TW200833467A - Friction sensor for polishing system - Google Patents

Friction sensor for polishing system

Info

Publication number
TW200833467A
TW200833467A TW096144337A TW96144337A TW200833467A TW 200833467 A TW200833467 A TW 200833467A TW 096144337 A TW096144337 A TW 096144337A TW 96144337 A TW96144337 A TW 96144337A TW 200833467 A TW200833467 A TW 200833467A
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
contacting member
polishing system
top surface
Prior art date
Application number
TW096144337A
Other languages
English (en)
Inventor
Dominic J Benvegnu
Boguslaw A Swedek
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200833467A publication Critical patent/TW200833467A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/02—Measuring coefficient of friction between materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096144337A 2006-11-22 2007-11-22 Friction sensor for polishing system TW200833467A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/562,602 US7727049B2 (en) 2003-10-31 2006-11-22 Friction sensor for polishing system

Publications (1)

Publication Number Publication Date
TW200833467A true TW200833467A (en) 2008-08-16

Family

ID=39430571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096144337A TW200833467A (en) 2006-11-22 2007-11-22 Friction sensor for polishing system

Country Status (3)

Country Link
US (3) US7727049B2 (zh)
TW (1) TW200833467A (zh)
WO (1) WO2008064268A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482966B (zh) * 2011-03-10 2015-05-01 Hon Hai Prec Ind Co Ltd 測試裝置
TWI818319B (zh) * 2020-09-25 2023-10-11 大陸商富聯裕展科技（深圳）有限公司 打磨裝置、方法、輔助打磨的裝置、系統及方法

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US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
US20080138988A1 (en) * 2006-12-07 2008-06-12 Jeffrey Drue David Detection of clearance of polysilicon residue
JP2008205464A (ja) * 2007-02-20 2008-09-04 Hitachi Chem Co Ltd 半導体基板の研磨方法
US9131543B2 (en) * 2007-08-30 2015-09-08 Goji Limited Dynamic impedance matching in RF resonator cavity
US9134214B2 (en) * 2008-02-29 2015-09-15 Juozas Padgurskas Device for measuring the influence of friction force on wear characteristics of a material surface with high frequency loading force
US20110169520A1 (en) * 2010-01-14 2011-07-14 Mks Instruments, Inc. Apparatus for measuring minority carrier lifetime and method for using the same
US9358660B2 (en) 2011-11-07 2016-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel design with elongated teeth arrangement
US9960088B2 (en) * 2011-11-07 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. End point detection in grinding
CN103837468B (zh) * 2014-02-27 2016-04-20 东北大学 一种检测端部摩擦效应及减摩材料性能的试验方法
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
JP6546845B2 (ja) * 2015-12-18 2019-07-17 株式会社荏原製作所 研磨装置、制御方法及びプログラム
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
JP6989317B2 (ja) * 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
KR20200108098A (ko) * 2018-02-05 2020-09-16 어플라이드 머티어리얼스, 인코포레이티드 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅
US11701749B2 (en) * 2018-03-13 2023-07-18 Applied Materials, Inc. Monitoring of vibrations during chemical mechanical polishing
WO2020046502A1 (en) 2018-08-31 2020-03-05 Applied Materials, Inc. Polishing system with capacitive shear sensor
JP7155035B2 (ja) * 2019-02-18 2022-10-18 株式会社荏原製作所 研磨装置および研磨方法
CN110281151A (zh) * 2019-08-16 2019-09-27 龙泉越来自动化技术有限公司 一种磨砂盘自动变速的打磨装置
WO2022186993A1 (en) 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482966B (zh) * 2011-03-10 2015-05-01 Hon Hai Prec Ind Co Ltd 測試裝置
TWI818319B (zh) * 2020-09-25 2023-10-11 大陸商富聯裕展科技（深圳）有限公司 打磨裝置、方法、輔助打磨的裝置、系統及方法

Also Published As

Publication number Publication date
US7727049B2 (en) 2010-06-01
US8342906B2 (en) 2013-01-01
US8758086B2 (en) 2014-06-24
US20130167614A1 (en) 2013-07-04
WO2008064268A2 (en) 2008-05-29
US20070087662A1 (en) 2007-04-19
WO2008064268A3 (en) 2008-09-04
US20090253351A1 (en) 2009-10-08

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