TW200736828A - Photosensitive resin composition and photoresist film using the same - Google Patents

Photosensitive resin composition and photoresist film using the same

Info

Publication number
TW200736828A
TW200736828A TW096104555A TW96104555A TW200736828A TW 200736828 A TW200736828 A TW 200736828A TW 096104555 A TW096104555 A TW 096104555A TW 96104555 A TW96104555 A TW 96104555A TW 200736828 A TW200736828 A TW 200736828A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
photoresist film
same
polymer
Prior art date
Application number
TW096104555A
Other languages
English (en)
Inventor
Shigeru Murakami
Yasuhiro Hamada
Takatoshi Yamamoto
Atsuyoshi Hinata
Original Assignee
Nichigo Morton Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichigo Morton Co Ltd filed Critical Nichigo Morton Co Ltd
Publication of TW200736828A publication Critical patent/TW200736828A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
TW096104555A 2006-02-08 2007-02-08 Photosensitive resin composition and photoresist film using the same TW200736828A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006030470 2006-02-08

Publications (1)

Publication Number Publication Date
TW200736828A true TW200736828A (en) 2007-10-01

Family

ID=38345156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104555A TW200736828A (en) 2006-02-08 2007-02-08 Photosensitive resin composition and photoresist film using the same

Country Status (4)

Country Link
KR (1) KR20080092421A (zh)
CN (1) CN101379434A (zh)
TW (1) TW200736828A (zh)
WO (1) WO2007091560A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101486560B1 (ko) * 2010-12-10 2015-01-27 제일모직 주식회사 감광성 수지 조성물 및 이를 이용한 차광층
KR101675822B1 (ko) * 2013-08-07 2016-11-15 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
CN111258181B (zh) * 2018-11-30 2024-02-27 常州正洁智造科技有限公司 六芳基双咪唑混合光引发剂
CN111258180B (zh) * 2018-11-30 2024-03-08 常州正洁智造科技有限公司 六芳基双咪唑类混合光引发剂及应用
CN110488570B (zh) * 2019-08-29 2022-03-11 浙江福斯特新材料研究院有限公司 一种感光性树脂组合物及其用途
US11827781B2 (en) * 2019-08-29 2023-11-28 Zhejiang First Advanced Material R&D Institute Co., Ltd. Photosensitive resin composition and use thereof
CN113717308B (zh) * 2021-09-28 2024-01-30 江苏集萃光敏电子材料研究所有限公司 一种光刻胶用树脂及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3838715B2 (ja) * 1996-10-17 2006-10-25 日本合成化学工業株式会社 感光性樹脂組成物およびその用途
JP4384452B2 (ja) * 2003-08-28 2009-12-16 富士フイルム株式会社 光硬化性着色樹脂組成物、並びに、カラーフィルターおよびその製造方法
JP4446779B2 (ja) * 2004-03-31 2010-04-07 ニチゴー・モートン株式会社 フォトレジストフィルム
JP2007003740A (ja) * 2005-06-23 2007-01-11 Nippon Synthetic Chem Ind Co Ltd:The 感光性樹脂組成物及びそれを用いたフォトレジストフィルム
JP4535953B2 (ja) * 2005-07-11 2010-09-01 旭化成イーマテリアルズ株式会社 感光性樹脂積層体

Also Published As

Publication number Publication date
CN101379434A (zh) 2009-03-04
WO2007091560A1 (ja) 2007-08-16
KR20080092421A (ko) 2008-10-15

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