TW200704812A - Vapor deposition device - Google Patents

Vapor deposition device

Info

Publication number
TW200704812A
TW200704812A TW095111160A TW95111160A TW200704812A TW 200704812 A TW200704812 A TW 200704812A TW 095111160 A TW095111160 A TW 095111160A TW 95111160 A TW95111160 A TW 95111160A TW 200704812 A TW200704812 A TW 200704812A
Authority
TW
Taiwan
Prior art keywords
vapor deposition
substrate
deposition device
evaporator tube
nozzle bar
Prior art date
Application number
TW095111160A
Other languages
English (en)
Other versions
TWI314587B (en
Inventor
Marcus Bender
Uwe Hoffmann
Gunter Klemm
Dieter Haas
Ulrich Englert
Original Assignee
Applied Films Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Films Gmbh & Co Kg filed Critical Applied Films Gmbh & Co Kg
Publication of TW200704812A publication Critical patent/TW200704812A/zh
Application granted granted Critical
Publication of TWI314587B publication Critical patent/TWI314587B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
TW095111160A 2005-07-28 2006-03-30 Vapor deposition device TWI314587B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05016365A EP1752554B1 (de) 2005-07-28 2005-07-28 Bedampfervorrichtung

Publications (2)

Publication Number Publication Date
TW200704812A true TW200704812A (en) 2007-02-01
TWI314587B TWI314587B (en) 2009-09-11

Family

ID=35427677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111160A TWI314587B (en) 2005-07-28 2006-03-30 Vapor deposition device

Country Status (9)

Country Link
US (1) US20070022955A1 (zh)
EP (1) EP1752554B1 (zh)
JP (1) JP4681498B2 (zh)
KR (1) KR100712311B1 (zh)
CN (1) CN1904130A (zh)
AT (1) ATE376078T1 (zh)
DE (1) DE502005001749D1 (zh)
PL (1) PL1752554T3 (zh)
TW (1) TWI314587B (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2168644B1 (en) 2008-09-29 2014-11-05 Applied Materials, Inc. Evaporator for organic materials and method for evaporating organic materials
JP5623786B2 (ja) * 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
TWI472639B (zh) 2009-05-22 2015-02-11 Samsung Display Co Ltd 薄膜沉積設備
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) * 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8291872B2 (en) * 2009-06-12 2012-10-23 Ut-Battelle, Llc Highly efficient 6-stroke engine cycle with water injection
KR101117719B1 (ko) * 2009-06-24 2012-03-08 삼성모바일디스플레이주식회사 박막 증착 장치
JP4831841B2 (ja) * 2009-07-10 2011-12-07 三菱重工業株式会社 真空蒸着装置及び方法
US20110033621A1 (en) * 2009-08-10 2011-02-10 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus including deposition blade
JP5328726B2 (ja) * 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
JP5543159B2 (ja) * 2009-09-07 2014-07-09 株式会社オプトラン リニア蒸着源とその使用方法、成膜装置並びに成膜方法
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) * 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
FR2956411B1 (fr) * 2010-02-16 2012-04-06 Astron Fiamm Safety Systeme de chauffage d'une source de depot en phase vapeur
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
DE102010017895A1 (de) * 2010-04-21 2011-10-27 Ald Vacuum Technologies Gmbh Vorrichtung zum Beschichten von Substraten nach dem EB/PVD-Verfahren
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
JP2012026009A (ja) * 2010-07-26 2012-02-09 Ulvac Japan Ltd 薄膜形成装置
KR101673017B1 (ko) 2010-07-30 2016-11-07 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101237772B1 (ko) * 2010-11-30 2013-02-28 주식회사 케이씨텍 샤워헤드를 구비하는 직립방식 증착장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
CN103545460B (zh) * 2012-07-10 2017-04-12 三星显示有限公司 有机发光显示装置、有机发光显示设备及其制造方法
US10548367B2 (en) * 2013-01-29 2020-02-04 Exxonmobil Chemical Patents Inc. Footwear sole comprising a propylene-based elastomer, footwear comprising said sole, and methods of making them
KR20140118551A (ko) 2013-03-29 2014-10-08 삼성디스플레이 주식회사 증착 장치, 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치
KR102037376B1 (ko) 2013-04-18 2019-10-29 삼성디스플레이 주식회사 패터닝 슬릿 시트, 이를 구비하는 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
KR101479942B1 (ko) * 2013-06-21 2015-01-12 주식회사 에스에프에이 리니어 증발 소스 및 그를 구비하는 평판표시소자용 기판 증착장치
EP3119920A1 (en) * 2014-03-21 2017-01-25 Applied Materials, Inc. Evaporation source for organic material
CN104078626B (zh) * 2014-07-22 2016-07-06 深圳市华星光电技术有限公司 用于oled材料蒸镀的加热装置
KR20160090983A (ko) * 2015-01-22 2016-08-02 삼성디스플레이 주식회사 리플렉터를 구비한 증착원
FR3036710B1 (fr) * 2015-05-27 2020-06-19 China Triumph International Engineering Co., Ltd. Diaphragme a comportement d'emission thermique optimise
CN104988463B (zh) * 2015-06-24 2018-11-06 深圳市华星光电技术有限公司 一种加热源及有机发光二极管的蒸镀机
KR102045384B1 (ko) * 2015-07-13 2019-11-15 어플라이드 머티어리얼스, 인코포레이티드 증발 소스
CN105420675A (zh) * 2015-12-30 2016-03-23 山东大学 一种减少蒸发镀膜设备中衬底或其上的材料受烘烤升温影响的装置及应用
CN105543782A (zh) * 2015-12-30 2016-05-04 山东大学 一种避免衬底或其上的材料受烘烤损坏的蒸发镀膜设备及应用
CN107400861B (zh) * 2017-09-21 2020-05-08 深圳市华格纳米科技有限公司 一种自动化连续式电阻蒸发镀膜装置
JP6570012B2 (ja) * 2017-12-27 2019-09-04 キヤノントッキ株式会社 蒸発源及び蒸着装置
JP2020002388A (ja) * 2018-06-25 2020-01-09 株式会社アルバック 真空蒸着装置用の蒸着源
KR20200040537A (ko) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE976068C (de) 1941-10-28 1963-02-07 Siemens Ag Verfahren zum laufenden UEberziehen band- oder drahtaehnlicher Gebilde nach dem thermischen Aufdampfungsverfahren
US2908739A (en) * 1956-06-14 1959-10-13 Siemens Ag Water cooled crucible for high frequency heating
US4284867A (en) * 1979-02-09 1981-08-18 General Instrument Corporation Chemical vapor deposition reactor with infrared reflector
FR2611746B1 (fr) 1987-03-06 1989-06-30 Centre Nat Etd Spatiales Dispositif d'evaporation sous vide d'un metal en continu
US5157240A (en) * 1989-09-13 1992-10-20 Chow Loren A Deposition heaters
JPH0762239B2 (ja) 1990-09-28 1995-07-05 三菱重工業株式会社 真空蒸着装置
US5182567A (en) * 1990-10-12 1993-01-26 Custom Metallizing Services, Inc. Retrofittable vapor source for vacuum metallizing utilizing spatter reduction means
GB2251631B (en) 1990-12-19 1994-10-12 Mitsubishi Electric Corp Thin-film forming apparatus
US5554220A (en) 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
JPH108241A (ja) 1996-06-25 1998-01-13 Mitsubishi Heavy Ind Ltd 真空蒸着装置
JPH1088325A (ja) 1996-09-09 1998-04-07 Nissin Electric Co Ltd 薄膜形成装置
US6572700B2 (en) * 1997-12-26 2003-06-03 Sumitomo Electric Industries, Ltd. Semiconductor crystal, and method and apparatus of production thereof
DE19846602A1 (de) * 1998-10-09 2000-04-13 Leybold Systems Gmbh Verdampfer für Aluminium oder ein anderes hochschmelzendes Metall
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
DE10128091C1 (de) 2001-06-11 2002-10-02 Applied Films Gmbh & Co Kg Vorrichtung für die Beschichtung eines flächigen Substrats
JP3836032B2 (ja) * 2002-02-01 2006-10-18 三菱重工業株式会社 プラズマｃｖｄ装置
KR100647578B1 (ko) * 2002-07-11 2006-11-17 삼성에스디아이 주식회사 증착장치 및 증착방법
KR100889758B1 (ko) * 2002-09-03 2009-03-20 삼성모바일디스플레이주식회사 유기박막 형성장치의 가열용기
DE10256038A1 (de) 2002-11-30 2004-06-17 Applied Films Gmbh & Co. Kg Bedampfungsvorrichtung
JP4380319B2 (ja) 2002-12-19 2009-12-09 ソニー株式会社 蒸着装置および有機エレクトロルミネッセンス素子の製造方法
JP2005002450A (ja) * 2003-06-13 2005-01-06 Pioneer Electronic Corp 蒸着方法、蒸着ヘッド、及び有機エレクトロルミネッセンス表示パネルの製造装置
KR100659762B1 (ko) * 2005-01-17 2006-12-19 삼성에스디아이 주식회사 증발원, 증착장치 및 이를 이용한 증착방법

Also Published As

Publication number Publication date
KR20070014959A (ko) 2007-02-01
EP1752554B1 (de) 2007-10-17
ATE376078T1 (de) 2007-11-15
JP4681498B2 (ja) 2011-05-11
CN1904130A (zh) 2007-01-31
TWI314587B (en) 2009-09-11
DE502005001749D1 (de) 2007-11-29
PL1752554T3 (pl) 2008-03-31
EP1752554A1 (de) 2007-02-14
US20070022955A1 (en) 2007-02-01
KR100712311B1 (ko) 2007-04-27
JP2007031828A (ja) 2007-02-08

Similar Documents

Publication Publication Date Title
TW200704812A (en) Vapor deposition device
TWI341009B (en) Chemical vapor deposition
TW200731559A (en) Encapsulation and methods thereof
TWI349719B (en) Heater and vapor deposition source having the same
HK1130278A1 (en) Silicate-base luminescent materials having multiple emission peaks, processes for preparing the same and light emitting devices using the same
WO2010047755A3 (en) Gas environment for imprint lithography
UA97382C2 (ru) Таннат разагилина
IL181394A0 (en) Atmospheric pressure chemical vapor deposition
WO2010021524A3 (ko) 유기 전자 소자 재료 및 이를 이용한 유기 전자 소자
GB2491733B (en) Heat sink with multiple vapor chambers
EP2053589A4 (en) ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE HAVING THE SUBSTRATE
WO2007142919A3 (en) Compositions having a high antiviral effeicacy
EP2091707A4 (en) PRINTING, DEPOSITION OR COATING ON FLUIDIFIABLE SUBSTRATES
WO2009120766A3 (en) Nanocomposite dielectric coatings
PL2140476T3 (pl) Źródło do próżniowo-łukowego osadzania z fazy gazowej oraz komora do łukowego osadzania z fazy gazowej ze źródłem do próżniowo-łukowego osadzania z fazy gazowej
TW200742120A (en) Light emitting apparatus
SG126899A1 (en) Light-emitting device, method for making the same,and nitride semiconductor substrate
GB0613784D0 (en) Gravure plate, method for forming light emitting layer or hole injection layer using the same, and organic light emitting device
EP1844178A4 (en) HIGH PRECISION VAPOR GENERATION AND DISTRIBUTION FOR THIN LAYER DEPOSITION
WO2008014750A3 (de) Dünnfilm-halbleiterbauelement und bauelement-verbund
EP2178132A4 (en) ORGANIC ELECTROLUMINESCENT DEVICE, PROCESS FOR PRODUCING THE SAME, AND COATING LIQUID
WO2010035130A3 (en) Evaporator for organic materials
EP1889947A4 (en) METHOD AND DEVICE FOR FORMING SURFACE LIQUID PLASMA VAPOR DEPOSITION FILM
WO2009029954A3 (en) Improved solution deposition assembly
HK1148112A1 (zh) }< }< >取向襯底上的基於半導體的大面積靈活電子器件