TW200732508A - Electroless plating apparatus and electroless plating method - Google Patents
Electroless plating apparatus and electroless plating methodInfo
- Publication number
- TW200732508A TW200732508A TW095140436A TW95140436A TW200732508A TW 200732508 A TW200732508 A TW 200732508A TW 095140436 A TW095140436 A TW 095140436A TW 95140436 A TW95140436 A TW 95140436A TW 200732508 A TW200732508 A TW 200732508A
- Authority
- TW
- Taiwan
- Prior art keywords
- plating
- solution
- substrate
- electroless plating
- top surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005349607 | 2005-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200732508A true TW200732508A (en) | 2007-09-01 |
Family
ID=38119094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140436A TW200732508A (en) | 2005-12-02 | 2006-11-01 | Electroless plating apparatus and electroless plating method |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070128373A1 (zh) |
JP (1) | JP5466261B2 (zh) |
KR (1) | KR20070058310A (zh) |
TW (1) | TW200732508A (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101123705B1 (ko) * | 2008-04-04 | 2012-03-15 | 도쿄엘렉트론가부시키가이샤 | 반도체 제조 장치, 반도체 제조 방법 |
JP4571208B2 (ja) * | 2008-07-18 | 2010-10-27 | 東京エレクトロン株式会社 | 半導体製造装置 |
JP5666419B2 (ja) * | 2011-11-28 | 2015-02-12 | 東京エレクトロン株式会社 | めっき処理装置、めっき処理方法および記憶媒体 |
JP2013249495A (ja) * | 2012-05-30 | 2013-12-12 | Tokyo Electron Ltd | めっき処理装置、めっき処理方法および記憶媒体 |
JP6338904B2 (ja) * | 2014-03-24 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置 |
JP6653608B2 (ja) | 2016-03-29 | 2020-02-26 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6736386B2 (ja) | 2016-07-01 | 2020-08-05 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法および記録媒体 |
JP6980457B2 (ja) * | 2017-08-23 | 2021-12-15 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
KR20200094760A (ko) | 2017-12-01 | 2020-08-07 | 도쿄엘렉트론가부시키가이샤 | 기판 액 처리 장치 |
WO2020255739A1 (ja) * | 2019-06-17 | 2020-12-24 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
CN114574838B (zh) * | 2022-05-05 | 2022-07-22 | 武汉极点科技有限公司 | 一种机器人生产用镀覆装置及镀覆方法 |
CN115595566B (zh) * | 2022-11-17 | 2024-05-28 | 西华大学 | 一种环保节能高效灵活的化学镀装置和方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
KR0138097B1 (ko) * | 1989-05-22 | 1998-06-15 | 고다까 토시오 | 도포장치 |
JP2002009139A (ja) * | 2000-06-20 | 2002-01-11 | Nikon Corp | 静電チャック |
WO2002034963A1 (fr) * | 2000-10-26 | 2002-05-02 | Ebara Corporation | Dispositif et procede pour depot electrolytique |
JP3883802B2 (ja) * | 2000-10-26 | 2007-02-21 | 株式会社荏原製作所 | 無電解めっき装置 |
KR20020074175A (ko) * | 2000-10-26 | 2002-09-28 | 가부시키 가이샤 에바라 세이사꾸쇼 | 무전해도금장치 및 방법 |
JP2002334828A (ja) * | 2001-05-10 | 2002-11-22 | Ibiden Co Ltd | ホットプレートユニット |
JP4010791B2 (ja) * | 2001-08-10 | 2007-11-21 | 株式会社荏原製作所 | 無電解めっき装置及び無電解めっき方法 |
US6846519B2 (en) * | 2002-08-08 | 2005-01-25 | Blue29, Llc | Method and apparatus for electroless deposition with temperature-controlled chuck |
JP4339045B2 (ja) * | 2003-08-18 | 2009-10-07 | 東京エレクトロン株式会社 | 無電解メッキ装置および無電解メッキ方法 |
-
2006
- 2006-10-24 KR KR1020060103186A patent/KR20070058310A/ko not_active Application Discontinuation
- 2006-11-01 TW TW095140436A patent/TW200732508A/zh unknown
- 2006-11-30 US US11/606,158 patent/US20070128373A1/en not_active Abandoned
-
2012
- 2012-04-20 JP JP2012096998A patent/JP5466261B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20070128373A1 (en) | 2007-06-07 |
KR20070058310A (ko) | 2007-06-08 |
JP5466261B2 (ja) | 2014-04-09 |
JP2012136783A (ja) | 2012-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200732508A (en) | Electroless plating apparatus and electroless plating method | |
MY174421A (en) | Transportable integrated wash unit | |
TW200802579A (en) | Liquid processing apparatus | |
TW200737314A (en) | Gas supply system, substrate processing apparatus and gas supply method | |
EP2011897B8 (en) | Method for cleaning deposition chamber parts using selective spray etch | |
WO2010005238A3 (ko) | 무선통신 시스템에서 상향링크 전송 전력 제어 방법 및 단말 | |
PT1967100E (pt) | Sistema e método para a preparação de um líquido alimentar a partir de uma cápsula | |
TW200746339A (en) | Substrate supporting unit, and substrate temperature control apparatus and method | |
TW200725787A (en) | Substrate transportation device, substrate transportation method and coating-developing apparatus | |
EP2172781A3 (en) | Specimen processing device, specimen conveyance device, and specimen conveyance method | |
TW200701353A (en) | Substrate cleaning device and its method | |
TW200942638A (en) | Organic deposition apparatus and method of depositing organic substance using the same | |
MY155187A (en) | Diffuser apparatus, and diffuser apparatus running method | |
ATE369527T1 (de) | Gargerät mit einem garraumablauf und einem siphon | |
IN2012DN00283A (zh) | ||
FR2909101B1 (fr) | Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s) | |
WO2009122274A8 (en) | Device for adjusting the locking point of an electrode | |
TWI255867B (en) | Electroless plating apparatus | |
MX2009012141A (es) | Abrevadero. | |
PL1837443T3 (pl) | Urządzenie do umieszczania kolektorów fotowoltaicznych na ścianie, zwłaszcza na ścianie dźwiękochłonnej | |
TW200606087A (en) | Support guide | |
WO2011038107A3 (en) | Method and apparatus for injecting fluid in a wellbore | |
TW200709863A (en) | Nozzle for supplying treatment liquid and substrate treating apparatus | |
WO2009120034A3 (en) | Substrate processing apparatus and method | |
WO2008108036A1 (ja) | 基材処理装置及びそれを用いた基材処理方法 |