TW200844652A - Process for forming solder resist film and photosensitive composition - Google Patents

Process for forming solder resist film and photosensitive composition Download PDF

Info

Publication number
TW200844652A
TW200844652A TW096143195A TW96143195A TW200844652A TW 200844652 A TW200844652 A TW 200844652A TW 096143195 A TW096143195 A TW 096143195A TW 96143195 A TW96143195 A TW 96143195A TW 200844652 A TW200844652 A TW 200844652A
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
photosensitive composition
wavelength
laser light
Prior art date
Application number
TW096143195A
Other languages
English (en)
Chinese (zh)
Other versions
TWI360022B (enrdf_load_stackoverflow
Inventor
Yoko Shibasaki
Kenji Kato
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200844652A publication Critical patent/TW200844652A/zh
Application granted granted Critical
Publication of TWI360022B publication Critical patent/TWI360022B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW096143195A 2006-11-15 2007-11-15 Process for forming solder resist film and photosensitive composition TW200844652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309098 2006-11-15

Publications (2)

Publication Number Publication Date
TW200844652A true TW200844652A (en) 2008-11-16
TWI360022B TWI360022B (enrdf_load_stackoverflow) 2012-03-11

Family

ID=39487065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096143195A TW200844652A (en) 2006-11-15 2007-11-15 Process for forming solder resist film and photosensitive composition

Country Status (4)

Country Link
JP (1) JP5276832B2 (enrdf_load_stackoverflow)
KR (2) KR20080044193A (enrdf_load_stackoverflow)
CN (1) CN101192001B (enrdf_load_stackoverflow)
TW (1) TW200844652A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101338676B1 (ko) * 2008-11-05 2013-12-06 도오꾜오까고오교 가부시끼가이샤 감광성 수지 조성물 및 기재
JP5559976B2 (ja) * 2009-03-24 2014-07-23 太陽ホールディングス株式会社 画像形成方法と光硬化画像、およびその方法に用いる光硬化性組成物
TWI476541B (zh) * 2009-03-24 2015-03-11 Taiyo Holdings Co Ltd Image forming method and photohardenable composition
JP2010230721A (ja) * 2009-03-25 2010-10-14 Fujifilm Corp 感光性組成物、感光性フィルム、及び、永久パターン形成方法
US20150014029A1 (en) * 2011-04-08 2015-01-15 Taiyo Ink MFG. Co. Ltd Photosensitive composition, hardened coating films therefrom, and printed wiring boards using same
JP6003053B2 (ja) * 2011-12-14 2016-10-05 日立化成株式会社 半導体パッケージ用プリント配線板の保護膜用感光性樹脂組成物及び半導体パッケージ
GB201223064D0 (en) * 2012-12-20 2013-02-06 Rainbow Technology Systems Ltd Curable coatings for photoimaging
KR102500912B1 (ko) * 2017-03-01 2023-02-16 아사히 가세이 가부시키가이샤 감광성 수지 조성물
CN110806682B (zh) * 2019-12-05 2024-05-28 中山新诺科技股份有限公司 阻焊线路一体曝光的多光谱数字化曝光方法及系统
KR102210868B1 (ko) * 2020-10-27 2021-02-02 (주)샘씨엔에스 포토 공정을 이용한 세라믹 기판의 제조 방법
CN115135020B (zh) * 2021-03-25 2025-03-21 庆鼎精密电子（淮安）有限公司 曝光系统、电路板及其制备方法、背光板及显示装置
CN113099624A (zh) * 2021-04-06 2021-07-09 浙江欣旺达电子有限公司 一种线路板阻焊层的制作方法
CN115460790A (zh) * 2022-08-25 2022-12-09 台山市精诚达电路有限公司 一种线路板阻焊层制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100671986B1 (ko) * 1999-07-12 2007-01-23 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 알칼리현상형 광경화성 조성물 및 이를 사용하여 얻을 수 있는 소성물(燒成物) 패턴
DE60234095D1 (de) * 2001-06-11 2009-12-03 Basf Se Oxim ester photoinitiatoren mit kombinierter struktur
JP2004133140A (ja) * 2002-10-09 2004-04-30 Ngk Spark Plug Co Ltd プリント配線板用着色樹脂組成物及びそれを用いたプリント配線板
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
US7622243B2 (en) * 2003-09-24 2009-11-24 Hitachi Chemical Company, Ltd. Photosensitive element, resist pattern formation method and printed wiring board production method
JP2005128412A (ja) * 2003-10-27 2005-05-19 Mitsubishi Chemicals Corp 画像形成材及びそれを用いた画像形成方法
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JPWO2006004158A1 (ja) * 2004-07-07 2008-04-24 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物
JP4410134B2 (ja) * 2005-03-24 2010-02-03 日立ビアメカニクス株式会社 パターン露光方法及び装置
JP2007058196A (ja) * 2005-07-25 2007-03-08 Fujifilm Holdings Corp 画像記録装置及び方法
JP2007033882A (ja) * 2005-07-27 2007-02-08 Hitachi Via Mechanics Ltd 露光装置及び露光方法並びに配線基板の製造方法

Also Published As

Publication number Publication date
CN101192001B (zh) 2012-01-11
TWI360022B (enrdf_load_stackoverflow) 2012-03-11
KR101008424B1 (ko) 2011-01-14
KR20080044193A (ko) 2008-05-20
CN101192001A (zh) 2008-06-04
JP2008146045A (ja) 2008-06-26
JP5276832B2 (ja) 2013-08-28
KR20100038185A (ko) 2010-04-13

Similar Documents

Publication Publication Date Title
TWI360022B (enrdf_load_stackoverflow)
TWI395057B (zh) A photohardenable thermosetting resin composition and a cured product thereof, and a printed circuit board
JP5276831B2 (ja) 感光性組成物
TWI355559B (enrdf_load_stackoverflow)
JP5567543B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
KR101063643B1 (ko) 광경화성 수지 조성물, 경화물 및 인쇄 배선판
JP4975579B2 (ja) 組成物、ドライフィルム、硬化物及びプリント配線板
JP5384785B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
TW201032003A (en) Photosetting resin composition, dry film and cured product of the same, and printed wiring board using them
TWI388927B (zh) A photohardenable resin composition and a hardened pattern, and a printed circuit board
TW201027241A (en) Flame-retardant photocurable resin composition, dry film and cured product of the same, and printed wiring board using the composition, dry film or cured product
JP5193565B2 (ja) 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
WO2008059935A1 (fr) Composition de résine photodurcissable/thermodurcissable, produit durci et planche de câblage imprimé
JP5113298B2 (ja) 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板
JP5153304B2 (ja) 感光性組成物
TWI770369B (zh) 鹼顯像型感光性樹脂組成物、乾膜、硬化物，及印刷配線板
JP5058757B2 (ja) 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP2009116111A (ja) 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板