TW200721515A - Photovoltaic contact and wiring formation - Google Patents
Photovoltaic contact and wiring formationInfo
- Publication number
- TW200721515A TW200721515A TW095141211A TW95141211A TW200721515A TW 200721515 A TW200721515 A TW 200721515A TW 095141211 A TW095141211 A TW 095141211A TW 95141211 A TW95141211 A TW 95141211A TW 200721515 A TW200721515 A TW 200721515A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- contact
- wiring
- metal
- sputtering
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 6
- 238000000151 deposition Methods 0.000 abstract 3
- 239000007769 metal material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000005240 physical vapour deposition Methods 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000000137 annealing Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000000977 initiatory effect Effects 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 abstract 1
- 229910021332 silicide Inorganic materials 0.000 abstract 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73441005P | 2005-11-07 | 2005-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200721515A true TW200721515A (en) | 2007-06-01 |
Family
ID=38509946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095141211A TW200721515A (en) | 2005-11-07 | 2006-11-07 | Photovoltaic contact and wiring formation |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070148336A1 (zh) |
EP (1) | EP1952431A2 (zh) |
JP (1) | JP2009515369A (zh) |
KR (1) | KR20080075156A (zh) |
CN (1) | CN101305454B (zh) |
TW (1) | TW200721515A (zh) |
WO (1) | WO2007106180A2 (zh) |
Cited By (2)
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TWI404811B (zh) * | 2009-05-07 | 2013-08-11 | Atomic Energy Council | 金屬氮氧化物薄膜結構之製作方法 |
TWI425595B (zh) * | 2011-01-14 | 2014-02-01 |
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US20080279658A1 (en) * | 2007-05-11 | 2008-11-13 | Bachrach Robert Z | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
US20080279672A1 (en) * | 2007-05-11 | 2008-11-13 | Bachrach Robert Z | Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory |
US7496423B2 (en) * | 2007-05-11 | 2009-02-24 | Applied Materials, Inc. | Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots |
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DE10107600C1 (de) * | 2001-02-17 | 2002-08-22 | Saint Gobain | Verfahren zum Betreiben eines photovoltaischen Solarmoduls und photovoltaischer Solarmodul |
JP2002368247A (ja) * | 2001-06-01 | 2002-12-20 | Canon Inc | 太陽電池構造体、太陽電池アレイ及び太陽光発電システム |
US6815788B2 (en) * | 2001-08-10 | 2004-11-09 | Hitachi Cable Ltd. | Crystalline silicon thin film semiconductor device, crystalline silicon thin film photovoltaic device, and process for producing crystalline silicon thin film semiconductor device |
US6844568B2 (en) * | 2002-04-25 | 2005-01-18 | Kyocera Corporation | Photoelectric conversion device and manufacturing process thereof |
US20050189013A1 (en) * | 2003-12-23 | 2005-09-01 | Oliver Hartley | Process for manufacturing photovoltaic cells |
-
2006
- 2006-11-06 US US11/556,776 patent/US20070148336A1/en not_active Abandoned
- 2006-11-06 EP EP06850101A patent/EP1952431A2/en not_active Withdrawn
- 2006-11-06 WO PCT/US2006/060568 patent/WO2007106180A2/en active Application Filing
- 2006-11-06 KR KR1020087013628A patent/KR20080075156A/ko not_active Application Discontinuation
- 2006-11-06 CN CN200680041466XA patent/CN101305454B/zh not_active Expired - Fee Related
- 2006-11-06 JP JP2008540312A patent/JP2009515369A/ja not_active Withdrawn
- 2006-11-07 TW TW095141211A patent/TW200721515A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI404811B (zh) * | 2009-05-07 | 2013-08-11 | Atomic Energy Council | 金屬氮氧化物薄膜結構之製作方法 |
TWI425595B (zh) * | 2011-01-14 | 2014-02-01 |
Also Published As
Publication number | Publication date |
---|---|
WO2007106180A3 (en) | 2007-12-06 |
WO2007106180A2 (en) | 2007-09-20 |
JP2009515369A (ja) | 2009-04-09 |
CN101305454A (zh) | 2008-11-12 |
KR20080075156A (ko) | 2008-08-14 |
US20070148336A1 (en) | 2007-06-28 |
CN101305454B (zh) | 2010-05-19 |
EP1952431A2 (en) | 2008-08-06 |
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