TW200716989A - Testing apparatus, fixture board and pin electronics card - Google Patents

Testing apparatus, fixture board and pin electronics card

Info

Publication number
TW200716989A
TW200716989A TW095139493A TW95139493A TW200716989A TW 200716989 A TW200716989 A TW 200716989A TW 095139493 A TW095139493 A TW 095139493A TW 95139493 A TW95139493 A TW 95139493A TW 200716989 A TW200716989 A TW 200716989A
Authority
TW
Taiwan
Prior art keywords
testing apparatus
dut
testing
emphasis circuit
filter
Prior art date
Application number
TW095139493A
Other languages
English (en)
Other versions
TWI401441B (zh
Inventor
Daisuke Watanabe
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200716989A publication Critical patent/TW200716989A/zh
Application granted granted Critical
Publication of TWI401441B publication Critical patent/TWI401441B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31928—Formatter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
TW095139493A 2005-10-28 2006-10-26 測試裝置、配置板、電子卡 TWI401441B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315294 2005-10-28

Publications (2)

Publication Number Publication Date
TW200716989A true TW200716989A (en) 2007-05-01
TWI401441B TWI401441B (zh) 2013-07-11

Family

ID=37967588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139493A TWI401441B (zh) 2005-10-28 2006-10-26 測試裝置、配置板、電子卡

Country Status (6)

Country Link
US (1) US7795879B2 (zh)
JP (1) JP4944789B2 (zh)
KR (1) KR100949282B1 (zh)
DE (1) DE112006003065T5 (zh)
TW (1) TWI401441B (zh)
WO (1) WO2007049475A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009278412A (ja) * 2008-05-15 2009-11-26 Yokogawa Electric Corp 高速信号伝送線路とそれを用いた半導体試験装置
DE102008026276B4 (de) * 2008-06-02 2012-08-09 Sartorius Weighing Technology Gmbh Verfahren zum Untersuchen einer Leiterplatte und elektronisches Gerät
US8350583B2 (en) * 2009-08-12 2013-01-08 International Business Machines Corporation Probe-able voltage contrast test structures
JP5496940B2 (ja) * 2010-08-11 2014-05-21 アンリツ株式会社 エンファシス付加装置及びエンファシス付加方法
US8399266B2 (en) 2011-01-25 2013-03-19 International Business Machines Corporation Test structure for detection of gap in conductive layer of multilayer gate stack
US9025652B2 (en) * 2011-02-04 2015-05-05 Tektronix, Inc. Variable inter symbol interference generator
US9780007B2 (en) 2012-01-04 2017-10-03 Globalfoundries Inc. LCR test circuit structure for detecting metal gate defect conditions
US9182440B1 (en) * 2012-01-30 2015-11-10 Marvell International Ltd. Pressure activated high density switch array

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1541837B2 (de) 1966-09-23 1977-03-31 Siemens AG, 1000 Berlin und 8000 München Schaltungsanordnung zur messung der daempfung oder verstaerkung eines elektrischen vierpols nach dem vergleichsverfahren
FR2124059B1 (zh) * 1971-02-02 1976-05-28 Lignes Telegraph Telephon
JPH09312586A (ja) 1996-05-20 1997-12-02 Hitachi Denshi Ltd 無線機
JP2988375B2 (ja) * 1996-05-22 1999-12-13 日本電気株式会社 Ｆｍ通信システム
JP3209734B2 (ja) 1998-09-29 2001-09-17 松下電器産業株式会社 半導体集積回路及びその検査方法
TW495616B (en) 1999-04-06 2002-07-21 Advantest Corp Test device and method for electrically testing electronic device
JPWO2004023552A1 (ja) * 2002-09-05 2006-01-05 株式会社ルネサステクノロジ マルチチップ半導体装置およびテスト方法並びにシステム用基板
US7573286B2 (en) * 2003-05-16 2009-08-11 E.I. Du Pont De Nemours And Company System and method for testing displays
JP2005315294A (ja) 2004-04-27 2005-11-10 Toyota Motor Corp 高圧タンク

Also Published As

Publication number Publication date
WO2007049475A1 (ja) 2007-05-03
US7795879B2 (en) 2010-09-14
KR100949282B1 (ko) 2010-03-25
US20080218178A1 (en) 2008-09-11
DE112006003065T5 (de) 2008-09-25
TWI401441B (zh) 2013-07-11
JPWO2007049475A1 (ja) 2009-04-30
KR20080070689A (ko) 2008-07-30
JP4944789B2 (ja) 2012-06-06

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