TW200738848A - Surface modification liquid for plastic and method of metallizing plastic surface therewith - Google Patents

Surface modification liquid for plastic and method of metallizing plastic surface therewith

Info

Publication number
TW200738848A
TW200738848A TW095113224A TW95113224A TW200738848A TW 200738848 A TW200738848 A TW 200738848A TW 095113224 A TW095113224 A TW 095113224A TW 95113224 A TW95113224 A TW 95113224A TW 200738848 A TW200738848 A TW 200738848A
Authority
TW
Taiwan
Prior art keywords
plastic
modification liquid
surface modification
metallizing
therewith
Prior art date
Application number
TW095113224A
Other languages
English (en)
Inventor
Leonas Naruskevicius
Birute Simkunaite
Satoru Shimizu
Original Assignee
Ebara Udylite Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Kk filed Critical Ebara Udylite Kk
Publication of TW200738848A publication Critical patent/TW200738848A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW095113224A 2006-03-31 2006-04-13 Surface modification liquid for plastic and method of metallizing plastic surface therewith TW200738848A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/306916 WO2007116493A1 (ja) 2006-03-31 2006-03-31 プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法

Publications (1)

Publication Number Publication Date
TW200738848A true TW200738848A (en) 2007-10-16

Family

ID=38580802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113224A TW200738848A (en) 2006-03-31 2006-04-13 Surface modification liquid for plastic and method of metallizing plastic surface therewith

Country Status (6)

Country Link
US (1) US20090176022A1 (zh)
EP (1) EP2006415A2 (zh)
JP (1) JP4786708B2 (zh)
CN (1) CN101400823A (zh)
TW (1) TW200738848A (zh)
WO (1) WO2007116493A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974860B2 (en) * 2009-06-19 2015-03-10 Robert Hamilton Selective deposition of metal on plastic substrates
CN101892469B (zh) * 2010-06-29 2011-09-07 陕西师范大学 超声微蚀体系对abs工程塑料零部件表面微蚀方法
US20130209689A1 (en) * 2012-02-15 2013-08-15 Mark Wojtaszek Sulfonation of Plastic and Composite Materials
EP2639334A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
KR102011851B1 (ko) 2013-10-22 2019-08-20 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물
US9506150B2 (en) * 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
CN104988548A (zh) * 2015-07-21 2015-10-21 苏州荣昌复合材料有限公司 增加工程塑料镀层结合力的表面处理剂及应用
LT2015105A (lt) 2015-12-18 2017-06-26 Vmti Fiziniå² Ir Technologijos Mokslå² Centras Plastikų paviršiaus adhezinio paruošimo prieš metalizavimą būdas
DE102016215462A1 (de) * 2016-08-18 2018-02-22 Leibniz-Institut Für Polymerforschung Dresden E.V. Modifizierte abs-oberflächen und verfahren zu ihrer herstellung
CN107287633A (zh) * 2017-06-21 2017-10-24 太仓市金鹿电镀有限公司 一种表面无钯活化电镀工艺
US11371159B2 (en) * 2019-06-22 2022-06-28 Applied Materials, Inc. Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647699A (en) * 1967-12-22 1972-03-07 Gen Motors Corp Surface conditioner composition for abs resin
US3575747A (en) * 1969-01-21 1971-04-20 Samuel L Cohn Chemical polishing of aluminum
US3689303A (en) * 1970-12-21 1972-09-05 Crown City Plating Co Process for electroless plating of abs resins
US4054693A (en) * 1974-11-07 1977-10-18 Kollmorgen Technologies Corporation Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition
US4283248A (en) * 1979-02-01 1981-08-11 Nitto Electric Industrial Co., Ltd. Etching solution for tin-nickel alloy and process for etching the same
US4415406A (en) * 1980-03-07 1983-11-15 Standard Oil Company Chemical etching of polymers for metallizing
US5192590A (en) * 1989-11-03 1993-03-09 Raychem Corporation Coating metal on poly(aryl ether ketone) surfaces
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
JPH0413876A (ja) * 1990-05-07 1992-01-17 Nippon Synthetic Chem Ind Co Ltd:The ポリビニルアルコール系樹脂の無電解メッキ方法
US5340437A (en) * 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers
JPH07321457A (ja) * 1994-05-24 1995-12-08 Toray Eng Co Ltd ポリイミド基板の製造方法
JP3475260B2 (ja) * 1994-12-07 2003-12-08 日本リーロナール株式会社 樹脂製品への機能性皮膜の形成方法
JPH09117718A (ja) * 1995-10-24 1997-05-06 Nippon G Ii Plast Kk 樹脂成形品の塗装方法
JPH09202975A (ja) * 1996-01-29 1997-08-05 Toray Ind Inc 表面金属化液晶性樹脂成形品の製造方法
MXPA01004811A (es) * 1998-11-13 2002-09-18 Enthone Omi Inc Proceso para metalizar una superficie de plastico.
LT2000074A (lt) * 2000-07-20 2002-01-25 Mykolas Baranauskas Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
JP4109653B2 (ja) 2004-06-09 2008-07-02 株式会社巴川製紙所 光コネクタ、およびそれに用いる接続用割スリーブ、支持部材およびアダプタ
US20050199587A1 (en) 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic

Also Published As

Publication number Publication date
US20090176022A1 (en) 2009-07-09
JPWO2007116493A1 (ja) 2009-08-20
CN101400823A (zh) 2009-04-01
EP2006415A2 (en) 2008-12-24
EP2006415A9 (en) 2009-05-20
WO2007116493A1 (ja) 2007-10-18
JP4786708B2 (ja) 2011-10-05

Similar Documents

Publication Publication Date Title
TW200738848A (en) Surface modification liquid for plastic and method of metallizing plastic surface therewith
EP2149622A8 (en) Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent
PL2025708T3 (pl) Roztwór trawiący do powierzchni tworzyw sztucznych nie zawierający chromu
WO2010026571A3 (en) Metal nanowire thin-films
MX344173B (es) Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.
SG148975A1 (en) Methods and apparatus for cleaning deposition chamber parts using selective spray etch
WO2009148952A3 (en) Strengthening iron fischer-tropsch catalyst by co-feeding iron nitrate and precipitating agent or separately precipitating from ferrous nitrate and ferric nitrate solutions
GB0402963D0 (en) Counter current mixing device for two different fluids
SG150463A1 (en) Electroless palladium plating solution
TW200622034A (en) Method of fabricate copper-cobalt interconnects
WO2012040650A3 (en) Process for treating waters and water handling systems to remove scales and reduce the scaling tendency
WO2007021332A3 (en) Composite electroless plating
WO2011093934A8 (en) Method for improving plating on non-conductive substrates
GB2470620A (en) Method of measuring deposition onto a substrate
WO2010008967A3 (en) Improvement of organic line width roughness with h2 plasma treatment
WO2007001334A3 (en) Activation of aluminum for electrodeposition or electroless deposition
MY151123A (en) Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface
TW200632146A (en) Immersion process for electroplating applications
WO2012162530A3 (en) Modification of existing wastewater systems with substrate supported biofilms
EP1441045A3 (de) Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung
TW200741031A (en) Surface treating agent and method for manufacturing coating using the same
EP2017373A3 (en) High speed method for plating palladium and palladium alloys
WO2005098930A3 (en) Process for producing semi-conductor coated substrate
WO2006067077A3 (de) In-line-messgerät mit einem messrohr und verfahren zu dessen herstellung
MX2007014207A (es) Metodo de tratamiento y metodo de diseno novedosos para conexiones tubulares.