TW200729331A - Vacuum processing device - Google Patents
Vacuum processing deviceInfo
- Publication number
- TW200729331A TW200729331A TW095132459A TW95132459A TW200729331A TW 200729331 A TW200729331 A TW 200729331A TW 095132459 A TW095132459 A TW 095132459A TW 95132459 A TW95132459 A TW 95132459A TW 200729331 A TW200729331 A TW 200729331A
- Authority
- TW
- Taiwan
- Prior art keywords
- vacuum processing
- load lock
- processing device
- lock chamber
- chamber
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005255293A JP5078243B2 (ja) | 2005-09-02 | 2005-09-02 | 真空処理装置および真空予備室の排気方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729331A true TW200729331A (en) | 2007-08-01 |
TWI398921B TWI398921B (zh) | 2013-06-11 |
Family
ID=37817678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132459A TWI398921B (zh) | 2005-09-02 | 2006-09-01 | Vacuum processing device and exhaust preparation method of vacuum preparation room |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5078243B2 (zh) |
KR (1) | KR100810804B1 (zh) |
CN (2) | CN101441995B (zh) |
TW (1) | TWI398921B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4965358B2 (ja) * | 2007-06-25 | 2012-07-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5322254B2 (ja) * | 2007-06-29 | 2013-10-23 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理方法並びに記憶媒体 |
JP5028193B2 (ja) * | 2007-09-05 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | 半導体製造装置における被処理体の搬送方法 |
JP5005512B2 (ja) * | 2007-11-07 | 2012-08-22 | 東京エレクトロン株式会社 | ゲートバルブ装置および真空処理装置およびゲートバルブ装置における弁体の開放方法。 |
JP5059583B2 (ja) * | 2007-12-26 | 2012-10-24 | 東京エレクトロン株式会社 | 真空装置、真空処理システムおよび真空室の圧力制御方法 |
JP5123820B2 (ja) * | 2008-10-27 | 2013-01-23 | 東京エレクトロン株式会社 | 基板処理装置の真空排気方法及び基板処理装置 |
KR200473996Y1 (ko) * | 2008-12-22 | 2014-08-13 | 주식회사 테스 | 슬릿밸브 |
JP5546395B2 (ja) * | 2010-09-07 | 2014-07-09 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
GB2492065A (en) * | 2011-06-16 | 2012-12-26 | Edwards Ltd | Noise reduction of a vacuum pumping system |
CN102842637A (zh) * | 2011-06-20 | 2012-12-26 | 理想能源设备(上海)有限公司 | 衬底处理装置和衬底处理方法 |
CN104928645A (zh) * | 2015-04-07 | 2015-09-23 | 凌嘉科技股份有限公司 | 双门闸阀装置及具双门闸阀装置的镀膜设备 |
US11270899B2 (en) * | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
JP7378357B2 (ja) | 2020-06-17 | 2023-11-13 | 東京エレクトロン株式会社 | 基板処理装置およびガス供給配管のパージ方法 |
KR20230001280A (ko) * | 2021-06-28 | 2023-01-04 | 주식회사 원익아이피에스 | 챔버내부처리방법 및 기판처리방법 |
CN116624651A (zh) * | 2022-02-10 | 2023-08-22 | 长鑫存储技术有限公司 | 一种气压平衡阀、气压平衡方法以及负载锁定室 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2939378B2 (ja) * | 1991-11-21 | 1999-08-25 | 東京エレクトロン株式会社 | 真空処理装置 |
JP2598353B2 (ja) * | 1991-12-04 | 1997-04-09 | アネルバ株式会社 | 基板処理装置、基板搬送装置及び基板交換方法 |
JP3154144B2 (ja) * | 1992-09-21 | 2001-04-09 | ソニー株式会社 | チャンバー内の圧力変化方法及び圧力変化されるチャンバーを備えた装置 |
US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
JPH08335572A (ja) * | 1995-06-07 | 1996-12-17 | Hitachi Ltd | 半導体製造装置 |
JP3297632B2 (ja) * | 1997-09-20 | 2002-07-02 | 松下電器産業株式会社 | Cdma端末装置 |
JP3111994B2 (ja) * | 1998-08-03 | 2000-11-27 | 日本電気株式会社 | 金属酸化物誘電体材料の気相成長装置 |
US6746196B1 (en) * | 1999-01-12 | 2004-06-08 | Tokyo Electron Limited | Vacuum treatment device |
US6095741A (en) * | 1999-03-29 | 2000-08-01 | Lam Research Corporation | Dual sided slot valve and method for implementing the same |
US6267545B1 (en) * | 1999-03-29 | 2001-07-31 | Lam Research Corporation | Semiconductor processing platform architecture having processing module isolation capabilities |
JP2002110560A (ja) * | 2000-09-29 | 2002-04-12 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
JP4841035B2 (ja) * | 2000-11-27 | 2011-12-21 | 東京エレクトロン株式会社 | 真空処理装置 |
JP2002329763A (ja) * | 2001-04-27 | 2002-11-15 | Yaskawa Electric Corp | 気密室間の連結構造 |
JP2004087781A (ja) * | 2002-08-27 | 2004-03-18 | Ulvac Japan Ltd | 真空処理装置及び真空処理方法 |
JP2004119595A (ja) * | 2002-09-25 | 2004-04-15 | Sharp Corp | 真空チャンバーの減圧方法および真空チャンバーの減圧装置 |
JP2004241566A (ja) * | 2003-02-05 | 2004-08-26 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4319434B2 (ja) * | 2003-03-11 | 2009-08-26 | 東京エレクトロン株式会社 | ゲートバルブ及び真空容器 |
JP2005116854A (ja) * | 2003-10-09 | 2005-04-28 | Canon Inc | ロードロックチャンバー、露光装置、デバイスの製造方法 |
-
2005
- 2005-09-02 JP JP2005255293A patent/JP5078243B2/ja active Active
-
2006
- 2006-09-01 CN CN2008101857774A patent/CN101441995B/zh active Active
- 2006-09-01 CN CNB2006101289137A patent/CN100463105C/zh not_active Expired - Fee Related
- 2006-09-01 TW TW095132459A patent/TWI398921B/zh active
- 2006-09-01 KR KR1020060084292A patent/KR100810804B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100463105C (zh) | 2009-02-18 |
KR20070026241A (ko) | 2007-03-08 |
CN1925110A (zh) | 2007-03-07 |
KR100810804B1 (ko) | 2008-03-06 |
JP2007073541A (ja) | 2007-03-22 |
JP5078243B2 (ja) | 2012-11-21 |
CN101441995B (zh) | 2013-09-11 |
TWI398921B (zh) | 2013-06-11 |
CN101441995A (zh) | 2009-05-27 |
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