TW200745792A - Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method - Google Patents

Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method

Info

Publication number
TW200745792A
TW200745792A TW096111987A TW96111987A TW200745792A TW 200745792 A TW200745792 A TW 200745792A TW 096111987 A TW096111987 A TW 096111987A TW 96111987 A TW96111987 A TW 96111987A TW 200745792 A TW200745792 A TW 200745792A
Authority
TW
Taiwan
Prior art keywords
exposure
stage
device manufacturing
substrate
holding section
Prior art date
Application number
TW096111987A
Other languages
English (en)
Inventor
Kiyoaki Kumazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200745792A publication Critical patent/TW200745792A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
TW096111987A 2006-04-05 2007-04-04 Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method TW200745792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006103860 2006-04-05

Publications (1)

Publication Number Publication Date
TW200745792A true TW200745792A (en) 2007-12-16

Family

ID=38581049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111987A TW200745792A (en) 2006-04-05 2007-04-04 Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method

Country Status (6)

Country Link
US (1) US20090033906A1 (zh)
EP (1) EP2006899A4 (zh)
JP (1) JPWO2007116752A1 (zh)
KR (1) KR20090006064A (zh)
TW (1) TW200745792A (zh)
WO (1) WO2007116752A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452443B (zh) * 2011-01-20 2014-09-11 Asml Netherlands Bv 微影裝置及元件製造方法
CN112799283A (zh) * 2019-10-28 2021-05-14 上海微电子装备（集团）股份有限公司 基片温度稳定装置及方法、光刻系统

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5241368B2 (ja) * 2008-07-31 2013-07-17 キヤノン株式会社 処理装置及びデバイス製造方法
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
JP5537380B2 (ja) * 2009-11-16 2014-07-02 キヤノン株式会社 露光装置及びデバイス製造方法
NL2006285A (en) * 2010-03-31 2011-10-03 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and substrate exchanging method.
JP2012151407A (ja) * 2011-01-21 2012-08-09 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
EP2752870A1 (en) * 2013-01-04 2014-07-09 Süss Microtec Lithography GmbH Chuck, in particular for use in a mask aligner
JP6440416B2 (ja) 2014-08-29 2018-12-19 キヤノン株式会社 処理装置、処理方法及びデバイスの製造方法
JP6495484B2 (ja) * 2015-06-11 2019-04-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び基板をロードするための方法
CN113075865B (zh) * 2020-01-06 2022-11-08 夏泰鑫半导体(青岛)有限公司 一种用于处理半导体衬底的装置和方法

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JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
JP2908153B2 (ja) 1992-11-19 1999-06-21 キヤノン株式会社 露光装置
JPH08313842A (ja) 1995-05-15 1996-11-29 Nikon Corp 照明光学系および該光学系を備えた露光装置
JP3166065B2 (ja) * 1996-02-08 2001-05-14 東京エレクトロン株式会社 処理装置及び処理方法
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
DE69735016T2 (de) 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
JP4264676B2 (ja) 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
KR100638533B1 (ko) * 1998-02-09 2006-10-26 가부시키가이샤 니콘 기판지지장치, 기판반송장치 및 그 방법, 기판교환방법,그리고 노광장치 및 그 제조방법
JP2001332609A (ja) * 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP2003156322A (ja) 2001-09-05 2003-05-30 Nikon Corp 位置計測方法及び装置、位置決め方法、露光装置、並びにマイクロデバイスの製造方法
JP2004304135A (ja) 2003-04-01 2004-10-28 Nikon Corp 露光装置、露光方法及びマイクロデバイスの製造方法
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
JP2005114882A (ja) * 2003-10-06 2005-04-28 Hitachi High-Tech Electronics Engineering Co Ltd 処理ステージの基板載置方法、基板露光ステージおよび基板露光装置
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101068384B1 (ko) * 2004-06-28 2011-09-28 엘지디스플레이 주식회사 글라스 지지시스템 및 지지핀 구조
JP2006103860A (ja) 2004-10-04 2006-04-20 Sony Corp スプリングバランサー

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452443B (zh) * 2011-01-20 2014-09-11 Asml Netherlands Bv 微影裝置及元件製造方法
US8891063B2 (en) 2011-01-20 2014-11-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN112799283A (zh) * 2019-10-28 2021-05-14 上海微电子装备（集团）股份有限公司 基片温度稳定装置及方法、光刻系统
CN112799283B (zh) * 2019-10-28 2022-04-15 上海微电子装备（集团）股份有限公司 基片温度稳定装置及方法、光刻系统

Also Published As

Publication number Publication date
JPWO2007116752A1 (ja) 2009-08-20
EP2006899A9 (en) 2009-07-22
EP2006899A2 (en) 2008-12-24
KR20090006064A (ko) 2009-01-14
US20090033906A1 (en) 2009-02-05
WO2007116752A1 (ja) 2007-10-18
EP2006899A4 (en) 2011-12-28

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