TW200846823A - Photosensitive composition - Google Patents

Photosensitive composition Download PDF

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Publication number
TW200846823A
TW200846823A TW096143193A TW96143193A TW200846823A TW 200846823 A TW200846823 A TW 200846823A TW 096143193 A TW096143193 A TW 096143193A TW 96143193 A TW96143193 A TW 96143193A TW 200846823 A TW200846823 A TW 200846823A
Authority
TW
Taiwan
Prior art keywords
group
photosensitive composition
alkyl
carbon atoms
absorbance
Prior art date
Application number
TW096143193A
Other languages
English (en)
Chinese (zh)
Other versions
TWI366741B (ko
Inventor
Yoko Shibasaki
Kenji Kato
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200846823A publication Critical patent/TW200846823A/zh
Application granted granted Critical
Publication of TWI366741B publication Critical patent/TWI366741B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW096143193A 2006-11-15 2007-11-15 Photosensitive composition TW200846823A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309097 2006-11-15

Publications (2)

Publication Number Publication Date
TW200846823A true TW200846823A (en) 2008-12-01
TWI366741B TWI366741B (ko) 2012-06-21

Family

ID=39448535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096143193A TW200846823A (en) 2006-11-15 2007-11-15 Photosensitive composition

Country Status (4)

Country Link
JP (1) JP5153304B2 (ko)
KR (2) KR100963354B1 (ko)
CN (1) CN101183216B (ko)
TW (1) TW200846823A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010230721A (ja) * 2009-03-25 2010-10-14 Fujifilm Corp 感光性組成物、感光性フィルム、及び、永久パターン形成方法
JP2013539072A (ja) 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
JP5568679B1 (ja) * 2013-01-30 2014-08-06 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
JP7270204B2 (ja) 2018-11-09 2023-05-10 互応化学工業株式会社 皮膜の製造方法及びプリント配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1318915C (zh) * 1999-07-12 2007-05-30 太阳油墨制造株式会社 碱显影型光固化性组合物及使用该组合物所得的烧成物图案
SG97168A1 (en) * 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
EP1395615B1 (en) * 2001-06-11 2009-10-21 Basf Se Oxime ester photoinitiators having a combined structure
JP2003107697A (ja) * 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、フォトマスクおよびフォトマスクの製造方法
JP2004133140A (ja) * 2002-10-09 2004-04-30 Ngk Spark Plug Co Ltd プリント配線板用着色樹脂組成物及びそれを用いたプリント配線板
JP2004271788A (ja) * 2003-03-07 2004-09-30 Kyoto Elex Kk アルカリ現像型感光性樹脂組成物及びその樹脂組成物を用いたグリーンシート上へのパターン形成方法
KR20060055547A (ko) * 2003-09-24 2006-05-23 히다치 가세고교 가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트배선판의 제조방법
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JPWO2006004158A1 (ja) 2004-07-07 2008-04-24 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物
JP4599974B2 (ja) * 2004-10-04 2010-12-15 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN1841196A (zh) * 2005-04-01 2006-10-04 Jsr株式会社 放射线敏感性树脂组合物、由该组合物形成的突起和分隔物及其形成方法、及液晶显示元件
JP2007033685A (ja) * 2005-07-25 2007-02-08 Fujifilm Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Also Published As

Publication number Publication date
TWI366741B (ko) 2012-06-21
KR20100038187A (ko) 2010-04-13
KR100963354B1 (ko) 2010-06-14
CN101183216B (zh) 2011-11-02
JP2008146044A (ja) 2008-06-26
CN101183216A (zh) 2008-05-21
JP5153304B2 (ja) 2013-02-27
KR20080044195A (ko) 2008-05-20

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