TW200836867A - Lead-free solder material and method of producing the same - Google Patents

Lead-free solder material and method of producing the same Download PDF

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Publication number
TW200836867A
TW200836867A TW096149940A TW96149940A TW200836867A TW 200836867 A TW200836867 A TW 200836867A TW 096149940 A TW096149940 A TW 096149940A TW 96149940 A TW96149940 A TW 96149940A TW 200836867 A TW200836867 A TW 200836867A
Authority
TW
Taiwan
Prior art keywords
alloy
welding
strength
phase
present
Prior art date
Application number
TW096149940A
Other languages
English (en)
Chinese (zh)
Other versions
TWI343295B (https=
Inventor
Hiroki Ikeda
Katsu Yanagimoto
Noriaki Matsubara
Original Assignee
Sanyo Special Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Special Steel Co Ltd filed Critical Sanyo Special Steel Co Ltd
Publication of TW200836867A publication Critical patent/TW200836867A/zh
Application granted granted Critical
Publication of TWI343295B publication Critical patent/TWI343295B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW096149940A 2006-12-25 2007-12-25 Lead-free solder material and method of producing the same TW200836867A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006346942 2006-12-25
JP2007306122A JP5253794B2 (ja) 2006-12-25 2007-11-27 鉛フリー接合用材料およびその製造方法

Publications (2)

Publication Number Publication Date
TW200836867A true TW200836867A (en) 2008-09-16
TWI343295B TWI343295B (https=) 2011-06-11

Family

ID=39723200

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149940A TW200836867A (en) 2006-12-25 2007-12-25 Lead-free solder material and method of producing the same

Country Status (3)

Country Link
US (1) US9157135B2 (https=)
JP (1) JP5253794B2 (https=)
TW (1) TW200836867A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058766B2 (ja) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
CN102132390B (zh) * 2009-06-22 2013-03-20 松下电器产业株式会社 接合结构体、接合材料及接合材料的制造方法
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
JP2014136236A (ja) * 2013-01-16 2014-07-28 Sumitomo Metal Mining Co Ltd ＰｂフリーＩｎ系はんだ合金
JP6017351B2 (ja) * 2013-03-04 2016-10-26 山陽特殊製鋼株式会社 鉛フリー接合材料
CN103212918A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种无铅焊料助焊混合物
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
CN119525816B (zh) * 2024-12-12 2026-04-21 昆明理工大学 一种耐腐蚀锡基合金焊料及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
JP2954850B2 (ja) * 1995-03-10 1999-09-27 科学技術振興事業団 炭素系材料用接合材料及び硬質表面層をもつ炭素系材料
US7771547B2 (en) * 1998-07-13 2010-08-10 Board Of Trustees Operating Michigan State University Methods for producing lead-free in-situ composite solder alloys
TWI248384B (en) * 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
JP3757881B2 (ja) 2002-03-08 2006-03-22 株式会社日立製作所 はんだ
JP3879582B2 (ja) * 2002-04-26 2007-02-14 千住金属工業株式会社 ソルダペースト、電子部品およびステップ・ソルダリング方法
US6892925B2 (en) * 2002-09-18 2005-05-17 International Business Machines Corporation Solder hierarchy for lead free solder joint

Also Published As

Publication number Publication date
JP2008178909A (ja) 2008-08-07
US9157135B2 (en) 2015-10-13
US20100089498A1 (en) 2010-04-15
JP5253794B2 (ja) 2013-07-31
TWI343295B (https=) 2011-06-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees