TW200640044A - Semiconductor light emitting device and semiconductor light emitting unit - Google Patents

Semiconductor light emitting device and semiconductor light emitting unit

Info

Publication number
TW200640044A
TW200640044A TW095106120A TW95106120A TW200640044A TW 200640044 A TW200640044 A TW 200640044A TW 095106120 A TW095106120 A TW 095106120A TW 95106120 A TW95106120 A TW 95106120A TW 200640044 A TW200640044 A TW 200640044A
Authority
TW
Taiwan
Prior art keywords
lead
light emitting
section
semiconductor light
mold resin
Prior art date
Application number
TW095106120A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305062B (https=
Inventor
Iwao Matsumoto
Tatsuo Tonedachi
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200640044A publication Critical patent/TW200640044A/zh
Application granted granted Critical
Publication of TWI305062B publication Critical patent/TWI305062B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW095106120A 2005-03-30 2006-02-23 Semiconductor light emitting device and semiconductor light emitting unit TW200640044A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005098970A JP4711715B2 (ja) 2005-03-30 2005-03-30 半導体発光装置及び半導体発光ユニット

Publications (2)

Publication Number Publication Date
TW200640044A true TW200640044A (en) 2006-11-16
TWI305062B TWI305062B (https=) 2009-01-01

Family

ID=37030706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106120A TW200640044A (en) 2005-03-30 2006-02-23 Semiconductor light emitting device and semiconductor light emitting unit

Country Status (4)

Country Link
US (1) US7557384B2 (https=)
JP (1) JP4711715B2 (https=)
CN (1) CN1841801A (https=)
TW (1) TW200640044A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675497B (zh) * 2013-07-26 2019-10-21 新光電氣工業股份有限公司 發光裝置封裝及搭載發光裝置之封裝

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EP1919002B1 (en) * 2005-08-23 2018-07-18 Kabushiki Kaisha Toshiba Light-emitting device, backlight using same, and liquid crystal display
KR100904152B1 (ko) * 2006-06-30 2009-06-25 서울반도체 주식회사 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
JP4205135B2 (ja) 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
US7638814B2 (en) * 2007-06-19 2009-12-29 Philips Lumileds Lighting Company, Llc Solderless integrated package connector and heat sink for LED
JP5114773B2 (ja) * 2007-08-10 2013-01-09 スタンレー電気株式会社 表面実装型発光装置
DE102007041136A1 (de) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh LED-Gehäuse
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
KR100998233B1 (ko) 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
KR101018191B1 (ko) * 2008-11-27 2011-02-28 삼성엘이디 주식회사 세라믹 패키지 및 이를 구비하는 헤드램프 모듈
JP2010161139A (ja) * 2009-01-07 2010-07-22 Toshiba Corp 発光装置
TW201103170A (en) * 2009-07-08 2011-01-16 Paragon Sc Lighting Tech Co LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
JP5936810B2 (ja) * 2009-09-11 2016-06-22 ローム株式会社 発光装置
EP2302985A1 (en) * 2009-09-28 2011-03-30 Huan-Chang Huang LED assembly
CN102034782A (zh) * 2009-09-30 2011-04-27 万国半导体有限公司 一种用于功率半导体器件的混合合金引线框架
TWI413226B (zh) * 2009-11-09 2013-10-21 萬國半導體有限公司 一種用於功率半導體裝置的混合合金引線框架及其製作方法
US8598612B2 (en) * 2010-03-30 2013-12-03 Micron Technology, Inc. Light emitting diode thermally enhanced cavity package and method of manufacture
DE102010023815A1 (de) * 2010-06-15 2011-12-15 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements
KR101825473B1 (ko) * 2011-02-16 2018-02-05 삼성전자 주식회사 발광소자 패키지 및 그 제조방법
JP5753446B2 (ja) * 2011-06-17 2015-07-22 株式会社東芝 半導体発光装置の製造方法
JP2013065706A (ja) * 2011-09-16 2013-04-11 Sumitomo Bakelite Co Ltd 発熱デバイス組立体および発熱デバイス組立体の製造方法
CN104718634A (zh) * 2012-10-19 2015-06-17 夏普株式会社 发光装置以及发光装置向散热器安装的安装构造
DE102013225552A1 (de) 2013-12-11 2015-06-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN104167411A (zh) * 2014-08-19 2014-11-26 中国科学院半导体研究所 一种led阵列结构
CN104900638B (zh) * 2015-05-27 2017-10-24 深圳市华星光电技术有限公司 发光元件组装结构
JP6831624B2 (ja) * 2015-11-27 2021-02-17 ローム株式会社 Ｌｅｄ発光装置
CN109863611B (zh) * 2016-10-25 2021-08-17 京瓷株式会社 发光元件搭载用基板、发光装置以及发光模块
CN110476262A (zh) * 2017-04-04 2019-11-19 昕诺飞控股有限公司 固态发光器封装件、灯、灯具以及制造固态发光器封装件的方法

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Publication number Priority date Publication date Assignee Title
JPH03108452A (ja) * 1989-09-22 1991-05-08 Dai Ichi Kogyo Seiyaku Co Ltd 養魚用ドライペレットの製造方法
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US7420271B2 (en) * 2003-02-20 2008-09-02 Tsung Hsin Chen Heat conductivity and brightness enhancing structure for light-emitting diode
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
JP4359195B2 (ja) 2004-06-11 2009-11-04 株式会社東芝 半導体発光装置及びその製造方法並びに半導体発光ユニット
USD531140S1 (en) 2005-11-14 2006-10-31 Kabushiki Kaisha Toshiba Light emitting semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675497B (zh) * 2013-07-26 2019-10-21 新光電氣工業股份有限公司 發光裝置封裝及搭載發光裝置之封裝

Also Published As

Publication number Publication date
US20060220048A1 (en) 2006-10-05
TWI305062B (https=) 2009-01-01
CN1841801A (zh) 2006-10-04
US7557384B2 (en) 2009-07-07
JP4711715B2 (ja) 2011-06-29
JP2006278934A (ja) 2006-10-12

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