TW200742760A - Light emitting diode and wavelength converting material - Google Patents

Light emitting diode and wavelength converting material

Info

Publication number
TW200742760A
TW200742760A TW095116888A TW95116888A TW200742760A TW 200742760 A TW200742760 A TW 200742760A TW 095116888 A TW095116888 A TW 095116888A TW 95116888 A TW95116888 A TW 95116888A TW 200742760 A TW200742760 A TW 200742760A
Authority
TW
Taiwan
Prior art keywords
wavelength converting
wavelength
emitting diode
light
light emitting
Prior art date
Application number
TW095116888A
Other languages
English (en)
Other versions
TWI357435B (en
Inventor
Wen-Jeng Hwang
Chih-Chin Chang
Hsiang-Cheng Hsieh
Hsin-Hua Ho
Original Assignee
Lighthouse Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lighthouse Technology Co Ltd filed Critical Lighthouse Technology Co Ltd
Priority to TW095116888A priority Critical patent/TWI357435B/zh
Priority to US11/420,766 priority patent/US7718088B2/en
Priority to DE102006028259A priority patent/DE102006028259B4/de
Priority to KR1020060061007A priority patent/KR100913372B1/ko
Priority to JP2006191853A priority patent/JP4803439B2/ja
Publication of TW200742760A publication Critical patent/TW200742760A/zh
Application granted granted Critical
Publication of TWI357435B publication Critical patent/TWI357435B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2996—Glass particles or spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW095116888A 2006-05-12 2006-05-12 Light emitting diode and wavelength converting mat TWI357435B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095116888A TWI357435B (en) 2006-05-12 2006-05-12 Light emitting diode and wavelength converting mat
US11/420,766 US7718088B2 (en) 2006-05-12 2006-05-29 Light emitting diode and wavelength converting material
DE102006028259A DE102006028259B4 (de) 2006-05-12 2006-06-20 Licht emittierende Diode und Material zur Wellenlängenwandlung
KR1020060061007A KR100913372B1 (ko) 2006-05-12 2006-06-30 발광 다이오드 및 파장 전환 물질
JP2006191853A JP4803439B2 (ja) 2006-05-12 2006-07-12 発光ダイオードおよび波長変換材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095116888A TWI357435B (en) 2006-05-12 2006-05-12 Light emitting diode and wavelength converting mat

Publications (2)

Publication Number Publication Date
TW200742760A true TW200742760A (en) 2007-11-16
TWI357435B TWI357435B (en) 2012-02-01

Family

ID=38580161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116888A TWI357435B (en) 2006-05-12 2006-05-12 Light emitting diode and wavelength converting mat

Country Status (5)

Country Link
US (1) US7718088B2 (zh)
JP (1) JP4803439B2 (zh)
KR (1) KR100913372B1 (zh)
DE (1) DE102006028259B4 (zh)
TW (1) TWI357435B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946728B2 (en) 2010-11-01 2015-02-03 Samsung Electronics Co., Ltd. Semiconductor light emitting device
CN114149262A (zh) * 2021-11-23 2022-03-08 松山湖材料实验室 可逆光致变色透明陶瓷及其制备方法和应用

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080029774A1 (en) * 2006-08-04 2008-02-07 Acol Technologies S.A. Semiconductor light source packages with broadband and angular uniformity support
JP5104621B2 (ja) * 2008-07-28 2012-12-19 三菱化学株式会社 植物育成用の照明装置
KR101227030B1 (ko) 2011-03-09 2013-01-28 희성금속 주식회사 형광체 원료용 합금 조성물 및 그의 제조 방법
CN102250616B (zh) * 2011-05-06 2014-01-01 中国科学院苏州纳米技术与纳米仿生研究所 一种双钙钛矿结构红色荧光粉、制备方法及应用
DE102012206646B4 (de) * 2012-04-23 2024-01-25 Osram Gmbh Leuchtvorrichtung mit LED-Chip und Vergussmasse und Verfahren zum Herstellen einer Leuchtvorrichtung
JP6068473B2 (ja) * 2012-08-01 2017-01-25 パナソニック株式会社 波長変換粒子、波長変換部材及び発光装置
CN103773367B (zh) * 2014-01-09 2015-06-03 延边大学 用于白光led的荧光材料及制备方法
JP2017218574A (ja) * 2016-06-07 2017-12-14 シャープ株式会社 ナノ粒子蛍光体素子および発光素子

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DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE19626219A1 (de) * 1996-06-29 1998-01-02 Philips Patentverwaltung Leuchtstoffzubereitung mit SiO¶2¶-Partikel-Beschichtung
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JP2000044942A (ja) 1998-07-27 2000-02-15 Mitsubishi Electric Corp 蛍光体及びその表面処理方法と、カラー陰極線管の形成方法
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JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置
JP3784651B2 (ja) * 2001-02-06 2006-06-14 日亜化学工業株式会社 蛍光体とその製造方法
TW511303B (en) 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
JP2003243727A (ja) * 2001-12-14 2003-08-29 Nichia Chem Ind Ltd 発光装置
JP2004107572A (ja) 2002-09-20 2004-04-08 Sharp Corp 蛍光体およびそれを含む照明装置と表示装置
JP4529349B2 (ja) * 2002-11-08 2010-08-25 日亜化学工業株式会社 窒化物系蛍光体および発光装置
WO2004042834A1 (ja) * 2002-11-08 2004-05-21 Nichia Corporation 発光装置、蛍光体および蛍光体の製造方法
JP2004182907A (ja) 2002-12-04 2004-07-02 Matsushita Electric Ind Co Ltd 赤色蛍光体およびこれを用いた蛍光ランプ
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TWI241034B (en) 2004-05-20 2005-10-01 Lighthouse Technology Co Ltd Light emitting diode package
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TWI249861B (en) * 2005-01-12 2006-02-21 Lighthouse Technology Co Ltd Wavelength converting substance and light emitting device and encapsulating material comprising the same
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946728B2 (en) 2010-11-01 2015-02-03 Samsung Electronics Co., Ltd. Semiconductor light emitting device
CN114149262A (zh) * 2021-11-23 2022-03-08 松山湖材料实验室 可逆光致变色透明陶瓷及其制备方法和应用
CN114149262B (zh) * 2021-11-23 2023-05-12 松山湖材料实验室 可逆光致变色透明陶瓷及其制备方法和应用

Also Published As

Publication number Publication date
US20070262325A1 (en) 2007-11-15
JP4803439B2 (ja) 2011-10-26
KR100913372B1 (ko) 2009-08-20
JP2007305951A (ja) 2007-11-22
US7718088B2 (en) 2010-05-18
KR20070109751A (ko) 2007-11-15
DE102006028259B4 (de) 2013-01-17
TWI357435B (en) 2012-02-01
DE102006028259A1 (de) 2007-11-15

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