TW200710583A - Peripheral exposure device, coating and developing apparatus and peripheral exposure method - Google Patents
Peripheral exposure device, coating and developing apparatus and peripheral exposure methodInfo
- Publication number
- TW200710583A TW200710583A TW095116240A TW95116240A TW200710583A TW 200710583 A TW200710583 A TW 200710583A TW 095116240 A TW095116240 A TW 095116240A TW 95116240 A TW95116240 A TW 95116240A TW 200710583 A TW200710583 A TW 200710583A
- Authority
- TW
- Taiwan
- Prior art keywords
- peripheral exposure
- optical path
- path forming
- light
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
- G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005136575A JP4642543B2 (ja) | 2005-05-09 | 2005-05-09 | 周縁露光装置、塗布、現像装置及び周縁露光方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200710583A true TW200710583A (en) | 2007-03-16 |
TWI334061B TWI334061B (zh) | 2010-12-01 |
Family
ID=36808766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095116240A TW200710583A (en) | 2005-05-09 | 2006-05-08 | Peripheral exposure device, coating and developing apparatus and peripheral exposure method |
Country Status (7)
Country | Link |
---|---|
US (1) | US7573054B2 (zh) |
EP (1) | EP1722402B1 (zh) |
JP (1) | JP4642543B2 (zh) |
KR (1) | KR101105568B1 (zh) |
CN (1) | CN100465795C (zh) |
DE (1) | DE602006015126D1 (zh) |
TW (1) | TW200710583A (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100733137B1 (ko) * | 2006-06-14 | 2007-06-28 | 삼성전자주식회사 | 웨이퍼 에지 노광 장치 |
US7659965B2 (en) * | 2006-10-06 | 2010-02-09 | Wafertech, Llc | High throughput wafer stage design for optical lithography exposure apparatus |
CN101216679B (zh) * | 2007-12-28 | 2011-03-30 | 上海微电子装备有限公司 | 一种边缘曝光装置 |
US7901854B2 (en) * | 2009-05-08 | 2011-03-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer edge exposure unit |
US8625076B2 (en) * | 2010-02-09 | 2014-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer edge exposure module |
JP5327135B2 (ja) * | 2010-05-11 | 2013-10-30 | 東京エレクトロン株式会社 | 周縁露光装置及び周縁露光方法 |
CN103034062B (zh) * | 2011-09-29 | 2014-11-26 | 中芯国际集成电路制造(北京)有限公司 | 用于晶片边缘曝光的方法、光学模块和自动聚焦系统 |
US8903532B2 (en) | 2012-03-26 | 2014-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Litho cluster and modulization to enhance productivity |
US9196515B2 (en) | 2012-03-26 | 2015-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Litho cluster and modulization to enhance productivity |
JP5873907B2 (ja) * | 2013-09-03 | 2016-03-01 | キヤノン・コンポーネンツ株式会社 | 照明装置、イメージセンサユニット、画像読取装置および画像形成装置 |
US9287151B2 (en) * | 2014-01-10 | 2016-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd | Systems and method for transferring a semiconductor substrate |
US9891529B2 (en) * | 2014-03-28 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Light transmission device and method for semiconductor manufacturing process |
JP6661270B2 (ja) | 2015-01-16 | 2020-03-11 | キヤノン株式会社 | 露光装置、露光システム、および物品の製造方法 |
CN106292195B (zh) * | 2015-05-24 | 2018-08-14 | 上海微电子装备(集团)股份有限公司 | 边缘曝光装置和方法 |
JP6444909B2 (ja) * | 2016-02-22 | 2018-12-26 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 |
US10558125B2 (en) * | 2016-11-17 | 2020-02-11 | Tokyo Electron Limited | Exposure apparatus, exposure apparatus adjustment method and storage medium |
US10747121B2 (en) * | 2016-12-13 | 2020-08-18 | Tokyo Electron Limited | Optical processing apparatus and substrate processing apparatus |
JP7124277B2 (ja) * | 2016-12-13 | 2022-08-24 | 東京エレクトロン株式会社 | 光処理装置及び基板処理装置 |
CN108803245B (zh) * | 2017-04-28 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | 硅片处理装置及方法 |
US10295909B2 (en) | 2017-09-26 | 2019-05-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Edge-exposure tool with an ultraviolet (UV) light emitting diode (LED) |
JP7312692B2 (ja) * | 2019-12-25 | 2023-07-21 | 株式会社Screenホールディングス | エッジ露光装置およびエッジ露光方法 |
CN111427231A (zh) * | 2020-04-09 | 2020-07-17 | 深圳市华星光电半导体显示技术有限公司 | 掩膜板和新型产线 |
CN112799282A (zh) * | 2020-12-30 | 2021-05-14 | 六安优云通信技术有限公司 | 一种电源芯片制造用晶圆光刻显影蚀刻装置及其制备工艺 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH053214Y2 (zh) * | 1987-01-06 | 1993-01-26 | ||
KR960016175B1 (en) * | 1987-08-28 | 1996-12-04 | Tokyo Electron Ltd | Exposing method and apparatus thereof |
JPH0750680B2 (ja) * | 1988-12-28 | 1995-05-31 | ウシオ電機株式会社 | ウエハ周辺露光装置 |
JPH0775220B2 (ja) * | 1991-03-20 | 1995-08-09 | ウシオ電機株式会社 | ウエハ上の不要レジスト露光方法 |
JPH06112103A (ja) * | 1992-09-24 | 1994-04-22 | Mitsubishi Electric Corp | 露光装置および露光方法 |
KR0179163B1 (ko) * | 1995-12-26 | 1999-03-20 | 문정환 | 비휘발성 메모리 셀 및 그 제조방법 |
JP3237522B2 (ja) | 1996-02-05 | 2001-12-10 | ウシオ電機株式会社 | ウエハ周辺露光方法および装置 |
JPH09283396A (ja) * | 1996-04-08 | 1997-10-31 | Sony Corp | 周辺露光装置および周辺露光方法 |
JP2924881B2 (ja) * | 1997-01-27 | 1999-07-26 | 住友電気工業株式会社 | 波長可変光源およびotdr装置 |
JPH10233354A (ja) * | 1997-02-20 | 1998-09-02 | Ushio Inc | 紫外線照射装置 |
JPH10335216A (ja) | 1997-05-30 | 1998-12-18 | Dainippon Screen Mfg Co Ltd | 基板処理方法 |
KR100250152B1 (ko) * | 1997-11-15 | 2000-03-15 | 유무성 | 노광장치 |
JP3356047B2 (ja) | 1997-11-26 | 2002-12-09 | ウシオ電機株式会社 | ウエハ周辺露光装置 |
JP2000077299A (ja) * | 1998-08-28 | 2000-03-14 | Dainippon Screen Mfg Co Ltd | 基板端縁露光装置 |
US6240874B1 (en) * | 1999-05-27 | 2001-06-05 | Advanced Micro Devices, Inc. | Integrated edge exposure and hot/cool plate for a wafer track system |
JP2001007012A (ja) * | 1999-06-24 | 2001-01-12 | Dainippon Screen Mfg Co Ltd | 露光装置 |
MXPA02001391A (es) * | 1999-08-11 | 2004-07-16 | Luckoff Display Corp | Direccion de senales opticas mediante un elemento optico difrangente movible. |
US6618118B2 (en) * | 2001-05-08 | 2003-09-09 | Asml Netherlands B.V. | Optical exposure method, device manufacturing method and lithographic projection apparatus |
KR100387418B1 (ko) | 2001-05-23 | 2003-06-18 | 한국디엔에스 주식회사 | 반도체 제조 공정에서 사용되는 스피너 시스템 |
KR20020094504A (ko) | 2001-06-12 | 2002-12-18 | 삼성전자 주식회사 | 웨이퍼 에지 노광 장치 |
JP4090273B2 (ja) | 2002-05-23 | 2008-05-28 | 株式会社Sokudo | エッジ露光装置 |
KR100478730B1 (ko) * | 2002-07-30 | 2005-03-24 | 주식회사 제일 | 기판 주변 노광 장치 |
KR20040024165A (ko) | 2002-09-13 | 2004-03-20 | 삼성전자주식회사 | 웨이퍼 에지 노광 장치 |
JP4318913B2 (ja) * | 2002-12-26 | 2009-08-26 | 東京エレクトロン株式会社 | 塗布処理装置 |
JP4083100B2 (ja) * | 2003-09-22 | 2008-04-30 | 株式会社Sokudo | 周縁部露光装置 |
KR100585170B1 (ko) * | 2004-12-27 | 2006-06-02 | 삼성전자주식회사 | 트윈 기판 스테이지를 구비한 스캐너 장치, 이를 포함하는반도체 사진 설비 및 상기 설비를 이용한 반도체 소자의제조방법 |
-
2005
- 2005-05-09 JP JP2005136575A patent/JP4642543B2/ja active Active
-
2006
- 2006-05-04 US US11/417,163 patent/US7573054B2/en active Active
- 2006-05-08 EP EP06009433A patent/EP1722402B1/en not_active Not-in-force
- 2006-05-08 KR KR1020060041108A patent/KR101105568B1/ko active IP Right Grant
- 2006-05-08 DE DE602006015126T patent/DE602006015126D1/de active Active
- 2006-05-08 TW TW095116240A patent/TW200710583A/zh unknown
- 2006-05-09 CN CNB2006100803180A patent/CN100465795C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
DE602006015126D1 (de) | 2010-08-12 |
KR101105568B1 (ko) | 2012-01-17 |
US7573054B2 (en) | 2009-08-11 |
EP1722402A3 (en) | 2007-08-01 |
CN1862387A (zh) | 2006-11-15 |
TWI334061B (zh) | 2010-12-01 |
CN100465795C (zh) | 2009-03-04 |
KR20060116167A (ko) | 2006-11-14 |
JP2006313862A (ja) | 2006-11-16 |
EP1722402A2 (en) | 2006-11-15 |
US20060250594A1 (en) | 2006-11-09 |
EP1722402B1 (en) | 2010-06-30 |
JP4642543B2 (ja) | 2011-03-02 |
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