CN1841801A - 半导体发光器件及其制造方法和半导体发光组件 - Google Patents

半导体发光器件及其制造方法和半导体发光组件 Download PDF

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Publication number
CN1841801A
CN1841801A CN200610071661.9A CN200610071661A CN1841801A CN 1841801 A CN1841801 A CN 1841801A CN 200610071661 A CN200610071661 A CN 200610071661A CN 1841801 A CN1841801 A CN 1841801A
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CN
China
Prior art keywords
semiconductor light
light emitting
lead
emitting device
resin
Prior art date
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Pending
Application number
CN200610071661.9A
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English (en)
Chinese (zh)
Inventor
松本岩夫
刀祢馆达郎
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Toshiba Corp
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Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN1841801A publication Critical patent/CN1841801A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
CN200610071661.9A 2005-03-30 2006-03-30 半导体发光器件及其制造方法和半导体发光组件 Pending CN1841801A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP098970/2005 2005-03-30
JP2005098970A JP4711715B2 (ja) 2005-03-30 2005-03-30 半導体発光装置及び半導体発光ユニット

Publications (1)

Publication Number Publication Date
CN1841801A true CN1841801A (zh) 2006-10-04

Family

ID=37030706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610071661.9A Pending CN1841801A (zh) 2005-03-30 2006-03-30 半导体发光器件及其制造方法和半导体发光组件

Country Status (4)

Country Link
US (1) US7557384B2 (https=)
JP (1) JP4711715B2 (https=)
CN (1) CN1841801A (https=)
TW (1) TW200640044A (https=)

Cited By (2)

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CN102779933A (zh) * 2006-06-30 2012-11-14 首尔半导体株式会社 引线框架、发光二极管封装件及其制造方法
WO2016187920A1 (zh) * 2015-05-27 2016-12-01 深圳市华星光电技术有限公司 发光元件组装结构

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EP1919002B1 (en) * 2005-08-23 2018-07-18 Kabushiki Kaisha Toshiba Light-emitting device, backlight using same, and liquid crystal display
JP4205135B2 (ja) 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
US7638814B2 (en) * 2007-06-19 2009-12-29 Philips Lumileds Lighting Company, Llc Solderless integrated package connector and heat sink for LED
JP5114773B2 (ja) * 2007-08-10 2013-01-09 スタンレー電気株式会社 表面実装型発光装置
DE102007041136A1 (de) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh LED-Gehäuse
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
KR100998233B1 (ko) 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
KR101018191B1 (ko) * 2008-11-27 2011-02-28 삼성엘이디 주식회사 세라믹 패키지 및 이를 구비하는 헤드램프 모듈
JP2010161139A (ja) * 2009-01-07 2010-07-22 Toshiba Corp 発光装置
TW201103170A (en) * 2009-07-08 2011-01-16 Paragon Sc Lighting Tech Co LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
JP5936810B2 (ja) * 2009-09-11 2016-06-22 ローム株式会社 発光装置
EP2302985A1 (en) * 2009-09-28 2011-03-30 Huan-Chang Huang LED assembly
CN102034782A (zh) * 2009-09-30 2011-04-27 万国半导体有限公司 一种用于功率半导体器件的混合合金引线框架
TWI413226B (zh) * 2009-11-09 2013-10-21 萬國半導體有限公司 一種用於功率半導體裝置的混合合金引線框架及其製作方法
US8598612B2 (en) * 2010-03-30 2013-12-03 Micron Technology, Inc. Light emitting diode thermally enhanced cavity package and method of manufacture
DE102010023815A1 (de) * 2010-06-15 2011-12-15 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements
KR101825473B1 (ko) * 2011-02-16 2018-02-05 삼성전자 주식회사 발광소자 패키지 및 그 제조방법
JP5753446B2 (ja) * 2011-06-17 2015-07-22 株式会社東芝 半導体発光装置の製造方法
JP2013065706A (ja) * 2011-09-16 2013-04-11 Sumitomo Bakelite Co Ltd 発熱デバイス組立体および発熱デバイス組立体の製造方法
CN104718634A (zh) * 2012-10-19 2015-06-17 夏普株式会社 发光装置以及发光装置向散热器安装的安装构造
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ
DE102013225552A1 (de) 2013-12-11 2015-06-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN104167411A (zh) * 2014-08-19 2014-11-26 中国科学院半导体研究所 一种led阵列结构
JP6831624B2 (ja) * 2015-11-27 2021-02-17 ローム株式会社 Ｌｅｄ発光装置
CN109863611B (zh) * 2016-10-25 2021-08-17 京瓷株式会社 发光元件搭载用基板、发光装置以及发光模块
CN110476262A (zh) * 2017-04-04 2019-11-19 昕诺飞控股有限公司 固态发光器封装件、灯、灯具以及制造固态发光器封装件的方法

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JPH03108452A (ja) * 1989-09-22 1991-05-08 Dai Ichi Kogyo Seiyaku Co Ltd 養魚用ドライペレットの製造方法
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US7420271B2 (en) * 2003-02-20 2008-09-02 Tsung Hsin Chen Heat conductivity and brightness enhancing structure for light-emitting diode
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
JP4359195B2 (ja) 2004-06-11 2009-11-04 株式会社東芝 半導体発光装置及びその製造方法並びに半導体発光ユニット
USD531140S1 (en) 2005-11-14 2006-10-31 Kabushiki Kaisha Toshiba Light emitting semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102779933A (zh) * 2006-06-30 2012-11-14 首尔半导体株式会社 引线框架、发光二极管封装件及其制造方法
WO2016187920A1 (zh) * 2015-05-27 2016-12-01 深圳市华星光电技术有限公司 发光元件组装结构
GB2549647A (en) * 2015-05-27 2017-10-25 Shenzhen China Star Optoelect Light emitting element assembling structure

Also Published As

Publication number Publication date
TW200640044A (en) 2006-11-16
US20060220048A1 (en) 2006-10-05
TWI305062B (https=) 2009-01-01
US7557384B2 (en) 2009-07-07
JP4711715B2 (ja) 2011-06-29
JP2006278934A (ja) 2006-10-12

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