TWI660451B - 助焊劑轉移治具及助焊劑轉移方法 - Google Patents
助焊劑轉移治具及助焊劑轉移方法 Download PDFInfo
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7501—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
- H01L2224/75501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L2924/151—Die mounting substrate
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
一種助焊劑轉移治具,包含一加熱器、一助焊劑供應器、一推出器以及一模板。加熱器具有一噴嘴。助焊劑供應器連接於加熱器且容納一助焊劑。推出器連接於加熱器。模板具有複數個第一孔洞。助焊劑供應器供應助焊劑至加熱器,加熱器加熱助焊劑,且推出器將助焊劑自噴嘴推出,以將助焊劑噴灑於模板上。
Description
本發明關於一種助焊劑轉移治具及助焊劑轉移方法,尤指一種用以增進球柵陣列(Ball Grid Array,BGA)封裝與晶片級封裝(Chip Scale Package,CSP)之助焊劑轉移製程之助焊劑轉移治具及助焊劑轉移方法。
球柵陣列封裝與晶片級封裝技術於近幾年來已愈來愈普及,用以將高密度積體電路元件連接至電路板上。於球柵陣列封裝與晶片級封裝技術中,助焊劑轉移治具係用以將助焊劑轉移至一基板之複數個銲墊,以去除氧化薄膜,且在經由回焊製程將錫球固定於銲墊上前暫時固定錫球。
請參閱第1圖至第3圖,第1圖為先前技術之助焊劑轉移治具1的側視圖,第2圖為助焊劑12沾附於助焊劑轉移針腳10的側視圖,第3圖為助焊劑12自助焊劑轉移針腳10轉移至基板2之銲墊20的側視圖。如第1圖所示,助焊劑轉移治具1包含複數個助焊劑轉移針腳10。助焊劑托盤14中的助焊劑12可藉由刮板16形成均勻厚度。接著,將助焊劑轉移治具1朝助焊劑托盤14的方向移動,使得助焊劑12均勻地沾附於助焊劑轉移針腳10,如第2圖所示。接著,將助焊劑轉移治具1移動至基板2上方且朝基板2的方向移動,使得助焊劑12自助焊劑轉移針腳10轉移至基板2之複數個銲墊20,如第3圖所示。
由於電子裝置愈來愈趨向於小型化且具備更強大的功能,因此,球柵陣列封裝與晶片級封裝中錫球的尺寸以及二相鄰錫球之間的距離也隨之變得愈來愈小。然而,受到二相鄰助焊劑轉移針腳10之間的空間S的限制,錫球的尺寸無法做到小於約0.15毫米,且二相鄰錫球之間的距離也無法做到小於約0.3毫米,使得電子裝置的發展受到限制。
本發明提供一種用以增進球柵陣列封裝與晶片級封裝之助焊劑轉移製程之助焊劑轉移治具及助焊劑轉移方法,以解決上述問題。
根據一實施例,本發明之助焊劑轉移治具包含一加熱器、一助焊劑供應器、一推出器以及一模板。加熱器具有一噴嘴。助焊劑供應器連接於加熱器且容納一助焊劑。推出器連接於加熱器。模板具有複數個第一孔洞。助焊劑供應器供應助焊劑至加熱器,加熱器加熱助焊劑,且推出器將助焊劑自噴嘴推出,以將助焊劑噴灑於模板上。
根據另一實施例,本發明之助焊劑轉移方法適用於一助焊劑轉移治具。助焊劑轉移治具包含一加熱器、一助焊劑供應器、一推出器以及一模板。加熱器具有一噴嘴。助焊劑供應器連接於加熱器且容納一助焊劑。推出器連接於加熱器。模板具有複數個第一孔洞。助焊劑轉移方法包含下列步驟:將模板放置於一基板上,其中基板具有複數個銲墊,且第一孔洞對齊基板之銲墊;由助焊劑供應器供應助焊劑至加熱器;由加熱器加熱助焊劑;以及由推出器將助焊劑自噴嘴推出,以將助焊劑噴灑於模板上,使得助焊劑經由第一孔洞形成於銲墊上。
綜上所述,本發明係利用加熱器加熱助焊劑,以降低助焊劑之黏度,使得助焊劑可自加熱器之噴嘴推出而噴灑於模板上。接著,助焊劑即可經由模板之第一孔洞形成於基板之銲墊上。由於模板之第一孔洞可根據錫球的尺寸與二相鄰錫球之間的距離做調整,因此,球柵陣列封裝與晶片級封裝可根據實際需求而小型化。藉此,本發明即可增進球柵陣列封裝與晶片級封裝之助焊劑轉移製程,且節省先前技術之助焊劑轉移針腳的製造成本。
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。
請參閱第4圖至第9圖,第4圖為根據本發明一實施例之助焊劑轉移治具3的立體圖,第5圖為模板36與基板5的立體圖,第6圖為模板36放置於基板5上的立體圖,第7圖為助焊劑40自加熱器30之噴嘴300推出而噴灑於模板36上的立體圖,第8圖為模板36自基板5移除的立體圖,第9圖為根據本發明一實施例之助焊劑轉移方法的流程圖。
如第4圖所示,助焊劑轉移治具3包含一加熱器30、一助焊劑供應器32、一推出器34、一模板36以及一冷卻器38。加熱器30具有一噴嘴300。助焊劑供應器32連接於加熱器30且容納一助焊劑40。推出器34連接於加熱器30。模板36具有複數個第一孔洞360。於此實施例中,模板36可為一鋼板(stencil),但不以此為限。冷卻器38具有複數個第二孔洞380。於此實施例中,冷卻器38之第二孔洞380可對應模板36之第一孔洞360排列,但不以此為限。
如第5圖至第8圖所示,助焊劑轉移治具3用以將助焊劑40經由模板36轉移至一基板5。基板5可為一積體電路封裝元件或其它類似元件。基板5具有複數個銲墊50,其中模板36之第一孔洞360與冷卻器38之第二孔洞380係對應基板5之銲墊50排列。
第9圖中的本發明之助焊劑轉移方法係適用於上述之助焊劑轉移治具3。在將助焊劑40經由模板36轉移至基板5時,首先,將基板5放置於冷卻器38上,如第5圖與第9圖中的步驟S10所示。接著,將模板36放置於基板5上,且使第一孔洞360對齊銲墊50,如第6圖與第9圖中的步驟S12所示。
接著,由助焊劑供應器32供應助焊劑40至加熱器30,如第9圖中的步驟S14所示。接著,由加熱器30加熱助焊劑40,以降低助焊劑40之黏度,如第9圖中的步驟S16所示。接著,由推出器34將助焊劑40自加熱器30之噴嘴300推出,以將助焊劑40噴灑於模板36上,使得助焊劑40經由模板36之第一孔洞360形成於基板5之銲墊50上,如第7圖與第9圖中的步驟S18所示。於此實施例中,推出器34可以氣壓將助焊劑40自加熱器30之噴嘴300推出。
於此實施例中,冷卻器38係用以冷卻形成於基板5之銲墊50上之助焊劑40。當助焊劑40噴灑於模板36上且形成於基板5之銲墊50上時,由冷卻器38冷卻助焊劑40,使得助焊劑40之黏度增加,如第9圖中的步驟S20所示。藉此,助焊劑40即可穩定地定位於銲墊50上。於此實施例中,冷卻器38可自第二孔洞380吹出氣體,以冷卻基板5之銲墊50上之助焊劑40。此外,可由冷卻器38將助焊劑40冷卻至低於室溫。
接著,可將模板36自基板5移除,以完成助焊劑轉移製程,如第8圖所示。於此實施例中,模板36之第一孔洞360可根據錫球的尺寸與二相鄰錫球之間的距離做調整,因此,球柵陣列封裝與晶片級封裝可根據實際需求而小型化。藉此,本發明即可增進球柵陣列封裝與晶片級封裝之助焊劑轉移製程,且節省先前技術之助焊劑轉移針腳的製造成本。
請參閱第10圖,第10圖為根據本發明另一實施例之助焊劑轉移治具3'的立體圖。助焊劑轉移治具3'與上述的助焊劑轉移治具3的主要不同之處在於,助焊劑轉移治具3'另包含一刮板42,可移動地設置於模板36上,如第10圖所示。藉此,於此實施例中,當助焊劑40噴灑於模板36上時,可移動刮板42,使刮板42刮過模板36,以將助焊劑40填充於第一孔洞360中。
綜上所述,本發明係利用加熱器加熱助焊劑,以降低助焊劑之黏度,使得助焊劑可自加熱器之噴嘴推出而噴灑於模板上。接著,助焊劑即可經由模板之第一孔洞形成於基板之銲墊上。由於模板之第一孔洞可根據錫球的尺寸與二相鄰錫球之間的距離做調整,因此,球柵陣列封裝與晶片級封裝可根據實際需求而小型化。藉此,本發明即可增進球柵陣列封裝與晶片級封裝之助焊劑轉移製程,且節省先前技術之助焊劑轉移針腳的製造成本。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。
1、3、3'‧‧‧助焊劑轉移治具
2、5‧‧‧基板
10‧‧‧助焊劑轉移針腳
12、40‧‧‧助焊劑
14‧‧‧助焊劑托盤
16、42‧‧‧刮板
20、50‧‧‧銲墊
30‧‧‧加熱器
32‧‧‧助焊劑供應器
34‧‧‧推出器
36‧‧‧模板
38‧‧‧冷卻器
300‧‧‧噴嘴
360‧‧‧第一孔洞
380‧‧‧第二孔洞
S‧‧‧空間
S10-S18‧‧‧步驟
第1圖為先前技術之助焊劑轉移治具的側視圖。 第2圖為助焊劑沾附於助焊劑轉移針腳的側視圖。 第3圖為助焊劑自助焊劑轉移針腳轉移至基板之銲墊的側視圖。 第4圖為根據本發明一實施例之助焊劑轉移治具的立體圖。 第5圖為模板與基板的立體圖。 第6圖為模板放置於基板上的立體圖。 第7圖為助焊劑自加熱器之噴嘴推出而噴灑於模板上的立體圖。 第8圖為模板自基板移除的立體圖。 第9圖為根據本發明一實施例之助焊劑轉移方法的流程圖。 第10圖為根據本發明另一實施例之助焊劑轉移治具的立體圖。
Claims (5)
- 一種助焊劑轉移治具,包含:一加熱器,具有一噴嘴;一助焊劑供應器,連接於該加熱器且容納一助焊劑;一推出器,連接於該加熱器;一模板,具有複數個第一孔洞;以及一冷卻器,具有複數個第二孔洞,該等第二孔洞對應該等第一孔洞排列;其中,該助焊劑供應器供應該助焊劑至該加熱器,該加熱器加熱該助焊劑,且該推出器將該助焊劑自該噴嘴推出,以將該助焊劑噴灑於該模板上,該冷卻器自該等第二孔洞吹出氣體,以冷卻該助焊劑。
- 如請求項1所述之助焊劑轉移治具,另包含一刮板,可移動地設置於該模板上,其中當該助焊劑噴灑於該模板上時,該刮板刮過該模板,以將該助焊劑填充於該等第一孔洞中。
- 如請求項1所述之助焊劑轉移治具,其中該模板之該等第一孔洞對應一基板之複數個銲墊排列。
- 一種助焊劑轉移方法,適用於一助焊劑轉移治具,該助焊劑轉移治具包含一加熱器、一助焊劑供應器、一推出器、一模板以及一冷卻器,該加熱器具有一噴嘴,該助焊劑供應器連接於該加熱器且容納一助焊劑,該推出器連接於該加熱器,該模板具有複數個第一孔洞,該冷卻器具有複數個第二孔洞,該等第二孔洞對應該等第一孔洞排列,該助焊劑轉移方法包含下列步驟:將該基板放置於該冷卻器上;將該模板放置於一基板上,其中該基板具有複數個銲墊,且該等第一孔洞對齊該基板之該等銲墊;由該助焊劑供應器供應該助焊劑至該加熱器;由該加熱器加熱該助焊劑;由該推出器將該助焊劑自該噴嘴推出,以將該助焊劑噴灑於該模板上,使得該助焊劑經由該等第一孔洞形成於該等銲墊上;以及由該冷卻器自該等第二孔洞吹出氣體,以冷卻該銲墊上之該助焊劑。
- 如請求項4所述之助焊劑轉移方法,其中該助焊劑轉移治具另包含一刮板,可移動地設置於該模板上,該助焊劑轉移方法另包含下列步驟:當該助焊劑噴灑於該模板上時,移動該刮板,使該刮板刮過該模板,以將該助焊劑填充於該等第一孔洞中。
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US15/908,759 US20190267346A1 (en) | 2018-02-28 | 2018-02-28 | Flux transfer tool and flux transfer method |
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TW200808144A (en) * | 2006-07-18 | 2008-02-01 | Denso Corp | Equipment and method for screen printing |
CN206366487U (zh) * | 2016-12-22 | 2017-08-01 | 深圳铭达康科技有限公司 | 点助焊剂装置 |
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US5323947A (en) * | 1993-05-03 | 1994-06-28 | Motorola, Inc. | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
US6854633B1 (en) * | 2002-02-05 | 2005-02-15 | Micron Technology, Inc. | System with polymer masking flux for fabricating external contacts on semiconductor components |
WO2005008726A2 (en) * | 2003-07-09 | 2005-01-27 | Newport Corporation | Flip chip device assembly machine |
US20070164089A1 (en) * | 2006-01-19 | 2007-07-19 | Nordson Corporation | Method of dispensing small amounts of liquid material |
US9073153B2 (en) * | 2010-02-09 | 2015-07-07 | Nordson Corporation | Flux and solder material and method of making same |
US8740040B2 (en) * | 2012-07-31 | 2014-06-03 | Samsung Electro-Mechanics Co., Ltd. | Solder injection head |
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TW200808144A (en) * | 2006-07-18 | 2008-02-01 | Denso Corp | Equipment and method for screen printing |
CN206366487U (zh) * | 2016-12-22 | 2017-08-01 | 深圳铭达康科技有限公司 | 点助焊剂装置 |
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