WO2008042903A3 - Systems for sensing pressure/shear force - Google Patents

Systems for sensing pressure/shear force

Info

Publication number
WO2008042903A3
WO2008042903A3 PCT/US2007/080197 US2007080197W WO2008042903A3 WO 2008042903 A3 WO2008042903 A3 WO 2008042903A3 US 2007080197 W US2007080197 W US 2007080197W WO 2008042903 A3 WO2008042903 A3 WO 2008042903A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
force
structure
panel
shear
pressure
Prior art date
Application number
PCT/US2007/080197
Other languages
French (fr)
Other versions
WO2008042903A2 (en )
Inventor
Aron Abramowksi Mason
Wayne G Renken
Mei H Sun
Lynn Karl Wiese
Original Assignee
Kla Tencor Tech Corp
Aron Abramowksi Mason
Wayne G Renken
Mei H Sun
Lynn Karl Wiese
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G01L5/0047Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes measuring forces due to residual stresses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress in general
    • G01L1/14Measuring force or stress in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142Measuring force or stress in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G01L5/0061Force sensors associated with industrial machines or actuators
    • G01L5/0076Force sensors associated with manufacturing machines
    • G01L5/008Force sensors integrated in an article or a dummy workpiece
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring

Abstract

At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
PCT/US2007/080197 2006-10-03 2007-10-02 Systems for sensing pressure/shear force WO2008042903A3 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US82800006 true 2006-10-03 2006-10-03
US60/828,000 2006-10-03
US82835106 true 2006-10-05 2006-10-05
US60/828,351 2006-10-05
US11/861,207 2007-09-25
US11861119 US7698952B2 (en) 2006-10-03 2007-09-25 Pressure sensing device
US11861207 US7497134B2 (en) 2006-10-03 2007-09-25 Process condition measuring device and method for measuring shear force on a surface of a substrate that undergoes a polishing or planarization process
US11/861,119 2007-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009531559A JP2010506407A (en) 2006-10-03 2007-10-02 Pressure, and / or, the shear force detection system

Publications (2)

Publication Number Publication Date
WO2008042903A2 true WO2008042903A2 (en) 2008-04-10
WO2008042903A3 true true WO2008042903A3 (en) 2008-08-07

Family

ID=39226631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/080197 WO2008042903A3 (en) 2006-10-03 2007-10-02 Systems for sensing pressure/shear force

Country Status (2)

Country Link
JP (2) JP2010506407A (en)
WO (1) WO2008042903A3 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8351854B2 (en) 2008-09-30 2013-01-08 Research In Motion Limited Mobile wireless communications device having touch activated near field communications (NFC) circuit
ES2371583T3 (en) * 2008-09-30 2012-01-05 Research In Motion Limited Wireless mobile communication device having a circuit near-field communications (NFC) touch activation.
DE102009019452A1 (en) * 2009-04-29 2010-11-25 Siltronic Ag An apparatus for measuring forces acting on a semiconductor wafer
US8681493B2 (en) 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
KR101310012B1 (en) 2011-12-19 2013-09-24 성균관대학교산학협력단 Hybrid type multi-axis sensor
GB201219632D0 (en) * 2012-10-31 2012-12-12 Univ Southampton Apparatus for sensing and measuring pressure and shear components of a force at an interface between two surfaces
US9836118B2 (en) 2015-06-16 2017-12-05 Wilson Steele Method and system for analyzing a movement of a person

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3815566A1 (en) * 1988-05-06 1989-11-16 Siemens Ag Method for determining mechanical stress conditions in electrical or electronic components to be coated, or already coated, with moulding compound
WO1990013425A1 (en) * 1989-05-08 1990-11-15 American Composite Technology Inc. System and method for monitoring pressure during the production of fiber reinforced polymers
DE4413442A1 (en) * 1994-04-18 1994-09-08 Fm Automation Elektronik Gmbh Assembly platform with a process-observing function
WO2000028277A2 (en) * 1998-11-06 2000-05-18 Wisconsin Alumni Research Foundation Micromachined strain sensor
US6129613A (en) * 1998-01-30 2000-10-10 Philips Electronics North America Corp. Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer
US20030022595A1 (en) * 2001-07-24 2003-01-30 Chien-Hsin Lai Wafer pressure regulation system for polishing machine
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
US20050239371A1 (en) * 2003-09-09 2005-10-27 Tetsuji Togawa Pressure control system and polishing apparatus
US20050263760A1 (en) * 2004-05-28 2005-12-01 Eckhard Langer Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1563894A (en) * 1976-03-12 1980-04-02 Kavlico Corp Capacitive pressure transducer and method for making same
JPH0465645A (en) * 1990-07-05 1992-03-02 Toshiba Corp Pressure sensor array
WO2003074228A1 (en) * 2002-01-17 2003-09-12 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
JP2000258272A (en) * 1999-01-04 2000-09-22 Fuji Electric Co Ltd Capacitive pressure sensor
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
JP2003014564A (en) * 2001-06-28 2003-01-15 Fujitsu Ten Ltd Sheet sensor and sitting person sensing system
US6892563B2 (en) * 2002-11-26 2005-05-17 Stowe Woodward Llc Calibration apparatus and method for roll covers with embedded sensors
US7135852B2 (en) * 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7151366B2 (en) * 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
JP2005331327A (en) * 2004-05-19 2005-12-02 Alps Electric Co Ltd Contact pressure sensor and its manufacturing method
WO2005119775A3 (en) * 2004-05-28 2007-04-12 Advanced Micro Devices Inc Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
JP2006112842A (en) * 2004-10-13 2006-04-27 Alps Electric Co Ltd Surface pressure distribution sensor
JP4516445B2 (en) * 2005-02-18 2010-08-04 パナソニック株式会社 A method of manufacturing a semiconductor device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3815566A1 (en) * 1988-05-06 1989-11-16 Siemens Ag Method for determining mechanical stress conditions in electrical or electronic components to be coated, or already coated, with moulding compound
WO1990013425A1 (en) * 1989-05-08 1990-11-15 American Composite Technology Inc. System and method for monitoring pressure during the production of fiber reinforced polymers
DE4413442A1 (en) * 1994-04-18 1994-09-08 Fm Automation Elektronik Gmbh Assembly platform with a process-observing function
US6129613A (en) * 1998-01-30 2000-10-10 Philips Electronics North America Corp. Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer
WO2000028277A2 (en) * 1998-11-06 2000-05-18 Wisconsin Alumni Research Foundation Micromachined strain sensor
US20030022595A1 (en) * 2001-07-24 2003-01-30 Chien-Hsin Lai Wafer pressure regulation system for polishing machine
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
US20050239371A1 (en) * 2003-09-09 2005-10-27 Tetsuji Togawa Pressure control system and polishing apparatus
US20050263760A1 (en) * 2004-05-28 2005-12-01 Eckhard Langer Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure

Also Published As

Publication number Publication date Type
JP2010506407A (en) 2010-02-25 application
WO2008042903A2 (en) 2008-04-10 application
JP2014122914A (en) 2014-07-03 application
JP5964337B2 (en) 2016-08-03 grant

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