TW200745562A - Extended probe tips - Google Patents

Extended probe tips

Info

Publication number
TW200745562A
TW200745562A TW096115040A TW96115040A TW200745562A TW 200745562 A TW200745562 A TW 200745562A TW 096115040 A TW096115040 A TW 096115040A TW 96115040 A TW96115040 A TW 96115040A TW 200745562 A TW200745562 A TW 200745562A
Authority
TW
Taiwan
Prior art keywords
probe tips
contact
contact portions
probe
extended probe
Prior art date
Application number
TW096115040A
Other languages
English (en)
Inventor
John K Gritters
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200745562A publication Critical patent/TW200745562A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW096115040A 2006-05-02 2007-04-27 Extended probe tips TW200745562A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/381,274 US7528618B2 (en) 2006-05-02 2006-05-02 Extended probe tips

Publications (1)

Publication Number Publication Date
TW200745562A true TW200745562A (en) 2007-12-16

Family

ID=38661677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115040A TW200745562A (en) 2006-05-02 2007-04-27 Extended probe tips

Country Status (3)

Country Link
US (1) US7528618B2 (zh)
TW (1) TW200745562A (zh)
WO (1) WO2007130517A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796202B1 (ko) * 2007-02-12 2008-01-24 주식회사 유니테스트 프로브 카드의 프로브 구조물 제조 방법
JP2011196934A (ja) * 2010-03-23 2011-10-06 Hitachi Ltd 試験方法およびそれに用いられるインターポーザ
US9678108B1 (en) * 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
KR102179165B1 (ko) * 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
JP7079799B2 (ja) * 2018-02-06 2022-06-02 株式会社日立ハイテク 半導体装置の評価装置
WO2019155519A1 (ja) 2018-02-06 2019-08-15 株式会社 日立ハイテクノロジーズ 半導体装置の製造方法
JP6600387B2 (ja) * 2018-07-12 2019-10-30 東京特殊電線株式会社 プローブ及びプローブの接触方法

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* Cited by examiner, † Cited by third party
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JPS5988860A (ja) 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 金属リ−ドへの金属突起物形成方法
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4916002A (en) * 1989-01-13 1990-04-10 The Board Of Trustees Of The Leland Jr. University Microcasting of microminiature tips
JP3218414B2 (ja) 1992-07-15 2001-10-15 キヤノン株式会社 微小ティップ及びその製造方法、並びに該微小ティップを用いたプローブユニット及び情報処理装置
JPH06102006A (ja) * 1992-09-18 1994-04-12 Nikon Corp 走査型プローブ顕微鏡用のプローブの製造方法
US5914614A (en) * 1996-03-12 1999-06-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US20030199179A1 (en) * 1993-11-16 2003-10-23 Formfactor, Inc. Contact tip structure for microelectronic interconnection elements and method of making same
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5583368A (en) * 1994-08-11 1996-12-10 International Business Machines Corporation Stacked devices
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
JP3022312B2 (ja) 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
KR100577131B1 (ko) 1997-05-15 2006-05-10 폼팩터, 인크. 초소형 전자 요소 접촉 구조물과 그 제조 및 사용 방법
US5969422A (en) * 1997-05-15 1999-10-19 Advanced Micro Devices, Inc. Plated copper interconnect structure
US5973405A (en) * 1997-07-22 1999-10-26 Dytak Corporation Composite electrical contact structure and method for manufacturing the same
US6242788B1 (en) * 1997-08-01 2001-06-05 Nippon Steel Corporation Semiconductor device and a method of manufacturing the same
USRE41515E1 (en) * 1998-08-12 2010-08-17 Tokyo Electron Limited Contactor and production method for contactor
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
JP4514855B2 (ja) * 1999-08-19 2010-07-28 東京エレクトロン株式会社 プロービングカードの製造方法
JP2001091544A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置の製造方法
JP4527267B2 (ja) * 2000-11-13 2010-08-18 東京エレクトロン株式会社 コンタクタの製造方法
US6933738B2 (en) * 2001-07-16 2005-08-23 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
US20030138731A1 (en) * 2001-12-21 2003-07-24 Treliant Fang Photoresist formulation for high aspect ratio plating
US7010854B2 (en) * 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US7122760B2 (en) * 2002-11-25 2006-10-17 Formfactor, Inc. Using electric discharge machining to manufacture probes
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
JP2005271142A (ja) * 2004-03-25 2005-10-06 Sii Nanotechnology Inc 微小凸状構造体
US20060038576A1 (en) * 2004-08-19 2006-02-23 Pooya Tadayon Sort interface unit having probe capacitors
US7368305B2 (en) * 2005-06-10 2008-05-06 Wisconsin Alumni Research Foundation High aspect ratio micromechanical probe tips and methods of fabrication
KR100748023B1 (ko) * 2006-06-16 2007-08-09 주식회사 유니테스트 프로브 카드의 프로브 구조물 제조 방법

Also Published As

Publication number Publication date
WO2007130517A2 (en) 2007-11-15
US7528618B2 (en) 2009-05-05
WO2007130517A3 (en) 2008-04-17
US20070259456A1 (en) 2007-11-08

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