TW200900246A - Screen printing device and bump forming method - Google Patents

Screen printing device and bump forming method Download PDF

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Publication number
TW200900246A
TW200900246A TW096146997A TW96146997A TW200900246A TW 200900246 A TW200900246 A TW 200900246A TW 096146997 A TW096146997 A TW 096146997A TW 96146997 A TW96146997 A TW 96146997A TW 200900246 A TW200900246 A TW 200900246A
Authority
TW
Taiwan
Prior art keywords
printing
screen
substrate
solder ball
mask
Prior art date
Application number
TW096146997A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357381B (https=
Inventor
Noriaki Mukai
Makoto Honma
Isao Abe
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200900246A publication Critical patent/TW200900246A/zh
Application granted granted Critical
Publication of TWI357381B publication Critical patent/TWI357381B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)
TW096146997A 2006-12-15 2007-12-10 Screen printing device and bump forming method TW200900246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006337720A JP5018062B2 (ja) 2006-12-15 2006-12-15 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
TW200900246A true TW200900246A (en) 2009-01-01
TWI357381B TWI357381B (https=) 2012-02-01

Family

ID=39567121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146997A TW200900246A (en) 2006-12-15 2007-12-10 Screen printing device and bump forming method

Country Status (4)

Country Link
JP (1) JP5018062B2 (https=)
KR (1) KR100941275B1 (https=)
CN (1) CN100524677C (https=)
TW (1) TW200900246A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504324B (zh) * 2013-03-14 2015-10-11 日立製作所股份有限公司 Solder ball printing machine and solder ball printing method
TWI510373B (zh) * 2011-11-22 2015-12-01 Samsung Electro Mech 印刷裝置
TWI706866B (zh) * 2019-11-25 2020-10-11 倉和股份有限公司 具有震動結構的印刷網版系統及印刷方法
US12220768B2 (en) 2019-06-13 2025-02-11 Illinois Tool Works Inc. Solder paste bead recovery system and method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098434B2 (ja) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
KR20100122643A (ko) 2009-05-13 2010-11-23 삼성전기주식회사 범프 인쇄장치
GB0919580D0 (en) 2009-11-09 2009-12-23 Dtg Int Gmbh Screen printing
CN103531559A (zh) * 2013-10-18 2014-01-22 上海纪元微科电子有限公司 倒装芯片键合结构及其形成方法
JP6003872B2 (ja) * 2013-11-22 2016-10-05 トヨタ自動車株式会社 ロータリースクリーン版及び二次電池の製造方法
JP6424334B2 (ja) * 2014-12-01 2018-11-21 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び部品実装ライン
CN105856817B (zh) * 2016-04-07 2018-12-28 益阳市富晖制衣有限公司 一种丝网印花机
JP2019196511A (ja) * 2018-05-08 2019-11-14 住友重機械工業株式会社 板処理装置及び板処理方法
JP7686509B2 (ja) * 2021-09-13 2025-06-02 マクセル株式会社 印刷用メタルマスク

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180591B2 (ja) * 1994-12-02 2001-06-25 松下電器産業株式会社 半田ボールの搭載装置
JP3123370B2 (ja) * 1994-12-02 2001-01-09 松下電器産業株式会社 半田ボールの搭載装置
JP3648660B2 (ja) * 1997-05-23 2005-05-18 澁谷工業株式会社 半田ボールマウント装置
JP3779490B2 (ja) * 1998-05-29 2006-05-31 株式会社ルネサステクノロジ バンプ形成方法
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置
KR20060133282A (ko) * 2005-06-20 2006-12-26 삼성테크윈 주식회사 기체흐름을 이용한 솔더 볼 범프 형성방법 및 형성장치
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法
JP5076922B2 (ja) * 2008-01-25 2012-11-21 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4983737B2 (ja) * 2008-06-30 2012-07-25 株式会社日立プラントテクノロジー ハンダボール検査リペア装置およびハンダボール検査リペア方法
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510373B (zh) * 2011-11-22 2015-12-01 Samsung Electro Mech 印刷裝置
TWI504324B (zh) * 2013-03-14 2015-10-11 日立製作所股份有限公司 Solder ball printing machine and solder ball printing method
US12220768B2 (en) 2019-06-13 2025-02-11 Illinois Tool Works Inc. Solder paste bead recovery system and method
TWI706866B (zh) * 2019-11-25 2020-10-11 倉和股份有限公司 具有震動結構的印刷網版系統及印刷方法

Also Published As

Publication number Publication date
KR20080055715A (ko) 2008-06-19
CN100524677C (zh) 2009-08-05
KR100941275B1 (ko) 2010-02-11
JP5018062B2 (ja) 2012-09-05
CN101207052A (zh) 2008-06-25
JP2008153319A (ja) 2008-07-03
TWI357381B (https=) 2012-02-01

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees