TW200816534A - Method for producing a structured layer sequence on a substrate - Google Patents
Method for producing a structured layer sequence on a substrate Download PDFInfo
- Publication number
- TW200816534A TW200816534A TW096121277A TW96121277A TW200816534A TW 200816534 A TW200816534 A TW 200816534A TW 096121277 A TW096121277 A TW 096121277A TW 96121277 A TW96121277 A TW 96121277A TW 200816534 A TW200816534 A TW 200816534A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- substrate
- electrode
- printed
- tear
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 143
- 238000000034 method Methods 0.000 claims description 62
- 239000002356 single layer Substances 0.000 claims description 23
- 230000004888 barrier function Effects 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 4
- 230000009969 flowable effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004049 embossing Methods 0.000 abstract description 2
- 239000012777 electrically insulating material Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 poly(phenylene acrylate Chemical compound 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/10—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising heterojunctions between organic semiconductors and inorganic semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/50—Photovoltaic [PV] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Printing Methods (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006027292A DE102006027292B4 (de) | 2006-06-13 | 2006-06-13 | Verfahren zur Herstellung einer strukturierten Schichtfolge auf einem Substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200816534A true TW200816534A (en) | 2008-04-01 |
Family
ID=38582278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096121277A TW200816534A (en) | 2006-06-13 | 2007-06-13 | Method for producing a structured layer sequence on a substrate |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102006027292B4 (fr) |
TW (1) | TW200816534A (fr) |
WO (1) | WO2007144163A2 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2373095A (en) * | 2001-03-09 | 2002-09-11 | Seiko Epson Corp | Patterning substrates with evaporation residues |
DE10130992B4 (de) * | 2001-06-27 | 2006-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer hermetisch dichten Verbindung zwischen einem Substrat und einer Dioden-Schutzkappe |
JP3975779B2 (ja) * | 2002-03-01 | 2007-09-12 | 株式会社日立製作所 | 有機エレクトロルミネッセンス装置およびその製造方法 |
GB0207134D0 (en) * | 2002-03-27 | 2002-05-08 | Cambridge Display Tech Ltd | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
KR20050032114A (ko) * | 2002-08-06 | 2005-04-06 | 아베시아 리미티드 | 유기 전기 소자 |
JP2005116193A (ja) * | 2003-10-02 | 2005-04-28 | Toyota Industries Corp | 有機電界発光素子及び当該素子を備えた有機電界発光デバイス |
DE102004024461A1 (de) * | 2004-05-14 | 2005-12-01 | Konarka Technologies, Inc., Lowell | Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht |
-
2006
- 2006-06-13 DE DE102006027292A patent/DE102006027292B4/de not_active Expired - Fee Related
-
2007
- 2007-06-13 TW TW096121277A patent/TW200816534A/zh unknown
- 2007-06-13 WO PCT/EP2007/005221 patent/WO2007144163A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102006027292B4 (de) | 2010-06-17 |
DE102006027292A1 (de) | 2007-12-27 |
WO2007144163A2 (fr) | 2007-12-21 |
WO2007144163A3 (fr) | 2008-03-27 |
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