TW200704360A - Mounting structure of high-frequency apparatus - Google Patents

Mounting structure of high-frequency apparatus

Info

Publication number
TW200704360A
TW200704360A TW095109653A TW95109653A TW200704360A TW 200704360 A TW200704360 A TW 200704360A TW 095109653 A TW095109653 A TW 095109653A TW 95109653 A TW95109653 A TW 95109653A TW 200704360 A TW200704360 A TW 200704360A
Authority
TW
Taiwan
Prior art keywords
enclosed
mother board
frequency apparatus
mounting structure
terminals
Prior art date
Application number
TW095109653A
Other languages
English (en)
Chinese (zh)
Other versions
TWI304322B (enExample
Inventor
Daisuke Inoue
Shigetomo Chiba
Satoshi Iimure
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200704360A publication Critical patent/TW200704360A/zh
Application granted granted Critical
Publication of TWI304322B publication Critical patent/TWI304322B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW095109653A 2005-04-21 2006-03-21 Mounting structure of high-frequency apparatus TW200704360A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005124281A JP4500726B2 (ja) 2005-04-21 2005-04-21 高周波機器の取付構造

Publications (2)

Publication Number Publication Date
TW200704360A true TW200704360A (en) 2007-01-16
TWI304322B TWI304322B (enExample) 2008-12-11

Family

ID=37187520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109653A TW200704360A (en) 2005-04-21 2006-03-21 Mounting structure of high-frequency apparatus

Country Status (4)

Country Link
US (1) US7361030B2 (enExample)
JP (1) JP4500726B2 (enExample)
CN (1) CN100512616C (enExample)
TW (1) TW200704360A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1693402A3 (en) 1997-01-07 2009-05-27 Kaneka Corporation Cellulosic particles, spherical object comprising cross-linked polymer particles, and adsorbent for body fluid purification
GB2445378B (en) * 2007-01-04 2009-06-17 Motorola Inc Electronic component housing assembly and a method of its manufacture
JP4945337B2 (ja) * 2007-06-19 2012-06-06 株式会社東芝 電子機器
JP2010129559A (ja) * 2008-11-25 2010-06-10 Alps Electric Co Ltd 高周波回路ユニット
US8681493B2 (en) * 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
JP6056238B2 (ja) * 2011-12-12 2017-01-11 株式会社アドヴィックス 回路基板と電気部品との電気接続構造
US9553382B2 (en) * 2014-06-27 2017-01-24 Xiaomi Inc. Headphone socket assembly and electronic equipment including same
DE102016119293A1 (de) * 2016-10-11 2018-04-12 HELLA GmbH & Co. KGaA Elektronik, insbesondere Leistungselektronik und System
JP6947071B2 (ja) * 2018-02-13 2021-10-13 株式会社オートネットワーク技術研究所 インダクタ、基板付きインダクタ及び電気接続箱

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910827Y2 (ja) * 1978-12-28 1984-04-04 株式会社村田製作所 電子チユ−ナの仮固定構造
JPH036099A (ja) * 1989-06-02 1991-01-11 Canon Inc 電子機器の実装構造
JP2573661Y2 (ja) * 1991-04-30 1998-06-04 ミツミ電機株式会社 選局回路ユニット
JPH0562095U (ja) * 1992-01-24 1993-08-13 株式会社富士通ゼネラル プリント基板用シールドケース
JP3569951B2 (ja) * 1993-05-21 2004-09-29 ソニー株式会社 チューナケース
JPH0722541A (ja) * 1993-06-30 1995-01-24 Nec Kansai Ltd 高周波装置
JP2908967B2 (ja) 1993-09-10 1999-06-23 シャープ株式会社 チューナユニット
JP2586389B2 (ja) * 1993-09-17 1997-02-26 日本電気株式会社 Ｌｓｉケースのシールド構造
TW443717U (en) * 1996-06-28 2001-06-23 Sharp Kk Tuner structure and cable modem tuner using the same
JPH1041667A (ja) * 1996-07-19 1998-02-13 Nec Eng Ltd 回路基板のシールド構造
JP3208076B2 (ja) * 1996-12-02 2001-09-10 アルプス電気株式会社 シールドケース
JP2000294973A (ja) * 1999-04-06 2000-10-20 Matsushita Electric Ind Co Ltd 高周波ユニット
JP3062909U (ja) 1999-04-08 1999-10-15 船井電機株式会社 チュ―ナユニット
JP2004253462A (ja) * 2003-02-18 2004-09-09 Murata Mfg Co Ltd パッケージモジュール
JP2004273721A (ja) * 2003-03-07 2004-09-30 Mitsumi Electric Co Ltd 高周波ユニット
JP2005108881A (ja) * 2003-09-26 2005-04-21 Toshiba Corp 電子機器

Also Published As

Publication number Publication date
TWI304322B (enExample) 2008-12-11
CN1856244A (zh) 2006-11-01
JP2006303255A (ja) 2006-11-02
JP4500726B2 (ja) 2010-07-14
US20060240689A1 (en) 2006-10-26
CN100512616C (zh) 2009-07-08
US7361030B2 (en) 2008-04-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees