TW200808144A - Equipment and method for screen printing - Google Patents
Equipment and method for screen printing Download PDFInfo
- Publication number
- TW200808144A TW200808144A TW96109352A TW96109352A TW200808144A TW 200808144 A TW200808144 A TW 200808144A TW 96109352 A TW96109352 A TW 96109352A TW 96109352 A TW96109352 A TW 96109352A TW 200808144 A TW200808144 A TW 200808144A
- Authority
- TW
- Taiwan
- Prior art keywords
- printing
- solder paste
- screen
- main body
- squeegee
- Prior art date
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000007639 printing Methods 0.000 claims abstract description 126
- 229910000679 solder Inorganic materials 0.000 claims abstract description 105
- 230000004907 flux Effects 0.000 claims abstract description 16
- 238000007790 scraping Methods 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims description 21
- 238000011084 recovery Methods 0.000 claims description 15
- 239000007779 soft material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006195966A JP4857978B2 (ja) | 2006-07-18 | 2006-07-18 | スクリーン印刷装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200808144A true TW200808144A (en) | 2008-02-01 |
| TWI332374B TWI332374B (enExample) | 2010-10-21 |
Family
ID=39114891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96109352A TW200808144A (en) | 2006-07-18 | 2007-03-19 | Equipment and method for screen printing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4857978B2 (enExample) |
| TW (1) | TW200808144A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI660451B (zh) * | 2018-02-28 | 2019-05-21 | Powertech Technology Inc. | 助焊劑轉移治具及助焊劑轉移方法 |
| CN109878203A (zh) * | 2019-04-13 | 2019-06-14 | 东莞市鹏利节能设备有限公司 | 一种活塞塞孔装置 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011201054A (ja) * | 2010-03-24 | 2011-10-13 | Panasonic Corp | スクリーン印刷装置およびスクリーン印刷方法 |
| KR101538571B1 (ko) * | 2014-01-16 | 2015-07-22 | 김종률 | 레진도포장치 |
| KR102385397B1 (ko) | 2017-11-14 | 2022-04-14 | 하이 로보틱스 씨오., 엘티디. | 운반 로봇 및 운반 로봇에 기반한 픽업 방법 |
| JP7651976B2 (ja) * | 2020-09-30 | 2025-03-27 | Ｔｏｐｐａｎホールディングス株式会社 | パターン印刷物の製造方法、及び、パターン印刷物 |
| CN115003147A (zh) * | 2022-05-23 | 2022-09-02 | 新华三技术有限公司 | 锡膏调整装置及smt自动加工系统 |
| CN115734510B (zh) * | 2022-11-14 | 2026-01-23 | 同力恒业科技(天津)有限公司 | 一种smt工艺封装设备以及封装方法 |
| CN117246034A (zh) * | 2023-10-10 | 2023-12-19 | 深圳德森精密设备有限公司 | 一种锡膏回收装置及缺纸告警方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3099447B2 (ja) * | 1991-09-02 | 2000-10-16 | 松下電器産業株式会社 | 塗布装置及び方法並びに印刷装置及び方法 |
| JP3622707B2 (ja) * | 2001-09-03 | 2005-02-23 | 松下電器産業株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
-
2006
- 2006-07-18 JP JP2006195966A patent/JP4857978B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-19 TW TW96109352A patent/TW200808144A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI660451B (zh) * | 2018-02-28 | 2019-05-21 | Powertech Technology Inc. | 助焊劑轉移治具及助焊劑轉移方法 |
| CN109878203A (zh) * | 2019-04-13 | 2019-06-14 | 东莞市鹏利节能设备有限公司 | 一种活塞塞孔装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4857978B2 (ja) | 2012-01-18 |
| TWI332374B (enExample) | 2010-10-21 |
| JP2008023747A (ja) | 2008-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |