 in FIG. 5A).

  Specifically, the first transport device 30 causes the substrate holding portion to enter the carry-in / out station 11, holds the DF-attached superposition substrate T accommodated in the cassette Ct, and removes it from the cassette Ct. At this time, the superposed substrate T with DF is held from above by the substrate holding portion of the first transfer device 30 with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface. Then, the first transport device 30 carries the DF-attached superposition substrate T taken out from the cassette Ct into the standby station 13.

  Subsequently, in the standby station 13, the ID reading device performs an ID reading process for reading the ID of the dicing frame F based on the control of the control device 60 (step S102 in FIG. 4). The ID read by the ID reading device is transmitted to the control device 60.

  Subsequently, under the control of the control device 60, the first transport device 30 carries out the DF-attached superposition substrate T from the standby station 13 and transports it to the edge cut station 14 (see T2 in FIG. 5A). In the edge cut station 14, the edge cut device performs an edge cut process based on the control of the control device 60 (step S103 in FIG. 4). The edge portion of the adhesive G is removed by the edge cutting process, and the substrate to be processed W and the support substrate S are easily separated in the subsequent peeling process. Thereby, the time which a peeling process requires can be shortened.

  In the peeling system 1 according to the first embodiment, since the edge cut station 14 is incorporated in the first processing block 10, the DF-attached superposition substrate T carried into the first processing block 10 is transferred to the first transfer device 30. And can be directly carried into the edge cut station 14. For this reason, according to the peeling system 1, the throughput of a series of substrate processing can be improved. Moreover, the time from the edge cut process to the peeling process can be easily managed, and the peeling performance can be stabilized.

  Further, for example, when a DF-attached superposed substrate T waiting for processing is generated due to a difference in processing time between apparatuses, the DF-attached superposed substrate T is temporarily kept in a standby state using a temporary standby unit provided in the standby station 13. The loss time between a series of processes can be shortened.

  Subsequently, under the control of the control device 60, the first transport device 30 carries out the DF-attached superposed substrate T after the edge cut processing from the edge cut station 14 and transports it to the peeling station 15 (see T3 in FIG. 5A). ). And in the peeling station 15, a peeling apparatus performs peeling processing based on control of the control apparatus 60 (step S104 of FIG. 4).

  Thereafter, in the peeling system 1, the processing for the target substrate W after peeling is performed in the first processing block 10, and the processing for the supporting substrate S after peeling is performed in the second processing block 20. Note that the substrate to be processed W after peeling is held by the dicing frame F.

  First, in the first processing block 10, the first transfer device 30 carries out the substrate to be processed W after being peeled from the peeling device based on the control of the control device 60 and transfers it to the first cleaning station 16 (FIG. 5B). W1).

  Then, based on the control of the control device 60, the first cleaning device performs a processing substrate cleaning process for cleaning the bonding surface Wj of the processing target substrate W after peeling (Step S105 in FIG. 4). By such a substrate cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed.

  Subsequently, based on the control of the control device 60, the first transport device 30 carries out the processed substrate carry-out process for carrying out the processed substrate W after cleaning from the first cleaning device and transporting it to the carry-in / out station 11 ( Step S106 in FIG. 4 and W2 in FIG. 5B). Thereafter, the substrate W to be processed is unloaded from the loading / unloading station 11 and collected. Thus, the process for the substrate to be processed W is completed.

  On the other hand, in the second processing block 20, the processes in steps S107 to S109 are performed in parallel with the processes in steps S105 and S106.

  First, in the second processing block 20, the third transfer device 50 installed in the delivery station 21 performs delivery processing of the support substrate S after peeling based on the control of the control device 60 (step S107 in FIG. 4). .

  In this step S107, the third transfer device 50 receives the support substrate S after peeling from the peeling device (see S1 in FIG. 5B), and places the received support substrate S on the second cleaning device of the second cleaning station 22. (Refer to S2 in FIG. 5B).

  Here, the support substrate S after peeling is in a state in which the upper surface side, that is, the non-joint surface Sn side is held by the peeling device, and the third transport device 50 does not move the joint surface Sj side of the support substrate S from below. Hold in contact. The third transport device 50 carries the held support substrate S into the second cleaning station 22, then reverses the support substrate S and places it on the second cleaning device. As a result, the support substrate S is placed on the second cleaning device with the bonding surface Sj facing upward. Then, the second cleaning device performs a support substrate cleaning process for cleaning the bonding surface Sj of the support substrate S based on the control of the control device 60 (step S108 in FIG. 4). The adhesive G remaining on the bonding surface Sj of the support substrate S is removed by the support substrate cleaning process.

  Subsequently, under the control of the control device 60, the second transport device 40 carries out a support substrate carry-out process in which the washed support substrate S is unloaded from the second cleaning device and transported to the carry-out station 24 (FIG. 4). Step S109, see S3 of FIG. 5B). Thereafter, the support substrate S is unloaded from the unloading station 24 and collected. Thus, the process for the support substrate S is completed.

  As described above, the peeling system 1 according to the first embodiment is for the substrate front end (the carry-in / out station 11 and the first transfer device 30) held by the dicing frame F and for the substrate not held by the dicing frame F. The front end (the carry-out station 24 and the second transfer device 40) is provided. This makes it possible to perform in parallel the process of transporting the cleaned substrate W to the carry-in / out station 11 and the process of transporting the cleaned support substrate S to the carry-out station 24. Processing can be performed efficiently.

  In the peeling system 1 according to the first embodiment, the first processing block 10 and the second processing block 20 are connected by a delivery station 21. Thus, since the peeled support substrate S can be directly taken out from the peeling station 15 and carried into the second processing block 20, the peeled support substrate S can be smoothly transferred to the second cleaning device. it can.

  Therefore, according to the peeling system 1 which concerns on 1st Embodiment, the throughput of a series of substrate processing can be improved.

<2. Configuration of each device>
<2-1. Peeling device>
Next, the structure of each apparatus with which the peeling system 1 is provided is demonstrated concretely. First, the structure of the peeling apparatus installed in the peeling station 15 and the peeling operation of the polymer substrate T with DF performed using the peeling apparatus will be described. FIG. 6 is a schematic side view showing the configuration of the peeling apparatus according to the first embodiment.

  As shown in FIG. 6, the peeling device 5 includes a processing unit 100. A loading / unloading port (not shown) is formed on the side surface of the processing unit 100, and through this loading / unloading port, the DF-attached superposition substrate T is loaded into the processing unit 100, and the target substrate W and the support substrate after peeling are supported. Unloading from the processing unit 100 of S is performed. For example, an opening / closing shutter is provided at the loading / unloading port, and the opening / closing shutter partitions the inside of the processing unit 100 from other regions, thereby preventing entry of particles. The carry-in / out port is provided on each of the side surface adjacent to the first transfer region 12 and the side surface adjacent to the delivery station 21.

  The peeling apparatus 5 includes a first holding unit 110, an upper base unit 120, a local moving unit 130, and a moving mechanism 140. The peeling device 5 includes a second holding unit 150, a frame holding unit 160, a lower base unit 170, and a rotation mechanism 180. These are arranged inside the processing unit 100.

  The first holding part 110 is supported from above by the upper base part 120. The upper base part 120 is supported by the moving mechanism 140. When the moving mechanism 140 moves the upper base part 120 in the vertical direction, the first holding part 110 moves up and down in the vertical direction.

  The second holding unit 150 is disposed below the first holding unit 110, and the frame holding unit 160 is disposed outside the second holding unit 150. The second holding part 150 and the frame holding part 160 are supported from below by the lower base part 170. The lower base portion 170 is supported by the rotation mechanism 180. When the rotation mechanism 180 rotates the lower base portion 170 around the vertical axis, the second holding portion 150 and the frame holding portion 160 are moved around the vertical axis. Rotate.

  In the peeling apparatus 5, the first holding unit 110 holds the DF-attached superposition substrate T from above, the second holding portion 150 holds the DF-attached superposition substrate T from below, and the local movement unit 130 has the first holding portion. A part of the outer peripheral portion of the portion 110 is moved away from the second holding portion 150. Thereby, the peeling apparatus 5 can peel the support substrate S continuously from the to-be-processed substrate W toward the center part from the outer peripheral part. Hereinafter, each component will be specifically described.

  The 1st holding | maintenance part 110 is a holding | maintenance part which adsorbs-holds the support substrate S which comprises the superposition | polymerization board | substrate T with DF. The first holding unit 110 is formed of a flexible member so that the shape of the first holding unit 110 can be changed flexibly when pulled by a local moving unit 130 described later. Here, a specific configuration of the first holding unit 110 will be described with reference to FIGS. 7A and 7B. FIG. 7A is a schematic perspective view showing the configuration of the first holding unit 110, and FIG. 7B is a schematic plan view showing the configuration of the suction pad.

  As shown in FIG. 7A, the first holding unit 110 includes a thin plate-like main body 111 and a suction pad 112 attached to the surface of the main body 111. The main body 111 is formed of an elastic member such as a leaf spring, and the suction pad 112 is formed of a resin member.

  The main body 111 has a disk part 111a having substantially the same diameter as the DF-attached superposition substrate T, and the suction pad 112 is attached to the lower surface of the disk part 111a.

  A tension part 111b is provided on the outer periphery of the disk part 111a, and an attachment part 111b1 for attaching a cylinder 132 of the local movement part 130 described later is formed at the tip of the tension part 111b.

  A plurality of fixed portions 111c are provided on the outer peripheral portion of the disk portion 111a. The fixing portion 111 c is provided at a position corresponding to a support member 121 provided on the upper base portion 120 described later, and is fixed to the support member 121. The first holding part 110 is supported by the upper base part 120 by fixing the fixing part 111 c to the support member 121 of the upper base part 120.

  In addition, although the example in which the five fixing parts 111c are provided with respect to the disk part 111a was shown here, the number of the fixing parts 111c provided in the disk part 111a is not limited to five.

  The suction pad 112 is a disk-shaped resin member in which a suction region of the DF-attached superposition substrate T is formed. As shown in FIG. 7B, the suction area of the suction pad 112 is divided into a plurality of individual areas R1 to R4 by a plurality of straight lines L1 and L2 extending in the radial direction from the center and a plurality of arcs a1 to a3.

  In the individual regions R1 to R4, intake ports 113a to 113d are formed, and the intake ports 113a to 113d are connected to an intake device 114 such as a vacuum pump via the intake pipe 113 shown in FIG. . The first holding unit 110 sucks and holds the support substrate S for each of the individual regions R1 to R4 by sucking the support substrate S constituting the DF-attached superposition substrate T from the intake ports 113a to 113d by the intake air of the intake device 114. To do.

  As described above, the suction area of the suction pad 112 is divided into a plurality of individual areas R1 to R4, and the support substrate S is sucked and held for each of the individual areas R1 to R4. Even if it occurs, the support substrate S can be appropriately held by other individual regions.

  Further, each of the individual regions R1 to R4 is formed so that the individual region provided on the distal end side in the traveling direction d is larger than the individual region provided on the proximal end side in the peeling traveling direction d. For example, the individual regions R1 to R3 are arranged in the order of the individual region R1, the individual region R2, and the individual region R3 along the peeling progress direction d. The individual region R2 is larger than the individual region R1, and is larger than the individual region R2. Also, the individual region R3 is formed large.

  Since the adsorption force in the adsorption region increases as the adsorption region becomes smaller, by configuring as described above, the adsorption force of the individual region R1 disposed on the base end side in the peeling traveling direction d is changed to another individual region. It can be larger than R2 to R4. Accordingly, the region on the base end side in the peeling progress direction d is a region where the greatest force is required when the target substrate W and the support substrate S are peeled off. Therefore, the substrate W to be processed and the support substrate S can be reliably peeled by increasing the suction force in the region.

  Further, by forming the air inlets 113a to 113d of the individual regions R1 to R4 side by side along the peeling progress direction d, the support substrate S can be more reliably held during the peeling operation.

  Although the lines L1 and L2 are straight lines here, the lines L1 and L2 do not necessarily need to be straight lines. In addition, although an example in which one intake device 114 is connected to each intake port 113a to 113d is shown here, an intake device may be provided for each intake port 113a to 113d.

  Returning to FIG. 6, the description of the configuration of the peeling device 5 is continued. Above the first holding part 110, the upper base part 120 is arranged to face the first holding part 110 with a gap. A plurality of support members 121 protrude from the lower surface of the upper base portion 120 toward the first holding portion 110. By fixing the support member 121 and the fixing part 111c of the first holding part 110, the first holding part 110 is supported by the upper base part 120.

  The local moving unit 130 moves a part of the outer periphery of the first holding unit 110 in a direction away from the second holding unit 150. Specifically, the local moving unit 130 includes a main body part 131 fixed to the upper base part 120 and a cylinder 132 whose base end part is fixed to the main body part 131 and moves up and down along the vertical direction by the main body part 131. Prepare. The distal end portion of the cylinder 132 is fixed to an attachment portion 111b1 (see FIG. 7A) of the tension portion 111b provided in the main body portion 111 of the first holding portion 110.

  The local moving unit 130 moves the cylinder 132 vertically upward using the main body 131, thereby moving the tension part 111 b fixed to the cylinder 132 vertically upward. As a result, a part of the outer peripheral portion of the support substrate S held by the first holding unit 110 moves vertically upward and is peeled off from the substrate W to be processed held by the second holding unit 150.

  The local moving unit 130 is provided with a load cell 133, and the local moving unit 130 can detect a load applied to the cylinder 132 by the load cell 133. The local moving unit 130 can pull the first holding unit 110 while controlling the vertically upward force applied to the support substrate S based on the detection result by the load cell 133.

  By the way, in the peeling apparatus 5 which concerns on 1st Embodiment, all the several fixing parts 111c formed in the main-body part 111 of the 1st holding | maintenance part 110 are fixed to the support member 121, or only one part is fixed. The amount of movement of the first holding unit 110 by the local moving unit 130 can be adjusted by fixing. This point will be described with reference to FIGS. 8A and 8B. 8A and 8B are schematic plan views of the main body 111 of the first holding unit 110. FIG.

  For example, as shown in FIG. 8A, when all the five fixing portions 111c provided in the main body 111 of the first holding unit 110 are fixed to the support member 121, the first holding unit 110 is moved by the local moving unit 130. The movable region R is limited to a region from the base end in the peeling progress direction d to the two fixing portions 111c closest to the base end. On the other hand, as shown in FIG. 8B, the first holding unit 110 is moved by the local moving unit 130 by removing the support member 121 from the two fixing portions 111 c provided on the base end side in the peeling traveling direction d. The possible region R can be made larger than in the case shown in FIG. 8A.

  As described above, the fixing portion 111 c is provided not only with the function of fixing the first holding portion 110 to the upper base portion 120 but also with a plurality along the circumferential direction of the outer peripheral portion of the main body portion 111, and is fixed to the support member 121. This also has a function of restricting the movement of the first holding unit 110 by the local moving unit 130.

  Returning to FIG. 6, the description of the configuration of the peeling device 5 is continued. A moving mechanism 140 is disposed above the upper base portion 120. The moving mechanism 140 includes a main body 141 fixed to the ceiling of the processing unit 100, and a driving unit 142 whose base end is fixed to the main body 141 and moves up and down along the vertical direction. As the driving unit 142, for example, a motor, a cylinder, or the like can be used. The distal end portion of the driving means 142 is fixed to the upper base portion 120.

  The moving mechanism 140 moves the upper base portion 120 fixed to the driving means 142 along the vertical direction by moving the driving means 142 vertically upward using the main body 141. Thereby, the 1st holding | maintenance part 110 and the local movement part 130 supported by the upper side base part 120 raise / lower.

  Below the first holding unit 110, the second holding unit 150 is arranged to face. The second holding unit 150 sucks and holds the substrate W to be processed that constitutes the DF-attached superposition substrate T via the dicing tape P.

  The second holding unit 150 includes a disk-shaped main body 151 and a support member 152 that supports the main body 151. The column member 152 is supported by the lower base portion 170.

  The main body 151 is made of a metal member such as aluminum. An adsorption surface 151 a is provided on the upper surface of the main body 151. The adsorption surface 151a has substantially the same diameter as the DF-attached superposition substrate T, and comes into contact with the lower surface of the DF-attachment superposition substrate T, that is, the non-joint surface Wn of the substrate W to be processed. The adsorption surface 151a is formed of, for example, a porous body such as silicon carbide or a porous ceramic.

  A suction space 151b is formed inside the main body 151 and communicates with the outside via the suction surface 151a. The suction space 151b is connected to an intake device 154 such as a vacuum pump via an intake pipe 153.

  The second holding unit 150 uses the negative pressure generated by the intake air of the intake device 154 to adsorb the non-joint surface Wn of the substrate W to be processed to the adsorption surface 151a via the dicing tape P, thereby processing the substrate W to be processed. Hold. In addition, although the example using a porous chuck was shown as the 2nd holding | maintenance part 150, it is not limited to this. For example, an electrostatic chuck may be used as the second holding unit 150.

  A frame holding unit 160 is disposed outside the second holding unit 150. The frame holding unit 160 holds the dicing frame F from below. The frame holding portion 160 is fixed to the plurality of suction portions 161 for sucking and holding the dicing frame F, the support member 162 for supporting the suction portion 161, and the lower base portion 170, and the support member 162 is arranged along the vertical direction. And a moving mechanism 163 for moving.

  The adsorbing portions 161 are formed of an elastic member such as rubber, and are provided at positions corresponding to, for example, four positions on the front, rear, left and right of the dicing frame F shown in FIG. The suction portion 161 is formed with an intake port (not shown), and an intake device 165 such as a vacuum pump is connected to the intake port via a support member 162 and an intake pipe 164.

  The frame holding unit 160 holds the dicing frame F by adsorbing the dicing frame F using the negative pressure generated by the intake air of the intake device 165. In addition, the frame holding unit 160 moves the dicing frame F along the vertical direction by moving the support member 162 and the suction unit 161 along the vertical direction by the moving mechanism 163 while holding the dicing frame F. .

  The lower base part 170 is disposed below the second holding part 150 and the frame holding part 160 and supports the second holding part 150 and the frame holding part 160. The lower base portion 170 is supported by a rotation mechanism 180 fixed to the floor surface of the processing unit 100, for example. As the lower base portion 170 rotates about the vertical axis by the rotation mechanism 180, the second holding portion 150 and the frame holding portion 160 supported by the lower base portion 170 rotate about the vertical axis.

  Next, the operation of the peeling apparatus 5 will be described with reference to FIGS. 9 and 10A to 10E. FIG. 9 is a flowchart showing a processing procedure of the peeling process. 10A to 10E are explanatory views of the peeling operation by the peeling device 5. FIG. Note that the peeling device 5 executes each processing procedure shown in FIG. 9 based on the control of the control device 60.

  First, the peeling device 5 sucks and holds the dicing frame F of the DF-attached superposed substrate T carried into the peeling station 15 by the first transport device 30 from below using the frame holding portion 160 (step S201). At this time, the DF-attached superposition substrate T is in a state of being held only by the frame holding unit 160 (see FIG. 10A).

  Subsequently, the peeling device 5 lowers the frame holding unit 160 using the moving mechanism 163 (see FIG. 6) (step S202). Thereby, the to-be-processed substrate W among the superposition | polymerization board | substrates T with DF contact | abuts to the 2nd holding | maintenance part 150 via the dicing tape P (refer FIG. 10B). Thereafter, the peeling device 5 uses the second holding unit 150 to hold the DF-attached superposition substrate T by suction (step S203). As a result, the substrate to be processed W is held by the second holding unit 150 and the dicing frame F is held by the frame holding unit 160 in the DF-superposed substrate T.

  Subsequently, the peeling device 5 lowers the first holding unit 110 using the moving mechanism 140 (step S204). As a result, the support substrate S of the DF-attached superposition substrate T comes into contact with the first holding unit 110 via the dicing tape P (see FIG. 10C). Thereafter, the peeling device 5 uses the first holding unit 110 to suck and hold the support substrate S that constitutes the DF-attached superposition substrate T (step S205).

  Subsequently, the peeling device 5 pulls a part of the outer peripheral portion of the first holding unit 110 using the local moving unit 130 (step S206). Specifically, the local moving unit 130 moves the pulling unit 111 b provided on the main body 111 of the first holding unit 110 vertically upward by the operation of the cylinder 132. As a result, the outer peripheral portion of the DF-attached superposed substrate T is pulled vertically upward, and the support substrate S begins to peel continuously from the substrate W to be processed from the outer peripheral portion toward the central portion (see FIG. 10D).

  Here, as described above, since the first holding unit 110 is formed of a flexible member, it takes place when the local moving unit 130 pulls the pulling unit 111b of the first holding unit 110 vertically upward. Deforms flexibly with tension. Thereby, the peeling apparatus 5 can peel the support substrate S from the target substrate W without applying a large load to the target substrate W.

  And the peeling apparatus 5 raises the 1st holding | maintenance part 110 using the moving mechanism 140 (step S207). As a result, the support substrate S is separated from the substrate W to be processed. Thereafter, the peeling device 5 ends the peeling process.

  Note that the peeling device 5 may rotate the second holding unit 150 and the frame holding unit 160 using the rotation mechanism 180 after the target substrate W and the support substrate S are peeled off. Thereby, when there exists the adhesive G stuck across the support substrate S and the to-be-processed substrate W, this adhesive G can be threaded off.

  When the peeling device 5 finishes the peeling process, the first transport device 30 carries the substrate to be processed W after peeling from the peeling device 5 and transports it to the first cleaning station 16. At this time, as shown in FIG. 10E, the substrate to be processed W after being peeled is held by the second holding unit 150 with the bonding surface Wj to be cleaned positioned on the upper surface. For this reason, the first transfer apparatus 30 can transfer the substrate to be processed W after peeling from the peeling apparatus 5 to the first cleaning station 16 as it is without inverting it.

  Thus, in the peeling apparatus 5 which concerns on 1st Embodiment, the 1st holding part 110 hold | maintains the support substrate S among the superposition | polymerization board | substrates T with DF from the upper part, and the 2nd holding part 150 becomes a superposition | polymerization board | substrate with DF. The substrate W to be processed is held from below through the dicing tape P. Therefore, according to the peeling apparatus 5, since it is not necessary to invert the to-be-processed substrate W after peeling, the efficiency of the peeling process can be improved.

  Further, the peeling apparatus 5 according to the first embodiment forms the first holding unit 110 with a flexible member, so that the support substrate S can be covered without applying a large load to the substrate W to be processed. It can be peeled from the processing substrate W. For this reason, peeling with the support substrate S and the to-be-processed substrate W can be performed efficiently.

<2-2. Configuration of first cleaning device>
Next, the configuration of the first cleaning device will be described with reference to FIGS. 11A and 11B are schematic side views showing the configuration of the first cleaning device. FIG. 11C is a schematic plan view showing the configuration of the cleaning jig.

  As shown in FIG. 11A, the first cleaning device 70 has a processing container 71. A loading / unloading port (not shown) for the substrate W to be processed is formed on the side surface of the processing container 71, and an opening / closing shutter (not shown) is provided at the loading / unloading port. Note that a filter (not shown) for cleaning the internal atmosphere is provided in the processing container 71.

  A substrate holding part 72 is arranged at the center in the processing container 71. The substrate holding part 72 has a spin chuck 721 that holds and rotates the dicing frame F and the substrate W to be processed.

  The spin chuck 721 has a horizontal upper surface, and a suction port (not shown) for sucking, for example, the dicing tape P is provided on the upper surface. Then, the substrate to be processed W is sucked and held on the spin chuck 721 through the dicing tape P by suction from the suction port. At this time, the substrate to be processed W is sucked and held by the spin chuck 721 so that the bonding surface Wj faces upward.

  Below the spin chuck 721, for example, a chuck driving unit 722 including a motor is disposed. The spin chuck 721 is rotated at a predetermined speed by the chuck driving unit 722. Further, the chuck driving unit 722 includes an elevating drive source such as a cylinder, and the spin chuck 721 is moved up and down by the elevating drive source.

  Around the substrate holding portion 72, a cup 723 that receives and collects the liquid scattered or dropped from the substrate W to be processed is disposed. The lower surface of the cup 723 is connected to a discharge pipe 724 that discharges the collected liquid and an exhaust pipe 725 that exhausts the atmosphere in the cup 723.

  A cleaning jig 73 for cleaning the bonding surface Wj of the substrate W to be processed is disposed above the substrate holding part 72. The cleaning jig 73 is disposed to face the substrate to be processed W held by the substrate holder 72. Here, the configuration of the cleaning jig 73 will be described with reference to FIGS. 11B and 11C.

  As shown in FIGS. 11B and 11C, the cleaning jig 73 has a substantially disk shape. A supply surface 731 is formed on the lower surface of the cleaning jig 73 so as to cover at least the bonding surface Wj of the substrate W to be processed. In the present embodiment, the supply surface 731 is formed to have substantially the same size as the bonding surface Wj of the substrate W to be processed.

  In the central part of the cleaning jig 73, a solvent supply part 74 for supplying a solvent of the adhesive G, for example, thinner, between the supply surface 731 and the joint surface Wj, a rinse liquid supply part 75 for supplying a solvent rinse liquid, An inert gas supply unit 76 that supplies an inert gas such as nitrogen gas is provided. The solvent supply unit 74, the rinse liquid supply unit 75, and the inert gas supply unit 76 merge inside the cleaning jig 73 and communicate with a supply port 732 formed on the supply surface 731 of the cleaning jig 73. That is, the flow path of the solvent from the solvent supply section 74 to the supply port 732, the flow path of the rinse liquid from the rinse liquid supply section 75 to the supply port 732, and the inert gas flow from the inert gas supply section 76 to the supply port 732 Each flow path penetrates in the thickness direction of the cleaning jig 73. In addition, various liquids are used for the rinse liquid according to the component of the main solvent of the adhesive G. For example, pure water or IPA (isopropyl alcohol) is used. Further, in order to promote drying of the rinse liquid, it is preferable to use a highly volatile liquid as the rinse liquid.

  A supply pipe 742 that communicates with a solvent supply source 741 that stores the solvent therein is connected to the solvent supply unit 74. The supply pipe 742 is provided with a supply device group 743 including a valve for controlling the flow of the solvent, a flow rate adjusting unit, and the like. A supply pipe 752 that communicates with a rinse liquid supply source 751 that stores a rinse liquid therein is connected to the rinse liquid supply unit 75. The supply pipe 752 is provided with a supply device group 753 including a valve for controlling the flow of the rinse liquid, a flow rate adjusting unit, and the like. A supply pipe 762 communicating with an inert gas supply source 761 that stores an inert gas therein is connected to the inert gas supply unit 76. The supply pipe 762 is provided with a supply device group 763 including a valve for controlling the flow of the solvent, a flow rate adjusting unit, and the like.

  A suction part 77 for sucking a solvent or a rinsing liquid in a gap between the supply surface 731 and the joint surface Wj is provided on the outer peripheral portion of the cleaning jig 73. The suction part 77 is provided so as to penetrate in the thickness direction of the cleaning jig 73. A plurality of, for example, eight suction portions 77 are arranged at equal intervals on the same circumference as the cleaning jig 73 (see FIG. 11C). Each suction part 77 is connected to an intake pipe 772 communicating with a negative pressure generator 771 such as a vacuum pump.

  As shown in FIG. 11A, a moving mechanism 78 that moves the cleaning jig 73 in the vertical direction and the horizontal direction is provided on the ceiling surface of the processing container 71 and above the cleaning jig 73. The moving mechanism 78 includes a support member 781 that supports the cleaning jig 73 and a jig driving unit 782 that supports the support member 781 and moves the cleaning jig 73 in the vertical direction and the horizontal direction. .

  The first transfer device 30 places the held substrate W on the spin chuck 721 of the first cleaning device 70. Accordingly, the substrate to be processed W after being peeled is placed on the spin chuck 721 with the bonding surface Wj positioned on the upper surface.

  The first cleaning device 70 performs a cleaning process (first cleaning process) on the substrate W to be processed placed on the substrate holding unit 72 based on the control of the control device 60.

  First, the first cleaning device 70 uses the spin chuck 721 to suck and hold the substrate W to be processed and the dicing frame F via the dicing tape P. Subsequently, the first cleaning device 70 adjusts the position of the cleaning jig 73 in the horizontal direction by the moving mechanism 78 and then lowers the cleaning jig 73 to a predetermined position. At this time, the distance between the supply surface 731 of the cleaning jig 73 and the bonding surface Wj of the substrate W to be processed is such that the solvent of the adhesive G is caused by surface tension between the supply surface 731 and the bonding surface Wj as described later. The distance that can be diffused is set.

  Thereafter, the first cleaning device 70 supplies the solvent from the solvent supply source 741 to the solvent supply unit 74 while rotating the substrate W to be processed by the spin chuck 721. Such a solvent is supplied from the supply port 732 to the space between the supply surface 731 and the bonding surface Wj, and the surface tension of the solvent and the centrifugal force generated by the rotation of the substrate W to be processed in this space on the bonding surface Wj of the substrate W to be processed. To diffuse. At this time, the first cleaning device 70 prevents the solvent from flowing onto the dicing tape P by appropriately sucking the solvent by the suction unit 77. Thereby, it can prevent that the intensity | strength of the dicing tape P weakens with a solvent. In this way, the solvent is supplied to the entire bonding surface Wj of the substrate to be processed W.

  Thereafter, the first cleaning device 70 maintains a state where the bonding surface Wj of the substrate W to be processed is immersed in a solvent for a predetermined time, for example, several minutes. Then, impurities such as the adhesive G remaining on the joint surface Wj are removed by the solvent.

  Thereafter, the first cleaning device 70 raises the cleaning jig 73 to a predetermined position while continuing the rotation of the substrate W to be processed by the spin chuck 721 and the suction of the solvent by the suction unit 77. Subsequently, the first cleaning device 70 supplies the rinse liquid from the rinse liquid supply source 751 to the rinse liquid supply unit 75. The rinse liquid diffuses on the bonding surface Wj of the substrate W to be processed by surface tension and centrifugal force while being mixed with the solvent. Thereby, the mixed liquid of the solvent and the rinsing liquid is supplied to the entire bonding surface Wj of the substrate W to be processed.

  Thereafter, the cleaning jig 73 is lowered to a predetermined position while the rotation of the substrate W to be processed by the spin chuck 721 and the suction by the suction unit 77 are continuously performed. Then, the inert gas is supplied from the inert gas supply source 761 through the inert gas supply unit 76 and the supply port 732. The inert gas pushes the mixed liquid of the solvent and the rinsing liquid out of the substrate W to be processed. As a result, the mixed liquid of the solvent and the rinsing liquid is sucked from the suction portion 77 and the mixed liquid is removed from the bonding surface Wj of the substrate W to be processed.

  Thereafter, the first cleaning device 70 dries the substrate W to be processed by continuously rotating the substrate W to be processed by the spin chuck 721 and supplying the inert gas. Thereby, the cleaning process (first cleaning process) of the substrate W to be processed is completed. The substrate to be processed W after cleaning is unloaded from the first cleaning device 70 by the first transfer device 30 and transferred to the cassette Cw of the loading / unloading station 11.

<2-3. Configuration of third transfer device>
Next, the structure of the 3rd conveying apparatus 50 installed in the delivery station 21 is demonstrated with reference to FIG. FIG. 12 is a schematic side view showing the configuration of the third transport device 50.

  As shown in FIG. 12, the third transport device 50 includes a Bernoulli chuck 51 that holds the substrate W to be processed. The Bernoulli chuck 51 ejects gas from the ejection port provided on the suction surface toward the plate surface of the substrate W to be processed, and the gas flow velocity changes according to the distance between the suction surface and the plate surface of the substrate W to be processed. The substrate W to be processed is held in a non-contact state by utilizing a change in the negative pressure accompanying this.

  The third transfer device 50 includes a first arm 52, a second arm 53, and a base 54. The first arm 52 extends in the horizontal direction and supports the Bernoulli chuck 51 at the tip. The second arm 53 extends in the vertical direction and supports the proximal end portion of the first arm 52 at the distal end portion. A driving mechanism for rotating the first arm 52 around the horizontal axis is provided at the tip of the second arm 53. By using the driving mechanism to rotate the first arm 52 around the horizontal axis, The Bernoulli chuck 51 can be reversed.

  The base end portion of the second arm 53 is supported by the base portion 54. The base 54 is provided with a drive mechanism that rotates and raises and lowers the second arm 53. By rotating or raising / lowering the second arm 53 using such a drive mechanism, the Bernoulli chuck 51 can be turned or raised / lowered around the vertical axis.

  The third transfer device 50 is configured as described above, and performs a delivery process of receiving the peeled support substrate S from the peeling device 5 and passing it to the second cleaning device 80 based on the control of the control device 60.

  Specifically, the third transport device 50 uses the Bernoulli chuck 51 to hold the support substrate S held from above by the first holding unit 110 of the peeling device 5 from below. Accordingly, the support substrate S is held by the Bernoulli chuck 51 with the non-joint surface Sn facing upward. Subsequently, the third transport device 50 rotates the Bernoulli chuck 51 by rotating the second arm 53 around the vertical axis. As a result, the support substrate S held by the Bernoulli chuck 51 moves from the peeling station 15 to the second cleaning station 22 via the delivery station 21.

  Subsequently, the third transport device 50 reverses the Bernoulli chuck 51 by rotating the first arm 52 around the horizontal axis. Thereby, the support substrate S is in a state in which the non-joint surface Sn faces downward. The third transport device 50 lowers the Bernoulli chuck 51 by lowering the second arm 53 and places the support substrate S held by the Bernoulli chuck 51 on the second cleaning device. As a result, the support substrate S is placed on the second cleaning device with the bonding surface Sj facing upward, and the bonding surface Sj is cleaned by the second cleaning device.

<2-4. Configuration of second cleaning device>
Next, the configuration of the second cleaning device installed in the second cleaning station 22 will be described with reference to FIGS. 13A and 13B. FIG. 13A is a schematic side view showing the configuration of the second cleaning device, and FIG. 13B is a schematic plan view showing the configuration of the second cleaning device.

  As shown in FIG. 13A, the second cleaning device 80 has a processing container 81. A loading / unloading port (not shown) for the support substrate S is formed on the side surface of the processing container 81, and an opening / closing shutter (not shown) is provided at the loading / unloading port.

  A spin chuck 82 that holds and rotates the support substrate S is disposed in the center of the processing container 81. The spin chuck 82 has a horizontal upper surface, and a suction port (not shown) for sucking the support substrate S is provided on the upper surface. The support substrate S is sucked and held on the spin chuck 82 by suction from the suction port.

  Below the spin chuck 82, for example, a chuck driving unit 83 including a motor is disposed. The chuck driving unit 83 rotates the spin chuck 82 at a predetermined speed. Further, the chuck driving unit 83 is provided with an elevating drive source such as a cylinder, and the spin chuck 82 can be moved up and down.

  Around the spin chuck 82, a cup 84 that receives and collects liquid that scatters or falls from the support substrate S is disposed. Connected to the lower surface of the cup 84 are a discharge pipe 841 for discharging the collected liquid and an exhaust pipe 842 for evacuating and exhausting the atmosphere in the cup 84.

  As shown in FIG. 13B, the processing container 81 is provided with a rail 85, and a base end portion of an arm 86 is attached to the rail 85. Further, a cleaning liquid nozzle 87 for supplying a cleaning liquid, for example, an organic solvent, to the support substrate S is supported at the tip of the arm 86.

  The arm 86 is movable on the rail 85 by a nozzle driving unit 861. As a result, the cleaning liquid nozzle 87 can move from the standby portion 88 installed on the side of the cup 84 to above the center portion of the support substrate S in the cup 84, and the diameter of the support substrate S on the support substrate S. Can move in the direction. Further, the arm 86 can be moved up and down by a nozzle drive unit 861, and thereby the height of the cleaning liquid nozzle 87 can be adjusted.

  As shown in FIG. 13A, a supply pipe 891 that supplies the cleaning liquid to the cleaning liquid nozzle 87 is connected to the cleaning liquid nozzle 87. The supply pipe 891 communicates with a cleaning liquid supply source 892 that stores the cleaning liquid therein. The supply pipe 891 is provided with a supply device group 893 including a valve for controlling the flow of the cleaning liquid, a flow rate adjusting unit, and the like.

  The second cleaning device 80 is configured as described above, and performs the cleaning process (second cleaning process) of the support substrate S transferred by the third transfer apparatus 50 based on the control of the control apparatus 60.

  Specifically, the separated support substrate S is placed on the spin chuck 82 of the second cleaning device 80 with the bonding surface Sj facing upward by the third transport device 50. The second cleaning device 80 sucks and holds the support substrate S using the spin chuck 82, and then lowers the spin chuck 82 to a predetermined position. Subsequently, the arm 86 moves the cleaning liquid nozzle 87 of the standby unit 88 to above the center of the support substrate S. Thereafter, the cleaning liquid is supplied from the cleaning liquid nozzle 87 to the bonding surface Sj of the support substrate S while the support substrate S is rotated by the spin chuck 82. The supplied cleaning liquid is diffused over the entire bonding surface Sj of the support substrate S by centrifugal force, and the bonding surface Sj is cleaned.

  The cleaned support substrate S is unloaded from the second cleaning device 80 by the second transfer device 40 and is stored in the cassette Cs of the unloading station 24.

  A lift pin (not shown) for supporting and lifting the support substrate S from below may be provided below the spin chuck 82. In such a case, the elevating pins can pass through a through hole (not shown) formed in the spin chuck 82 and protrude from the upper surface of the spin chuck 82. Then, instead of raising and lowering the spin chuck 82, the raising and lowering pins are raised and lowered, and the support substrate S is transferred to and from the spin chuck 82.

  Further, in the second cleaning device 80, a back rinse nozzle (not shown) for injecting the cleaning liquid toward the back surface of the support substrate S, that is, the non-bonding surface Sn (see FIG. 2) is provided below the spin chuck 82. It may be done. The non-joint surface Sn of the support substrate S and the outer peripheral portion of the support substrate S are cleaned by the cleaning liquid sprayed from the back rinse nozzle.

  As described above, the peeling system 1 according to the first embodiment includes the first processing block 10 that performs processing on the DF-attached polymer substrate T or the target substrate W after peeling, and the processing on the support substrate S after peeling. And a second processing block 20 for performing

  The first processing block 10 includes a carry-in / out station 11, a first transfer device 30, a peeling station 15, and a first cleaning station 16. On the carry-in / out station 11, the DF-attached superposed substrate T held on the dicing frame F or the substrate W after being peeled is placed. The first transport device 30 transports the substrate to be processed W after separation or the superposed substrate T with DF placed on the carry-in / out station 11. The peeling station 15 is provided with a peeling device 5 for peeling the DF-attached superposed substrate T transported by the first transport device 30 into the target substrate W and the support substrate S. The first cleaning station 16 is provided with a first cleaning device 70 for cleaning the substrate to be processed W that has been peeled off and transferred by the first transfer device 30 while being held by the dicing frame F.

  The second processing block 20 includes a second cleaning station 22, a delivery station 21, a second transfer device 40, and a carry-out station 24. The second cleaning station 22 is provided with a second cleaning device 80 for cleaning the support substrate S after peeling. The delivery station 21 is disposed between the second cleaning station 22 and the peeling station 15, receives the peeled support substrate S from the peeling station 15, and passes it to the second cleaning station 22. The second transport device 40 transports the support substrate S cleaned by the second cleaning device 80. On the carry-out station 24, the support substrate S transported by the second transport device 40 is placed.

  In the peeling system 1, the first processing block 10 and the second processing block 20 are connected by a delivery station 21. Therefore, according to the peeling system 1 according to the first embodiment, it is possible to improve the throughput of a series of substrate processes including a peeling process and a cleaning process.

  In addition, the peeling device 5 according to the first embodiment includes a first holding unit 110, a second holding unit 150, and a moving mechanism 140. The 1st holding | maintenance part 110 hold | maintains the support substrate S among the superposition | polymerization board | substrates T with DF from upper direction. The 2nd holding | maintenance part 150 hold | maintains the to-be-processed substrate W from the downward direction through the dicing tape P among the superposition | polymerization board | substrates T with DF. The moving mechanism 140 moves the first holding unit 110 in a direction away from the second holding unit 150. Therefore, according to the peeling apparatus 5, since it is not necessary to invert the to-be-processed substrate W after peeling, the efficiency of the peeling process can be improved.

  Moreover, the peeling apparatus 5 according to the first embodiment includes a first holding unit 110, a second holding unit 150, and a local moving unit 130. The 1st holding | maintenance part 110 hold | maintains the support substrate S among the superposition | polymerization board | substrates T with DF with which the support substrate S and the to-be-processed substrate W were joined. The 2nd holding | maintenance part 150 hold | maintains the to-be-processed substrate W among the superposition | polymerization board | substrates T with DF. The local moving unit 130 moves a part of the outer periphery of the first holding unit 110 in a direction away from the second holding unit 150. The first holding part 110 is formed of a flexible member. Therefore, according to the peeling apparatus 5, the support substrate S and the substrate W to be processed can be efficiently peeled off.

(Second Embodiment)
In the above-described peeling apparatus, in order to further promote peeling of the DF-attached polymer substrate T, for example, a sharp member such as a blade may be used to cut a side surface of the DF-attached polymer substrate T. Below, the example in the case of notching the side surface of the superposition | polymerization board | substrate T with DF using a sharp member is demonstrated.

  FIG. 14 is a schematic side view showing the configuration of the peeling apparatus according to the second embodiment. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  As shown in FIG. 14, in addition to the configuration of the peeling device 5 according to the first embodiment, the peeling device 5A according to the second embodiment includes a measuring unit 210, a cutting unit 220, a position adjusting unit 230, and the like. Is further provided. The measurement part 210 and the position adjustment part 230 are provided in the upper base part 120, for example, and the notch part 220 is supported by the position adjustment part 230 in the side of the superposition | polymerization board | substrate T with DF.

  The measurement unit 210 is, for example, a laser displacement meter, and is a distance from a predetermined measurement reference position to the holding surface of the second holding unit 150 or an object interposed between the measurement reference position and the holding surface of the second holding unit 150. Measure the distance. The measurement result by the measurement unit 210 is transmitted to the control device 60 (see FIG. 1).

  The cut portion 220 makes a cut with respect to the joint portion between the substrate to be processed W and the support substrate S, that is, the adhesive G portion. Here, the structure of the notch part 220 is demonstrated with reference to FIG. FIG. 15 is a schematic perspective view showing the configuration of the cut portion 220.

  As shown in FIG. 15, the cut portion 220 includes a main body portion 221, a sharp member 222, and a gas ejection portion 223.

  The main body 221 is formed in a bow shape in accordance with the side surface of a substrate such as the superposed substrate T. A sharp member 222 is attached to the right side 221R of the main body part 221 via a fixing part 224, and a gas ejection part 223 is attached to the center part 221C.

  The sharp member 222 is, for example, a blade, and is supported by the position adjusting unit 230 so that the tip protrudes toward the DF-attached superposition substrate T. By causing the sharp member 222 to enter the adhesive G, which is a bonding portion between the substrate to be processed W and the support substrate S, and cutting the adhesive G, a starting point of peeling of the DF-attached polymer substrate T can be generated. it can.

  In the second embodiment, the sharp member 222 is a single-edged blade, and an inclined surface forming a blade edge angle is provided on the upper surface side, that is, the support substrate S side. In this way, when the sharp member 222 enters the adhesive G by directing the inclined surface of the sharp member 222 toward the support substrate S, in other words, directing the flat surface of the sharp member 222 toward the substrate W to be processed. In addition, damage to the substrate to be processed W that is a product substrate can be suppressed.

  As the blade, for example, a razor blade, a roller blade, an ultrasonic cutter, or the like can be used. Further, by using a ceramic resin-based blade or a fluorine-coated blade, it is possible to suppress the generation of particles when the DF-polymerized substrate T is cut. The fixing portion 224 is detachable with respect to the right side portion 221R, and the cutting portion 220 can easily replace the sharp member 222 by replacing the fixing portion 224.

  In addition, although the example at the time of attaching the sharp member 222 only to the right side part 221R of the main-body part 221 was shown here, the notch part 220 is equipped with the sharp member 222 also in the left side part 221L of the main-body part 221. Also good. The notch 220 may include different types of sharp members 222 at the right side 221R and the left side 221L.

  The gas ejection portion 223 ejects a gas such as air or an inert gas toward the cut portion of the joint portion where the sharp member 222 has been cut. That is, the gas ejection part 223 further promotes peeling of the DF-attached polymer substrate T by injecting gas into the inside of the DF-attached polymer substrate T from the cut portion by the sharp member 222.

  Returning to FIG. 14, the position adjustment unit 230 will be described. The position adjustment unit 230 includes a drive device 231 and a load cell 232. The drive device 231 moves the cut portion 220 along the vertical direction or the horizontal direction. The position adjustment unit 230 adjusts the cut position of the cut portion 220 into the adhesive G by moving the cut portion 220 in the vertical direction using the driving device 231. In addition, the position adjustment unit 230 moves the cutting portion 220 in the horizontal direction using the driving device 231, thereby causing the tip of the sharp member 222 to enter the adhesive G. Further, the load cell 232 detects a load applied to the cutting unit 220.

  The entry of the sharp member 222 into the adhesive G is controlled using the driving device 231 and the load cell 232, which will be described later.

  Further, the control device 60 (see FIG. 1) according to the second embodiment stores information (hereinafter referred to as “pre-thickness information”) on the thickness of the DF-attached superposition substrate T acquired in advance by an external device in a storage unit (not shown). Remember). Such prior thickness information includes the thickness of the polymer substrate T with DF, the thickness of the substrate W to be processed, the thickness of the support substrate S, the thickness of the adhesive G, and the thickness of the dicing tape P.

  Based on the measurement result acquired from the measurement unit 210 and the advance thickness information stored in the storage unit, the control device 60 determines the cut position of the cut unit 220 so as to be within the thickness range of the adhesive G. And the control apparatus 60 controls the position adjustment part 230 so that the front-end | tip of the sharp member 222 may be located in the determined cutting position, and moves the cutting part 220. FIG. Specific contents of the position adjustment process will be described later.

  As illustrated in FIG. 14, the frame holding unit 160 holds the dicing frame F at a position lower than the second holding unit 150. Thereby, the space for the notch part 220 to move toward the superposition | polymerization board | substrate T with DF hold | maintained at the 2nd holding | maintenance part 150 is securable.

  Next, the position adjustment process of the notch part 220 which the peeling apparatus 5A which concerns on 2nd Embodiment performs is demonstrated with reference to FIG. 16, FIG. 17A, and 17B. FIG. 16 is a flowchart illustrating a processing procedure of the position adjustment processing of the cutting unit 220. Moreover, FIG. 17A and FIG. 17B are operation explanatory views of the peeling device 5A. Note that the peeling device 5 </ b> A executes each processing procedure illustrated in FIG. 16 based on the control of the control device 60.

  As shown in FIG. 16, the peeling device 5A first performs a cutting portion diagnosis process (step S301). In the cut portion diagnosis process, the measurement unit 210 is used to diagnose the presence or absence of damage (for example, blade spillage) on the sharp member 222.

  Specifically, as illustrated in FIG. 17A, the peeling device 5A uses the measuring unit 210 to move the notch 220 in the horizontal direction using the position adjusting unit 230 and the distance to the upper surface of the sharp member 222. D1 is measured, and the measurement result is transmitted to the control device 60. Then, for example, when the rate of change of the distance D1 exceeds a predetermined range, or when the error between the reference distance measured in advance using the new sharp member 222 and the distance D1 falls within the predetermined range. When exceeding, it determines with the sharp member 222 being damaged.

  When it is determined that the sharp member 222 is damaged in the cut portion diagnosis processing in step S301 (step S302, Yes), the peeling device 5A stops the subsequent processing (step S303). As described above, the peeling device 5 </ b> A detects damage to the sharp member 222 based on a change in the distance D <b> 1 from the measurement reference position to the cut portion 220 when the cut portion 220 is moved horizontally. Accordingly, it is possible to prevent the target substrate W from being damaged by cutting into the DF-attached superposition substrate T using the damaged sharp member 222.

  On the other hand, when damage to the sharp member 222 is not detected in the cut portion diagnosis process in step S301 (step S302, No), the peeling device 5A uses the measuring unit 210 to reach the holding surface of the second holding unit 150. The distance D2 (see FIG. 17B) is measured (step S304). At this time, the DF-attached polymer substrate T is not yet carried into the peeling device 5A.

  Note that the thickness D4 of the DF-attached polymer substrate T, the thickness D4w of the substrate to be processed W, the thickness D4g of the adhesive G, the thickness D4s of the support substrate S, and the thickness D4p of the dicing tape P shown in FIG. This is information stored in the storage unit of the device 60.

  Next, the peeling device 5A sucks and holds the dicing frame F of the DF-attached superposed substrate T carried into the peeling station 15 by the first transport device 30 from below using the frame holding unit 160 (step S305). Further, the peeling device 5A lowers the frame holding unit 160 using the moving mechanism 163 (see FIG. 6) (step S306). Thereby, the to-be-processed substrate W among the superposition | polymerization board | substrates T with DF contact | abuts to the 2nd holding | maintenance part 150 via the dicing tape P. FIG. Thereafter, the peeling device 5A uses the second holding unit 150 to suck and hold the DF-attached superposed substrate T via the dicing tape P (step S307). As a result, the substrate to be processed W is held by the second holding unit 150 and the dicing frame F is held by the frame holding unit 160 in the DF-superposed substrate T.

  Thereafter, the peeling device 5A measures the distance D3 (see FIG. 17B) to the upper surface of the DF-attached superposition substrate T held by the second holding unit 150, that is, the non-joint surface Sn of the support substrate S (step S308). ). The measurement result is transmitted to the control device 60. The control device 60 has a predetermined difference between the thickness (D2-D3) of the DF-attached superposition substrate T calculated from the measurement result of the measurement unit 210 and the thickness (D4) of the DF-attachment superposition substrate T included in the prior thickness information. It is determined whether it is within the range.

  Here, when the error between the thickness (D2-D3) of the DF-attached superposition substrate T calculated from the measurement result of the measurement unit 210 and the prior thickness information (D4) exceeds a predetermined range, for example, it is originally carried in. There is a possibility that the DF-attached superposition substrate T different from the power-DF superposition substrate T has been erroneously carried in. In such a case, the thickness range of the adhesive G calculated based on the prior thickness information deviates from the actual thickness range, and the tip of the sharp member 222 comes into contact with the substrate to be processed W or the support substrate S to be processed. W or the support substrate S may be damaged. For this reason, when the error of the thickness of the DF-attached superposition substrate T calculated using the measurement result of the measurement unit 210 and the thickness of the DF-attachment superposition substrate T included in the previous thickness information exceeds a predetermined range ( In step S309, No), the peeling device 5A stops the subsequent processing (step S303).

  On the other hand, when the error from the prior thickness information is within the predetermined range (step S309, Yes), the control device 60 sets the thickness range of the adhesive G, which is a bonding portion between the substrate to be processed W and the support substrate S, to the prior thickness. Calculate based on information.

  For example, as shown in FIG. 17B, when the distance from the measurement reference position of the measurement unit 210 to the holding surface of the first holding unit 110, that is, the lower surface of the suction pad 112 is D5, the first holding unit 110 performs polymerization with DF. The thickness range of the adhesive G when the substrate T is held by suction is D5 + D4w to D5 + D4w + D4g. And the control apparatus 60 determines the cutting position of the cutting part 220 in this thickness range. For example, the control device 60 determines D5 + D4w + D4g / 2, which is the center of the thickness range, as the cutting position. It is assumed that the distance D5 from the measurement reference position to the lower surface of the main body 111 is stored in advance in a storage unit (not shown).

  When the cut position of the cut portion 220 is determined by the control device 60, the peeling device 5 </ b> A moves the cut portion 220 using the position adjusting portion 230 based on the control of the control device 60, thereby causing the adhesive G to move. The cut position of the cut portion 220 is adjusted within the thickness range (step S310). That is, 5 A of peeling apparatuses move the notch part 220 to a perpendicular direction using the position adjustment part 230 so that the front-end | tip of the sharp member 222 may be located in the incision position determined by the control apparatus 60. FIG.

  Thereafter, the peeling device 5A performs the processing after step S204 in FIG. And when peeling apparatus 5A pulls a part of outer peripheral part of the 1st holding | maintenance part 110 using the local movement part 130 in step S206, it moves the cutting part 220 horizontally using the position adjustment part 230. The sharp member 222 is caused to enter the adhesive G. As a result, the adhesive G, which is a bonded portion between the substrate to be processed W and the support substrate S, is cut, and the peeling of the DF-attached superposed substrate T by the local moving unit 130 is promoted.

  In addition, the approach distance to the adhesive G of the sharp member 222 is about 2 mm, for example. The timing at which the sharp member 222 enters the adhesive G may be between step S205 and step S206, between step S206 and step S207, or at the same time as step S206.

  Further, as described above, the entry of the sharp member 222 into the adhesive G is controlled using the driving device 231 and the load cell 232. Specifically, the sharp member 222 enters the adhesive G at a predetermined speed by the driving device 231. Further, the cutting start position (the position where the tip of the sharp member 222 contacts the adhesive G) is detected by the load cell 232, and the sharp member 222 is entered by using the driving device 231 by an amount programmed in advance from the cutting start position. Let

  As described above, the peeling device 5A according to the second embodiment can generate the starting point of the peeling of the DF-attached polymer substrate T by performing the cutting into the adhesive G by the cutting portion 220.

  Further, since the peeling device 5A according to the second embodiment adjusts the position of the cut portion 220 based on the measurement result of the measurement unit 210 and the prior thickness information, the tip of the sharp member 222 is attached to the adhesive G. Can be entered more reliably.

  That is, since the to-be-processed substrate W, the support substrate S, and the adhesive G are very thin, it is difficult to align the cut portion 220 with the naked eye. On the other hand, if the measurement part 210 is used, the position of the adhesive G can be detected easily and accurately and the cut position of the cut part 220 can be adjusted. In addition, it is conceivable to confirm the cutting position by image recognition using a camera or the like. However, since the side surface portion of the substrate such as the superposed substrate T is a curved surface, it is difficult to focus, there is reflection from the substrate, and the adhesive G is also transparent. Therefore, it is difficult to confirm the position of the adhesive G by image recognition. On the other hand, if the measuring unit 210 is used, the position of the adhesive G can be easily confirmed without causing the above problems.

  Further, the notch 220 uses a distance D2 from the measurement reference position to the holding surface of the second holding unit 150 and a distance D3 from the measurement reference position to the overlapped substrate T with DF held by the first holding unit 110. When the difference between the calculated thickness of the DF-attached superposition substrate T and the previously obtained thickness of the DF-attachment superposition substrate T is within a predetermined range, the cutting into the adhesive G is performed. Thereby, damage to the to-be-processed substrate W and the support substrate S by the sharp member 222 can be prevented beforehand.

  Here, an example in which the sharp member 222 is a single-edged blade has been described, but the sharp member may be a double-edged blade. Further, it is not always necessary to use a blade, and may be a tubular needle body such as a hypodermic needle, a wire, or the like.

  By the way, 5 A of peeling apparatuses which concern on 2nd Embodiment can also detect the inclination of the 2nd holding | maintenance part 150 using the measurement part 210. FIG. Specifically, the peeling device 5A measures the distance D2 (see FIG. 17B) from the measurement reference position to the holding surface of the second holding unit 150 while rotating the second holding unit 150 by the rotation mechanism 180. Then, the peeling device 5A determines that the holding surface of the second holding unit 150 is inclined when the change amount of the distance D2 is equal to or greater than a predetermined value, for example, 20 μm or more, and performs subsequent processing. Discontinue.

  As described above, the peeling device 5 </ b> A has the holding surface of the second holding unit 150 based on the change in the distance D <b> 2 from the measurement reference position to the holding surface of the second holding unit 150 when the second holding unit 150 is rotated. It is also possible to detect the inclination of.

  When the holding surface of the second holding unit 150 is inclined, an error occurs between the thickness range of the adhesive G calculated using the prior thickness information and the actual thickness range of the adhesive G, and the sharp member 222 is bonded. There is a possibility that the agent G cannot be appropriately entered. Therefore, when the holding surface of the second holding unit 150 is inclined, the subsequent processing is stopped, thereby preventing the target substrate W and the support substrate S from being damaged by the sharp member 222. In addition, the process which detects the inclination of the 2nd holding | maintenance part 150 should just be performed before the superposition | polymerization board | substrate T with DF is carried in to 5 A of peeling apparatuses.

(Third embodiment)
By the way, the peeling apparatus mentioned above is an example in case the 1st holding | maintenance part is provided with the suction pad 112 (refer FIG. 7B) by which the adsorption | suction area | region was divided | segmented by the some line extended from the center to radial direction, and the some circular arc. Explained. However, the configuration of the suction pad included in the first holding unit is not limited to this. Therefore, hereinafter, another configuration example of the suction pad included in the first holding unit will be described with reference to FIGS. 18A to 18C are schematic plan views showing other configuration examples of the suction pad.

  As illustrated in FIG. 18A, the suction region of the suction pad 112 </ b> A may be divided by a line orthogonal to the peeling progress direction d. In the example shown in FIG. 18A, the suction area of the suction pad 112A is divided into individual areas R5 to R7 by two straight lines L3 and L4 orthogonal to the peeling progress direction d.

  As described above, the suction region of the suction pad may be divided by a line orthogonal to the direction of peeling. In addition, the suction pad having such a configuration is suitable when peeling from one direction.

  In addition, as with the suction pad 112 shown in FIG. 7B, intake ports 114a to 114c are formed in the individual regions R5 to R7 of the suction pad 112A, and the intake ports 114a to 114c are connected to the intake device via the intake pipe. Connected to. Thereby, like the suction pad 112 shown in FIG. 7B, the support substrate S can be appropriately held.

  Similarly to the suction pad 112 shown in FIG. 7B, each of the individual regions R5 to R7 has an individual region R7 provided on the distal end side in the traveling direction d rather than the individual region R5 provided on the proximal end side in the peeling traveling direction d. Largely formed. Thereby, like the suction pad 112 shown in FIG. 7B, it is possible to prevent the support substrate S from being peeled off from the first holding unit 110 during the peeling operation.

  Here, an example in which the suction area of the suction pad 112A is divided into three individual areas R5 to R7 is shown, but the number of divisions of the suction area is not limited to three.

  Further, as shown in FIG. 18B, the suction area of the suction pad 112B may be divided into a lattice shape. FIG. 18B shows an example in which the suction area of the suction pad 112B is divided into nine individual areas R8 to R15. As with the suction pad 112 shown in FIG. 7B, intake ports 115a to 115i are formed in the individual regions R8 to R15, respectively, and the intake ports 115a to 115i are connected to an intake device via an intake pipe.

  Thus, the suction area of the suction pad may be divided into a lattice shape. Here, an example in which the straight line that divides the suction region of the suction pad 112B is oblique to the peeling progress direction d is shown, but the suction pad is parallel to the peeling progress direction d. You may divide | segment into a grid | lattice form by a straight line and the straight line orthogonal to the advancing direction d of peeling.

  Moreover, although each embodiment mentioned above demonstrated the example in case the advancing direction of peeling is one direction, you may peel from a several direction by providing multiple local moving parts 130. FIG.

  In such a case, as shown in FIG. 18C, the suction area of the suction pad is divided into the peeling progress directions d1 to d3 by a plurality of lines extending in the radial direction from the center, and further, each of the divided areas is divided for each travel direction. The suction area may be further divided into a plurality of individual areas by an arc. For example, the suction area of the suction pad 112C shown in FIG. 18C is divided into three for each of the peeling traveling directions d1 to d3, and the suction area corresponding to each of the traveling directions is further divided into three divided areas by an arc. Yes.

  Specifically, the suction region corresponding to the traveling direction d1 is divided into individual regions R17 to R19, and the suction region corresponding to the traveling direction d2 is divided into individual regions R20 to R22, and the suction region corresponding to the traveling direction d3. The region is divided into individual regions R23 to R25. In each of the individual regions R17 to R25, intake ports 116a to 116c, 117a to 117c, 118a to 118c are respectively formed. Connected to. The intake ports 116a to 116c, 117a to 117c, and 118a to 118c may be connected to a single intake device, or may be connected to the intake devices provided for each of the separation traveling directions d1 to d3. Good.

  By the way, the polymerization substrate T has an optimal cutting direction depending on the crystal direction, the warp direction, the pattern, and the like. Therefore, in the second embodiment, the circumferential position of the sharp member 222 may be changed according to the type of the superposed substrate T. In such a case, for example, after the dicing frame F is held by the frame holding unit 160 (see FIG. 14), the cutting position in the circumferential direction of the sharp member 222 is adjusted by rotating the rotation mechanism 180 to a predetermined position, and then The sharp member 222 may be entered. As a result, the sharp member 222 can be set at an arbitrary position in the circumferential direction, so that any type of the superposed substrate T can be cut at an optimum position according to the superposed substrate T. In addition, after peeling of the superposition | polymerization board | substrate T, the rotation mechanism 180 is rotated again and it returns to the original rotation position.

  Further, when peeling is impossible at the first rotation position, it is possible to try peeling by rotating the rotation mechanism 180 to the second rotation position. Whether or not separation is possible is determined by, for example, overloading of the motor when the first holding unit 110 and the second holding unit 150 are unsucked or when a motor is used as the driving unit of the rotation mechanism 180. can do. By providing such a retry function, even if a partial alteration of the adhesive G or an unpeelable state due to the first holding part 110 or the second holding part 150 occurs, the peeling process is completed without interruption. Can be made.

  In the above-described embodiment, an example in which the substrate to be processed W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and different adhesive strengths are obtained for each region. The adhesive may be applied.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Peeling system 5 Peeling apparatus 10 1st process block 11 Carry-in / out station 12 1st conveyance area 13 Standby station 14 Edge cut station 15 Peeling station 16 1st washing station 20 2nd process block 21 Delivery station 22 2nd washing station 23 1st 2 transport area 24 unloading station 30 first transport device 40 second transport device 50 third transport device 60 control device 110 first holding unit 111 main body unit 112 suction pad 130 local moving unit 140 moving mechanism 150 second holding unit 160 frame holding Unit 210 measuring unit 220 cutting unit 230 position adjusting unit F dicing frame P dicing tape S support substrate T superposed substrate W substrate to be processed

Claims (6)

A peeling apparatus that peels a superposed substrate having a first substrate and a second substrate bonded to the first substrate and the second substrate,
The superposed substrate is disposed in the opening of the frame having an opening having a larger diameter than the superposed substrate, and the non-joint surface of the first substrate is attached to the tape provided in the open portion. Held in the frame by being
A first holding portion that is formed of a flexible member and holds the second substrate from above among the superposed substrates;
A second holding unit for holding the first substrate of the superposed substrates from below via the tape;
A moving mechanism for moving the first holding part in a direction away from the second holding part;
A frame holding part that is disposed outside the second holding part and holds the frame from below;
The frame holding unit is controlled to hold the frame, the second holding unit is controlled to hold the first substrate, and the moving mechanism is controlled to hold the second substrate. A control unit that moves the first holding unit in a direction away from the second holding unit that holds the first substrate ;
The first holding part is
A thin elastic member;
A resin member affixed to the surface of the elastic member and in contact with the second substrate;
With
A peeling apparatus characterized in that the second substrate is sucked and held by suction from an air inlet formed in the resin member . The frame holding part is
A suction part that is disposed outside the second holding part and holds the frame from below; and a second movement mechanism that moves the suction part along a vertical direction;
The controller is
The second moving mechanism is controlled so as to lower the suction portion holding the frame to a position where at least the first substrate contacts the second holding portion, and then the first substrate holding the second substrate. The peeling apparatus according to claim 1, wherein the moving mechanism is controlled so as to move the holding unit in a direction away from the second holding unit holding the first substrate.   The peeling apparatus according to claim 1, further comprising a local moving unit that moves a part of the outer peripheral portion of the first holding unit in a direction away from the second holding unit. Peeling device according to any one of claims 1 to 3, characterized by further comprising a rotation mechanism for relatively rotating the second holding portion and the first holding portion. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transported by the substrate transporting device into the first substrate and the second substrate is installed,
The superposed substrate is disposed in the opening of the frame having an opening having a larger diameter than the superposed substrate, and the non-joint surface of the first substrate is attached to the tape provided in the open portion. Held in the frame by being
The peeling device is
A first holding portion that is formed of a flexible member and holds the second substrate from above among the superposed substrates;
A second holding unit for holding the first substrate of the superposed substrates from below via the tape;
A moving mechanism for moving the first holding part in a direction away from the second holding part;
A frame holding part that is disposed outside the second holding part and holds the frame from below;
The frame holding unit is controlled to hold the frame, the second holding unit is controlled to hold the first substrate, and the moving mechanism is controlled to hold the second substrate. A control unit that moves the first holding unit in a direction away from the second holding unit that holds the first substrate ;
The first holding part is
A thin elastic member;
A resin member affixed to the surface of the elastic member and in contact with the second substrate;
With
A peeling system , wherein the second substrate is sucked and held by suction from an air inlet formed in the resin member . A peeling method for peeling a superposed substrate in which a first substrate and a second substrate are bonded to the first substrate and the second substrate,
The superposed substrate is disposed in the opening of the frame having an opening having a larger diameter than the superposed substrate, and the non-joint surface of the first substrate is attached to the tape provided in the open portion. Held in the frame by being
A thin plate-like elastic member; and a resin member that is affixed to the surface of the elastic member and abuts against the second substrate; the first holding unit for attracting and holding the second substrate from above, a first holding step of holding suction from above the second substrate of the laminated substrate,
A second holding step of holding the first substrate of the overlapped substrate from below via the tape by a second holding portion that holds the first substrate of the overlapped substrate from below via the tape;
A frame holding step of holding the frame from below by a frame holding unit that is disposed outside the second holding unit and holds the frame from below;
A moving mechanism for moving the first holding part in a direction away from the second holding part by a moving mechanism for moving the first holding part in a direction away from the second holding part,
The moving step includes
With the frame holding unit holding the frame and the second holding unit holding the first substrate, the first holding unit holding the second substrate is moved by the moving mechanism to the first substrate. The peeling method characterized by moving in the direction away | separated from the said 2nd holding | maintenance part hold | maintained.

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