CN100524677C - 丝网印刷装置以及焊球填充方法 - Google Patents

丝网印刷装置以及焊球填充方法 Download PDF

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Publication number
CN100524677C
CN100524677C CNB2007101994669A CN200710199466A CN100524677C CN 100524677 C CN100524677 C CN 100524677C CN B2007101994669 A CNB2007101994669 A CN B2007101994669A CN 200710199466 A CN200710199466 A CN 200710199466A CN 100524677 C CN100524677 C CN 100524677C
Authority
CN
China
Prior art keywords
printing
screen
substrate
mesh
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007101994669A
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English (en)
Chinese (zh)
Other versions
CN101207052A (zh
Inventor
向井范昭
本间真
阿部猪佐雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of CN101207052A publication Critical patent/CN101207052A/zh
Application granted granted Critical
Publication of CN100524677C publication Critical patent/CN100524677C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/011Apparatus therefor
    • H10W72/0112Apparatus for manufacturing bump connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/012Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)
CNB2007101994669A 2006-12-15 2007-12-13 丝网印刷装置以及焊球填充方法 Expired - Fee Related CN100524677C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006337720A JP5018062B2 (ja) 2006-12-15 2006-12-15 ハンダボール印刷装置
JP2006337720 2006-12-15

Publications (2)

Publication Number Publication Date
CN101207052A CN101207052A (zh) 2008-06-25
CN100524677C true CN100524677C (zh) 2009-08-05

Family

ID=39567121

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101994669A Expired - Fee Related CN100524677C (zh) 2006-12-15 2007-12-13 丝网印刷装置以及焊球填充方法

Country Status (4)

Country Link
JP (1) JP5018062B2 (https=)
KR (1) KR100941275B1 (https=)
CN (1) CN100524677C (https=)
TW (1) TW200900246A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098434B2 (ja) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
KR20100122643A (ko) 2009-05-13 2010-11-23 삼성전기주식회사 범프 인쇄장치
GB0919580D0 (en) 2009-11-09 2009-12-23 Dtg Int Gmbh Screen printing
JP5519729B2 (ja) * 2011-11-22 2014-06-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. 印刷装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Aiメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
CN103531559A (zh) * 2013-10-18 2014-01-22 上海纪元微科电子有限公司 倒装芯片键合结构及其形成方法
JP6003872B2 (ja) * 2013-11-22 2016-10-05 トヨタ自動車株式会社 ロータリースクリーン版及び二次電池の製造方法
JP6424334B2 (ja) * 2014-12-01 2018-11-21 パナソニックIpマネジメント株式会社 スクリーン印刷装置及び部品実装ライン
CN105856817B (zh) * 2016-04-07 2018-12-28 益阳市富晖制衣有限公司 一种丝网印花机
JP2019196511A (ja) * 2018-05-08 2019-11-14 住友重機械工業株式会社 板処理装置及び板処理方法
US11318549B2 (en) 2019-06-13 2022-05-03 Illinois Tool Works Inc. Solder paste bead recovery system and method
TWI706866B (zh) * 2019-11-25 2020-10-11 倉和股份有限公司 具有震動結構的印刷網版系統及印刷方法
JP7686509B2 (ja) * 2021-09-13 2025-06-02 マクセル株式会社 印刷用メタルマスク

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180591B2 (ja) * 1994-12-02 2001-06-25 松下電器産業株式会社 半田ボールの搭載装置
JP3123370B2 (ja) * 1994-12-02 2001-01-09 松下電器産業株式会社 半田ボールの搭載装置
JP3648660B2 (ja) * 1997-05-23 2005-05-18 澁谷工業株式会社 半田ボールマウント装置
JP3779490B2 (ja) * 1998-05-29 2006-05-31 株式会社ルネサステクノロジ バンプ形成方法
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置
KR20060133282A (ko) * 2005-06-20 2006-12-26 삼성테크윈 주식회사 기체흐름을 이용한 솔더 볼 범프 형성방법 및 형성장치
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法
JP5076922B2 (ja) * 2008-01-25 2012-11-21 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4983737B2 (ja) * 2008-06-30 2012-07-25 株式会社日立プラントテクノロジー ハンダボール検査リペア装置およびハンダボール検査リペア方法
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置

Also Published As

Publication number Publication date
KR20080055715A (ko) 2008-06-19
KR100941275B1 (ko) 2010-02-11
JP5018062B2 (ja) 2012-09-05
TW200900246A (en) 2009-01-01
CN101207052A (zh) 2008-06-25
JP2008153319A (ja) 2008-07-03
TWI357381B (https=) 2012-02-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: HITACHI,LTD.

Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD.

Effective date: 20140306

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20140306

Address after: Tokyo, Japan

Patentee after: Hitachi Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: Hitachi Plant Technologies Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805

Termination date: 20161213