TW200805608A - Semiconductor package having polymer coated copper wire and method for manufacturing the same - Google Patents

Semiconductor package having polymer coated copper wire and method for manufacturing the same Download PDF

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Publication number
TW200805608A
TW200805608A TW96115974A TW96115974A TW200805608A TW 200805608 A TW200805608 A TW 200805608A TW 96115974 A TW96115974 A TW 96115974A TW 96115974 A TW96115974 A TW 96115974A TW 200805608 A TW200805608 A TW 200805608A
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Taiwan
Prior art keywords
copper
polymer
wire
semiconductor wafer
semiconductor package
Prior art date
Application number
TW96115974A
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English (en)
Chinese (zh)
Inventor
Joo-Seok Oh
Eui-Deok Kim
Ki-Suk Park
Seoung-Whan Shin
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Hanwha Chemical Corp
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Publication of TW200805608A publication Critical patent/TW200805608A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/20755—Diameter ranges larger or equal to 50 microns less than 60 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
TW96115974A 2006-05-04 2007-05-04 Semiconductor package having polymer coated copper wire and method for manufacturing the same TW200805608A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20060040252A KR20070107818A (ko) 2006-05-04 2006-05-04 고분자 막으로 코팅된 구리 와이어를 갖는 반도체 패키지및 그 제조 방법

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JP (1) JP2008544542A (fr)
KR (1) KR20070107818A (fr)
CN (1) CN101331600A (fr)
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JPH04218932A (ja) * 1990-12-19 1992-08-10 Mitsubishi Materials Corp 半導体装置用銅合金極細線及び半導体装置
JPH05129357A (ja) * 1991-11-01 1993-05-25 Tanaka Denshi Kogyo Kk ボンデイング用ワイヤ
JPH07133461A (ja) * 1993-11-12 1995-05-23 Toyo Ink Mfg Co Ltd 貯蔵安定性良好な被覆用水性樹脂組成物
JP3237049B2 (ja) * 1995-11-27 2001-12-10 三菱マテリアル株式会社 半導体装置用表面被覆ボンディングワイヤの製造方法
JP2000195892A (ja) * 1998-12-25 2000-07-14 Sumitomo Electric Ind Ltd ボンディングワイヤ―
KR20010010858A (ko) * 1999-07-23 2001-02-15 이수남 반도체 패키지의 제조 방법
KR20030002627A (ko) * 2001-06-29 2003-01-09 주식회사 하이닉스반도체 에어 컬럼을 갖는 반도체 패키지

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JP2008544542A (ja) 2008-12-04
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CN101331600A (zh) 2008-12-24

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