TW200801800A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200801800A
TW200801800A TW096113330A TW96113330A TW200801800A TW 200801800 A TW200801800 A TW 200801800A TW 096113330 A TW096113330 A TW 096113330A TW 96113330 A TW96113330 A TW 96113330A TW 200801800 A TW200801800 A TW 200801800A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
compound
carboxylic acid
unsaturated carboxylic
Prior art date
Application number
TW096113330A
Other languages
Chinese (zh)
Inventor
Hong-Dae Shin
Joo-Pyo Yun
Hyoc-Min Youn
Tae-Hoon Yeo
Ki-Hyuk Koo
Ui Cheol Jeong
Ho Jin Lee
Dong Myung Kim
Sang Gak Choi
Dong Hyuk Lee
Byung Uk Kim
Sung Tak Kim
Su Youn Choi
Dong Ho Cho
Dae Jung Jeong
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200801800A publication Critical patent/TW200801800A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Epoxy Resins (AREA)

Abstract

To provide a photosensitive resin composition which excels in performances such as sensitivity, heat resistance and chemical resistance and particularly forms a film having excellent hydrophobic property, accordingly which is suitable for use as a composition for lift-off as well as for forming a bank by an ink jet system. The photosensitive resin composition comprises (a) an acrylic copolymer obtained by copolymerizing (I) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of these; (ii) an epoxy group-containing unsaturated compound; and (iii) an olefinically unsaturated compound and then removing unreacted monomers; (b) a 1,2-quinonediazide compound; (c) a fluorine compound of a specific structure; and (d) a solvent.
TW096113330A 2006-04-18 2007-04-16 Photosensitive resin composition TW200801800A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060034791A KR20070103109A (en) 2006-04-18 2006-04-18 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
TW200801800A true TW200801800A (en) 2008-01-01

Family

ID=38758373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113330A TW200801800A (en) 2006-04-18 2007-04-16 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP2007286620A (en)
KR (1) KR20070103109A (en)
CN (1) CN101059653A (en)
TW (1) TW200801800A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5466375B2 (en) * 2008-04-08 2014-04-09 東京応化工業株式会社 Manufacturing method of resin pattern
JP5173543B2 (en) * 2008-04-08 2013-04-03 東京応化工業株式会社 Positive photosensitive resin composition
KR20090111517A (en) * 2008-04-22 2009-10-27 주식회사 동진쎄미켐 Low Temperature Curable Photosensitive Resin Composition
JP2010243599A (en) * 2009-04-01 2010-10-28 Dnp Fine Chemicals Co Ltd Resin composition for color layer for color filter
CN102786631B (en) * 2012-08-16 2014-05-14 京东方科技集团股份有限公司 Photosensitive alkali-soluble resin, preparation method thereof and color photoresist
CN103232603B (en) 2013-04-03 2015-03-18 京东方科技集团股份有限公司 Alkali-soluble resin and preparation method thereof, and photoresist composition
CN103709311B (en) * 2013-11-18 2016-01-20 长春永固科技有限公司 For the preparation method of the modified epoxy of die adhesive
KR102235159B1 (en) * 2014-04-15 2021-04-05 롬엔드하스전자재료코리아유한회사 Photosensitive resin composition, and insulating film and electric device using same
KR20170128678A (en) * 2016-05-12 2017-11-23 삼성디스플레이 주식회사 Photosensitive resin composition and display device
KR102433199B1 (en) * 2017-03-09 2022-08-17 주식회사 동진쎄미켐 Positive photosensitive resin composition

Also Published As

Publication number Publication date
JP2007286620A (en) 2007-11-01
KR20070103109A (en) 2007-10-23
CN101059653A (en) 2007-10-24

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