TW200741342A - Curable resin composition and its cured product - Google Patents

Curable resin composition and its cured product

Info

Publication number
TW200741342A
TW200741342A TW095146460A TW95146460A TW200741342A TW 200741342 A TW200741342 A TW 200741342A TW 095146460 A TW095146460 A TW 095146460A TW 95146460 A TW95146460 A TW 95146460A TW 200741342 A TW200741342 A TW 200741342A
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
infrared rays
cured product
far infrared
Prior art date
Application number
TW095146460A
Other languages
English (en)
Other versions
TWI391784B (zh
Inventor
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200741342A publication Critical patent/TW200741342A/zh
Application granted granted Critical
Publication of TWI391784B publication Critical patent/TWI391784B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/12—Esters of monohydric alcohols or phenols
    • C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
TW095146460A 2006-03-27 2006-12-12 Hardened resin composition and hardened product thereof TWI391784B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006084426A JP4927426B2 (ja) 2006-03-27 2006-03-27 硬化性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
TW200741342A true TW200741342A (en) 2007-11-01
TWI391784B TWI391784B (zh) 2013-04-01

Family

ID=38629234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146460A TWI391784B (zh) 2006-03-27 2006-12-12 Hardened resin composition and hardened product thereof

Country Status (4)

Country Link
JP (1) JP4927426B2 (zh)
KR (1) KR100844692B1 (zh)
CN (1) CN101046629B (zh)
TW (1) TWI391784B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101005242B1 (ko) * 2008-03-03 2011-01-04 삼성전기주식회사 방열 인쇄회로기판 및 반도체 칩 패키지
JP5723103B2 (ja) * 2009-03-27 2015-05-27 株式会社神戸製鋼所 高熱伝導性放熱鋼板
JP2011037986A (ja) * 2009-08-11 2011-02-24 Taiyo Holdings Co Ltd 光硬化性ペースト及びその硬化物
JP5632146B2 (ja) * 2009-09-02 2014-11-26 太陽ホールディングス株式会社 硬化性樹脂組成物
CN104122748A (zh) * 2013-04-28 2014-10-29 北京京东方光电科技有限公司 蓝色光阻组合物、其制备方法、彩色滤光片和显示器件
CN104122751A (zh) 2013-04-28 2014-10-29 北京京东方光电科技有限公司 绿色光阻组合物、其制备方法、彩色滤光片和显示器件
CN104122750A (zh) * 2013-04-28 2014-10-29 北京京东方光电科技有限公司 红色光阻组合物、其制备方法、彩色滤光片和显示器件
CN104122749A (zh) * 2013-04-28 2014-10-29 北京京东方光电科技有限公司 黑色光阻组合物、其制备方法、彩色滤光片和显示器件
JP6879690B2 (ja) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
CN110856368A (zh) * 2019-11-22 2020-02-28 东莞市鸿运电子有限公司 一种白油阻焊uv工艺
WO2022075432A1 (ja) 2020-10-08 2022-04-14 太陽インキ製造株式会社 感光性積層樹脂構造体、ドライフィルム、硬化物および電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162116A (ja) * 1993-12-01 1995-06-23 Toagosei Co Ltd 金属ベース基板材料およびその製造方法
JP3441176B2 (ja) * 1994-08-01 2003-08-25 ダイセル化学工業株式会社 硬化性樹脂組成物
JPH09148748A (ja) * 1995-11-20 1997-06-06 Taiyo Ink Mfg Ltd 多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物
JP2000044640A (ja) * 1998-07-29 2000-02-15 Takeda Chem Ind Ltd セラミック成形用感光性樹脂組成物
JP2001053407A (ja) * 1999-08-12 2001-02-23 Ngk Insulators Ltd プリント回路用基板材とその製造方法
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP2005242096A (ja) * 2004-02-27 2005-09-08 Toray Ind Inc 感光性セラミックス組成物
JP2005298613A (ja) * 2004-04-09 2005-10-27 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜

Also Published As

Publication number Publication date
CN101046629B (zh) 2011-06-29
KR100844692B1 (ko) 2008-07-07
JP2007254688A (ja) 2007-10-04
TWI391784B (zh) 2013-04-01
KR20070096943A (ko) 2007-10-02
CN101046629A (zh) 2007-10-03
JP4927426B2 (ja) 2012-05-09

Similar Documents

Publication Publication Date Title
TW200741342A (en) Curable resin composition and its cured product
WO2009025292A1 (ja) 反射防止フィルム
TW200630448A (en) Coating composition, hard coat film and optical recording medium
TWI508861B (zh) 透明樹脂層疊體及包括該層疊體的觸控式螢幕面板
CN108778715B (zh) 封装膜
ATE492613T1 (de) Bodensubstrat mit einer beschichtung aus einer härtbaren zusammensetzung
TW200602447A (en) Adhesive composition, optical disk producing sheet, and optical disk
WO2009041533A1 (ja) ハードコートフィルム
TW200519156A (en) Coating composition, hard coat film, and optical disk
MX2007012886A (es) Pelicula o cinta adhesiva sensible a la presion curada por ultravioleta sin sustrato de soporte.
TW200833770A (en) Thermally conductive material
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
TW200746935A (en) Heat-radiating insulating resin composition and printed wiring board using the same
WO2009001492A1 (ja) 接着フィルムおよびこれを用いた半導体装置
MX2009004013A (es) Paneles murales decorativos y proceso para la fabricacion de tales paneles.
JP2008247936A5 (zh)
ATE517156T1 (de) Härtbare zusammensetzung und substrate mit daraus hergestellter schutzschicht
KR102198770B1 (ko) 에너지선 경화성 접착제
ATE440125T1 (de) Oberflächenmodifiziertes corund sowie harzzusammensetzung
EP1308471A3 (en) Radiation curable resin composition for Fresnel lens and Fresnel lens sheet
EP1728839A3 (en) Actinic radiation curable coating compositions
TW200621880A (en) Curable composition, cured product, and laminate
TW200711847A (en) Antireflective laminate
EP2033984A3 (en) Heat-curable polyimide silicone composition and a cured film therefrom
TW200628576A (en) Acrylic adhesive composition and acrylic adhesive sheet