TW200732445A - Removable water-dispersible acrylic adhesive composition and adhesive sheet - Google Patents

Removable water-dispersible acrylic adhesive composition and adhesive sheet

Info

Publication number
TW200732445A
TW200732445A TW095148629A TW95148629A TW200732445A TW 200732445 A TW200732445 A TW 200732445A TW 095148629 A TW095148629 A TW 095148629A TW 95148629 A TW95148629 A TW 95148629A TW 200732445 A TW200732445 A TW 200732445A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
water
dispersible acrylic
adhesive sheet
crosslinker
Prior art date
Application number
TW095148629A
Other languages
English (en)
Inventor
Katsuhiko Kamiya
Tomonari Naito
Satomi Yoshie
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005370230A external-priority patent/JP5235271B2/ja
Priority claimed from JP2005374553A external-priority patent/JP5235273B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200732445A publication Critical patent/TW200732445A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095148629A 2005-12-22 2006-12-22 Removable water-dispersible acrylic adhesive composition and adhesive sheet TW200732445A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005370230A JP5235271B2 (ja) 2005-12-22 2005-12-22 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
JP2005374553A JP5235273B2 (ja) 2005-12-27 2005-12-27 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート

Publications (1)

Publication Number Publication Date
TW200732445A true TW200732445A (en) 2007-09-01

Family

ID=38194177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148629A TW200732445A (en) 2005-12-22 2006-12-22 Removable water-dispersible acrylic adhesive composition and adhesive sheet

Country Status (3)

Country Link
US (1) US7491772B2 (zh)
KR (1) KR20070066929A (zh)
TW (1) TW200732445A (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5000370B2 (ja) * 2007-04-20 2012-08-15 日東電工株式会社 ウォータージェットレーザダイシング用粘着シート
KR100865482B1 (ko) * 2008-03-05 2008-10-27 주식회사 골든포우 내수성 및 방수성이 개선된 수성 아크릴계 에멀젼 방수성점착제 및 그 제조방법
US9752022B2 (en) * 2008-07-10 2017-09-05 Avery Dennison Corporation Composition, film and related methods
ES2712893T3 (es) 2010-03-04 2019-05-16 Avery Dennison Corp Película exenta de PVC y película laminada exenta de PVC
TWI456012B (zh) 2010-06-08 2014-10-11 Henkel IP & Holding GmbH 使用脈衝式ｕｖ光源之晶圓背面塗覆方法
KR101560039B1 (ko) 2010-06-08 2015-10-13 헨켈 아이피 앤드 홀딩 게엠베하 그라인딩 전의 다이싱 및 마이크로 제조된 웨이퍼들 상의 접착제의 코팅
JP5546973B2 (ja) * 2010-07-02 2014-07-09 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物、および該粘着剤を用いた光学部材
KR101115681B1 (ko) * 2010-08-31 2012-02-16 주식회사 엘지화학 재박리형 수성 에멀젼 점착제 및 이의 제조방법
JP5436394B2 (ja) * 2010-10-29 2014-03-05 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
CN102464960B (zh) 2010-10-29 2014-10-15 第一毛织株式会社 粘合剂组合物、光学元件、表面保护膜和粘合剂片
JP5518675B2 (ja) * 2010-10-29 2014-06-11 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
JP2014511560A (ja) 2011-02-01 2014-05-15 ヘンケル コーポレイション プレカットされウェハに塗布されるダイシングテープ上のアンダーフィル膜
EP2671249A4 (en) 2011-02-01 2015-10-07 Henkel IP & Holding GmbH FILLING FILM APPLIED TO A PRE-CUTTING WAFER
TWI598411B (zh) * 2012-05-29 2017-09-11 巴斯夫歐洲公司 用於印刷墨水及塗層之水基聚合物組成物
JP5348343B1 (ja) 2013-04-25 2013-11-20 東洋インキＳｃホールディングス株式会社 感圧式接着剤組成物、及びそれを用いてなる感圧式接着シート
AU2014374206B2 (en) 2013-12-30 2018-02-22 Avery Dennison Corporation Polyurethane protective film
CA2937330A1 (en) * 2014-01-22 2015-07-30 Adhesives Research, Inc. Gamma resistant adhesives
CN106281138A (zh) * 2016-08-08 2017-01-04 澳新粘胶科技(湖北)有限公司 一种环保型压敏胶粘剂
GB2577308A (en) * 2018-09-21 2020-03-25 Synthomer Deutschland Gmbh Contact adhesives
JP2020105407A (ja) * 2018-12-27 2020-07-09 日東電工株式会社 保護シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3319240A1 (de) * 1983-05-27 1984-11-29 Basf Ag, 6700 Ludwigshafen Haftkleberdispersionen zur herstellung selbstklebender artikel z. b. mit polyolefinischen traegern
JP3908929B2 (ja) 2001-06-25 2007-04-25 日東電工株式会社 半導体ウエハ加工用粘着シート及びそれに用いる粘着剤組成物
US20060188714A1 (en) * 2005-02-24 2006-08-24 Lintec Corporation Adhesive sheet

Also Published As

Publication number Publication date
US20070148444A1 (en) 2007-06-28
KR20070066929A (ko) 2007-06-27
US7491772B2 (en) 2009-02-17

Similar Documents

Publication Publication Date Title
TW200732445A (en) Removable water-dispersible acrylic adhesive composition and adhesive sheet
CN107849406B (zh) 粘合带、电子设备部件固定用粘合带和光学用透明粘合带
CN104004477B (zh) 一种室温自交联聚丙烯酸酯压敏胶及其制备方法与应用
JP6194118B2 (ja) アクリル系エマルジョン粘着剤及びその製造方法
CN1651540A (zh) 光学元件用粘合组合物、光学元件用粘合层、光学元件用粘合片及光学元件
TW200706625A (en) Adhesive composition, double-coated adhesive sheet, adhesion method and portable electronic devices
IN2012DN02720A (zh)
JP6014781B1 (ja) 粘着テープ及び電子機器部品固定用の粘着テープ
CN102504717A (zh) 用于低表面能材质粘接的胶带及其制备方法
TW200720081A (en) Pressure-sensitive adhesive sheet and method of processing articles
WO2012173885A3 (en) Structural member for polishing
CN103952105B (zh) 一种聚乙烯保护膜用氟硅改性水性压敏胶及其制备方法
TW201430082A (zh) 黏著劑層及黏著膜
KR101828931B1 (ko) 폴리에틸렌 박리력 및 중합 안정성이 우수한 아크릴계 에멀젼 점착제 및 이의 제조방법
JP2015189852A5 (zh)
MX2013013935A (es) Imprimador para mejorar la adhesion de las cintas adhesivas sobre plasticos y metales que son dificiles de unir.
CN108495903B (zh) 用于制造无色且抗老化的基于聚丙烯酸酯的压敏胶粘剂配混物的方法
JP2011231203A (ja) 表面保護フィルム用アクリル系粘着剤
ATE527330T1 (de) Druckempfindliches acryl-klebeband oder -folie sowie herstellungsverfahren dafür
TW201612273A (en) Adhesive composition, adhesive film, and surface-protective adhesive film
JP2017527634A (ja) 低温粘着力及び保持力に優れたアクリル系エマルジョン粘着剤及びその製造方法
JP2016538407A (ja) ポリプロピレンフィルム用粘着剤組成物及びその製造方法
KR20110021277A (ko) 수성 점착제 조성물, 그 제조방법 및 점착 필름
JP6168347B2 (ja) 粘着テープ
JP2016028166A5 (zh)