TW200644139A - Interface assembly and dry gas enclosing apparatus using same - Google Patents

Interface assembly and dry gas enclosing apparatus using same

Info

Publication number
TW200644139A
TW200644139A TW095113761A TW95113761A TW200644139A TW 200644139 A TW200644139 A TW 200644139A TW 095113761 A TW095113761 A TW 095113761A TW 95113761 A TW95113761 A TW 95113761A TW 200644139 A TW200644139 A TW 200644139A
Authority
TW
Taiwan
Prior art keywords
interface
dry gas
interface assembly
same
test head
Prior art date
Application number
TW095113761A
Other languages
English (en)
Inventor
Akihiko Goto
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200644139A publication Critical patent/TW200644139A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
TW095113761A 2005-05-16 2006-04-18 Interface assembly and dry gas enclosing apparatus using same TW200644139A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005142979A JP2006319273A (ja) 2005-05-16 2005-05-16 インターフェースアッセンブリ、及びそれを用いた乾燥ガス封入装置

Publications (1)

Publication Number Publication Date
TW200644139A true TW200644139A (en) 2006-12-16

Family

ID=37311285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113761A TW200644139A (en) 2005-05-16 2006-04-18 Interface assembly and dry gas enclosing apparatus using same

Country Status (5)

Country Link
US (1) US7518389B2 (zh)
JP (1) JP2006319273A (zh)
KR (1) KR20060118356A (zh)
DE (1) DE102006021468A1 (zh)
TW (1) TW200644139A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100656586B1 (ko) * 2005-01-07 2006-12-13 삼성전자주식회사 프로브 카드 냉각용 공기 분사기를 갖는 웨이퍼 번인 시스템
KR100791000B1 (ko) * 2006-10-31 2008-01-03 삼성전자주식회사 웨이퍼의 고속 병렬검사를 위한 전기적 검사장치 및 검사방법
DE102010054801A1 (de) * 2010-12-16 2012-06-21 Andrew Wireless Systems Gmbh HF-Verbindungselement und HF-Gerät
CN102157870B (zh) * 2010-12-31 2014-04-30 上海航天科工电器研究院有限公司 磁性射频同轴连接器
US8357000B1 (en) * 2011-09-29 2013-01-22 The United States Of America As Represented By The Secretary Of The Army Fluid-isolating, self-aligning make-break electrical connection
JP5874427B2 (ja) * 2012-02-14 2016-03-02 セイコーエプソン株式会社 部品検査装置、及び、ハンドラー
JP2014011373A (ja) * 2012-07-02 2014-01-20 Tokyo Electron Ltd 半導体検査システム及びインターフェース部の結露防止方法
US10101363B2 (en) * 2015-04-12 2018-10-16 Keysight Technologies, Inc. Coaxial connector locking bracket
JP6655516B2 (ja) * 2016-09-23 2020-02-26 東京エレクトロン株式会社 基板検査装置
CN110568336B (zh) * 2019-08-30 2022-03-04 上海御渡半导体科技有限公司 一种接口装置及设有该接口装置的测试设备
WO2021190759A1 (en) * 2020-03-26 2021-09-30 Advantest Corporation Test arrangement for testing high-frequency components, particularly silicon photonics devices under test

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03142944A (ja) * 1989-10-30 1991-06-18 Mitsubishi Electric Corp ソケットボードの結露防止装置
US5559446A (en) * 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
JP2606602B2 (ja) * 1993-11-30 1997-05-07 日本電気株式会社 冷却試験装置
JP3487914B2 (ja) * 1994-07-14 2004-01-19 株式会社アドバンテスト 試験装置用テストヘッド
US6118286A (en) * 1995-10-10 2000-09-12 Xilinx, Inc. Semiconductor device tester-to-handler Interface board with large test area
JP3302576B2 (ja) * 1996-09-30 2002-07-15 アジレント・テクノロジー株式会社 コネクタ付きプローブカード及びdut接続装置
JP3286183B2 (ja) * 1996-09-30 2002-05-27 アジレント・テクノロジー株式会社 同軸コネクタフローティングマウント装置
JP3251205B2 (ja) * 1997-07-09 2002-01-28 株式会社アドバンテスト ウェーハ測定方法及び装置
US6181145B1 (en) * 1997-10-13 2001-01-30 Matsushita Electric Industrial Co., Ltd. Probe card
US6570397B2 (en) * 2001-08-07 2003-05-27 Agilent Technologies, Inc. Timing calibration and timing calibration verification of electronic circuit testers
JP3783075B2 (ja) * 2001-12-13 2006-06-07 東京エレクトロン株式会社 プローブ装置及びローダ装置
US7129730B2 (en) * 2004-12-15 2006-10-31 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly

Also Published As

Publication number Publication date
JP2006319273A (ja) 2006-11-24
US7518389B2 (en) 2009-04-14
DE102006021468A1 (de) 2006-11-23
KR20060118356A (ko) 2006-11-23
US20060255821A1 (en) 2006-11-16

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