TW200705581A - Cooper bonding wire with improved bonding and corrosion properties - Google Patents

Cooper bonding wire with improved bonding and corrosion properties

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Publication number
TW200705581A
TW200705581A TW095107821A TW95107821A TW200705581A TW 200705581 A TW200705581 A TW 200705581A TW 095107821 A TW095107821 A TW 095107821A TW 95107821 A TW95107821 A TW 95107821A TW 200705581 A TW200705581 A TW 200705581A
Authority
TW
Taiwan
Prior art keywords
bonding
copper
gold
wire
cooper
Prior art date
Application number
TW095107821A
Other languages
English (en)
Inventor
Albrecht Bischoff
Lutz Schrapler
Heinz Forderer
Frank Kruger
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of TW200705581A publication Critical patent/TW200705581A/zh

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    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/941Solid state alloying, e.g. diffusion, to disappearance of an original layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12438Composite
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12458All metal or with adjacent metals having composition, density, or hardness gradient
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2933Coated or with bond, impregnation or core
    • Y10T428/2938Coating on discrete and individual rods, strands or filaments
TW095107821A 2005-03-08 2006-03-08 Cooper bonding wire with improved bonding and corrosion properties TW200705581A (en)

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DE102005011028A DE102005011028A1 (de) 2005-03-08 2005-03-08 Kupferbonddraht mit verbesserten Bond- und Korrosionseigenschaften

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DE102008043361A1 (de) 2008-10-31 2010-05-06 Micro Systems Engineering Gmbh Anschlussdraht und Verfahren zur Herstellung eines solchen
US8572838B2 (en) 2011-03-02 2013-11-05 Honeywell International Inc. Methods for fabricating high temperature electromagnetic coil assemblies
DE102011106518B4 (de) * 2011-06-15 2017-12-28 Heraeus Deutschland GmbH & Co. KG Draht für Schleifkontakte und Schleifkontakte
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DE102013000057B4 (de) 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
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KR102450574B1 (ko) 2015-11-19 2022-10-11 삼성전자주식회사 반도체 패키지용 본딩 와이어 및 이를 포함하는 반도체 패키지
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KR101004866B1 (ko) 2010-12-28
CN101138086B (zh) 2011-08-31
US20080076251A1 (en) 2008-03-27
JP2008533707A (ja) 2008-08-21
EP1856736A1 (de) 2007-11-21
WO2006094654A1 (de) 2006-09-14
DE102005011028A1 (de) 2006-09-14
CN101138086A (zh) 2008-03-05
JP5550231B2 (ja) 2014-07-16
KR20070108541A (ko) 2007-11-12
US7645522B2 (en) 2010-01-12

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