TW200704295A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
TW200704295A
TW200704295A TW095118057A TW95118057A TW200704295A TW 200704295 A TW200704295 A TW 200704295A TW 095118057 A TW095118057 A TW 095118057A TW 95118057 A TW95118057 A TW 95118057A TW 200704295 A TW200704295 A TW 200704295A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
bent
region
conductors
Prior art date
Application number
TW095118057A
Other languages
English (en)
Other versions
TWI391040B (zh
Inventor
Kazumasa Takeuchi
Nozomu Takano
Masaki Yamaguchi
Makoto Yanagida
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200704295A publication Critical patent/TW200704295A/zh
Application granted granted Critical
Publication of TWI391040B publication Critical patent/TWI391040B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW095118057A 2005-05-20 2006-05-19 A printed circuit board TWI391040B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005148150 2005-05-20
JP2006139126A JP5124984B2 (ja) 2005-05-20 2006-05-18 印刷配線板

Publications (2)

Publication Number Publication Date
TW200704295A true TW200704295A (en) 2007-01-16
TWI391040B TWI391040B (zh) 2013-03-21

Family

ID=37431352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118057A TWI391040B (zh) 2005-05-20 2006-05-19 A printed circuit board

Country Status (7)

Country Link
US (1) US8664534B2 (zh)
JP (1) JP5124984B2 (zh)
KR (1) KR20080012980A (zh)
CN (1) CN101180925B (zh)
DE (1) DE112006001295T5 (zh)
TW (1) TWI391040B (zh)
WO (1) WO2006123783A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101518163B (zh) * 2006-09-21 2011-06-08 株式会社大昌电子 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法
JP5689277B2 (ja) * 2009-10-22 2015-03-25 新日鉄住金化学株式会社 フレキシブル回路基板及び多層回路基板
JP5463205B2 (ja) * 2010-05-27 2014-04-09 日本メクトロン株式会社 フレキシブル回路基板
FR2966692B1 (fr) * 2010-10-26 2012-12-14 Sagem Defense Securite Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique
US8823186B2 (en) * 2010-12-27 2014-09-02 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
KR102036135B1 (ko) 2011-08-30 2019-10-24 히타치가세이가부시끼가이샤 액상 잉크
JP5934078B2 (ja) * 2012-11-19 2016-06-15 信越化学工業株式会社 繊維含有樹脂基板及び半導体装置の製造方法
CN106063393B (zh) * 2015-02-16 2019-03-22 日本梅克特隆株式会社 柔性印刷布线板的制造方法
EP3358359B1 (de) * 2017-02-01 2019-08-28 Siemens Aktiengesellschaft Leiterplatte mit implantiertem optischen stromsensor
DE102018212272A1 (de) * 2018-07-24 2020-01-30 Robert Bosch Gmbh Keramischer Schaltungsträger und Elektronikeinheit
DE102019201281B4 (de) * 2019-01-31 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825057A (ja) 1981-07-16 1983-02-15 Jeol Ltd 質量分析装置
DE4003345C1 (zh) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
JPH0462885A (ja) 1990-06-25 1992-02-27 Seiko Epson Corp フレキシブル回路基板
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JPH06302962A (ja) 1993-02-19 1994-10-28 Mitsubishi Rayon Co Ltd リジッド−フレキシブル配線板およびその製造方法
JPH08193139A (ja) 1995-01-17 1996-07-30 Nippon Steel Chem Co Ltd プリント配線板用プリプレグ及びそれを用いた金属張積層板
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
EP1496094B1 (en) * 1997-10-29 2008-08-13 Hitachi Chemical Company, Ltd. An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet
JP2000012991A (ja) * 1998-06-18 2000-01-14 Nitto Denko Corp 異なる厚さの導体層を有する回路基板形成部材およびそれを用いた回路基板
JP2000196205A (ja) * 1998-12-28 2000-07-14 Fujitsu Ltd フレキシブルプリント基板
US6198634B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Electronic package with stacked connections
JP4442832B2 (ja) * 1999-04-13 2010-03-31 イビデン株式会社 多層プリント配線板
JP2001351448A (ja) * 2000-06-06 2001-12-21 Mitsui Chemicals Inc フラットケーブルの製造方法及びフラットケーブル
JP3744383B2 (ja) 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
JP2002246748A (ja) * 2001-02-16 2002-08-30 Nippon Mektron Ltd フレキシブルプリント基板およびその製造方法
JP4455806B2 (ja) 2001-05-24 2010-04-21 日立化成工業株式会社 プリプレグ及び積層板
JP4412864B2 (ja) 2001-05-30 2010-02-10 日本メクトロン株式会社 両面可撓性回路基板の製造法
KR100515492B1 (ko) * 2001-12-27 2005-09-20 미쓰이 가가쿠 가부시키가이샤 회로기판 및 그 제조방법
JP2004051689A (ja) 2002-07-17 2004-02-19 Sumitomo Chem Co Ltd プリプレグ及び基板材料
JP4075580B2 (ja) * 2002-11-21 2008-04-16 日立化成工業株式会社 接着剤層付きプリプレグの製造方法及び接着剤層付きプリプレグ
JP2004266170A (ja) 2003-03-04 2004-09-24 Showa Denko Kk プリント配線基板用積層体の製造方法
TW200500387A (en) 2003-06-02 2005-01-01 Showa Denko Kk Flexible wiring board and flex-rigid wiring board
JP4363137B2 (ja) 2003-09-16 2009-11-11 日立化成工業株式会社 金属箔層付き基板フィルム及び両面金属箔付き基板フィルム
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4147298B2 (ja) * 2005-03-25 2008-09-10 株式会社 大昌電子 フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法
JP5007057B2 (ja) 2006-03-17 2012-08-22 公益財団法人高輝度光科学研究センター 電子ビーム発生装置

Also Published As

Publication number Publication date
KR20080012980A (ko) 2008-02-12
CN101180925A (zh) 2008-05-14
JP2006352103A (ja) 2006-12-28
JP5124984B2 (ja) 2013-01-23
DE112006001295T5 (de) 2008-04-17
US20100270059A1 (en) 2010-10-28
US8664534B2 (en) 2014-03-04
CN101180925B (zh) 2010-05-19
WO2006123783A1 (ja) 2006-11-23
TWI391040B (zh) 2013-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees