TW200720681A - Electronic component test apparatus and temperature control method in electronic component test apparatus - Google Patents
Electronic component test apparatus and temperature control method in electronic component test apparatusInfo
- Publication number
- TW200720681A TW200720681A TW095130792A TW95130792A TW200720681A TW 200720681 A TW200720681 A TW 200720681A TW 095130792 A TW095130792 A TW 095130792A TW 95130792 A TW95130792 A TW 95130792A TW 200720681 A TW200720681 A TW 200720681A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- test apparatus
- component test
- temperature
- control method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/015481 WO2007023557A1 (ja) | 2005-08-25 | 2005-08-25 | 電子部品試験装置および電子部品試験装置における温度制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200720681A true TW200720681A (en) | 2007-06-01 |
TWI300485B TWI300485B (zh) | 2008-09-01 |
Family
ID=37771315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095130792A TW200720681A (en) | 2005-08-25 | 2006-08-22 | Electronic component test apparatus and temperature control method in electronic component test apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US7768286B2 (zh) |
JP (1) | JPWO2007023557A1 (zh) |
KR (1) | KR100930657B1 (zh) |
CN (1) | CN101248361A (zh) |
TW (1) | TW200720681A (zh) |
WO (1) | WO2007023557A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI603172B (zh) * | 2015-10-26 | 2017-10-21 | 陽榮科技股份有限公司 | Ic溫控裝置及方法 |
TWI815203B (zh) * | 2020-11-30 | 2023-09-11 | 日商阿德潘鐵斯特股份有限公司 | 電子部件處理裝置、電子部件測試裝置及電子部件測試方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7969175B2 (en) | 2009-05-07 | 2011-06-28 | Aehr Test Systems | Separate test electronics and blower modules in an apparatus for testing an integrated circuit |
JPWO2011007419A1 (ja) * | 2009-07-14 | 2012-12-20 | 株式会社アドバンテスト | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
JP5601863B2 (ja) * | 2010-03-29 | 2014-10-08 | 三菱電機株式会社 | 電力半導体装置 |
US8854069B2 (en) * | 2011-01-05 | 2014-10-07 | Texas Instruments Incorporated | Production integrated circuit test handler using microcontroller reading a thermal diode of a device under test for temperature control |
KR102006508B1 (ko) * | 2011-08-17 | 2019-08-01 | 램 리써치 코포레이션 | 멀티플렉싱된 가열기 어레이의 온도를 모니터링하고 이를 제어하는 시스템 및 방법 |
JP5758790B2 (ja) * | 2011-12-14 | 2015-08-05 | Necフィールディング株式会社 | ストレステストシステムおよびその方法、ストレステスト制御装置およびその制御方法と制御プログラム、冷却加熱装置、および、テストプログラム |
KR20140080750A (ko) * | 2012-12-14 | 2014-07-01 | 한국전자통신연구원 | 반도체 소자 테스트 장치 |
US9470720B2 (en) * | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
US10914635B2 (en) | 2014-09-29 | 2021-02-09 | Rosemount Inc. | Wireless industrial process monitor |
JP2016188782A (ja) * | 2015-03-30 | 2016-11-04 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP6426552B2 (ja) * | 2015-07-29 | 2018-11-21 | 日立オートモティブシステムズ株式会社 | バーンイン試験装置及び方法 |
CN105157865B (zh) * | 2015-08-17 | 2017-07-11 | 济南晶恒电子有限责任公司 | 二极管的热焊接试验台及试验方法 |
KR102175798B1 (ko) * | 2015-11-13 | 2020-11-06 | 주식회사 아이에스시 | 인터페이스 모듈 및 이를 포함하는 반도체 소자 테스트 장치 |
JP5916025B1 (ja) * | 2015-12-11 | 2016-05-11 | 上野精機株式会社 | 電気特性テスト装置 |
KR102478111B1 (ko) * | 2016-07-27 | 2022-12-14 | 삼성전자주식회사 | 테스트 장치 |
US10479495B2 (en) * | 2016-08-10 | 2019-11-19 | Bell Helicopter Textron Inc. | Aircraft tail with cross-flow fan systems |
US10514416B2 (en) * | 2017-09-29 | 2019-12-24 | Advantest Corporation | Electronic component handling apparatus and electronic component testing apparatus |
CN110618370B (zh) * | 2018-06-04 | 2022-02-01 | 苏州能讯高能半导体有限公司 | 测试装置 |
JP7143134B2 (ja) * | 2018-07-26 | 2022-09-28 | 株式会社アドバンテスト | ロードボード及び電子部品試験装置 |
JP6719784B2 (ja) | 2018-12-21 | 2020-07-08 | 株式会社 Synax | ハンドラ |
JP6770758B2 (ja) | 2019-01-15 | 2020-10-21 | 株式会社 Synax | コンタクタおよびハンドラ |
CN111951878A (zh) * | 2019-05-16 | 2020-11-17 | 第一检测有限公司 | 检测设备、芯片承载装置及电连接单元 |
CN113182198B (zh) * | 2020-01-14 | 2023-08-29 | 鸿劲精密股份有限公司 | 具温控单元的测试装置及其应用的测试分类设备 |
KR102295435B1 (ko) | 2020-03-12 | 2021-08-31 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법 |
US11573267B1 (en) * | 2021-11-12 | 2023-02-07 | Advantest Corporation | Electronic component handling apparatus and electronic component testing apparatus |
CN114442694B (zh) * | 2021-12-31 | 2023-03-21 | 重庆长安新能源汽车科技有限公司 | 一种自校准的碳化硅电机控制器结温估算方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0964128A (ja) * | 1995-08-28 | 1997-03-07 | Hitachi Ltd | バーンイン方法および装置 |
JP3784884B2 (ja) * | 1996-05-15 | 2006-06-14 | エスペック株式会社 | 試料実測式環境試験装置 |
JPH09312359A (ja) * | 1996-05-22 | 1997-12-02 | Nec Gumma Ltd | 半導体集積回路の内部温度測定方法ならびにこれを用い た半導体集積回路の冷却方法および冷却装置 |
JP2000035462A (ja) * | 1998-07-16 | 2000-02-02 | Advantest Corp | 半導体試験装置 |
SG98373A1 (en) * | 1998-11-25 | 2003-09-19 | Advantest Corp | Device testing apparatus |
JP4054473B2 (ja) * | 1999-02-22 | 2008-02-27 | 株式会社アドバンテスト | 電子部品試験装置および電子部品の試験方法 |
JP3700505B2 (ja) | 1999-12-07 | 2005-09-28 | セイコーエプソン株式会社 | Icハンドラー |
WO2003075025A1 (fr) * | 2002-03-07 | 2003-09-12 | Advantest Corporation | Dispositif d'essai de composants electroniques |
JP4086613B2 (ja) * | 2002-10-09 | 2008-05-14 | Necエレクトロニクス株式会社 | 半導体装置および内部温度測定方法 |
JP2004245756A (ja) | 2003-02-17 | 2004-09-02 | Alps Electric Co Ltd | ジャンクション温度の推定方法 |
US7345495B2 (en) * | 2004-06-30 | 2008-03-18 | Intel Corporation | Temperature and voltage controlled integrated circuit processes |
-
2005
- 2005-08-25 KR KR1020087006854A patent/KR100930657B1/ko active IP Right Grant
- 2005-08-25 US US11/990,435 patent/US7768286B2/en not_active Expired - Fee Related
- 2005-08-25 JP JP2007531999A patent/JPWO2007023557A1/ja active Pending
- 2005-08-25 CN CNA2005800514038A patent/CN101248361A/zh active Pending
- 2005-08-25 WO PCT/JP2005/015481 patent/WO2007023557A1/ja active Application Filing
-
2006
- 2006-08-22 TW TW095130792A patent/TW200720681A/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI603172B (zh) * | 2015-10-26 | 2017-10-21 | 陽榮科技股份有限公司 | Ic溫控裝置及方法 |
TWI815203B (zh) * | 2020-11-30 | 2023-09-11 | 日商阿德潘鐵斯特股份有限公司 | 電子部件處理裝置、電子部件測試裝置及電子部件測試方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI300485B (zh) | 2008-09-01 |
KR100930657B1 (ko) | 2009-12-09 |
WO2007023557A1 (ja) | 2007-03-01 |
US7768286B2 (en) | 2010-08-03 |
KR20080040016A (ko) | 2008-05-07 |
US20090051381A1 (en) | 2009-02-26 |
JPWO2007023557A1 (ja) | 2009-02-26 |
CN101248361A (zh) | 2008-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |